A kind of auxiliary jig for adsorbing warped wafer

Abstract

The application relates to the technical field of adsorption table devices, in particular to an auxiliary jig for adsorbing a warped wafer, which comprises a main body frame, the main body frame is provided with a plurality of pressing rings, and the pressing rings are concentrically arranged; the pressing ring is provided with a pressing piece for pressing a wafer, the pressing piece comprises a pressing tube connected to the pressing ring and a pressing head arranged at the end of the pressing tube, and the at least outer surface of the pressing head is made of flexible material; the direction perpendicular to the surface of the pressing ring is an adjusting direction, and the pressing tube is movably connected to the pressing ring along the adjusting direction. The application has the following effects: a plurality of pressing heads are arranged on the pressing ring, and a plurality of concentric pressing rings are arranged to form cooperative pressing in the radial direction; the length of the pressing tube in the radial direction is different, when the main frame body is moved, different pressing degrees can be formed, and therefore a more convenient auxiliary adsorption effect can be formed.

Description

Technical Field

[0001] This application relates to the technical field of adsorption stage devices, and in particular to an auxiliary fixture for adsorbing warped wafers. Background Technology

[0002] In semiconductor processing, wafers need to be placed in a fixed position for manipulation. Wafer adsorption stages are primarily used to place and hold wafers. Tweezers or a robotic arm are used to position the wafer in the center of the stage. For the adsorption stage to hold the wafer securely, the wafer must cover the adsorption grooves and vents on the stage. A vacuum pump creates negative pressure to ensure the stage's grip on the wafer.

[0003] However, in practice, wafers are warped, meaning that the outer edge of the wafer cannot fit well against the adsorption stage, resulting in poor edge adsorption. Therefore, at present, it is necessary to manually press the edge to make the warped part of the wafer close to the adsorption stage to ensure the adsorption effect. However, the overall operation efficiency is not high and needs to be optimized. Utility Model Content

[0004] In order to more conveniently press the warped wafer and make it adhere and adsorb onto the adsorption stage, this application provides an auxiliary fixture for adsorbing the warped wafer.

[0005] This application provides an auxiliary fixture for adsorbing warped wafers, which adopts the following technical solution: an auxiliary fixture for adsorbing warped wafers includes a main frame, wherein the main frame is provided with a plurality of pressure rings, and the plurality of pressure rings are concentrically arranged; The pressure ring is provided with a contact element for contacting the wafer. The contact element includes a contact tube connected to the pressure ring and a contact head disposed at the end of the contact tube. At least the outer surface of the contact head is made of a flexible material. The direction perpendicular to the surface of the pressure ring is the adjustment direction, and the contact tube is movably connected to the pressure ring along the adjustment direction.

[0006] By adopting the above technical solution, by setting multiple contact points on the pressure ring, and cooperating with several concentrically arranged pressure rings to form a radially coordinated contact, and by differentiating the radial length of the contact tube, different degrees of pressure can be formed when the main frame is moved, thus forming a more convenient auxiliary adsorption effect.

[0007] Preferably, the contact head has a connecting rod extending into the contact tube, the end of the connecting rod has a piston, and a spring is provided inside the contact tube to abut against the piston.

[0008] By adopting the above technical solution, the presence of the spring can create a buffering effect during the contact process, avoiding complete hard contact and thus protecting the wafer.

[0009] Preferably, an adjusting block is threadedly connected to the end of the abutment tube away from the abutment head, and the adjusting block abuts against the end of the spring.

[0010] By adopting the above technical solution, the preload of the spring can be adjusted by turning the adjusting block according to the actual situation, thus adapting to different situations.

[0011] Preferably, the end of the contact tube furthest from the contact head is open.

[0012] By adopting the above technical solution, it can be directly inserted into the contact tube to directly operate the adjusting block.

[0013] Preferably, the pressure ring has a threaded groove for abutting the pipe thread connection.

[0014] By adopting the above technical solution, the rotating contact tube can achieve its movement in the adjustment direction, thereby controlling the extension distance on different pressure rings.

[0015] Preferably, a blocking sleeve is detachably connected to the side of the pressure ring away from the contact head. The outer wall of the blocking sleeve has a protruding ring for abutting against the surface of the pressure ring, and the blocking sleeve is used to abut against the end of the contact tube.

[0016] By adopting the above technical solution, in order to prevent uneven length of the contact tube on the pressure ring, the rotation distance of the contact tube is limited by the blocking sleeve. When the contact tube rotates and abuts against the end of the blocking sleeve, its final position can be limited.

[0017] Preferably, the blocking sleeve is threadedly connected to the threaded groove; or the convex ring is bolted to the pressure ring, and the blocking sleeve is inserted into the threaded groove.

[0018] By adopting the above technical solution, the blocking sleeve can be connected by threads or fixed directly by bolts.

[0019] Preferably, it also includes a guide rod fixedly connected to the adsorption stage, and the main frame has a guide hole through which the guide rod passes.

[0020] By adopting the above technical solution, the presence of the guide rod, in conjunction with the guide hole, can limit the movement process of the main frame.

[0021] Preferably, the pressure ring has a plurality of threaded grooves evenly distributed along the circumference, and the contact tube is evenly distributed in some or all of the threaded grooves.

[0022] By adopting the above technical solution, the specific contact points can be fitted with corresponding contact pipes according to the actual situation.

[0023] In summary, this application includes at least one of the following beneficial technical effects: by setting multiple contact heads on the pressure ring, and simultaneously cooperating with several concentrically arranged pressure rings to form a radially coordinated contact, and by differentiating the radial length of the contact tube, different degrees of pressure can be formed when the main frame is moved, thus forming a more convenient auxiliary adsorption effect. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 This is a partial sectional view of this application; Figure 3 This is a partial explosion diagram of this application.

[0025] Explanation of reference numerals in the attached drawings: 100, main frame; 110, pressure ring; 111, contact tube; 112, contact head; 113, connecting rod; 114, spring; 115, piston; 120, threaded groove; 121, adjusting block; 122, linkage plate; 123, blocking sleeve; 124, convex ring; 200, guide rod; 210, guide hole. Detailed Implementation

[0026] The present application will be further described in detail below with reference to the accompanying drawings.

[0027] This application discloses an auxiliary fixture for adsorbing warped wafers, referring to... Figure 1 The system includes a main frame 100, which is provided with a plurality of pressure rings 110, which are concentrically arranged. The main frame 100 is a cross-shaped structure. The pressure rings 110 are spaced apart from the inside out, and the spacing may be the same or different. This embodiment only shows two concentrically arranged pressure rings 110. Furthermore, the pressure rings 110 are integrally mounted on the main frame 100.

[0028] In other embodiments, the pressure ring 110 may also be detachably connected to the main frame 100, for example, by bolts. This allows for adjustment of the radial position of the pressure ring 110, or to accommodate different numbers of pressure rings 110, by setting different connection points on the main frame 100 accordingly.

[0029] Reference Figure 2 , Figure 3 The pressure ring 110 is provided with a contact element for contacting the wafer. The contact element includes a contact tube 111 connected to the pressure ring 110 and a contact head 112 disposed at the end of the contact tube 111. At least the outer surface of the contact head 112 is made of a flexible material. In this embodiment, the outer surface of the contact head 112 is covered with a silicone layer (not shown in the figure) to provide protection when contacting the wafer.

[0030] The direction perpendicular to the annular surface of the pressure ring 110 is the adjustment direction, and the contact tube 111 is movably connected to the pressure ring 110 along the adjustment direction. In this embodiment, the pressure ring 110 has threaded grooves 120 for threaded connection of the contact tube 111. Furthermore, the pressure ring 110 has several threaded grooves 120 evenly distributed circumferentially, and the contact tube 111 is evenly distributed within some or all of the threaded grooves 120. In this embodiment, the pressure ring 110 has eight threaded grooves 120, but the contact tube 111 is installed in only four of the threaded grooves 120. The outer wall of the contact tube 111 is threaded into the threaded grooves 120.

[0031] The specific reason is that, depending on the different requirements for resistance, different numbers of resistance points can be set. Of course, in general, the resistance points are evenly distributed along the circumference, but there are exceptions where there may be individual resistance points.

[0032] The contact head 112 has a connecting rod 113 extending into the contact tube 111. The end of the connecting rod 113 has a piston 115, and a spring 114 is disposed inside the contact tube 111, abutting against the piston 115. The end of the contact tube 111 away from the contact head 112 is open. An adjusting block 121 is threadedly connected to the open end. In this embodiment, one end of the spring 114 abuts against the piston 115, and the other end abuts against the adjusting block 121. The adjusting block 121 has a groove, allowing it to be rotated using a tool, thereby moving the adjusting block 121 closer to or further away from the piston 115 to fine-tune the preload of the spring 114.

[0033] For different radial pressure rings 110, the corresponding contact tubes 111 are located in different positions within the threaded groove 120. For example, the outermost contact tubes 111 are generally located at a greater distance from the pressure rings 110, so the position of the contact tubes 111 on the entire pressure ring 110 needs to be adjusted.

[0034] To standardize the distance between the various contact tubes 111, in this embodiment, a blocking sleeve 123 is detachably connected to the side of the pressure ring 110 away from the contact head 112. The outer wall of the blocking sleeve 123 has a protruding ring 124 for abutting against the surface of the pressure ring 110, and the blocking sleeve 123 is used to abut against the end of the contact tube 111. That is, different blocking sleeves 123 can be installed for different distance requirements, the specific difference being the extension length of the blocking sleeve 123 within the threaded groove 120. In this embodiment, the blocking sleeve 123 is also threaded into the threaded groove 120. When the protruding ring 124 abuts against the upper side of the pressure ring 110, the distance will be limited. At this time, after the contact tube 111 is tightened, its end will abut against the blocking sleeve 123, thereby limiting the distance of the contact tube 111 in the adjustment direction.

[0035] In other embodiments, the protruding ring 124 can be directly fixed to the pressure ring 110 by bolts, while the blocking sleeve 123 is inserted into the threaded groove 120 without being connected by threads.

[0036] It is worth noting that, in order to facilitate fine-tuning of the preload of the spring 114, since both ends of the blocking sleeve 123 are also through-holes, it can also be directly inserted into the contact tube 111 using a tool, thereby directly acting on the adjusting block 121. Furthermore, in this embodiment, the side of the adjusting block 121 closest to the spring 114 is configured with a rotatable linkage plate 122. The purpose of this is to ensure that, during the rotation of the adjusting block 121, it rotates relative to the linkage plate 122, thereby avoiding any torsional effect on the spring 114.

[0037] Furthermore, to facilitate vertical pressing against the upper side of the wafer, the outer end of the main body frame 100 in this embodiment has a guide hole 210. A guide rod 200 is inserted into the guide hole 210 and will be fixed to the adsorption stage. Before pressing down, the guide rod 200 is inserted into the guide hole 210 to ensure the overall stability and directional movement of the pressing ring 110.

[0038] The implementation principle of this application embodiment is as follows: First, determine the number of pressure rings 110 to be set according to this batch of wafers. In this embodiment, two pressure rings 110 are used as an example. Then, according to the actual situation, install blocking sleeves 123 on the inner and outer pressure rings 110 to limit the extension distance of the contact tube 111 in the adjustment direction.

[0039] The contact tube 111 is rotated and tightened into the threaded groove 120, and then abuts against the end of the blocking sleeve 123. At this time, the contact tubes 111 on the same pressure ring 110 will have the same exposed length. The guide rod 200 is then installed on the adsorption stage. The guide rod 200 passes through the guide hole 210 and can be driven by an external cylinder, hydraulic cylinder, or manual operation to move the main frame 100 toward the wafer set on the adsorption stage. The contact head 112 abuts against the wafer to overcome warping. The synchronous spring 114 is compressed to achieve a gentler pressure, allowing the adsorption stage to better adsorb the wafer.

[0040] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An auxiliary fixture for adsorbing warped wafers, comprising a main frame (100), characterized in that: The main frame (100) is provided with a plurality of pressure rings (110), and the plurality of pressure rings (110) are arranged concentrically; The pressure ring (110) is provided with a contact element for contacting the wafer. The contact element includes a contact tube (111) connected to the pressure ring (110) and a contact head (112) disposed at the end of the contact tube (111). The contact head (112) is at least made of a flexible material on its outer surface. The direction perpendicular to the ring surface of the pressure ring (110) is the adjustment direction, and the contact tube (111) is movably connected to the pressure ring (110) in a positionable manner along the adjustment direction.

2. The auxiliary fixture for adsorbing warped wafers according to claim 1, characterized in that: The contact head (112) has a connecting rod (113) that passes through the contact tube (111), and the end of the connecting rod (113) has a piston (115). A spring (114) that abuts against the piston (115) is provided inside the contact tube (111).

3. The auxiliary fixture for adsorbing warped wafers according to claim 2, characterized in that: The end of the abutment tube (111) away from the abutment head (112) is threaded with an adjusting block (121), which abuts against the end of the spring (114).

4. The auxiliary fixture for adsorbing warped wafers according to claim 3, characterized in that: The end of the contact tube (111) away from the contact head (112) is open.

5. The auxiliary fixture for adsorbing warped wafers according to claim 4, characterized in that: The pressure ring (110) has a threaded groove (120) for threaded connection of the pressure tube (111).

6. The auxiliary fixture for adsorbing warped wafers according to claim 5, characterized in that: The side of the pressure ring (110) away from the contact head (112) is detachably connected to a blocking sleeve (123). The outer wall of the blocking sleeve (123) has a protruding ring (124) for abutting against the surface of the pressure ring (110). The blocking sleeve (123) is used to abut against the end of the contact tube (111).

7. The auxiliary fixture for adsorbing warped wafers according to claim 6, characterized in that: The blocking sleeve (123) is threaded to the threaded groove (120); or the convex ring (124) is bolted to the pressure ring (110), and the blocking sleeve (123) is inserted into the threaded groove (120).

8. The auxiliary fixture for adsorbing warped wafers according to claim 1, characterized in that: It also includes a guide rod (200) fixedly connected to the adsorption stage, and the main frame (100) has a guide hole (210) through which the guide rod (200) passes.

9. The auxiliary fixture for adsorbing warped wafers according to claim 1, characterized in that: The pressure ring (110) has a number of threaded grooves (120) evenly distributed in the circumferential direction, and the contact tube (111) is evenly distributed in some or all of the threaded grooves (120).

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