Wafer cleaning clamp

Abstract

The utility model discloses a kind of wafer cleaning jigs, it is related to the technical field of semiconductor product cleaning.The utility model includes carrier module and cleaning module, carrier module is evenly inserted in the inside of cleaning module, carrier module includes carrier plate, carrier plate is equipped with multiple columns of card frame, wafer is placed in the inside of card frame, the both sides of card frame are equipped with access component, pressure piece is installed in the inside of access component, connecting rod is installed between the top of each access component, reset spring is installed in the bottom of access component;Cleaning module includes washing basket, multiple carrier components are installed in the inside of washing basket, carrier module is inserted in the middle of carrier component, the adjacent side of washing basket is rotatably connected with the outside of the bottom of carrier component, and straight rod is provided at bottom, pull spring is installed in one side of washing basket.The utility model makes the locking of wafer more secure by the use of carrier module, and the subsequent discharge of cleaning fluid is more rapid by the use of cleaning module.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor product cleaning technology, specifically relating to a wafer cleaning fixture. Background Technology

[0002] In semiconductor product manufacturing, before key production processes such as deposition and photolithography, it is necessary to clean semi-finished products such as wafers in a concentrated manner to remove impurities such as contaminants, processing particles, and residual particles. When cleaning wafers in a semi-finished or finished state, fixtures are required for centralized clamping.

[0003] The patent specification with publication number CN223193780U discloses a wafer cleaning rack, including two baffles arranged opposite each other; the two baffles are connected by a handle, a connecting rod, a support rod, a side baffle, and a pressure rod that are parallel to each other; the handle is located at the top of the baffle, the connecting rod and the support rod are both located at the bottom of the baffle, and the support rod is configured to support the bottom of the wafer, the side baffle is configured to abut against the side of the wafer, and the pressure rod is configured to press against the top of the wafer; This type of wafer cleaning rack uses vertically evenly arranged wafer slots, with baffles inserted between two opposing wafer slots on both sides of the rack. Baffles have bars on both sides and bottom to limit the bottom of the wafers. The wafers are evenly inserted between adjacent baffles, and then pressure bars limit the top position of all wafers. The shortcomings of this technology are as follows: First, the device stabilizes the wafers by using four rods to abut against each other. However, most wafers undergoing centralized cleaning are already etched, and applying pressure to the wafers risks damaging the etched circuitry, i.e., easily damaging the wafers. Second, the cleaning rack is vertical before and after cleaning. However, after cleaning, the cleaning solution needs to be drained. With the wafers placed vertically, the bottom receiving surface is horizontal, which is not conducive to the rapid drainage of the cleaning solution.

[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0005] The purpose of this utility model is to provide a wafer cleaning fixture, and the technical problem to be solved is as follows: the existing wafer cleaning fixture directly presses against the wafer during use, which can easily cause wafer damage, and the cleaning structure is always in a vertical state, which is not conducive to the rapid drainage of cleaning fluid after cleaning.

[0006] The objective of this utility model can be achieved through the following technical solutions: A wafer cleaning fixture includes a carrier module and a cleaning module. The carrier module is evenly inserted into the cleaning module. The carrier module includes a carrier plate with multiple rows of card frames mounted on it. Wafers are placed inside the card frames. Access components are provided on both sides of the card frames. A retractable pressure member is installed inside the access component. A connecting rod is installed between the top ends of each access component. The connecting rod is used to control the extension and retraction state of the pressure member. A reset spring is installed at the bottom of the access component. The cleaning module includes a cleaning basket, and multiple carrier components are installed inside the cleaning basket. The carrier module is inserted into the middle of the carrier components. The bottom outer side of the carrier components is rotatably connected to the adjacent side of the cleaning basket, and a straight rod is provided at the bottom. A tension spring is installed on one side of the cleaning basket, and the tension spring is used to pull the straight rod horizontally. In the wafer mounting stage, the carrier module clamps the wafer into the various clips on the carrier board. After being clamped, the wafer is naturally locked by the clamping components. When removing the wafer, the connecting rod is pressed to cause the clamping components to retract inward, thus effectively locking the wafer without damaging it. In the cleaning module, during the cleaning fluid discharge stage after the wafer cleaning is completed, the carrier module is pulled by a tension spring to tilt it to the side, so that the cleaning fluid can be quickly discharged at the tilted surface.

[0007] As a further embodiment of this utility model: the pressing component includes pressing block one and pressing block two. Both pressing block one and pressing block two are provided with limit openings on their outer sides. Both pressing block one and pressing block two are provided with waist holes in their middle parts. The two waist holes one of pressing block one and pressing block two on both sides of the card frame are in the shape of an "eight" in the direction close to the connecting rod. The clamping component includes two clamping blocks, one and two, with limit openings on their sides. The waist holes in the middle of the clamping blocks one and two stacked at the bottom of the same clamping component are tilted in opposite directions. When the opening direction of the waist hole one of the adjacent clamping blocks one and two on both sides of the frame is "V" shaped near the connecting rod, the clamping blocks one and two are in a retracted state when the connecting rod is pressed, which facilitates wafer removal. When the connecting rod is not pressed, the connecting rod is reset by the return spring, and the clamping component is in an open state, which means that the wafer in its natural state can always be locked.

[0008] As a further embodiment of this utility model: the access component further includes limiting posts disposed on both sides of the card frame, the top of the limiting post is provided with a sliding groove, the sliding groove is adapted to the adjacent card frame to open a transverse limiting groove, the pressing member is placed on the top of the transverse limiting groove, a shifting strip is slidably connected to the outside of the sliding groove, the shifting strip is adapted to each pressing member to be fixedly connected to multiple insert rods at the bottom, the bottom of the insert rod is inserted into the waist hole of the pressing member, a pin is fixedly connected between the top of the limiting post and the connecting rod, multiple support blocks are disposed along the circumferential side of the bottom of the card frame, the bottom of the wafer overlaps between the tops of each support block, and the top surface is in contact with the bottom surface of the limiting opening; When the connecting rod is pressed, the shifting bar is driven, which in turn drives the bottom insert rod to shift the pressure block one and pressure block two. Pressure block one and pressure block two are simultaneously opened or closed in the direction of moving closer to or away from the frame, limited by the transverse shifting limiting groove. The pressure block in the open state is used to lock the wafer, and the pressure block in the closed state is used to release the wafer.

[0009] As a further embodiment of this utility model: the reset spring is fixedly connected to the bottom of the shifting bar and a guide pin is provided in the middle. The top of the shifting bar is provided with a plurality of limiting waist holes, and a limiting pin is fixedly connected between the limiting waist holes and the limiting post. When the linkage is released, a guide pin is provided to facilitate the return spring's return to its original position in order to ensure that the return spring can effectively rebound. A limiting hole and a limiting pin are also provided to limit the automatic return of the shift bar. At the same time, the limiting hole limits the return position to maintain the consistency and smoothness of the vehicle module's opening and closing process.

[0010] As a further embodiment of this utility model: the bottom and top sides of the cleaning basket are provided with slots, the bottom slot is slidably connected with a slide bar, and the top slot is fixedly connected with a positioning bar. Rotating shafts are evenly arranged on the inner sides of the slide bar and the positioning bar. The carrier assembly is installed between the four rotating shafts on the same vertical plane, and the tension spring is installed in the middle of one side of the bottom of the cleaning basket. This involves evenly installing multiple carrier components inside the cleaning basket, so that the bottom of each carrier component can move laterally synchronously by sliding bars, and the top of the carrier component can rotate synchronously with the bottom, so as to structurally adapt to the synchronous tilting action of each carrier component.

[0011] As a further embodiment of this utility model: the vehicle assembly further includes a vehicle clip installed between two adjacent vertical rotating shafts, the bottom of the vehicle clip is rotatably connected to the adjacent rotating shaft, and the top is provided with a second waist hole, the second waist hole is slidably connected to the adjacent rotating shaft, the straight rod is fixedly connected between the bottoms of the two vehicle clips, and a hook is provided on the inner side of the tension spring; That is, the tilting function is achieved by pulling the straight rod of the adjacent vehicle component with a hook. When tilting, the waist hole 2 on the top of the vehicle component can adapt to the tilting state and limit the tilting degree, so as to facilitate the rapid oblique discharge of cleaning fluid.

[0012] The beneficial effects of this utility model are: 1. By setting multiple rows of card frames on the carrier plate, access components are set between each row of card frames and on the sides. A connecting rod is installed between the top of each access component. In use, pressing the connecting rod moves the shift bar downward. The insertion rod at the bottom of the shift bar is inserted into the oblique waist hole of the pressure component, which causes the limiting ports on the outer sides of the two pressure blocks to retract into the transverse limiting groove, thereby opening the card frame. After the wafer is clamped inside the card frame, the connecting rod is released, and the reset spring at the bottom of the shift bar returns to its original position. The push-shift bar, with its bottom insert rod, causes pressure blocks one and two to extend outward from the center of the transverse limiting groove toward the frame side, completing the automatic limiting of the top of the wafer. At this time, the wafer's periphery is limited by the frame, the bottom is supported by the support blocks, and the top is limited by the limiting opening of the pressure blocks. Its technical advantage is that it can effectively fix the wafer without damaging it by pressing, and the wafer can be easily removed by pressing the connecting rod, thereby improving the protection effect and disassembly efficiency of the wafer cleaning process.

[0013] 2. By sliding and installing sliding bars with rotating shafts on both sides of the bottom of the cleaning basket, and installing positioning bars with rotating shafts on both sides of the top of the cleaning basket, multiple carrier components are installed between the sliding bars and positioning bars and connected by adjacent rotating shafts. After inserting the carrier plate with the installed wafer into the carrier clip and cleaning it, the cleaning basket is removed and the tension spring is connected to the adjacent straight rod, which drives each carrier component to tilt at the same angle. This prevents the cleaning fluid from accumulating on the horizontal surfaces when the carrier plate is placed vertically, thereby improving the efficiency of cleaning fluid discharge after the wafer is cleaned. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a structural schematic diagram of the vehicle module for localized explosion according to this utility model; Figure 3 This is a utility model Figure 2 Enlarged detail view of point A in the middle; Figure 4 This is a utility model Figure 3 Enlarged detail of the middle B initial Figure 5 This is a partial structural schematic diagram of the cleaning module of this utility model; Figure 6 This is a utility model Figure 5A magnified view of the details at point C.

[0016] In the diagram: 1. Carrier plate; 2. Frame; 21. Support block; 3. Wafer; 4. Access component; 41. Pressing element; 411. Pressing block one; 412. Pressing block two; 413. Limiting port; 414. Waist hole one; 42. Return spring; 43. Limiting post; 44. Slide groove; 45. Lateral movement limiting groove; 46. Shifting strip; 47. Insert rod; 48. Pin; 49. Limiting waist hole; 5. Connecting rod; 6. Cleaning basket; 7. Carrier assembly; 71. Straight rod; 72. Carrier clip; 73. Waist hole two; 8. Tension spring; 9. Slot; 10. Slide bar; 11. Positioning bar; 12. Rotating shaft; 13. Hook. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0018] like Figures 1 to 6 As shown, a wafer cleaning fixture includes a carrier module and a cleaning module. The carrier module is evenly inserted into the cleaning module. The carrier module includes a carrier plate 1, on which five rows of card frames 2 are mounted. Wafers 3 are placed inside the card frames 2. Access components 4 are provided on both sides of the card frames 2. Retractable pressure members 41 are installed inside the access components 4. The pressure members 41 include a first pressure block 411 and a second pressure block 412. A limiting port 413 is provided on the outer side of the pressure member 41. The limiting ports 413 on the outer sides of the first pressure block 411 and the second pressure block 412 have the same shape and height. The sum of the thicknesses of the middle parts of the first pressure block 411 and the second pressure block 412 is the same as the thickness of the limiting port 413. A waist hole 414 with opposite inclined directions is provided in the middle of the first pressure block 411 and the second pressure block 412. In addition, only one pressure block 411 or one pressure block 412 is installed in the access components 4 on both sides of the carrier plate 1, so as to cooperate with the pressure block 412 or one pressure block 411 on the opposite side of the corresponding card frame 2 to clamp the wafer 3; a connecting rod 5 is installed between the tops of each access component 4, the connecting rod 5 is used to control the extension and retraction state of the pressure component 41, and a reset spring 42 is installed at the bottom of the access component 4; the cleaning module includes a cleaning basket 6, and multiple carrier components 7 are installed inside the cleaning basket 6. The carrier module is inserted into the middle of the carrier component 7, and the bottom outer side of the carrier component 7 is rotatably connected to the adjacent side of the cleaning basket 6, and a straight rod 71 is set at the bottom. A tension spring 8 is installed in the middle of one side of the cleaning basket 6, and the tension spring 8 is used to pull the straight rod 71 horizontally to pull the carrier component 7 to the side tilting state.

[0019] like Figures 2 to 4As shown, the storage component 4 also includes limiting posts 43 on both sides of the card frame 2. A sliding groove 44 is provided at the top of the limiting post 43. The sliding groove 44 adapts to the transverse movement limiting groove 45 opened in each adjacent card frame 2. After the pressure member 41 is installed inside the transverse movement limiting groove 45, it can only perform transverse extension and retraction under the action of the insertion rod 47. The pressure member 41 is placed on top of the transverse movement limiting groove 45. A shifting strip 46 is slidably connected to the top of the sliding groove 44. The shifting strip 46 adapts to each pressure member 41 and is fixedly connected to the insertion rod 47 at the bottom. The bottom of the insertion rod 47 is inserted into the waist hole 414 of the pressure member 41. A pin 48 is fixedly connected between the top of the limiting post 43 and the connecting rod 5. The bottom of the card frame 2 is provided with... Multiple support blocks 21 are provided. The bottom of the wafer 3 is attached between the tops of each support block 21, and the top surface is in contact with the bottom surface of the limiting port 413. When in use, the operator presses down the connecting rod 5. The connecting rod 5 drives the shifting strip 46 to move along the sliding groove 44 of the limiting post 43 towards the side of the compression reset spring 42 through the pin 48. During the movement, the insertion rod 47 fixedly connected to the bottom of the shifting strip 46 drives the pressure piece 41 inserted with it to move. Since the waist hole 414 of the pressure piece 41 is oblique and its movement direction is limited by the horizontal movement limiting groove 45, when each shifting strip 46 is moved vertically in unison by the connecting rod 5, the pressure block 411 and the pressure block 412 of the pressure piece 41 move horizontally together. The reset spring 42 is fixedly connected to the bottom of the shifting bar 46, and a guide pin is provided in the middle. The top of the shifting bar 46 is adapted to the adjacent card frame 2 and is provided with a limiting waist hole 49. The limiting waist hole 49 and the limiting post 43 are fixedly connected to the limiting pin. The two waist holes 414 of the pressure block 411 and pressure block 412 on both sides of the card frame 2 for limiting the wafer 3 are in an "eight" shape open near the connecting rod 5. When the connecting rod 5 is pressed down, each pressure block 411 and pressure block 412 retracts inward (see Figure 3 The degree of inward retraction is controlled by the vertical movement length of the limiting pin within the limited waist hole 49. After the release link 5, the compressed return spring 42 automatically resets, the shift bar 46 moves upward, driving the insertion rod 47 to move upward, driving the pressure block 1 411 and pressure block 2 412 to move laterally towards the adjacent predetermined card frame 2. The bottom of the wafer 3 is supported by each support block 21, and the top is limited by the lateral movement limiting port 413. This achieves the automatic locking function of each wafer 3 in the natural state download board 1. The locking method of the wafer 3 is the card frame 2 snap-fit ​​and the double limiting of the top and bottom surfaces, rather than the squeezing limiting. This achieves the safe fixing function of the carrier board 1 for the wafer 3 to be cleaned. After cleaning, each wafer 3 can be removed one by one by pressing down the link 5, which is convenient and quick.

[0020] like Figure 5 and Figure 6As shown, the bottom and top sides of the cleaning basket 6 are provided with slots 9. The bottom slot 9 is slidably connected to a slide bar 10, and the top slot 9 is fixedly connected to a positioning bar 11. Rotating shafts 12 are evenly arranged on the inner sides of the slide bar 10 and the positioning bar 11. The carrier assembly 7 is installed between the four rotating shafts 12 on the same vertical plane (see...). Figure 5 The tension spring 8 is installed in the middle of one side of the bottom of the cleaning basket 6. When the tension spring 8 pulls the straight rod 71 at the bottom of the adjacent carrier assembly 7, the carrier assembly 7 tilts to the side and drives the other carrier assemblies 7 installed on the same slide bar 10 to tilt synchronously. During the tilting process, the top is limited by the rotating shaft 12 connected to the positioning bar 11 to prevent it from tipping over. The vehicle assembly 7 also includes a vehicle retainer 72 installed between two vertically rotating shafts 12. The bottom of the vehicle retainer 72 is rotatably connected to the adjacent rotating shaft 12 inside the slide bar 10, and the top is provided with a waist hole 73. The waist hole 73 is slidably connected to the adjacent rotating shaft 12 inside the positioning bar 11. The straight rod 71 is fixedly connected between the bottoms of the two vehicle retainers 72. The inside of the tension spring 8 is provided with a hook 13. When tilting, the rotating shaft 12 connected to the waist hole 73 at the top of the vehicle assembly 7 provides a space for tilting while keeping it from tipping over, and limits the degree of tilting. That is, the tilting stops when the rotating shaft 12 on the positioning bar 11 abuts against the top of the waist hole 73. The use of the hook 13 facilitates the quick change of the connection state between the tension spring 8 and the straight rod 71 at the bottom of the vehicle assembly 7.

[0021] The working principle of this utility model: After all the wafers 3 to be cleaned are installed in each carrier plate 1, the carrier plates 1 are sequentially inserted between the symmetrical carrier clips 72 on both sides of the cleaning basket 6, and then the cleaning basket 6 is placed in the cleaning solution for ultrasonic cleaning. After cleaning, the cleaning basket 6 is removed to drain the cleaning fluid. Since the bottom outer side of each carrier clip 72 is rotatably connected to the slide bar 10, when the hook 13 at the end of the tension spring 8 is engaged with the adjacent straight bar 71, the straight bar 71 drives the carrier clips 72 on both sides to move laterally towards the tension spring 8. The slide bar 10 moves laterally along the slot 9 at the same time. The rotating shaft 12 on the top outer side of the carrier clip 72 moves from the bottom of the waist hole 2 73 to the top to accommodate the increased distance between the two vertical rotating shafts 12 caused by the tilt of the carrier clip 72. The tilt state is limited by the length of the waist hole 2 73. Since the carrier clips 72 on both sides of each carrier plate 1 are connected to the slide bar 10, all carrier plates 1 are in the same tilt state after the hook 13 is connected to the adjacent straight bar 71. This facilitates the drainage of the cleaning fluid along the tilted surface, thereby improving the drainage efficiency of the cleaning fluid. After the cleaning fluid is drained, remove the tension spring 8 hook 13, push the connecting rod 5 to reset each carrier plate 1 to a vertical position, then pull the carrier plate 1 out one by one from between the two carrier clips 72, and then press the connecting rod 5 one by one to take out the cleaned wafer 3, thus completing the cleaning process of the wafer 3.

[0022] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A wafer cleaning fixture, characterized in that, The device includes a carrier module and a cleaning module. The carrier module is evenly inserted into the cleaning module. The carrier module includes a carrier plate (1). The carrier plate (1) is equipped with multiple rows of card frames (2). A wafer (3) is placed inside the card frames (2). Access components (4) are provided on both sides of the card frames (2). A retractable pressure member (41) is installed inside the access component (4). A connecting rod (5) is installed between the top ends of each access component (4). The connecting rod (5) is used to control the extension and retraction state of the pressure member (41). A reset spring (42) is installed at the bottom of the access component (4). The cleaning module includes a cleaning basket (6), and multiple carrier assemblies (7) are installed inside the cleaning basket (6). The carrier module is inserted into the middle of the carrier assembly (7). The bottom outer side of the carrier assembly (7) is rotatably connected to the adjacent side of the cleaning basket (6), and a straight rod (71) is provided at the bottom. A tension spring (8) is installed on one side of the cleaning basket (6), and the tension spring (8) is used to pull the straight rod (71) horizontally.

2. The wafer cleaning fixture according to claim 1, characterized in that, The pressing component (41) includes a pressing block one (411) and a pressing block two (412). Both the pressing block one (411) and the pressing block two (412) are provided with limit openings (413) on their outer sides. Both the pressing block one (411) and the pressing block two (412) are provided with waist holes one (414) in the middle. The two waist holes one (414) of the pressing block one (411) and the pressing block two (412) on both sides of the card frame (2) are in the shape of an "eight" in the direction close to the connecting rod (5).

3. A wafer cleaning fixture according to claim 2, characterized in that, The access component (4) further includes limiting posts (43) disposed on both sides of the card frame (2). The top of the limiting post (43) is provided with a sliding groove (44). The sliding groove (44) is adapted to the adjacent card frame (2) to open a transverse limiting groove (45). The pressing member (41) is placed on the top of the transverse limiting groove (45). A shifting strip (46) is slidably connected to the outside of the sliding groove (44). The shifting strip (46) is adapted to each of the pressing members (41). Multiple insert rods (47) are fixedly connected to the bottom of the clamping member (41). The bottom of the insert rods (47) is inserted into the waist hole (414) of the clamping member (41). The top of the limiting post (43) is fixedly connected to the connecting rod (5) with a pin (48). Multiple support blocks (21) are provided along the circumferential side of the bottom of the frame (2). The bottom of the wafer (3) overlaps between the tops of each support block (21), and the top surface is in contact with the bottom surface of the limiting port (413).

4. A wafer cleaning fixture according to claim 3, characterized in that, The reset spring (42) is fixedly connected to the bottom of the shifting bar (46) and a guide pin is provided in the middle. The top of the shifting bar (46) is provided with a plurality of limiting waist holes (49). A limiting pin is fixedly connected between the limiting waist hole (49) and the limiting post (43).

5. A wafer cleaning fixture according to claim 1, characterized in that, The cleaning basket (6) has slots (9) on both sides of the bottom and top. The slot (9) at the bottom is slidably connected to a slide bar (10), and the slot (9) at the top is fixedly connected to a positioning bar (11). Rotating shafts (12) are evenly arranged on the inner sides of the slide bar (10) and the positioning bar (11). The carrier assembly (7) is installed between the four rotating shafts (12) on the same vertical plane. The tension spring (8) is installed in the middle of one side of the bottom of the cleaning basket (6).

6. A wafer cleaning fixture according to claim 5, characterized in that, The vehicle assembly (7) also includes a vehicle clip (72) installed between two adjacent vertical rotating shafts (12). The bottom of the vehicle clip (72) is rotatably connected to the adjacent rotating shaft (12), and the top is provided with a waist hole (73). The waist hole (73) is slidably connected to the adjacent rotating shaft (12). The straight rod (71) is fixedly connected between the bottoms of the two vehicle clips (72). The tension spring (8) is provided with a hook (13) on its inner side.

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