A wire bonder window clamp for flexible electronic packaging materials

Abstract

The utility model belongs to the field of semiconductor manufacturing technology, especially relate to a window clamp for flexible electronic packaging material's wire bonding machine, window clamp is composed of stainless steel or aluminium alloy material, window clamp has support and press down structure, support and press down structure is used for the support of product, support and press down structure is composed of elastic material, support and press down structure is composed of a plurality of protrusions, support and press down structure is composed of the pattern corresponding with the shape of product, a plurality of protrusions are arrayed, and the elastic material is organic silica gel, compared with the prior art, the utility model constructs the strategic competitiveness of flexible electronic packaging for enterprises, forms the standardization scheme of reusability, promotes the breakthrough of technical barriers in the industry, and finally drives "line level revolution" with "jig level innovation".

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, it relates to a wire bonding machine window clamp for flexible electronic packaging materials. Background Technology

[0002] Currently, automated wire bonding machines for semiconductor packaging generally use rigid substrates (such as Kovar alloy or ceramic) for the substrate and lead frame, which offer excellent thermal stability and rigidity. The equipment secures the product via a mechanical combination of a heated top plate pushing upwards and window clamps pressing downwards (either directly on the track or indirectly via a rigid carrier). All fixing components (top plate, window clamps, carrier, and track) are made of high-rigidity metal materials (such as stainless steel) to ensure the rigid substrate remains stable and undeformed during wire bonding heating and equipment vibration. While some wire bonding machine models integrate a vacuum adsorption function on the top plate, this feature is not standard on all models.

[0003] However, facing the growing demand for flexible electronic packaging (such as FPC and other flexible substrates), existing fixing technologies have significant drawbacks: 1. Mechanical clamping failure: When the window clamp presses down on the flexible material, it causes localized deformation, resulting in large areas of the substrate (especially the solder joints far from the pressure point) not being evenly flattened and fixed, easily leading to warping, deformation, and positional displacement; 2. Vacuum adsorption deficiency / mismatch: Many existing models lack vacuum adsorption functionality on the top plate, or although they do, the size and layout of the adsorption holes are incompatible with the characteristics of the flexible substrate (size, solder joint distribution), failing to provide uniform and sufficient adsorption force; 3. Modification limitations: Relying on the original equipment manufacturer to modify the top plate to add or optimize the vacuum adsorption function carries risks of long cycles, high costs, and project delays, and repeated hardware modifications can easily introduce equipment instability. These shortcomings directly lead to process problems such as inconsistent height during flexible substrate soldering (PR recognition failure), poor soldering / inability to solder joints, and difficulty in ball placement, hindering the production implementation and order delivery of flexible packaging. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a wire bonding machine window clamp for flexible electronic packaging materials that can be used without modifying the wire bonding machine, adaptively compensate for deformation, and provide full-area clamping.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A wire bonding machine window clamp for flexible electronic packaging materials, the window clamp having a support and pressure structure for supporting the product, the support and pressure structure being made of an elastic material.

[0006] The present invention is further configured such that the supporting pressure structure is composed of several protrusions.

[0007] The present invention is further configured such that the supporting pressure structure is composed of a graphic corresponding to the shape of the product.

[0008] The present invention is further configured such that the plurality of protrusions are arranged in an array.

[0009] The present invention is further configured such that the elastic material is silicone.

[0010] The present invention is further configured such that the window clamp is made of stainless steel or aluminum alloy.

[0011] Compared with the shortcomings of the prior art, the beneficial effects of this utility model are as follows: By covering the window clamp bonding surface with a customizable silicone layer (distributed in dots or patterns), the soft and elastic properties and adaptive deformation capability of silicone are utilized to achieve multi-contact synchronous clamping when the window clamp is pressed down. This effectively compensates for thickness differences and local deformation of soft substrates (such as FPC), ensuring stable adhesion of the product throughout and completely solving core process problems such as PR recognition failure, solder joint defects, and ball misalignment caused by warping. This solution is directly compatible with existing machines without modifying the wire bonding machine structure, avoiding reliance on original equipment manufacturers (OEMs), high-cost modifications, and equipment stability risks. The window clamp, as a standard fixture, can be quickly installed in existing facilities, and the operation process is seamlessly integrated into the production line, significantly lowering the entry barrier. Based on the product's solder joint layout, the silicone pattern and thickness can be freely designed using a dispensing machine. Damaged silicone layers can be locally repaired or recoated, and the window clamp substrate (stainless steel) can be permanently reused, avoiding overall scrapping. This significantly accelerates new product introduction and order delivery; eliminates production line downtime caused by equipment modifications, improves machine utilization, and reduces rework and material waste. The silicone rubber offers selectable hardness, making it compatible with various flexible substrates such as FPC and thin polyimide. After curing, the silicone can withstand temperatures exceeding 150°C in wire bonding equipment, with no risk of colloidal decomposition or contamination. It bonds firmly to the metal window clip substrate, eliminating the risk of detachment. This innovation overcomes the bottleneck of flexible substrate fixing at ultra-low cost and with zero hardware modification. It not only achieves a leap in yield, shortened cycle time, and drastically reduced costs, but also enhances technological autonomy and production line agility, enabling companies to build strategic competitiveness in flexible electronic packaging. It forms a reusable standardized solution, drives the industry to break through technological barriers, and ultimately drives a "production line revolution" through "fixture-level innovation." Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model; Figure 2 This is a partial enlarged view of an embodiment of the present utility model.

[0013] Window clip 1, support and pressure structure 2, protrusion 3. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0016] Working Principle: The wire bonding machine's window clamp 1 is made of stainless steel or aluminum alloy. Its pressing surface is equipped with a support and pressing structure 2 made of silicone. This support and pressing structure 2 consists of several arrayed protrusions 3 or customized patterns that match the product shape. During operation, the window clamp 1 is first installed onto the wire bonding machine's window clamp 1 mechanism; the flexible substrate product is placed on the carrier or track, and the equipment is started to press down the window clamp 1; the silicone support and pressing structure 2 of the window clamp 1 simultaneously contacts the product surface, utilizing the elastic deformation characteristics of silicone to adaptively compensate for product thickness differences and local deformations. Local deformations include product deformation and deformations of the mechanical mechanisms such as the window clamp 1 carrier; by controlling the pressing stroke of the window clamp 1, all silicone protrusions 3 or patterns are evenly pressured, achieving stable flatness of the flexible substrate across the entire surface; during the heating of the top plate to 150℃ and the wire bonding operation, the silicone support and pressing structure 2 continuously provides elastic support, resisting equipment vibration and maintaining the product's fixed position to ensure wire bonding accuracy; after the operation is completed, the window clamp 1 rises and resets, and the product is removed. This process does not require modification of the wire bonding machine body. The problem of pressing soft substrates is overcome by the adaptive deformation of the silicone support pressing structure 2.

[0017] The window clamp 1 is made of stainless steel or aluminum alloy and has a guide hole for connecting to the wire bonding machine.

[0018] The window clip 1 has a supporting pressure structure 2, which supports the product. The supporting pressure structure 2 is made of an elastic material, specifically silicone rubber. Silicone rubber offers a wide range of hardness and viscosity options, allowing for selection based on the product's substrate. Furthermore, silicone rubber is readily available and commonly used in electronic packaging plants, eliminating concerns about contamination during curing. Since automatic wire bonding machines transmit high temperatures (around 150°C) through the top plate and carrier, most silicone rubbers can be used at around 150°C after curing without failing or disintegrating. Most silicone rubbers also exhibit good adhesion to metal surfaces such as stainless steel and aluminum alloys, eliminating concerns about adhesive detachment from the window clip 1. Damage or contamination to the silicone area on the window clip 1 can be easily repaired without damaging the clip itself. The manufacturing process is simple, convenient, efficient, has a short cycle time, and low cost.

[0019] The supporting pressure structure 2 consists of several protrusions 3, which are formed by a graphic corresponding to the shape of the product. The protrusions 3 are arranged in an array, which can accurately match the layout of the product's solder joints, ensuring that each area to be soldered has elastic support. The customized graphic perfectly fits the product's contour, eliminating blind spots in the pressing process. The array arrangement ensures that the pressure is evenly covered across the entire area, and the elasticity of the silicone automatically compensates for the thickness difference and deformation of the substrate, achieving zero-suspended pressing of the flexible substrate and eliminating solder joint failure caused by warping from the root.

[0020] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wire bonding machine window clamp for flexible electronic packaging materials, characterized in that, The window clamp (1) has a support and pressure structure (2), which is used to support the product. The support and pressure structure (2) is made of elastic material with a hardness >30A.

2. The wire bonding machine window clamp for flexible electronic packaging materials according to claim 1, characterized in that: The supporting pressure structure (2) is composed of several protrusions (3).

3. The wire bonding machine window clamp for flexible electronic packaging materials according to claim 1, characterized in that: The supporting pressure structure (2) is composed of a graphic corresponding to the shape of the product.

4. A wire bonding machine window clamp for flexible electronic packaging materials according to claim 2, characterized in that: The protrusions (3) are arranged in an array.

5. A wire bonding machine window clamp for flexible electronic packaging materials according to claim 3 or 4, characterized in that: The elastic material is silicone.

6. A wire bonding machine window clamp for flexible electronic packaging materials according to claim 5, characterized in that: The window clip (1) is made of stainless steel or aluminum alloy.

Images