Gripping device and heat treatment apparatus

Abstract

The application provides a clamping device and a heat treatment equipment. The clamping device is used for fixing a wafer to be treated and comprises a support and at least three clamping assemblies. The support is a hollow structure and has a notch, the notch being communicated with an inner chamber of the support and being used for allowing a component for clamping the wafer to be treated to pass through; the at least three clamping assemblies are arranged on the support in a spaced manner and enclose a clamping space; each clamping assembly has a clamping part, and the clamping part is capable of moving towards or away from the center of the clamping space to adjust the size of the clamping space. The application can fix wafers to be treated with different sizes, thereby improving the versatility and flexibility of the heat treatment equipment.

Description

Technical Field

[0001] This application relates to the technical field of heat treatment equipment, and more particularly to a clamping device and heat treatment equipment. Background Technology

[0002] In the fabrication process of semiconductor devices, the thermal treatment of the wafer is an extremely important step. For example, the wafer is usually fixed on the heating plate of the thermal treatment equipment and heated by heat conduction.

[0003] Since both the heating plate and the wafer to be processed have smooth surfaces, tools such as tweezers or clamps are difficult to insert between them and can cause adverse effects on the wafer, such as chipping, scratching, or uneven heating. Related technologies typically incorporate lifting pins on the heating plate to facilitate the safe and stable handling of the wafer by robotic arms or other gripping devices.

[0004] However, rising ejector pins are typically designed for wafers of specific sizes and are not suitable for the process requirements of wafers of different sizes, thus limiting the versatility and flexibility of thermal processing equipment. Utility Model Content

[0005] In view of the above problems, embodiments of this application provide a clamping device and a heat treatment equipment that can fix wafers of different sizes to be processed, thereby improving the versatility and flexibility of the heat treatment equipment.

[0006] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0007] In a first aspect, embodiments of this application provide a clamping device for fixing a wafer to be processed, comprising:

[0008] A support member, which is a hollow structure with a notch, the notch communicating with the internal cavity of the support member, for the insertion of components that hold the wafer to be processed;

[0009] At least three clamping components are spaced apart on the support member and enclose a clamping space; each clamping component has a clamping part that can move toward or away from the center of the clamping space to adjust the size of the clamping space.

[0010] In one possible implementation, each of the clamping components includes an adjusting member and a clamping member, the adjusting member being connected to the clamping member for moving the clamping member in a direction toward or away from the center of the clamping space.

[0011] In one possible implementation, the adjusting member includes a guide and an adjusting screw, the guide is fixedly connected to the support, and the clamping member is slidably disposed on the guide;

[0012] The adjusting screw is movably connected to the clamping member and can move in a direction perpendicular to the guide member;

[0013] Once the clamping member has moved to the appropriate position, the adjusting screw moves toward the guide member and abuts against the guide member.

[0014] In one possible implementation, the adjusting member further includes a guide, an adjusting screw, and an adjusting sleeve;

[0015] The adjusting sleeve is fixedly connected to the support member and sleeved on the guide member; the guide member can move along the axial direction of the adjusting sleeve.

[0016] The end of the guide member facing the clamping space is connected to the clamping member;

[0017] The adjusting screw is movably connected to the adjusting sleeve.

[0018] In one possible implementation, the clamping member includes a first clamping member and a second clamping member, one end of the first clamping member is connected to the end of the guide member facing the clamping space, and the other end of the first clamping member is connected to the second clamping member and is perpendicular to the second clamping member.

[0019] The clamping portion is formed by the top surface of the second clamping member and the surface of the first clamping member facing the clamping space.

[0020] In one possible implementation, the guide is provided with multiple scale lines;

[0021] And / or, the clamping member includes a first clamping member and a second clamping member, wherein the first clamping member and the second clamping member are clamping plates.

[0022] In one possible implementation, a first positioning part is provided on the bottom surface of each of the second clamping members, the first positioning part being adapted to cooperate with the second positioning part of the heat treatment equipment.

[0023] In one possible implementation, the clamping device further includes a handle connected to the support.

[0024] Secondly, embodiments of this application provide a heat treatment apparatus, including a heating plate and the clamping device described in the first aspect, wherein the clamping device is connected to the heating plate and is used to fix the wafer to be processed.

[0025] In one possible implementation, the heating plate includes a plurality of second positioning part groups, which are arranged at radial intervals along the heating plate.

[0026] Each second positioning part group includes at least three second positioning parts, which correspond to the first positioning parts of the clamping device.

[0027] The clamping device and heat treatment equipment provided in this application embodiment utilize at least three clamping components spaced apart on a support member to form a clamping space. The clamping portion of each clamping component can move towards or away from the center of the clamping space, allowing for flexible adjustment of the space's size. This enables the clamping device to adapt to various wafers of different sizes, significantly improving its versatility across different production scenarios and product specifications. It reduces the need for frequent replacements or complex adjustments due to changing products of different sizes, lowering production costs and enhancing the versatility and flexibility of the heat treatment equipment.

[0028] In addition, the support component has a notch that communicates with the internal cavity of the support component, allowing the components for clamping the wafer to be processed to pass through. This makes it easier to install the wafer to be processed onto the clamping part of each clamping assembly, greatly shortening the installation time and significantly improving the production efficiency of the heat treatment equipment.

[0029] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the clamping device and heat treatment equipment provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific implementation. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A top view of the clamping device provided in the embodiments of this application;

[0032] Figure 2 A schematic diagram of the clamping assembly provided in an embodiment of this application;

[0033] Figure 3 This is a partial cross-sectional view of the clamping assembly provided in an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of the heating plate of the heat treatment equipment provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100: Clamping device;

[0037] 110: Support component; 111: Notch;

[0038] 120: Clamping assembly; 121: Adjusting component; 1211: Guide component; 1212: Adjusting screw; 1213: Adjusting sleeve; 1214: Scale line; 122: Clamping component; 1221: First clamping component; 1222: Second clamping component;

[0039] 130: Handle;

[0040] 140: Clamping space;

[0041] 200: Heating plate; 210: Second positioning part. Detailed Implementation

[0042] As described in the background section, the positions of the lifting pins on the heating plate of current heat treatment equipment are all fixed. As a result, the lifting pins are usually designed for wafers of a specific size, making it difficult to adapt to the process requirements of wafers of different sizes, thus limiting the versatility and flexibility of heat treatment equipment.

[0043] To address the aforementioned technical problems, this application provides a clamping device and a heat treatment apparatus. By distributing at least three clamping components at intervals on a support member and enclosing them to form a clamping space, the clamping portion of each component can move towards or away from the center of the clamping space, allowing for flexible adjustment of the space's size. This enables the clamping device to adapt to various wafers of different sizes, significantly improving its versatility across different production scenarios and product specifications. It reduces the need for frequent changes to the clamping device or complex adjustments due to product size variations, lowering production costs and enhancing the versatility and flexibility of the heat treatment equipment.

[0044] In addition, the support component has a notch that communicates with the internal cavity of the support component, allowing the components for clamping the wafer to be processed to pass through. This makes it easier to install the wafer to be processed onto the clamping part of each clamping assembly, greatly shortening the installation time and significantly improving the production efficiency of the heat treatment equipment.

[0045] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0046] Please refer to Figure 1 This application provides a clamping device 100, which can be applied to heat treatment equipment (please refer to...). Figure 4 In the process of fixing the wafer to be processed, it is used to fix the wafer to be processed.

[0047] The clamping device 100 includes a support member 110, which is a hollow structure with a notch 111 communicating with its internal cavity. In this embodiment, the notch 111 is used for a component to clamp the wafer to be processed. It should be noted that the component clamping the wafer to be processed can be a suction pen, as used in related technologies, to attract the wafer and move it out of or into the clamping device 100.

[0048] The internal cavity of the support 110 can be freely configured according to the shape of the wafer to be processed. For example, please refer to... Figure 1 The support member 110 is an annular support ring, and the inner cavity of the support ring forms a hollow structure. A notch is provided on the support ring and communicates with the internal cavity of the support ring.

[0049] The clamping device 100 further includes at least three clamping components 120, which are spaced apart on the support member 110 and enclose a clamping space 140. The at least three clamping components 120 may be disposed on the top surface of the support member 110, and a portion of the structure of each clamping component 120 may be located within an internal cavity of the support member 110. It should be noted that, for ease of understanding, the clamping space 140 can be represented as... Figure 1 The space within the dashed area is defined as clamping space 140.

[0050] It should be noted that the number of at least three clamping components 120 can be three, four, or even more. The following embodiments all use three clamping components 120, which form a stable three-point support to improve the stability of the wafer to be fixed and prevent the wafer to be processed from drifting.

[0051] Each clamping assembly 120 has a clamping portion that can move toward or away from the center of the clamping space 140 to adjust the size of the clamping space 140. In this embodiment, the clamping portion is used to fix the wafer to be processed, wherein the clamping portion and the wafer to be processed can be fixed by means of snap-fit, magnetic attraction, or vacuum adsorption.

[0052] In this embodiment, the clamping portion of each clamping component 120 can move toward or away from the center of the clamping space 140, allowing for flexible adjustment of the size of the clamping space 140. This enables the clamping device 100 to adapt to various wafers of different sizes, greatly improving its versatility in different production scenarios and product specifications. It reduces the need for frequent replacements of the clamping device 100 or complex adjustments due to changes in product sizes, lowering production costs and enhancing the versatility and flexibility of the heat treatment equipment.

[0053] In addition, the support member 110 is provided with a notch 111, which communicates with the internal cavity of the support member 110 for the component for clamping the wafer to be processed to pass through. This makes it easier to install the wafer to be processed onto the clamping part of each clamping assembly 120, greatly shortens the installation time, and significantly improves the production efficiency of the heat treatment equipment.

[0054] In one possible implementation, each clamping assembly 120 includes an adjusting member 121 and a clamping member 122, the adjusting member 121 being connected to the clamping member 122 for moving the clamping member 122 toward or away from the center of the clamping space 140.

[0055] When the clamping member 122 moves away from the center of the clamping space 140, the clamping space 140 can be increased, thereby clamping and fixing larger wafers to be processed. When the clamping member 122 moves towards the center of the clamping space 140, the clamping space 140 can be decreased, thereby clamping and fixing smaller wafers to be processed. This configuration greatly improves the versatility of the clamping device 100 under different production scenarios and wafer sizes to be processed.

[0056] It should be noted that the movement of the adjusting member 121 driving the clamping member 122 can be achieved automatically or manually.

[0057] In some embodiments, the adjusting member 121 can be a miniature cylinder, the output end of which is connected to the clamping member 122 to drive the clamping member 122 to reciprocate.

[0058] In other embodiments, the clamping member 122 is slidably mounted on the adjusting member 121 and moves along the axial direction of the adjusting member 121. The sliding of the clamping member 122 can be achieved by a person manually moving it.

[0059] Exemplarily, the adjusting member 121 includes a guide member 1211 and an adjusting screw 1212. The clamping member 122 is slidably disposed on the guide member 1211, and the adjusting screw 1212 is movably connected to the clamping member 122 and can move in a direction perpendicular to the guide member 1211. For example, part of the structure of the clamping member 122 is in the form of a sleeve, in which case the clamping member 122 can be sleeved on the guide member 1211, the adjusting screw 1212 is movably connected to the clamping member 122, and can reciprocate in a direction perpendicular to the axis of the guide member 1211. Alternatively, the clamping member 122 has a threaded hole, and the adjusting screw 1212 is threadedly connected to the threaded hole of the clamping member 122.

[0060] Once the clamping component 122 is moved to the appropriate position, the adjusting screw 1212 moves toward the guide component 1211 and abuts against the guide component 1211 to fix the clamping component 122 onto the guide component 1211, preventing the clamping component 122 from slipping. Furthermore, the entire adjustment process is simple and quick, greatly shortening the adjustment time and improving work efficiency, making it particularly suitable for production scenarios requiring frequent adjustments to the clamping position.

[0061] In some other embodiments, please refer to Figure 2 and Figure 3 The adjusting component 121 also includes a guide component 1211, an adjusting screw 1212, and an adjusting sleeve 1213.

[0062] The adjusting sleeve 1213 is fixedly connected to the support member 110 and sleeved on the guide member 1211. That is, the guide member 1211 passes through the adjusting sleeve 1213, and the adjusting sleeve 1213 can be welded to the upper surface of the support member 110. When the operator applies force to the adjusting member 121, the guide member 1211 can move along the axial direction of the adjusting sleeve 1213, thereby adjusting the size of the clamping space 140 enclosed by at least three clamping members 122.

[0063] The end of the guide member 1211 facing the clamping space 140 is connected to the clamping member 122, so that the guide member 1211 and the clamping member 122 form an integral structure. The adjusting screw 1212 is movably connected to the adjusting sleeve 1213. Alternatively, the adjusting sleeve 1213 has a threaded hole, and the adjusting screw 1212 is threaded into the threaded hole of the adjusting sleeve 1213. It should be noted that the shape of the adjusting screw 1212 can be either straight or T-shaped.

[0064] During adjustment, hold the clamp 122 or guide 1211 by hand so that the whole formed by the clamp 122 and guide 1211 moves along the axis of the adjusting sleeve 1213. When the clamp 122 moves to the appropriate position, the adjusting screw 1212 moves toward the guide 1211 and abuts against the guide 1211 to fix the clamp 122 in the appropriate position.

[0065] In this embodiment, by forming an integral unit with clamping member 122 and guide member 1211, the integral unit formed with clamping member 122 and guide member 1211 can be freely replaced according to the shape and size of the wafer to be clamped, thereby further improving the versatility of clamping device 100.

[0066] In one possible implementation, the clamping member 122 includes a first clamping member 1221 and a second clamping member 1222. One end of the first clamping member 1221 is connected to the end of the guide member 1211 facing the clamping space 140, and the other end of the first clamping member 1221 is connected to the second clamping member 1222 and is perpendicular to the second clamping member 1222. Thus, the first clamping member 1221 and the second clamping member 1222 form an L-shape, and the top surface of the second clamping member 1222 and the surface of the first clamping member 1221 facing the clamping space 140 constitute the clamping portion. In other words, the top surfaces of the three second clamping members 1222 and the inner surface of the first clamping member 1221 are all fitted to the wafer to be processed, jointly supporting the wafer to be processed.

[0067] The wafer to be processed is fixed to the clamping member 122 by the friction between the wafer to be processed and the top surface of the second clamping member 1222, as well as the clamping force of the inner surface of the first clamping member 1221. This makes the structure of the entire clamping device 100 simpler and more compact, reduces the number of parts, and lowers the manufacturing difficulty and cost of the clamping device 100.

[0068] It should be noted that the mutual fixation between the wafer to be processed and the clamping member 122 can also be achieved by providing an adsorption element on the top surface of the second clamping member 1222, which fixes the wafer to be processed by adsorption force. The adsorption principle used by the adsorption element can be vacuum adsorption, electromagnetic adsorption, etc. For example, the adsorption element can be a vacuum chuck, and the vacuum chuck is made of flexible materials such as silicone, which has good fit and sealing properties, ensuring that the wafer to be processed will not be displaced due to vibration or external force during processing.

[0069] In one possible implementation, the guide 1211 is provided with a plurality of scale lines 1214. The scale lines 1214 are set with reference to the size of the wafer to be processed. For example, there are three scale lines 1214, arranged sequentially on the guide 1211 in a direction away from the clamping member 122. When the end face of the adjusting sleeve 1213 away from the clamping member 122 is aligned with the first scale line 1214, the clamping assembly 120 is used to clamp an 8-inch wafer to be processed. When the end face of the adjusting sleeve 1213 away from the clamping member 122 is aligned with the second scale line 1214, the clamping assembly 120 is used to clamp a 6-inch wafer to be processed. When the end face of the adjusting sleeve 1213 away from the clamping member 122 is aligned with the third scale line 1214, the clamping assembly 120 is used to clamp a 4-inch wafer to be processed.

[0070] The embodiments of this application, through the setting of multiple scale lines 1214, can clearly and intuitively adjust the relative position between the guide 1211 and the adjusting sleeve 1213, thereby improving the efficiency of clamping and fixing the wafer to be processed.

[0071] It should be noted that the scale line 1214 can be a line drawn on the guide member 1211 with a colored marker. The scale line 1214 can also be a scale groove carved into the guide member 1211 (see reference). Figure 3 This makes it more eye-catching.

[0072] It should also be noted that the shapes of the first clamping member 1221 and the second clamping member 1222 can be selected in various ways. For example, both the first clamping member 1221 and the second clamping member 1222 are clamping plates, which can increase the contact area between the inner side of the first clamping member 1221 and the wafer to be processed, as well as the contact area between the top surface of the second clamping member 1222 and the wafer to be processed, thereby improving the stability of the wafer to be processed.

[0073] In particular, compared with the point contact between the wafer to be processed in related technologies, in this embodiment, the first clamping member 1221 and the wafer to be processed are in surface contact, and the second clamping member 1222 and the wafer to be processed are in surface contact. This can prevent the wafer to be processed from sliding due to inertia during use, and reduce the risk of the wafer to be processed tilting or falling off.

[0074] In one possible implementation, a first positioning part (not shown in the figure) is provided on the bottom surface of each second clamping member 1222, and the first positioning part is adapted to cooperate with the second positioning part of the heat treatment equipment.

[0075] One of the first positioning part and the second positioning part is a positioning groove, and the other of the first positioning part and the second positioning part is a positioning protrusion. By utilizing the cooperation between the positioning groove and the positioning protrusion, a clear guide can be provided for the installation process, and the operator does not need to spend a lot of time to precisely adjust the installation position. In addition, the engagement of the positioning groove and the positioning protrusion realizes the advantage of mechanical interlocking.

[0076] During operation, simply align the positioning protrusion with the positioning groove and gently push or place it to quickly complete the initial positioning, greatly shortening the installation time and improving work efficiency.

[0077] In one possible implementation, please refer to [reference needed]. Figure 1 The clamping device 100 also includes a handle 130, which is connected to the support member 110 and is staggered from the notch 111.

[0078] In this way, the clamping device 100 can be moved by hand using the handle 130, which improves the ease of use of the clamping device 100.

[0079] This application also provides a heat treatment apparatus for heat-treating a wafer after a certain fabrication process to improve the performance of the wafer.

[0080] Please refer to Figure 1 and Figure 4 The heat treatment equipment includes a heating plate 200 and a clamping device 100 as described in any of the above embodiments. The clamping device 100 is connected to the heating plate 200 and is used to fix the wafer to be processed.

[0081] In the clamping device 100, three clamping components 120 are disposed on the support member 110, so that there is a gap between the clamping part of the clamping component 120 and the heating plate 200, avoiding direct contact between the wafer to be processed and the heating plate 200. This reduces scratches on the wafer to be processed and extends its service life. In addition, the size of the clamping space 140 enclosed by at least three clamping components 120 of the clamping device 100 is adjustable, so that the clamping device 100 can be adapted to various wafers of different sizes. This greatly improves the versatility of the clamping device 100 under different production scenarios and product specifications, reduces the work of frequently changing the clamping device or making complex adjustments due to changing different sizes of products, reduces production costs, and thus improves the versatility and flexibility of the heat treatment equipment.

[0082] Furthermore, the clamping device 100 provided in this embodiment is a component independent of the heating plate 200, which can be modularly replaced and is applicable to more models and brands of heating plates 200.

[0083] In one possible implementation, the heating plate 200 has a plurality of second positioning parts arranged at radial intervals along the heating plate 200.

[0084] Each group of second positioning portions includes at least three second positioning portions 210. The at least three second positioning portions 210 are arranged at intervals along the circumferential direction of the wafer to be processed and correspond to the first positioning portions of the clamping device 100.

[0085] Along the direction away from the center of the heating plate 200, there are multiple second positioning parts, including a first second positioning part group, a second second positioning part group, and a third second positioning part group. The first second positioning part group is a fixing position for a 4-inch wafer to be processed, the second second positioning part group is a fixing position for a 6-inch wafer to be processed, and the third second positioning part group is a fixing position for an 8-inch wafer to be processed.

[0086] One of the first positioning part and the second positioning part is a positioning groove, and the other of the first positioning part and the second positioning part is a positioning protrusion. By using the cooperation between the positioning groove and the positioning protrusion, a clear guide can be provided for the installation process. The operator does not need to spend a lot of time to precisely adjust the installation position. He only needs to align the positioning protrusion with the positioning groove and gently push or place it to quickly complete the initial positioning, which greatly shortens the installation time and improves work efficiency.

[0087] It should be noted that the surface of the heating plate 200 facing the clamping device 100 may also be provided with exhaust grooves or protrusions, so as to release the gas between the wafer to be processed and the surface of the heating plate 200 more quickly when the wafer to be processed is placed on the heating plate 200, so as to avoid the gas from washing the wafer to be processed and prevent the wafer to be processed from sliding and drifting.

[0088] The following examples all use a 4-inch wafer to be processed as an example to describe in detail the installation and removal process of the wafer to be processed.

[0089] First, control the adjusting member 121 to move along the axial direction toward the clamping space 140 until the end face of the adjusting sleeve 1213 away from the clamping member 122 is aligned with the third scale line 1214, so as to complete the adjustment of the size of the clamping space 140.

[0090] Next, the wafer to be processed is picked up using a suction pen and placed into the clamping space 140, where it is secured by the clamping part of the clamping assembly 120. During this process, the suction pen moves within the notch 111 of the support member 110, making it easier to install the wafer to be processed onto the clamping part of each clamping assembly 120, greatly shortening the installation time and significantly improving the installation efficiency of the wafer to be processed.

[0091] Then, remove the suction pen.

[0092] Then, holding the handle 130, align the first positioning part of the clamping device 100 with the second positioning part in the first second positioning part group of the heating plate 200, and fix the clamping device 100 on the heating plate 200 by interlocking.

[0093] Then, the heating function of the heating plate 200 is activated to perform heat treatment on the wafer to be processed.

[0094] After the heat treatment process is completed, hold the handle 130 to remove the clamping device 100 from the heat treatment equipment, and use the suction pen to remove the wafer to be processed from the clamping device 100.

[0095] As can be seen from the above operation process of picking up and placing the wafer to be processed, the picking and placing tools (such as suction pens) do not need to be inserted between the wafer to be processed and the heating plate 200, which avoids adverse effects on the wafer to be processed, such as defects such as fragments and scratches, and improves the service life of the wafer to be processed.

[0096] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0097] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A clamping device, characterized in that, The clamping device is used to fix the wafer to be processed, including: A support member, which is a hollow structure with a notch, the notch communicating with the internal cavity of the support member, for the insertion of components that hold the wafer to be processed; At least three clamping components are spaced apart on the support member and enclose a clamping space; each clamping component has a clamping part that can move toward or away from the center of the clamping space to adjust the size of the clamping space.

2. The clamping device according to claim 1, characterized in that, Each of the clamping assemblies includes an adjusting member and a clamping member, the adjusting member being connected to the clamping member for moving the clamping member in a direction toward or away from the center of the clamping space.

3. The clamping device according to claim 2, characterized in that, The adjusting component includes a guide and an adjusting screw. The guide is fixedly connected to the support, and the clamping component is slidably disposed on the guide. The adjusting screw is movably connected to the clamping member and can move in a direction perpendicular to the guide member; Once the clamping member has moved to the appropriate position, the adjusting screw moves toward the guide member and abuts against the guide member.

4. The clamping device according to claim 2, characterized in that, The adjusting component includes a guide, an adjusting screw, and an adjusting sleeve; The adjusting sleeve is fixedly connected to the support member and sleeved on the guide member; the guide member can move along the axial direction of the adjusting sleeve. The end of the guide member facing the clamping space is connected to the clamping member; The adjusting screw is movably connected to the adjusting sleeve.

5. The clamping device according to claim 4, characterized in that, The clamping member includes a first clamping member and a second clamping member. One end of the first clamping member is connected to the end of the guide member facing the clamping space, and the other end of the first clamping member is connected to the second clamping member and is perpendicular to the second clamping member. The clamping portion is formed by the top surface of the second clamping member and the surface of the first clamping member facing the clamping space.

6. The clamping device according to any one of claims 3-5, characterized in that, The guide component is provided with multiple scale lines; And / or, the clamping member includes a first clamping member and a second clamping member, and the first clamping member and the second clamping member are clamping plates.

7. The clamping device according to claim 5, characterized in that, Each of the second clamping members has a first positioning part on its bottom surface, which is adapted to cooperate with the second positioning part of the heat treatment equipment.

8. The clamping device according to any one of claims 1-5, characterized in that, The clamping device also includes a handle, which is connected to the support.

9. A heat treatment apparatus, characterized in that, It includes a heating plate and a clamping device as described in any one of claims 1-8, wherein the clamping device is connected to the heating plate for fixing the wafer to be processed.

10. The heat treatment equipment according to claim 9, characterized in that, The heating plate includes a plurality of second positioning parts, which are arranged at radial intervals along the heating plate. Each second positioning part group includes at least three second positioning parts, which correspond to the first positioning parts of the clamping device.

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