Wafer chucking device for a metrology apparatus

Abstract

The utility model relates to wafer measurement equipment technical field especially for a kind of wafer clamping device of measurement equipment, including chassis, the top middle part of chassis is provided with wafer stage, the top of wafer stage is provided with wafer placing groove, the front side in wafer placing groove inside is provided with fixed base, the front side of fixed base is provided with connecting rod, the front middle part of wafer stage is equipped with first electric push rod, the left and right sides of fixed base are provided with limit block, the inner wall of wafer placing groove is opened with limit slot left and right symmetrical, the top of chassis and located wafer stage's left side is equipped with manipulator, the bottom of wafer stage is equipped with second electric push rod, the upper end of second electric push rod is provided with supporting plate, the above-mentioned design, to be able to when measuring wafer, the fixed, pick-and-place operation of wafer is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of wafer measurement equipment technology, specifically a wafer clamping device for a measurement equipment. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer, or wafer. Domestic wafer production lines mainly use 8-inch and 12-inch wafers, and the main wafer processing methods are wafer fabrication and batch processing, i.e., processing one or more wafers simultaneously. As semiconductor feature sizes become smaller and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. Simultaneously, the reduction in feature size increases the impact of airborne particles on the quality and reliability of the processed wafer, and with improved cleanliness, the particle count also exhibits new data characteristics.

[0003] Currently, after wafers are processed, they need to be measured. However, it is inconvenient to fix and handle the wafers during measurement. Utility Model Content

[0004] The purpose of this invention is to provide a wafer clamping device for a measurement equipment to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A wafer gripping device for a metrology equipment includes a base frame, a wafer stage disposed at the top center of the base frame, a wafer placement slot disposed at the top of the wafer stage, a fixing seat disposed at the front side inside the wafer placement slot, a connecting rod disposed at the front side of the fixing seat, a first electric push rod mounted at the center of the front of the wafer stage, limit blocks disposed on the left and right sides of the fixing seat, limit slots symmetrically formed on the inner wall of the wafer placement slot, a robot arm mounted at the top of the base frame and on the left side of the wafer stage, a second electric push rod mounted at the bottom of the wafer stage, and a support plate disposed at the upper end of the second electric push rod.

[0007] As a preferred embodiment of this utility model, the arc surface of the fixing base and the arc surface of the wafer placement slot are adapted to the wafer, and the connection between the wafer and the wafer placement slot is a sliding connection.

[0008] As a preferred embodiment of this utility model, the front half of the wafer placement slot is designed with a square structure, and the connection between the fixing base and the wafer placement slot is a sliding connection;

[0009] As a preferred embodiment of this utility model, the connecting rod is connected to the drive shaft of the first electric push rod via a coupling, the connecting rod is connected to the fixed base by fixed welding, the drive shaft of the first electric push rod passes through the wafer stage, and the drive shaft of the first electric push rod is connected to the wafer stage by sliding connection.

[0010] As a preferred embodiment of this utility model, the limiting block and the limiting groove are adapted to each other in shape and structure, and the limiting block and the limiting groove are connected by a sliding connection.

[0011] The above technical solution allows for convenient fixing of the wafer on the wafer stage during wafer measurement.

[0012] As a preferred embodiment of this utility model, the drive shaft of the second electric push rod passes through the wafer stage, and the connection between the drive shaft of the second electric push rod and the wafer stage is a sliding connection.

[0013] In a preferred embodiment of this invention, the diameter of the tray is smaller than the diameter of the wafer;

[0014] The above technical solution allows for easy removal of the wafer from the wafer carrier after wafer measurement is completed.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. In this utility model, the wafer placement slot, fixing seat, connecting rod, first electric push rod, limiting block, and limiting slot can conveniently fix the wafer on the wafer stage when measuring the wafer. The robotic arm, second electric push rod, and tray can conveniently remove the wafer from the wafer stage after the wafer measurement is completed. In summary, the design facilitates the fixing and placement of the wafer when measuring the wafer. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the wafer stage structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the fixed base, connecting rod, and first electric push rod of this utility model;

[0020] Figure 4 This is a schematic diagram of the second electric push rod and support plate structure of this utility model.

[0021] In the diagram: 1. Base frame; 2. Wafer stage; 3. Wafer placement slot; 4. Fixing base; 5. Connecting rod; 6. First electric push rod; 7. Limiting block; 8. Limiting slot; 9. Robotic arm; 10. Second electric push rod; 11. Pallet. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, and several embodiments of the utility model will be provided. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and complete.

[0024] For examples, please refer to Figure 1-4 This utility model provides a technical solution:

[0025] A wafer gripping device for a measurement equipment includes a base frame 1, a wafer stage 2 is provided at the top center of the base frame 1, and a wafer placement slot 3 is provided at the top of the wafer stage 2.

[0026] The wafer placement slot 3 has a fixed base 4 on its front side, a connecting rod 5 on its front side, a first electric push rod 6 on the center of the front of the wafer stage 2, limit blocks 7 on the left and right sides of the fixed base 4, and symmetrical limit grooves 8 on the inner wall of the wafer placement slot 3. A robot arm 9 is installed on the top of the base frame 1 and on the left side of the wafer stage 2, and a second electric push rod 10 is installed on the bottom of the wafer stage 2. A support plate 11 is installed on the upper end of the second electric push rod 10. The wafer placement slot 3, fixed base 4, connecting rod 5, first electric push rod 6, limit blocks 7, and limit grooves 8 facilitate the fixing of the wafer on the wafer stage 2 during wafer measurement. The robot arm 9, second electric push rod 10, and support plate 11 facilitate the removal of the wafer from the wafer stage 2 after the wafer measurement is completed. In summary, the design facilitates the fixing and removal of the wafer during measurement.

[0027] In this embodiment, the arc surface of the fixing base 4 and the arc surface of the wafer placement slot 3 are adapted to the wafer, and the wafer is connected to the wafer placement slot 3 by a sliding connection. The front half of the wafer placement slot 3 has a square structure design, and the fixing base 4 is connected to the wafer placement slot 3 by a sliding connection. The connecting rod 5 is connected to the drive shaft of the first electric push rod 6 through a coupling, and the connecting rod 5 is connected to the fixing base 4 by fixed welding. The drive shaft of the first electric push rod 6 passes through the wafer stage 2, and the drive shaft of the first electric push rod 6 is connected to the wafer stage 2 by a sliding connection. The shape and structure of the limiting block 7 and the limiting slot 8 are adapted to each other, and the limiting block 7 is connected to the limiting slot 8 by a sliding connection. This allows the wafer to be easily fixed on the wafer stage when measuring the wafer.

[0028] In this embodiment, the drive shaft of the second electric push rod 10 passes through the wafer stage 2, and the connection between the drive shaft of the second electric push rod 10 and the wafer stage 2 is a sliding connection. The diameter of the tray 11 is smaller than the diameter of the wafer, which allows the wafer to be easily removed from the wafer stage after the wafer measurement is completed.

[0029] The workflow of this utility model is as follows: When using the wafer gripping device of the measurement equipment designed in this scheme, the robotic arm 9 first grips and places the wafer into the wafer placement slot 3. Then, the first electric push rod 6 is activated to push the fixing seat 4 backward. At this time, the fixing seat 4 will slide within the wafer placement slot 3, and the limiting block 7 will also slide within the limiting slot 8. Then, the fixing seat 4 will fix the wafer in the wafer placement slot 3. Then, the measurement equipment can be started to measure the wafer. After the measurement is completed, the first electric push rod 6 is activated to pull the fixing seat 4 forward. The second electric push rod 10 is activated to push the wafer out of the wafer placement slot 3. Finally, the robot arm 9 is activated to clamp and remove the wafer. The wafer placement slot 3, fixing base 4, connecting rod 5, first electric push rod 6, limiting block 7, and limiting slot 8 can be set up to fix the wafer on the wafer stage 2 during wafer measurement. The robot arm 9, second electric push rod 10, and tray 11 can be set up to remove the wafer from the wafer stage 2 after the wafer measurement is completed. In summary, the design facilitates the fixing and removal of the wafer during wafer measurement.

[0030] The first electric push rod 6, the robotic arm 9, and the second electric push rod 10 used in this utility model are all existing known electrical devices, and all can be purchased and used directly on the market. Their structure, circuit, and control principle are all existing known technologies. Therefore, the structure, circuit, and control principle of the first electric push rod 6, the robotic arm 9, and the second electric push rod 10 will not be described in detail here.

[0031] All standard parts used in this application can be purchased from the market. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art and are also general components, which are common knowledge in this field.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer clamping device for a measurement apparatus, comprising a base frame (1), characterized in that: A wafer stage (2) is provided at the top center of the base frame (1). A wafer placement slot (3) is provided at the top of the wafer stage (2). A fixing seat (4) is provided on the front side inside the wafer placement slot (3). A connecting rod (5) is provided on the front side of the fixing seat (4). A first electric push rod (6) is installed at the center of the front of the wafer stage (2). Limiting blocks (7) are provided on the left and right sides of the fixing seat (4). Limiting slots (8) are symmetrically opened on the inner wall of the wafer placement slot (3). A robot arm (9) is installed at the top of the base frame (1) and on the left side of the wafer stage (2). A second electric push rod (10) is installed at the bottom of the wafer stage (2). A support plate (11) is provided at the upper end of the second electric push rod (10).

2. The wafer clamping device of a measurement equipment according to claim 1, characterized in that: The arc surface of the fixed base (4) and the arc surface of the wafer placement slot (3) are adapted to the wafer, and the wafer and the wafer placement slot (3) are connected by a sliding connection.

3. The wafer clamping device of a measurement equipment according to claim 1, characterized in that: The front half of the wafer placement slot (3) is designed with a square structure, and the connection between the fixing seat (4) and the wafer placement slot (3) is a sliding connection.

4. The wafer clamping device of a measurement equipment according to claim 1, characterized in that: The connecting rod (5) is connected to the drive shaft of the first electric push rod (6) through a coupling. The connection between the connecting rod (5) and the fixed seat (4) is fixed welding. The drive shaft of the first electric push rod (6) passes through the wafer stage (2), and the connection between the drive shaft of the first electric push rod (6) and the wafer stage (2) is a sliding connection.

5. The wafer clamping device of a measurement equipment according to claim 1, characterized in that: The limiting block (7) and the limiting groove (8) are adapted to each other in shape and structure, and the limiting block (7) and the limiting groove (8) are connected by a sliding connection.

6. The wafer clamping device of a measurement equipment according to claim 1, characterized in that: The drive shaft of the second electric push rod (10) passes through the wafer stage (2), and the connection between the drive shaft of the second electric push rod (10) and the wafer stage (2) is a sliding connection.

7. The wafer clamping device of a measurement equipment according to claim 1, characterized in that: The diameter of the tray (11) is smaller than the diameter of the wafer.

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