A kind of fixture for chip wafer production processing

Abstract

The utility model relates to the technical field of semiconductor manufacturing, concretely to a chip wafer production and processing clamp, include: bearing platform, adjusting assembly, including slide rail and sliding block, slide rail is connected with ground through bolt, slide rail sets up at both sides of bearing platform, sliding block is connected with slide rail slidingly, fixed component, including drive assembly and driven assembly, drive assembly is connected on the side wall of sliding block through bolt, driven assembly includes rotating block, support sleeve, sliding sleeve and clamping plate, rotating block is connected with sliding block rotatably, support sleeve is welded with rotating block, sliding sleeve is connected with support sleeve slidingly, clamping plate is connected with sliding sleeve through bolt, this clamp moves fixed component through adjusting assembly, and the cooperation of drive and driven assembly realizes accurate positioning and stable clamping to wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a jig for chip wafer production and processing. Background Technology

[0002] In the semiconductor chip manufacturing process, wafers, as the core substrate, need to undergo multiple precision processing steps such as cutting, grinding, and photolithography. Because wafers are brittle, thin, and require extremely high surface precision, they must be stably held by specialized fixtures during processing to avoid wafer breakage or surface damage due to positioning deviations or improper clamping force.

[0003] A search revealed existing technology (application number: CN214226899U), which describes a "wafer fixture". This utility model uses a tray to press the wafer onto a sealing element, and a positioning element is positioned by fitting the wafer's peripheral edge with a limiting surface. Before the tray is pressed down, the wafer is detached from the positioning element, thereby achieving wafer fixation.

[0004] However, the device lacks the precise position adjustment function achieved by the adjustment components and the cooling effect brought by the air passage structure. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a jig for chip wafer manufacturing and processing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a jig for chip wafer manufacturing and processing, comprising: a support platform; an adjustment component, including a slide rail and a sliding block, wherein the slide rail is connected to the ground by bolts and is disposed on both sides of the support platform, and the sliding block is slidably connected to the slide rail; and a fixing component, including a driving component and a driven component, wherein the driving component is bolted to the side wall of the sliding block, and the driven component includes a rotating block, a support sleeve, a sliding sleeve, and a clamping plate, wherein the rotating block is rotatably connected to the sliding block, the support sleeve is welded to the rotating block, the sliding sleeve is slidably connected to the support sleeve, and the clamping plate is disposed on one side of the sliding sleeve.

[0007] As a further description of the above technical solution:

[0008] The bearing platform has grooves on both sides, and the grooves are slidably connected to the clamping plate.

[0009] As a further description of the above technical solution:

[0010] The adjustment assembly further includes: a second drive motor, which is bolted to the top of the slide rail; and an adjustment screw, which is rotatably connected inside the slide rail, fixedly connected to the output shaft of the second drive motor, and threadedly connected to the sliding block.

[0011] As a further description of the above technical solution:

[0012] The drive assembly includes: an air pump, which is bolted to the side wall of the sliding block; and a drive motor, which is bolted to the sliding block, with its output shaft fixedly connected to the rotating block.

[0013] As a further description of the above technical solution:

[0014] A venting groove is provided on the side wall of the sliding block. The venting groove is trapezoidal, and the inner diameter of the venting groove gradually decreases from the side closer to the air pump to the side farther away from the air pump. The venting groove is connected to the air outlet of the air pump.

[0015] As a further description of the above technical solution:

[0016] The driven component further includes: a cylinder, disposed inside the support sleeve and the sliding sleeve, one end of which is bolted to the rotating block and the other end of which is welded to the inner wall of the sliding sleeve; a connecting plate, which is bolted to the side wall of the sliding sleeve and welded to the clamping plate; and a soft pad, which is adhered to the side wall of the connecting plate.

[0017] As a further description of the above technical solution:

[0018] The rotating block, support sleeve, sliding sleeve, connecting plate, soft pad, and clamping plate are all equipped with ventilation pipes. There are two sets of ventilation pipes, one end of which is connected to the ventilation groove of the sliding block, and the other end is in contact with the side wall of the wafer.

[0019] This utility model has the following beneficial effects:

[0020] This fixture moves the fixed component by adjusting the component, and the combination of the drive and driven components enables precise positioning and stable clamping of the wafer. At the same time, the clamping force is adjusted by the extension and retraction of the cylinder, and the soft pad cushions to prevent damage to the wafer.

[0021] In addition, the airflow generated by the air pump is delivered to the wafer sidewall through the ventilation structure, which can cool the clamping area, thus improving the safety of the wafer processing while ensuring the clamping firmness. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the structure of the adjustment component of this utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the fixing component of this utility model;

[0025] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0026] Legend:

[0027] 1. Supporting platform; 11. Groove; 2. Adjusting component; 21. Slide rail; 22. Drive motor II; 23. Adjusting screw; 24. Sliding block; 3. Fixing component; 31. Drive component; 311. Air pump; 312. Drive motor I; 32. Driven component; 321. Rotating block; 322. Support sleeve; 323. Sliding sleeve; 324. Cylinder; 325. Connecting plate; 326. Soft pad; 327. Clamping plate; 328. Air pipe. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Example 1:

[0032] like Figures 1 to 3As shown, this embodiment provides a jig for chip wafer manufacturing and processing, including: a support platform 1; an adjustment component 2, including a slide rail 21 and a sliding block 24, the slide rail 21 being connected to the ground by bolts and disposed on both sides of the support platform 1, the sliding block 24 being slidably connected to the slide rail 21; and a fixing component 3, including a drive component 31 and a driven component 32, the drive component 31 being bolted to the side wall of the sliding block 24, the driven component 32 including a rotating block 321, a support sleeve 322, a sliding sleeve 323, and a clamping plate 327, the rotating block 321 being rotatably connected to the sliding block 24, the support sleeve 322 being welded to the rotating block 321, the sliding sleeve 323 being slidably connected to the support sleeve 322, and the clamping plate 327 being disposed on one side of the sliding sleeve 323.

[0033] The adjusting component 2 and the fixing component 3 are each provided in two sets, and the clamping plates 327 are two in each set.

[0034] Specifically, the bearing platform 1 has grooves 11 on both sides, and the grooves 11 are slidably connected to the clamping plate 327.

[0035] In this embodiment, the support platform 1, the adjustment component 2, and the fixing component 3 constitute a jig for chip wafer manufacturing and processing according to this application.

[0036] Understandable, Figure 1 The illustration only shows some components of the wafer fabrication fixture; the actual shape, size, position, and structure of these components are not subject to change. Figure 1 Due to limitations, wafer fabrication fixtures can also include, compared to... Figure 1 More or fewer parts.

[0037] Example 2:

[0038] Specifically, the adjustment component 2 also includes: a second drive motor 22, which is bolted to the top of the slide rail 21; and an adjustment screw 23, which is rotatably connected inside the slide rail 21, fixedly connected to the output shaft of the second drive motor 22, and threadedly connected to the sliding block 24.

[0039] In this embodiment, the second drive motor 22 drives the adjusting screw 23 to rotate, causing the sliding block 24 to slide along the slide rail 21, thereby precisely adjusting the position of the fixing component 3.

[0040] Example 3:

[0041] Specifically, the drive assembly 31 includes: an air pump 311, which is bolted to the side wall of the sliding block 24; a drive motor 312, which is bolted to the sliding block 24, and whose output shaft is fixedly connected to the rotating block 321.

[0042] Specifically, a ventilation groove is provided on the side wall of the sliding block 24. The ventilation groove is trapezoidal, and the inner diameter of the ventilation groove gradually decreases from the side closer to the air pump 311 to the side farther away from the air pump 311. The ventilation groove is connected to the air outlet of the air pump 311.

[0043] Specifically, the driven component 32 also includes: a cylinder 324, which is disposed inside the support sleeve 322 and the sliding sleeve 323, with one end connected to the rotating block 321 by bolts and the other end welded to the inner wall of the sliding sleeve 323; a connecting plate 325, which is connected to the side wall of the sliding sleeve 323 by bolts and welded to the clamping plate 327; and a soft pad 326, which is adhered to the side wall of the connecting plate 325.

[0044] In addition, the sidewalls of cushion 326 are curved.

[0045] Specifically, the rotating block 321, the support sleeve 322, the sliding sleeve 323, the connecting plate 325, the soft pad 326 and the clamping plate 327 are all provided with ventilation pipes 328. There are two sets of ventilation pipes 328, one end of which is connected to the ventilation groove of the sliding block 24, and the other end is in contact with the side wall of the wafer.

[0046] In this embodiment, the drive motor 312 drives the rotating block 321 to rotate, the air pump 311 provides airflow, and guides the airflow output by the air pump 311 into the ventilation pipe 328. The cylinder 324 extends and retracts, causing the sliding sleeve 323 to slide, so that the clamping plate 327 approaches or moves away from the wafer. The soft pad 326 contacts the wafer, buffers the clamping force, avoids damage to the wafer, and enhances the clamping firmness. The airflow flows through the ventilation groove and ventilation pipe 328, adsorbs the wafer, and cools the clamping part.

[0047] In actual use, the operator first starts drive motor 22 via the PLC controller. Drive motor 22 drives adjusting screw 23 to rotate within slide rail 21, causing sliding block 24 to descend. Sliding block 24 then moves clamping plate 327 to groove 11. The wafer is then placed on the support platform 1. Next, air pump 311 is started, causing gas to flow along ventilation pipe 328, thus adsorbing and fixing the wafer on the support platform 1. If processing is required on the other side of the wafer, drive motor 22 can be started to move sliding block 24... Raise the wafer, then turn off the air pump 311, start the cylinder 324 to make the soft pad 326 adhere to the side wall of the wafer, then start the drive motor 312 to make the rotating block 321 rotate 180 degrees, so that the other ventilation pipe 328 connects to the ventilation groove of the sliding block 24, then start the cylinder 324 to make the wafer fall onto another clamping plate 327, then start the air pump 311 to make the wafer be adsorbed and fixed on the clamping plate 327, then start the drive motor 22 to make the clamping plate 327 descend to the groove 11, and fix the wafer on the support platform 1.

[0048] Drive motor 312, drive motor 22, air pump 311 and cylinder 324 are all electrically connected to the PLC controller. The PLC controller is electrically connected to an external power supply. The PLC controller facilitates the power supply control of the electrical equipment, allowing the equipment to be powered on when needed, thus avoiding the situation where power cannot be supplied when needed.

[0049] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A fixture for chip wafer manufacturing and processing, characterized in that: include: Platform (1); The adjustment component (2) includes a slide rail (21) and a sliding block (24). The slide rail (21) is connected to the ground by bolts. The slide rail (21) is set on both sides of the bearing platform (1). The sliding block (24) is slidably connected to the slide rail (21). The fixed component (3) includes a drive component (31) and a driven component (32). The drive component (31) is bolted to the side wall of the sliding block (24). The driven component (32) includes a rotating block (321), a support sleeve (322), a sliding sleeve (323), and a clamping plate (327). The rotating block (321) is rotatably connected to the sliding block (24). The support sleeve (322) is welded to the rotating block (321). The sliding sleeve (323) is slidably connected to the support sleeve (322). The clamping plate (327) is disposed on one side of the sliding sleeve (323).

2. The jig for chip wafer manufacturing and processing according to claim 1, characterized in that: The bearing platform (1) has grooves (11) on both sides, and the grooves (11) are slidably connected to the clamping plate (327).

3. The jig for chip wafer manufacturing and processing according to claim 1, characterized in that: The adjustment component (2) further includes: Drive motor 2 (22) is bolted to the top of slide rail (21); The adjusting screw (23) is rotatably connected inside the slide rail (21), fixedly connected to the output shaft of the second drive motor (22), and threadedly connected to the sliding block (24).

4. The jig for chip wafer manufacturing and processing according to claim 1, characterized in that: The driving component (31) includes: An air pump (311) is bolted to the side wall of the sliding block (24); The drive motor (312) is connected to the sliding block (24) by bolts, and the output shaft is fixedly connected to the rotating block (321).

5. A jig for chip wafer manufacturing and processing according to claim 1, characterized in that: The sliding block (24) has a ventilation groove on its side wall. The ventilation groove is trapezoidal and its inner diameter gradually decreases from the side closer to the air pump (311) to the side farther away from the air pump (311). The ventilation groove is connected to the air outlet of the air pump (311).

6. A jig for chip wafer manufacturing and processing according to claim 1, characterized in that: The driven component (32) further includes: The cylinder (324) is located inside the support sleeve (322) and the sliding sleeve (323). One end is connected to the rotating block (321) by bolts, and the other end is welded to the inner wall of the sliding sleeve (323). The connecting plate (325) is bolted to the side wall of the sliding sleeve (323) and welded to the clamping plate (327); The pad (326) is adhered to the side wall of the connecting plate (325).

7. A jig for chip wafer manufacturing and processing according to claim 1, characterized in that: The rotating block (321), the support sleeve (322), the sliding sleeve (323), the connecting plate (325), the soft pad (326), and the clamping plate (327) are all equipped with ventilation pipes (328). There are two sets of ventilation pipes (328), one end of which is connected to the ventilation groove of the sliding block (24), and the other end is in contact with the side wall of the wafer.

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