DBC substrate loading and adsorbing device and bonding equipment

Abstract

The utility model relates to the technical field of semiconductor, disclose a kind of DBC substrate feeding suction device and bonding equipment.The utility model transports the tray of bearing multiple DBC substrates by conveying mechanism, the downside of conveying mechanism is provided with liftable suction mechanism, and suction mechanism is used to lift the tray and adsorb DBC substrate;Suction mechanism includes gas circuit bottom plate and the suction assembly of being set on gas circuit bottom plate, multiple gas circuit communication holes are opened on gas circuit bottom plate, suction assembly has multiple interval arrangement's suction cup, and the air hole of each suction cup is communicated with at least one gas circuit communication hole, and each suction cup adsorbs one DBC substrate;Suction assembly has at least two forms and replaceably set on gas circuit bottom plate, and different forms of suction assembly have different number of suction cups, to adsorb different number of DBC substrate.The number of DBC substrate on tray changes, and only needs to replace corresponding suction assembly, improves the utilization of device, reduces the cost of production, improves the productivity of DBC substrate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a DBC substrate loading and adsorption device and bonding equipment. Background Technology

[0002] In the semiconductor industry, chips are typically mounted on Direct Bonded Copper (DBC) substrates. In the bonding process of Insulated Gate Bipolar Transistor (IGBT) module manufacturing, wire bonding is required to connect chips on the DBC substrate and between chips and the DBC substrate, forming a complete circuit structure. To avoid bonding errors caused by DBC substrate movement during bonding, adsorption devices are often used to hold the DBC substrate in place. In existing technologies, adsorption devices are typically designed to correspond to the number of DBC substrates on the carrier disk. When the number of DBC substrates changes, the corresponding adsorption device needs to be replaced, reducing the utilization rate of the adsorption device, extending production time, increasing production costs, and affecting the productivity of the DBC substrates.

[0003] Therefore, there is an urgent need to provide a DBC substrate loading and adsorption device and a bonding equipment to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a DBC substrate feeding and adsorption device and bonding equipment with replaceable adsorption components, thereby avoiding the need to replace the entire device, improving the utilization rate of the device, reducing production costs, and increasing the productivity of DBC substrates.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A DBC substrate loading and adsorption device includes a conveying mechanism and a carrier tray. The conveying mechanism is used to convey the carrier tray, and the carrier tray carries a plurality of DBC substrates. A liftable adsorption mechanism is provided on the lower side of the conveying mechanism. The adsorption mechanism is used to lift the carrier tray and the DBC substrates and adsorb the DBC substrates.

[0007] The aforementioned adsorption mechanism includes an air passage base plate and an adsorption assembly disposed on the air passage base plate. The air passage base plate is provided with a plurality of air passage communication holes. The adsorption assembly has a plurality of suction cups arranged at intervals. The air hole of each suction cup is connected to at least one of the air passage communication holes. Each suction cup is used to adsorb one of the aforementioned DBC substrates.

[0008] The adsorption assembly has at least two forms and is interchangeably disposed on the gas path base plate. The different forms of the adsorption assembly have different numbers of suction cups and are used to adsorb different numbers of the DBC substrates.

[0009] As an optional solution, the above-mentioned adsorption component includes a first adsorption component and a second adsorption component. The first adsorption component has M suction cups distributed on it, and the M suction cups are arranged in a square array. The second adsorption component has N suction cups distributed on it, and the N suction cups are arranged in a square array, where M is greater than N.

[0010] As an optional solution, the number of the above-mentioned air passage connection holes is M. When the above-mentioned first adsorption component is installed on the above-mentioned air passage base plate, the above-mentioned suction cups on the above-mentioned first adsorption component are connected to the above-mentioned air passage connection holes one by one.

[0011] When the second adsorption component is installed on the gas path base plate, at least one of the suction cups on the second adsorption component is connected to at least two of the gas path communication holes.

[0012] As an optional solution, the adsorption mechanism further includes multiple vacuum solenoid valves, each of which is connected to one of the aforementioned gas passage communication holes.

[0013] As an optional solution, the adsorption mechanism also includes multiple vacuum gauges corresponding to the vacuum solenoid valves, each of which is used to detect the vacuum pressure in the air path corresponding to each suction cup.

[0014] As an optional solution, the above-mentioned adsorption assembly includes an adsorption cover plate and an adsorption base plate. The adsorption base plate is detachably connected to the gas path base plate, and the adsorption cover plate is detachably connected to the adsorption base plate. The adsorption cover plate is provided with a plurality of the above-mentioned suction cups. The side of the adsorption base plate facing the adsorption cover plate and / or the side of the adsorption cover plate facing the adsorption base plate is provided with grooves that correspond to and communicate with the suction cups. The adsorption base plate is provided with through holes that connect the grooves to the corresponding gas path communication holes.

[0015] As an optional solution, the above-mentioned adsorption assembly further includes a first sealing ring, wherein the adsorption base plate is provided with a first sealing groove on the side facing the adsorption cover plate and / or the adsorption cover plate is provided with a first sealing groove, the first sealing groove is circumferentially disposed in the groove, and the first sealing ring is embedded in the first sealing groove and abuts against the adsorption base plate and the adsorption cover plate.

[0016] As an optional solution, the above-mentioned adsorption mechanism further includes a second sealing ring, a second sealing groove is provided on the gas path base plate, the second sealing groove is arranged around the gas path connecting hole, and the second sealing ring is embedded in the second sealing groove and abuts against the adsorption component.

[0017] As an optional solution, the DBC substrate loading and adsorption device further includes a lifting mechanism, which is disposed below the adsorption mechanism. The lifting mechanism includes a bracket and a lifting drive, the bracket is fixedly disposed, the lifting drive is connected to the bracket, the air passage base plate is connected to the output end of the lifting drive, and the lifting drive is used to drive the air passage base plate and the adsorption assembly to rise or fall.

[0018] The bonding equipment includes a bonding machine body and the aforementioned DBC substrate loading and adsorption device, wherein the bonding machine body is used to bond the aforementioned DBC substrate adsorbed by the adsorption mechanism.

[0019] The beneficial effects of this utility model are:

[0020] This invention provides a DBC substrate loading and adsorption device and a bonding apparatus. In use, a conveying mechanism first transports a tray carrying DBC substrates to above the adsorption mechanism. Then, the adsorption mechanism rises as a whole, lifting the tray on the conveying mechanism. Simultaneously, multiple suction cups on the adsorption assembly adsorb the corresponding DBC substrates on the tray. Subsequently, the bonding machine body bonds the adsorbed DBC substrates. In this invention, since the adsorption assembly has at least two forms and is interchangeably connected to the air path base plate, when the number of DBC substrates on the tray changes, only the adsorption assembly connected to the air path base plate needs to be replaced accordingly to accommodate different numbers of DBC substrates on the tray. This avoids replacing the entire device, improves device utilization, reduces equipment replacement time, lowers production costs, and increases DBC substrate productivity. Attached Figure Description

[0021] Figure 1 This is a first-view structural schematic diagram of the bonding device provided in an embodiment of the present invention;

[0022] Figure 2 This is a second-view structural schematic diagram of the bonding device provided in an embodiment of the present invention;

[0023] Figure 3 This is a partial structural schematic diagram from a first perspective of the DBC substrate loading and adsorption device with the adsorption component as the first adsorption component provided in this embodiment of the utility model.

[0024] Figure 4 This is a partial structural schematic diagram from a second perspective of the DBC substrate loading and adsorption device with the adsorption component as the first adsorption component provided in this embodiment of the utility model.

[0025] Figure 5 This is a partial structural schematic diagram of the DBC substrate loading and adsorption device provided in this embodiment of the present invention, in which the adsorption component is the second adsorption component.

[0026] Figure 6 This is a schematic diagram of the structure of the carrier disk corresponding to the first adsorption component provided in this embodiment of the utility model;

[0027] Figure 7 This is a schematic diagram of the structure of the first adsorption component and the corresponding carrier disk provided in this embodiment of the utility model;

[0028] Figure 8 This is a schematic diagram of the structure of the adsorption base plate of the first adsorption component provided in this embodiment of the utility model;

[0029] Figure 9 This is a schematic diagram of the structure of the adsorption base plate of the second adsorption component provided in this embodiment of the utility model;

[0030] Figure 10 This is a schematic diagram of the structure of the air passage base plate provided in this embodiment of the utility model;

[0031] Figure 11 This is a schematic diagram of the connection between the gas path base plate and the adsorption base plate of the first adsorption component provided in this embodiment of the utility model;

[0032] Figure 12 This is a schematic diagram of the connection between the gas path base plate and the adsorption base plate of the second adsorption component provided in this embodiment of the utility model.

[0033] Figure 13 This is a schematic diagram of the connection between the adsorption base plate and the adsorption cover plate of the first adsorption component provided in this embodiment of the utility model;

[0034] Figure 14 This is a schematic diagram of the connection between the adsorption base plate and the adsorption cover plate of the second adsorption component provided in this embodiment of the utility model.

[0035] In the picture:

[0036] 1. Conveying mechanism; 2. Carrier tray; 21. Through hole; 22. Limiting groove;

[0037] 3. Adsorption mechanism; 32. Gas path base plate; 321. Gas path connecting hole; 322. Second sealing groove; 323. Gas path interface; 324. First mounting hole; 325. Second mounting hole;

[0038] 33. Adsorption assembly; 3301. First adsorption assembly; 3302. Second adsorption assembly; 331. Suction cup; 3311. Air hole; 332. Adsorption cover plate; 333. Adsorption base plate; 3331. Groove; 3332. Through hole; 3333. First sealing groove; 334. First sealing ring; 34. Second sealing ring;

[0039] 4. Lifting mechanism; 41. Support frame; 42. Lifting drive component; 43. Guide column; 44. Guide sleeve; 45. Limiting component;

[0040] 6. Bonding machine body; 7. Touch screen. Detailed Implementation

[0041] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar parts or parts having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0042] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0045] like Figure 1 and Figure 2As shown, this embodiment provides a bonding apparatus for bonding DBC substrates. The bonding apparatus includes a bonding machine body 6 and a DBC substrate loading and adsorption device. The DBC substrate loading and adsorption device is located below the bonding machine body 6 and is used to adsorb the DBC substrate to prevent the DBC substrate from shifting. The bonding machine body 6 is used to bond the DBC substrate adsorbed by the DBC substrate loading and adsorption device.

[0046] like Figure 1 and Figure 2 As shown in the figure, in this embodiment, the bonding equipment also includes a touch screen 7, which can display the working status of the bonding machine body 6 and the DBC substrate loading and adsorption device, and facilitate the operator to control the operating parameters of the bonding machine body 6 and the DBC substrate loading and adsorption device.

[0047] like Figure 1 As shown, the DBC substrate loading and adsorption device includes a conveying mechanism 1 and a carrier tray 2 (see reference). Figure 6 The conveying mechanism 1 is used to convey the carrier tray 2, which carries multiple DBC substrates. A liftable adsorption mechanism 3 is provided on the lower side of the conveying mechanism 1. The adsorption mechanism 3 is used to lift the carrier tray 2 and the DBC substrates and adsorb the DBC substrates. Optionally, the conveying mechanism 1 can be a belt conveyor or chain conveyor, which are common in the prior art and will not be described in detail here. Exemplarily, the conveying mechanism 1 mainly includes two parallel and spaced-apart conveying components. The carrier tray 2 can move with the conveying components, and the adsorption mechanism 3 can pass between the two conveying components to achieve lifting or lowering. In actual operation, the carrier 2 carrying the DBC substrate to be bonded moves with the conveying mechanism 1 to above the adsorption mechanism 3. The adsorption mechanism 3 rises through the conveying mechanism 1 and lifts the carrier 2 on the conveying mechanism 1. At the same time, it adsorbs the DBC substrate to be bonded on the carrier 2, lifts the DBC substrate from the carrier 2, and fixes the DBC substrate to prevent it from shifting during the bonding process. Then, the bonding of the DBC substrate is completed by the bonding machine body 6. After the bonding is completed, the adsorption mechanism 3 descends and releases the adsorbed DBC substrate. The DBC substrate falls back onto the carrier 2 and moves downstream with the conveying mechanism 1.

[0048] Optionally, the conveyor mechanism 1 can be used in conjunction with an assembly line to improve operational efficiency.

[0049] like Figure 3 , Figure 4 and Figure 5As shown, the adsorption mechanism 3 includes an air passage base plate 32 and an adsorption assembly 33 disposed on the air passage base plate 32. The air passage base plate 32 has multiple air passage communication holes 321. The adsorption assembly 33 has multiple suction cups 331 arranged at intervals. Each suction cup 331 has an air hole 3311 communicating with at least one air passage communication hole 321. Each suction cup 331 is used to adsorb one DBC substrate. The adsorption assembly 33 has at least two forms and is interchangeably disposed on the air passage base plate 32. Different forms of the adsorption assembly 33 have different numbers of suction cups 331 and are used to adsorb different numbers of DBC substrates. Multiple suction cups 331 on the adsorption component 33 correspond to multiple DBC substrates in the carrier plate 2. The carrier plate 2 is used in conjunction with the DBC substrates. When the number of DBC substrates needs to be changed in the production line, the corresponding carrier plate 2 can be replaced on the production line. When the number of DBC substrates changes, the corresponding type of adsorption component 33 on the air passage base plate 32 can be replaced to adapt to the number of DBC substrates, avoiding the need to replace the entire DBC substrate feeding adsorption device, improving the utilization rate of the DBC substrate feeding adsorption device, reducing equipment replacement time, reducing production costs, and improving the productivity of DBC substrates.

[0050] In this embodiment, as Figure 3 , Figure 4 and Figure 5 As shown, the suction cup 331 is in the shape of a protrusion, which facilitates lifting and adsorbing the DBC substrate in the carrier 2, allowing the DBC substrate to detach from the carrier 2 and facilitating bonding by the bonding machine body 6. The suction cup 331 has multiple air holes 3311 arranged in a square array, covering the entire surface of the suction cup 331. This ensures that each air hole 3311 can adsorb the DBC substrate, resulting in a more uniform and secure adsorption force on the DBC substrate.

[0051] In this embodiment, the adsorption component 33 and the air passage base plate 32 can be connected by threaded fasteners. In other optional embodiments, the adsorption component 33 and the air passage base plate 32 can also be connected by snap-fit, snap-fit ​​and threaded fasteners, etc., which can satisfy the sealing between the adsorption component 33 and the air passage base plate 32 and are detachable connections. No specific limitation is made here.

[0052] like Figure 6 As shown, the carrier tray 2 has multiple limiting grooves 22 arranged in a square array. Each limiting groove 22 has a through hole 21 penetrating the carrier tray 2 at its bottom. Each limiting groove 22 is used to place one DBC substrate. The carrier tray 2 also has at least two forms. When the number of DBC substrates needs to be changed in the production line, the corresponding carrier tray 2 can be replaced. Figure 7As shown, the suction cups 331 and through holes 21 on the adsorption assembly 33 are arranged in a one-to-one correspondence. The suction cups 331 can pass through the corresponding through holes 21 and adsorb the DBC substrate (not shown) located in the limiting groove 22, and lift the DBC substrate from the carrier plate 2.

[0053] In this embodiment, as Figure 3 , Figure 4 and Figure 5 As shown, the adsorption assembly 33 includes an adsorption cover plate 332 and an adsorption base plate 333. The adsorption base plate 333 is detachably connected to the gas path base plate 32 for easy maintenance of the adsorption assembly 33. The adsorption cover plate 332 is detachably connected to the adsorption base plate 333. The adsorption cover plate 332 is provided with multiple suction cups 331. The adsorption base plate 333 has grooves 3331 on one side facing the adsorption cover plate 332 that correspond to and communicate with the suction cups 331. The adsorption base plate 333 has through holes 3332 that communicate with the grooves 3331 and the corresponding gas path communication holes 321.

[0054] In other embodiments, the grooves 3331 that correspond one-to-one with the suction cups 331 may also be provided on the side of the adsorption cover plate 332 facing the adsorption base plate 333, or both the side of the adsorption base plate 333 facing the adsorption cover plate 332 and the side of the adsorption cover plate 332 facing the adsorption base plate 333 are provided with grooves 3331 that correspond one-to-one with the suction cups 331. No specific limitation is made here.

[0055] In this embodiment, as Figure 8 and Figure 9 As shown, grooves 3331 and through holes 3332 corresponding to and communicating with suction cups 331 are provided on the adsorption base plate 333, so that each air hole 3311 on the suction cup 331 can be connected to the corresponding air passage communication hole 321 on the air passage base plate 32 through the grooves 3331 and through holes 3332, thereby forming a corresponding vacuum adsorption passage.

[0056] like Figure 4 and Figure 5 As shown, in the actual bonding process, there are usually two types of carrier disks 2 that can support different numbers of DBC substrates. When the number of DBC substrates changes, the corresponding adsorption component 33 of the carrier disk 2 also needs to be replaced accordingly. Therefore, in this embodiment, the adsorption component 33 includes a first adsorption component 3301 and a second adsorption component 3302. The first adsorption component 3301 has M suction cups 331 distributed on it, arranged in a square array. The second adsorption component 3302 has N suction cups 331 distributed on it, arranged in a square array, where M is greater than N. The multiple suction cups 331 on the adsorption component 33 can simultaneously adsorb multiple DBC substrates. When the carrier disk 2 is replaced, only the corresponding adsorption component 33 needs to be replaced, avoiding the need to replace the entire device.

[0057] like Figure 4 and Figure 5 As shown, in this embodiment, the first adsorption component 3301 has 15 suction cups 331 arranged in a square array, and the second adsorption component 3302 has 12 suction cups 331 arranged in a square array. Specifically, the 15 suction cups 331 of the first adsorption component 3301 are arranged in a 3×5 array, and the 12 suction cups 331 of the second adsorption component 3302 are arranged in a 3×4 array. This arrangement corresponds one-to-one with the DBC substrate placement areas distributed on the carrier disk 2. In other optional embodiments, the number of suction cups 331 on the adsorption component 33 can be set differently according to the carrier disk 2, such as two, three, four, etc., which are not specifically limited here. In other optional embodiments, the arrangement of the suction cups 331 on the adsorption component 33 can also be set differently according to the carrier disk 2, such as a circular array or an irregular arrangement, which are not specifically limited here.

[0058] In this embodiment, in order to adapt to the two adsorption components 33 described above, such as Figure 10 , Figure 11 and Figure 12 As shown, the number of air passage connection holes 321 is M, which is the same as the number of suction cups 331 on the first adsorption component 3301. When the first adsorption component 3301 is mounted on the air passage base plate 32, the suction cups 331 on the first adsorption component 3301 are connected to the air passage connection holes 321 one by one. When the second adsorption component 3302 is mounted on the air passage base plate 32, at least one suction cup 331 on the second adsorption component 3302 is connected to at least two air passage connection holes 321. Whether it is the suction cup 331 on the first adsorption component 3301 or the suction cup 331 on the second adsorption component 3302, each suction cup 331 corresponds to at least one air passage connection hole 321, ensuring that each suction cup 331 can adsorb one DBC substrate.

[0059] Specifically, such as Figure 10 , Figure 11 and Figure 12 As shown, there are 15 air passage connection holes 321 arranged in a 3×5 pattern. The air passage connection holes 321 in the middle column are offset to the left or right, so that the three air passage connection holes 321 in the middle column are close to the air passage connection holes 321 in the adjacent columns. Specifically, the air passage connection holes 321 in the middle columns of the first and second rows are offset to the right, and the air passage connection holes 321 in the middle column of the third row are offset to the left.

[0060] Regarding the two adsorption components 33 provided in this embodiment, such as Figure 11 As shown, the 15 suction cups 331 on the first adsorption component 3301 are connected to the 15 air passage communication holes 321 in a one-to-one correspondence. Figure 12As shown, for the suction cups 331 on the second adsorption component 3302, the suction cups 331 in the third row and second column of the second adsorption component 3302 correspond to the two air passage connection holes 321 in the third row and second column and the third column of the air passage base plate 32. The suction cups 331 in the first row and third column of the second adsorption component 3302 correspond to the two air passage connection holes 321 in the first row and third column and the fourth column of the air passage base plate 32. The suction cups 331 in the second row and third column of the second adsorption component 3302 correspond to the two air passage connection holes 321 in the second row and third column and the fourth column of the air passage base plate 32. The remaining suction cups 331 on the second adsorption component 3302 correspond one-to-one with the air passage connection holes 321 on the air passage base plate 32. Through the above-mentioned arrangement of the air passage connection holes 321 on the air passage base plate 32, one air passage base plate 32 can be adapted to two types of adsorption components 33 to meet different production needs, reduce the replacement of equipment such as the air passage base plate 32, reduce production costs, and improve the productivity of DBC substrates.

[0061] In other embodiments, the 15 air passage connection holes 321 may also be distributed in other ways, as long as each suction cup 331 of the two types of adsorption components 33 corresponds to at least one air passage connection hole 321, and no specific limitation is made here.

[0062] In this embodiment, the adsorption mechanism 3 also includes multiple vacuum solenoid valves, each of which is connected to a corresponding gas passage connection port 321. For example... Figure 3 As shown, an air passage interface 323 is connected below the air passage base plate 32. Each air passage connection hole 321 corresponds to one air passage interface 323. The air passage interface 323 is connected to a vacuum solenoid valve. The vacuum solenoid valve can control the suction cup 331 to adsorb and release the DBC substrate. Specifically, 15 vacuum solenoid valves control 15 air passage connection holes 321 one by one, which facilitates the adsorption of DBC substrates by individual control. When the carrier plate 2 is not full of DBC substrates, the adsorption mechanism 3 can still continue to work, improving the work efficiency.

[0063] In this embodiment, as Figure 1 As shown, the adsorption mechanism 3 also includes multiple vacuum gauges, each corresponding to a vacuum solenoid valve. Each vacuum gauge is used to detect the vacuum pressure in the corresponding air path of each suction cup 331. Specifically, each vacuum gauge is connected to the corresponding air path connection hole 321 and the vacuum solenoid valve. The vacuum gauges can detect the air pressure in each pipe. Each vacuum gauge is electrically connected to its corresponding vacuum solenoid valve, allowing for timely adjustment of the vacuum solenoid valve based on the gauge readings. This prevents damage to the DBC substrate due to excessive negative pressure or adsorption failure due to excessively low negative pressure, thus improving the reliability of the adsorption mechanism 3.

[0064] In this embodiment, as Figure 13 and Figure 14As shown, the adsorption assembly 33 also includes a first sealing ring 334. A first sealing groove 3333 is formed on the side of the adsorption base plate 333 facing the adsorption cover plate 332. The first sealing groove 3333 is arranged around the outside of the groove 3331. The first sealing ring 334 is embedded in the first sealing groove 3333 and abuts against the adsorption base plate 333 and the adsorption cover plate 332. In this embodiment, the number of first sealing rings 334 is the same as the number of grooves 3331 and corresponds one-to-one. By circling the outside of each groove 3331 with a first sealing ring 334 and abutting against the adsorption cover plate 332, the airtightness between each groove 3331 and the corresponding suction cup 331 is ensured.

[0065] In other embodiments, the first sealing groove 3333 may also be formed on the side of the adsorption cover plate 332 facing the adsorption base plate 333, or the first sealing groove 3333 may be formed on the side of the adsorption base plate 333 facing the adsorption cover plate 332 and the side of the adsorption cover plate 332 facing the adsorption base plate 333, as long as the airtightness between the adsorption base plate 333 and the adsorption cover plate 332 is guaranteed, and no specific limitation is made here.

[0066] In this embodiment, as Figure 11 and Figure 12 As shown, the adsorption mechanism 3 also includes a second sealing ring 34. A second sealing groove 322 is provided on the gas path base plate 32. The second sealing groove 322 is arranged around the gas path connecting hole 321. The second sealing ring 34 is embedded in the second sealing groove 322 and abuts against the adsorption component 33. In this embodiment, the number of second sealing rings 34 is the same as the number of gas path connecting holes 321 and they correspond one-to-one. By providing a second sealing ring 34 around each gas path connecting hole 321 and abutting against the adsorption base plate 333, the airtightness between each gas path connecting hole 321 and the corresponding through hole 3332 on the adsorption base plate 333 is ensured.

[0067] Optionally, both the first sealing ring 334 and the second sealing ring 34 are fluororubber rings. In addition, other materials can also be selected, such as nitrile rubber, hydrogenated nitrile rubber, polytetrafluoroethylene, etc., without specific limitations.

[0068] In this embodiment, as Figure 3 , Figure 4 and Figure 5 As shown, the DBC substrate loading and adsorption device also includes a lifting mechanism 4, which is located below the adsorption mechanism 3. The lifting mechanism 4 includes a bracket 41 and a lifting drive 42. The bracket 41 is fixedly installed, and the lifting drive 42 is connected to the bracket 41. The air passage base plate 32 is connected to the output end of the lifting drive 42. The lifting drive 42 is used to drive the air passage base plate 32 and the adsorption assembly 33 to rise or fall.

[0069] like Figure 10As shown, a first mounting hole 324 is provided on the air circuit base plate 32, and the output end of the lifting drive component 42 is installed in the first mounting hole 324. Optionally, in this embodiment, the lifting drive component 42 is a cylinder. In other optional embodiments, the lifting drive component 42 can also be a hydraulic cylinder, a linear motor, or other linear drive module, which is not specifically limited here.

[0070] like Figure 3 , Figure 4 and Figure 5 As shown, the lifting mechanism 4 in this embodiment also includes a guide post 43, a guide sleeve 44, and a limiting member 45. The guide sleeve 44 is installed on the bracket 41, and a guide hole is provided on the guide sleeve 44 for the guide post 43 to pass through. The upper end of the guide post 43 is installed on the second mounting hole 325 on the air passage base plate 32, and the lower end passes through the guide hole of the guide sleeve 44 and is connected to the limiting member 45. When the lifting drive 42 drives the air passage base plate 32 and the adsorption assembly 33 to rise or fall, the air passage base plate 32 drives the guide post 43 to slide up and down in the guide hole, thereby guiding the rise and fall of the air passage base plate 32 and the adsorption assembly 33. The limiting member 45 is connected to the lower end of the guide post 43 and plays a limiting role, which can limit the highest point of the rise of the air passage base plate 32 and the adsorption assembly 33, and prevent the guide post 43 from disengaging from the guide hole due to excessive stroke.

[0071] In this embodiment, four guide posts 43 are evenly distributed in a 2×2 pattern on the air passage base plate 32, and four guide sleeves 44 are evenly distributed in a 2×2 pattern on the bracket 41. Each guide sleeve 44 corresponds to one guide post 43. Two limiting members 45 are connected to each guide post 43, with one limiting member 45 corresponding to two guide posts 43. Furthermore, the number and distribution of guide posts 43, as well as the number of limiting members 45 and their correspondence with the guide posts 43, can also be in other forms, and are not specifically limited here.

[0072] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A DBC substrate loading and adsorption device, comprising a conveying mechanism (1) and a carrier plate (2), wherein the conveying mechanism (1) is used to convey the carrier plate (2), the carrier plate (2) carries a plurality of DBC substrates, and a liftable adsorption mechanism (3) is provided on the lower side of the conveying mechanism (1), wherein the adsorption mechanism (3) is used to lift the carrier plate (2) and the DBC substrates and adsorb the DBC substrates; The adsorption mechanism (3) includes an air passage base plate (32) and an adsorption assembly (33) disposed on the air passage base plate (32). The air passage base plate (32) has a plurality of air passage connecting holes (321). The adsorption assembly (33) has a plurality of suction cups (331) arranged at intervals. The air hole (3311) of each suction cup (331) is connected to at least one of the air passage connecting holes (321). Each suction cup (331) is used to adsorb one DBC substrate. The adsorption assembly (33) has at least two forms and is interchangeably disposed on the gas path base plate (32). The different forms of the adsorption assembly (33) have different numbers of the suction cups (331) and are used to adsorb different numbers of the DBC substrates.

2. The DBC substrate loading and adsorption device according to claim 1, characterized in that, The adsorption component (33) includes a first adsorption component (3301) and a second adsorption component (3302). M suction cups (331) are distributed on the first adsorption component (3301) and are arranged in a square array. N suction cups (331) are distributed on the second adsorption component (3302) and are arranged in a square array, wherein M is greater than N.

3. The DBC substrate loading and adsorption device according to claim 2, characterized in that, The number of air passage connecting holes (321) is M. When the first adsorption component (3301) is installed on the air passage base plate (32), the suction cup (331) on the first adsorption component (3301) is connected to the air passage connecting holes (321) one by one. When the second adsorption component (3302) is installed on the gas path base plate (32), at least one of the suction cups (331) on the second adsorption component (3302) is connected to at least two of the gas path communication holes (321).

4. The DBC substrate loading and adsorption device according to claim 1, characterized in that, The adsorption mechanism (3) also includes a plurality of vacuum solenoid valves, each of which is connected to a gas passage connection hole (321).

5. The DBC substrate loading and adsorption device according to claim 4, characterized in that, The adsorption mechanism (3) also includes a plurality of vacuum gauges corresponding to the vacuum solenoid valves, each of which is used to detect the vacuum pressure in the air path corresponding to each suction cup (331).

6. The DBC substrate loading and adsorption device according to claim 1, characterized in that, The adsorption assembly (33) includes an adsorption cover plate (332) and an adsorption base plate (333). The adsorption base plate (333) is detachably connected to the gas path base plate (32). The adsorption cover plate (332) is detachably connected to the adsorption base plate (333). The adsorption cover plate (332) is provided with a plurality of suction cups (331). The side of the adsorption base plate (333) facing the adsorption cover plate (332) and / or the side of the adsorption cover plate (332) facing the adsorption base plate (333) is provided with grooves (3331) that correspond one-to-one with the suction cups (331). The adsorption base plate (333) is provided with through holes (3332) that connect the grooves (3331) with the corresponding gas path connecting holes (321).

7. The DBC substrate loading and adsorption device according to claim 6, characterized in that, The adsorption assembly (33) further includes a first sealing ring (334). The adsorption base plate (333) has a first sealing groove (3333) on the side facing the adsorption cover plate (332) and / or the adsorption cover plate (332) has a first sealing groove (3333) on the side facing the adsorption base plate (333). The first sealing groove (3333) is circumferentially disposed in the groove (3331). The first sealing ring (334) is embedded in the first sealing groove (3333) and abuts between the adsorption base plate (333) and the adsorption cover plate (332).

8. The DBC substrate loading and adsorption device according to any one of claims 1-7, characterized in that, The adsorption mechanism (3) further includes a second sealing ring (34). A second sealing groove (322) is provided on the gas path base plate (32). The second sealing groove (322) is arranged around the gas path connecting hole (321). The second sealing ring (34) is embedded in the second sealing groove (322) and abuts against the adsorption component (33).

9. The DBC substrate loading and adsorption device according to any one of claims 1-7, characterized in that, The DBC substrate loading and adsorption device also includes a lifting mechanism (4), which is located below the adsorption mechanism (3). The lifting mechanism (4) includes a bracket (41) and a lifting drive (42). The bracket (41) is fixedly installed, and the lifting drive (42) is connected to the bracket (41). The gas path base plate (32) is connected to the output end of the lifting drive (42). The lifting drive (42) is used to drive the gas path base plate (32) and the adsorption assembly (33) to rise or fall.

10. A bonding apparatus, characterized in that, The device includes a bonding machine body (6) and a DBC substrate loading and adsorption device as described in any one of claims 1-9, wherein the bonding machine body (6) is used to bond the DBC substrate adsorbed by the adsorption mechanism (3).

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