Bga packaging equipment comprising a ball blocking prevention seed net

Abstract

The utility model relates to the technical field of semiconductor packaging, disclose a kind of BGA packaging equipment containing anti-blocking ball mounting steel net, the utility model includes packaging seat, top setting chip base;Clamping component, setting packaging seat side, including clamping block, horizontal sliding in packaging seat top side;Glue scraping component, setting in packaging seat side top, including glue coating frame, bottom hinged packaging seat top side;Ball mounting module, setting in the side of glue coating frame on the top of packaging seat immediately next to, including ball mounting frame, bottom hinged the side of glue coating frame on the top of packaging seat immediately next to, by adopting nanometer anti-sticking coating and the ball mounting hole of conical design, the smoothness and accuracy of ball mounting process are improved, effectively prevent the solder ball blockage problem, to improve packaging quality and production efficiency.In addition, the design of the equipment allows quick replacement of different caliber ball mounting holes, enhancing the flexibility and adaptability of the equipment, meeting the diverse packaging needs.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically a BGA packaging device including an anti-clogging ball-planting stencil. Background Technology

[0002] In the semiconductor packaging field, BGA packaging is widely used in high-end integrated circuits such as CPUs, GPUs, and memory chips due to its high density, high performance, and excellent heat dissipation and electrical connection characteristics. Ball placement is a crucial step in BGA packaging, mainly involving printing solder paste onto the chip pads, then precisely placing tiny solder balls onto the pads, and finally reflow soldering to form reliable solder joints. Traditional processes typically use step-by-step equipment to complete solder paste printing and solder ball placement, resulting in a cumbersome operation process that requires multiple chip transfers and positioning, easily introducing alignment errors and affecting soldering yield.

[0003] However, most existing equipment separates solder paste printing and ball placement processes, requiring operation at different workstations, resulting in low production efficiency and poor positioning accuracy. While some integrated devices attempt to combine functions, their complex structures, inconvenient operation, and lack of rapid switching mechanisms are problematic. More importantly, traditional ball placement stencils are mostly designed with straight walls or ordinary tapered holes, without a nano-anti-stick coating. Solder balls are prone to getting stuck in the holes during vibration feeding, causing missing balls or double-ball defects. At the same time, stencil replacement requires disassembling the fixing components, which is time-consuming and difficult to adapt to the rapid changeover requirements of multi-specification chips. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a BGA packaging device that includes an anti-clogging ball-planting steel mesh.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a BGA packaging device including an anti-blocking ball-planting stencil, comprising a packaging base with a chip base at the top; a snap-fit ​​assembly disposed on one side of the packaging base, including a snap-fit ​​block that slides horizontally on the top side of the packaging base; a glue-applying assembly disposed on the top side of one side of the packaging base, including a glue-applying frame that is hinged at the bottom to the top side of the packaging base; and a ball-planting module disposed on the top of the packaging base, with the glue-applying frame side adjacent to it, including a ball-planting frame that is hinged at the bottom to the top glue-applying frame side of the packaging base.

[0006] As a further description of the above technical solution: The snap-fit ​​assembly includes: a pressing head, which slides horizontally on the side of the encapsulation base near the snap-fit ​​block, with one end extending into the encapsulation base and abutting against the bottom of one side of the snap-fit ​​block; a compression spring, which is disposed inside one side of the encapsulation base, with one end welded to the end of the snap-fit ​​block away from the pressing head; a first snap-fit ​​hole, which is opened at the bottom of the glue-applying frame on the side near the pressing head, and the snap-fit ​​block snaps into the first snap-fit ​​hole; and a second snap-fit ​​hole, which is opened at the bottom of the ball-planting frame on the side near the pressing head, and the snap-fit ​​block snaps into the second snap-fit ​​hole.

[0007] As a further description of the above technical solution: The ball-planting module includes: a ball-planting steel mesh that slides inside the ball-planting frame; ball-planting holes that are opened inside the ball-planting steel mesh, and several holes are opened; a discharge chute that is opened on one side of the ball-planting frame; and pop-out components that are set on both sides of the ball-planting frame.

[0008] As a further description of the above technical solution: The ball-planting steel mesh has a nano-anti-stick coating on the inner surface of the ball-planting holes.

[0009] As a further description of the above technical solution: The planting hole is a cone shape, wider at the top and narrower at the bottom.

[0010] As a further description of the above technical solution: The pop-out assembly includes: a pull rod, which slides on both sides of one end of the ball-planting frame; a telescopic spring, which is disposed on both sides inside the ball-planting frame near the pull rod and sleeved on the outside of the pull rod; a locking block, which slides inside the ball-planting frame near the pull rod and has one end welded to the end of the pull rod that extends into the ball-planting frame, and abuts against one end of the telescopic spring; a pressure plate, which slides inside the ball-planting frame away from the locking block and has one side abutting against one end of the ball-planting steel mesh; and a tension spring, which is disposed on both sides inside the ball-planting frame near the pressure plate and has one end welded to the side of the pressure plate away from the ball-planting steel mesh.

[0011] As a further description of the above technical solution: The adhesive scraping assembly includes: a solder paste printing stencil, which is set inside the adhesive application frame and has matching chip adhesive application holes inside; a scraper, which slides inside the adhesive application frame and has a sloping bottom that contacts the upper surface of the solder paste printing stencil; and a toggle block, which is set on one side of the adhesive application frame and is bolted to one end of the scraper that extends out of the adhesive application frame.

[0012] This utility model has the following beneficial effects: 1. By hinged the solder paste squeegee assembly and the solder ball implantation module to both sides of the same package holder, the integrated operation of solder paste printing and solder ball implantation is realized, avoiding repeated chip positioning and improving packaging accuracy and work efficiency; the snap-fit ​​assembly, together with the pressing head, enables the two modules to be quickly locked and unlocked, with a compact structure and convenient operation.

[0013] 2. By adopting a tapered hole structure with a larger top and a smaller bottom and a nano anti-stick coating, the risk of solder ball jamming is reduced, ensuring smooth material feeding; the pop-up component can automatically push out the stencil, which facilitates quick replacement to adapt to different chip specifications, solves the problems of stencil blockage and cumbersome mold changing, and improves the practicality and maintenance efficiency of the equipment. Attached Figure Description

[0014] Figure 1 This is an overall schematic diagram of a BGA packaging device including an anti-clogging ball-planting steel mesh proposed in this utility model; Figure 2 This is a half-sectional schematic diagram of the encapsulation base of a BGA encapsulation device including an anti-clogging ball-planting steel mesh, as proposed in this utility model. Figure 3 A schematic diagram of the scraping assembly of a BGA packaging device including an anti-clogging ball-planting steel mesh, as proposed in this utility model; Figure 4 This is a half-sectional schematic diagram of the ball-planting frame of a BGA packaging device including an anti-clogging ball-planting steel mesh, as proposed in this utility model. Figure 5 This is a partially enlarged half-sectional view of the stencil in a BGA packaging device including an anti-clogging ball-planting stencil, as proposed in this utility model. Figure 6 This utility model proposes a BGA packaging device including an anti-clogging ball-planting stencil. Figure 5 Enlarged view at point A.

[0015] Legend: 1. Packaging base; 11. Chip base; 2. Snap-fit ​​assembly; 21. Press head; 22. Snap-fit ​​block; 23. Compression spring; 24. First snap-fit ​​hole; 25. Second snap-fit ​​hole; 3. Squeegee assembly; 31. Glue application frame; 32. Solder paste printing stencil; 33. Squeegee; 34. Toggle block; 4. Ball placement module; 41. Ball placement frame; 42. Ball placement stencil; 43. Ball placement hole; 44. Discharge chute; 45. Pop-up assembly; 451. Pull rod; 452. Telescopic spring; 453. Snap-fit ​​block one; 454. Pressure plate; 455. Tension spring. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0018] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. Example

[0019] like Figures 1 to 6 As shown, this embodiment provides a BGA packaging device including an anti-clogging ball-planting stencil, comprising: a packaging base 1 with a chip base 11 disposed on top; a snap-fit ​​assembly 2 disposed on one side of the packaging base 1, including a snap-fit ​​block 22, which slides horizontally on the top side of the packaging base 1; a glue applicator 3 disposed on the top side of the packaging base 1, including a glue applicator frame 31, which is hinged at the bottom to the top side of the packaging base 1; and a ball-planting module 4 disposed on the top of the packaging base 1, adjacent to the glue applicator frame 31 on one side, including a ball-planting frame 41, which is hinged at the bottom to the top side of the glue applicator frame 31 adjacent to the top side of the packaging base 1.

[0020] In this embodiment, the adhesive scraping assembly 3 and the ball-planting module 4 constitute a BGA packaging device including an anti-clogging ball-planting stencil, as described in this application.

[0021] Understandable, Figure 1 The diagram only schematically illustrates some of the components included in the packaging device; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, packaging equipment can also include, compared to Figure 1 More or fewer parts.

[0022] Furthermore, in this embodiment, the package holder 1 is made of rectangular metal, possessing high strength and stability. The chip base 11, also made of rectangular metal, is used to fix the chip. The snap-fit ​​assembly 2 includes a snap-fit ​​block 22, made of rectangular metal with a beveled top. The adhesive applicator 3 includes an adhesive application frame 31, made of rectangular metal with a hollow center. The ball-mounting module 4 includes a ball-mounting frame 41, made of rectangular metal with a hollow center. The snap-fit ​​assembly 2 enables locking and unlocking of the adhesive application frame 31 and the ball-mounting frame 41. The adhesive applicator 3 ensures uniform application of solder paste, and the ball-mounting module 4 enables precise ball placement. This improves packaging efficiency and quality and prevents blockage during the ball-mounting process.

[0023] Specifically, the snap-fit ​​assembly 2 includes: a pressing head 21, which slides horizontally on the side of the encapsulation base 1 near the snap-fit ​​block 22, with one end extending into the encapsulation base 1 and abutting against the bottom of the snap-fit ​​block 22; a compression spring 23, which is disposed inside the side of the encapsulation base 1, with one end welded to the end of the snap-fit ​​block 22 away from the pressing head 21; a first snap-fit ​​hole 24, which is opened on the bottom of the glue application frame 31 near the pressing head 21, and the snap-fit ​​block 22 snaps into the first snap-fit ​​hole 24; and a second snap-fit ​​hole 25, which is opened on the bottom of the ball-planting frame 41 near the pressing head 21, and the snap-fit ​​block 22 snaps into the second snap-fit ​​hole 25.

[0024] In this embodiment, the pressing head 21 is made of circular metal, and the compression spring 23 is made of cylindrical metal. The pressing head 21 pushes the locking block 22 to slide, and the compression spring 23 provides elastic force. The locking block 22 locks and unlocks the glue application frame 31 and the ball planting frame 41 through the locking holes 24 and 25. Effect: Enables rapid locking and unlocking of the glue application frame 31 and the ball planting frame 41, improving operational efficiency. Example

[0025] Based on Example 1, in order to further improve the anti-clogging of solder balls and facilitate the replacement of steel mesh with different ball hole diameters, a ball planting module 4 is provided on one side of the encapsulation base 1.

[0026] Specifically, the ball-planting module 4 includes: a ball-planting steel mesh 42, which slides inside the ball-planting frame 41; ball-planting holes 43, which are opened inside the ball-planting steel mesh 42, and several holes are opened; a discharge chute 44, which is opened on one side of the ball-planting frame 41; and pop-out components 45, which are arranged on both sides of the ball-planting frame 41.

[0027] In a preferred embodiment, the ball-planting stencil 42 is made of rectangular metal, the ball-planting holes 43 are conical, and the discharge chute 44 is a semi-circular chute. The ball-planting stencil 42 achieves precise ball planting through the ball-planting holes 43, the discharge chute 44 is used to discharge excess solder balls, and the ejector assembly 45 is used to replace ball-planting holes 43 of different diameters. This improves the accuracy and efficiency of ball planting and prevents solder ball clogging.

[0028] Specifically, the inner surface of the ball-planting steel mesh 42 with ball-planting holes 43 is a nano-anti-stick coating.

[0029] In this embodiment, the nano-anti-stick coating reduces the adhesion between the solder balls and the ball-planting stencil 42, ensuring that the solder balls can pass smoothly through the ball-planting holes 43. This prevents the solder balls from clogging and improves the reliability of the ball-planting process.

[0030] Specifically, the planting hole 43 is a cone shape with a larger upper part and a smaller lower part.

[0031] This design, with its tapered shape, makes it easier for solder balls to pass through the ball-mounting hole 43, reducing the possibility of clogging. This improves the efficiency and reliability of ball mounting.

[0032] Specifically, the pop-out component 45 includes: a pull rod 451, which slides on both sides of one end of the ball-planting frame 41; a telescopic spring 452, which is disposed on both sides inside the end of the ball-planting frame 41 near the pull rod 451 and sleeved on the outside of the pull rod 451; a locking block 453, which slides inside the side of the ball-planting frame 41 near the pull rod 451 and has one end welded to the end of the pull rod 451 that extends into the ball-planting frame 41, and abuts against one end of the telescopic spring 452; a pressure plate 454, which slides inside the end of the ball-planting frame 41 away from the locking block 453 and has one side abutting against one end of the ball-planting steel mesh 42; and a tension spring 455, which is disposed on both sides inside the ball-planting frame 41 near the pressure plate 454 and has one end welded to the side of the pressure plate 454 away from the ball-planting steel mesh 42.

[0033] The components include a pull rod 451 (cylindrical metal), a telescopic spring 452 (cylindrical metal), a locking block 453 (rectangular metal with an angled end away from 451), a pressure plate 454 (rectangular metal), and a tension spring 455 (cylindrical metal). Pulling the pull rod 451 compresses the telescopic spring 452, releasing the locking block 453 from the ball-planting mesh 42. The tension spring 455 then pushes the pressure plate 454, which in turn pushes the ball-planting mesh 42 out of the ball-planting frame 41. This allows for rapid replacement of the ball-planting mesh 42, improving the equipment's adaptability and maintenance efficiency. Example

[0034] Based on Example 2, in order to apply solder paste evenly before ball placement, a scraper assembly 3 is provided on one side of the packaging base 1.

[0035] Specifically, the squeegee assembly 3 includes: a solder paste printing stencil 32, which is disposed inside the coating frame 31 and has matching chip coating holes inside; a squeegee 33, which slides inside the coating frame 31 and has a sloping bottom that contacts the upper surface of the solder paste printing stencil 32; and a toggle block 34, which is disposed on one side of the coating frame 31 and is bolted to one end of the squeegee 33 that extends out of the coating frame 31.

[0036] In this embodiment, the solder paste printing stencil 32, the squeegee 33, and the agitator 34 are all rectangular metal materials. The squeegee 33 slides within the coating frame 31 under the push of the agitator 34. The inclined surface at the bottom of the squeegee 33 scrapes the solder paste, allowing it to adhere to the chip ball placement position through the coating holes of the solder paste printing stencil 32. This achieves uniform solder paste application, improving coating efficiency and quality.

[0037] In actual use, the user first places the chip to be packaged into the inner groove of the chip base 11, then flips the glue application frame 31 over the top of the package base 1, so that the glue application hole of the scraper 33 is aligned with the ball placement position on the upper surface of the chip. At the same time, the top of the snap-fit ​​block 22 will snap into the first snap-fit ​​hole 24, locking the rotation of the glue application frame 31. Then, the user applies solder paste to the upper surface of the ball placement stencil 42. The user slides the scraper 33 back and forth, so that the bottom slope of the push block 34 connected to the scraper 33 scrapes the solder paste from the glue application hole of the ball placement stencil 42 to the chip ball placement position.

[0038] The user then presses the pressing head 21, causing one end of the pressing head 21 to push the locking block 22 towards the chip in the package socket 1. The compression spring 23 is compressed, releasing the rotation lock of the adhesive application frame 31. The user rotates the adhesive application frame 31 to open it, then rotates the ball placement frame 41 to cover the top of the package socket 1. The locking interface on the top of the locking block 22 engages with the inside of the second locking hole 25, locking the rotation of the ball placement frame 41. The tapered pin hole of the ball placement hole 43 is aligned with the adhesive application area for the chip ball placement, and then... The user pours solder balls into the ball-placement frame 41 and onto the upper surface of the ball-placement stencil 42. Then, the user rotates the entire package holder 1 at a slight angle and taps the edge of the ball-placement frame 41 to ensure that the solder balls completely cover the ball-placement holes 43. Due to the larger top and smaller bottom of the ball-placement holes 43 and the nano anti-stick coating, the solder balls will not get stuck in the ball-placement holes 43 and will remain on the chip through the solder paste on the chip. Finally, the user pours out the remaining solder balls from 44, then presses the pressing head 21, and the locking block 22 releases the rotation lock of the ball-placement frame 41, allowing the chip to be removed.

[0039] When it is necessary to change the planting hole 43 of a different diameter, the user can pull the two pull rods 451, the telescopic spring 452 is compressed, the locking block 453 slides to both sides and releases the external locking of one end of the planting steel mesh 42, and at the same time the tension spring 455 opens the reset push plate 454, the pressure plate 454 pushes the planting steel mesh 42 to slide out of the planting frame 41, the planting frame 41 is pushed out and the user can pull out and replace the planting frame 41 with the appropriate diameter planting hole 43.

[0040] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A BGA packaging device comprising an anti-clogging ball-mounting stencil, characterized in that: Includes a package holder (1) and a chip base (11) on top; The snap-fit ​​assembly (2) is set on one side of the encapsulation base (1), including the snap-fit ​​block (22), which slides horizontally on the top side of the encapsulation base (1); The adhesive applicator (3) is located on the top of one side of the encapsulation base (1), including an adhesive applicator frame (31) and hinged at the bottom to the top side of the encapsulation base (1); The ball-planting module (4) is set on top of the encapsulation base (1), with the glue-coating frame (31) on one side next to it. It includes the ball-planting frame (41), which is hinged to the top of the encapsulation base (1) at the bottom, with the glue-coating frame (31) on one side next to it.

2. The BGA packaging device comprising an anti-clogging ball-planting stencil according to claim 1, characterized in that: The snap-fit ​​assembly (2) includes: a pressing head (21) that slides horizontally on the side of the encapsulation base (1) near the snap-fit ​​block (22), with one end extending into the encapsulation base (1) and abutting against the bottom of one side of the snap-fit ​​block (22); A compression spring (23) is disposed inside one side of the encapsulation base (1), and one end is welded to the end of the snap-fit ​​block (22) away from the pressing head (21); The first snap-fit ​​hole (24) is opened at the bottom of the glue application frame (31) near the pressing head (21), and the snap-fit ​​block (22) snaps into the first snap-fit ​​hole (24); The second snap-fit ​​hole (25) is opened at the bottom of the ball planting frame (41) near the pressing head (21), and the snap-fit ​​block (22) is snapped into the second snap-fit ​​hole (25).

3. A BGA packaging device comprising an anti-clogging ball-planting stencil according to claim 1, characterized in that: The ball-planting module (4) includes: a ball-planting steel mesh (42), which slides inside the ball-planting frame (41); The ball-planting holes (43) are opened inside the ball-planting steel mesh (42), and several holes are opened; The discharge chute (44) is located on one side of the ball-planting frame (41); Pop-up components (45) are set on both sides of the planting frame (41).

4. A BGA packaging device comprising an anti-clogging ball-planting stencil according to claim 3, characterized in that: The ball-planting steel mesh (42) has a ball-planting hole (43) with a nano anti-stick coating on the inner surface.

5. A BGA packaging device comprising an anti-clogging ball-planting stencil according to claim 3, characterized in that: The planting hole (43) is a cone shape with a larger upper part and a smaller lower part.

6. A BGA packaging device comprising an anti-clogging ball-planting stencil according to claim 3, characterized in that: The pop-out component (45) includes: a pull rod (451) that slides on both sides of one end of the ball-planting frame (41); The telescopic spring (452) is set on both sides inside the end of the ball planting frame (41) near the pull rod (451) and is sleeved on the outside of the pull rod (451); The first snap-fit ​​block (453) slides inside the ball-planting frame (41) on the side near the pull rod (451), and one end is welded to the end of the pull rod (451) that extends into the ball-planting frame (41) and abuts against one end of the telescopic spring (452); The pressure plate (454) slides inside the end of the ball-planting frame (41) away from the snap-fit ​​block (453), and one side abuts against one end of the ball-planting steel mesh (42); The tension spring (455) is set on both sides of the ball-planting frame (41) near the inside of the pressure plate (454), and one end is welded to the side of the pressure plate (454) away from the ball-planting steel mesh (42).

7. A BGA packaging device comprising an anti-clogging ball-planting stencil according to claim 1, characterized in that: The adhesive scraping assembly (3) includes: a solder paste printing stencil (32), which is set inside the adhesive application frame (31) and has matching chip adhesive application holes inside; The scraper (33) slides inside the glue application frame (31) with its bottom set as an incline and contacts the upper surface of the solder paste printing stencil (32); The actuating block (34) is located on one side of the glue application frame (31) and is bolted to one end of the scraper (33) that extends out of the glue application frame (31).

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