heat dissipating device

Abstract

The utility model discloses a heat abstractor, include: cooling chamber, including medium inlet, cavity and medium outlet, medium inlet with the cavity intercommunication, medium outlet with the cavity intercommunication, cooling medium, cooling medium from medium inlet enters the cavity and from the medium outlet flows out the cavity, a plurality of magnetic beads, distribute in the cavity, magnetic field generating device, to provide the alternating magnetic field, make the magnetic beads in the magnetic field multidirectional motion, to increase the convection heat exchange of cooling medium inside, thereby improve the heat exchange efficiency of heat abstractor.

Description

[Technical Field]

[0001] This utility model relates to a heat dissipation device, and more particularly to a heat dissipation device with high heat dissipation efficiency. [Background Technology]

[0002] With the development of electronic technology, especially integrated circuit technology, the power density of chips is getting higher and higher. For example, high-density VLSI chips have a heat dissipation rate of 500-1000W / cm². 2 High heat flux density often leads to excessively high local temperatures on the chip. If this heat cannot be dissipated in time, it can cause problems such as decreased chip performance, shortened lifespan, or even failure.

[0003] To cool chips with high heat flux density, existing technologies disclose a heat dissipation device comprising: a fluid inlet, a fluid outlet, a cooling chamber, and a cooling fluid. The wall of the cooling chamber is connected to the chip, which serves as a heat source. The cooling fluid flows into the cooling chamber from the fluid inlet, exchanges heat with the wall of the cooling chamber, and then flows out from the fluid outlet, thereby dissipating heat from the chip. However, the flow rate of the cooling fluid in existing heat dissipation devices is relatively low. The cooling fluid flows in a typical laminar flow pattern in the cooling chamber, that is, the cooling fluid flows in a stratified manner with no significant mixing between layers. Particles move along smooth paths. In laminar flow, heat transfer occurs only through diffusion, without turbulent heat transfer. If fluid heat transfer is based solely on diffusion without external interference, the heat transfer time is too long, resulting in low heat exchange efficiency of the cooling fluid and thus low overall heat exchange efficiency of the heat sink.

[0004] Therefore, it is necessary to design a heat dissipation device with high heat exchange efficiency to solve the above-mentioned technical problems. [Utility Model Content]

[0005] The purpose of this invention is to provide a heat dissipation device with high heat exchange efficiency. By setting up a magnetic field and magnetic components, the magnetic components distributed in the cooling medium move in the magnetic field to increase the convective heat transfer of the cooling medium, thereby improving the heat exchange efficiency of the heat dissipation device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat dissipation device includes: a cooling chamber comprising a medium inlet, a cavity, and a medium outlet, wherein the medium inlet is connected to the cavity, and the medium outlet is connected to the cavity; a cooling medium that enters the cavity from the medium inlet and flows out of the cavity from the medium outlet; at least one magnetic element distributed within the cavity; and a magnetic field generating device for providing an alternating magnetic field, causing the magnetic element to move within the cooling medium under the influence of the magnetic field, thereby increasing convective heat transfer of the cooling medium.

[0008] Furthermore, the heat dissipation device includes a microchannel array located within the cavity. The microchannel array includes multiple channel inlets and multiple channel outlets. The multiple channel inlets are connected to the medium inlet, and the multiple channel outlets are connected to the medium outlet. The magnetic element is a magnetic bead and multiple magnetic elements are located within the microchannel array.

[0009] Furthermore, the cooling medium is a phase change material that switches between a liquid state and a gaseous state. When the cooling medium flows in from the medium inlet, it is in a liquid state, and when it flows out from the medium outlet, it is at least partially in a gaseous state.

[0010] Furthermore, the magnetic component is a magnetic bead and there are multiple of them. The magnetic field generated by the magnetic field generating device in the cavity is perpendicular to the flow direction of the cooling medium, so that the movement direction of the magnetic component is inconsistent with the flow direction of the cooling medium in the cavity, thereby enhancing the turbulence of the cooling medium.

[0011] Furthermore, the magnetic component is a magnetic bead and there are multiple of them. The magnetic field generated by the magnetic field generating device in the cavity causes the magnetic component to rotate under the action of the magnetic field, thereby increasing the heat exchange efficiency of the cooling medium in the cavity.

[0012] Furthermore, the magnetic field generating device is located below the cavity, the magnetic component is a magnetic stirring rod located at the bottom of the cavity, and the medium outlet is located at the end of the cavity away from the magnetic field generating device in the vertical direction. The magnetic component rotates and stirs the cooling medium under the action of the magnetic field to increase the heat exchange efficiency of the cooling medium in the cavity.

[0013] Furthermore, the magnetic component is a magnetic bead and there are multiple of them. The magnetic field generated by the magnetic field generating device in the cavity causes the magnetic component to flow in the cavity along the flow direction of the cooling medium.

[0014] Furthermore, the magnetic component is a magnetic bead and there are multiple of them. The magnetic field generated by the magnetic field generating device in the cavity causes the flow direction of the magnetic component in the cavity to be opposite to the flow direction of the cooling medium.

[0015] Furthermore, the magnetic components are provided in multiple forms, and the multiple magnetic components are interconnected to form a magnetic chain. The magnetic components are selected from one or more of magnetite, nickel-iron alloy and artificial cilia. The cooling medium is selected from one or more of water, fluorocarbons, electronic fluorinated liquids and methoxy-nonafluorobutane.

[0016] Furthermore, the heat dissipation device also includes suspended particles distributed in the cooling medium to increase the thermal conductivity of the cooling medium. The suspended particles are selected from one or more of the following: titanium dioxide nanoparticles, alumina nanoparticles, silicon dioxide nanoparticles, zinc oxide nanoparticles, copper oxide nanoparticles, zirconium oxide nanoparticles, cerium oxide nanoparticles, copper nanoparticles, aluminum nanoparticles, silver nanoparticles, aluminum nitride nanoparticles, boron nitride nanoparticles, silicon carbide nanoparticles, single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerene nanoparticles, graphite nanoparticles, graphene nanoparticles, and diamond nanoparticles.

[0017] Compared with the prior art, the heat dissipation device designed in this utility model has the following beneficial effects:

[0018] The heat dissipation device of this utility model has magnetic components distributed in the cooling medium inside the cavity, and a magnetic field generating device is provided to provide an alternating magnetic field, so that the magnetic components move in the cooling medium to increase the fluid mixing of the cooling medium, increase the convective heat transfer of the cooling medium, and thus improve the heat exchange efficiency of the heat dissipation device. [Attached Image Description]

[0019] Figure 1 This is a schematic diagram of the internal structure of the heat dissipation device according to the first embodiment of the present invention;

[0020] Figure 2 for Figure 1 A cross-sectional view of the heat dissipation device in the image, cut along a plane defined by XY.

[0021] Figure 3 for Figure 2 A magnified view of the interior of the microchannel array in the image;

[0022] Figure 4 This is a schematic diagram of the internal structure of the heat dissipation device according to the second embodiment of the present invention;

[0023] Figure 5 for Figure 4 A cross-sectional view of the internal structure of the heat dissipation device along a plane defined by XY;

[0024] Figure 6 for Figure 4 The diagram shows the structure of the heat dissipation device, in which the magnetic component is a magnetic stirring rod.

[0025] Explanation of reference numerals in the accompanying drawings for the specific implementation methods:

[0026] Medium outlet 13 Cooling medium 2 Magnetic component 3 Magnetic field generating device 4 Magnetic field direction a Microchannel array 5 Entrance 51 Exit 52 of the passage Suspended particles 6 Heat source 200

Detailed Implementation Methods

[0027] To make the objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0028] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," and "middle," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the indicated position or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] like Figures 1 to 2 As shown, the heat dissipation device 100 of this utility model defines a vertical direction as the Z-axis, an upward direction as the positive Z-axis, a front-back direction as the X-axis, a forward direction as the positive X-axis, a left-right direction as the Y-axis, and a rightward direction as the positive Y-axis. For ease of description, the vertical, left-right, and front-back directions in this utility model are relative positions and do not constitute a limitation on implementation.

[0030] Figure 1-3 This is the first embodiment of the present utility model.

[0031] like Figure 1As shown, a heat dissipation device 100 is used to dissipate heat from a heat source 200. It includes a cooling chamber 1, a cooling medium 2, multiple magnetic components 3, a magnetic field generating device 4, a microchannel array 5, and suspended particles 6. The cooling chamber 1 is connected to the heat source 200 to achieve heat exchange. The cooling chamber 1 includes a medium inlet 11, a cavity 12, and a medium outlet 13. The outer surface of the cavity 12 is connected to the heat source 200, and the cavity 12 is filled with the cooling medium 2. Both the medium inlet 11 and the medium outlet 13 are connected to the cavity 12, and the medium inlet 11 and the medium outlet 13 do not interfere with each other. The cooling medium 2 enters the cavity 12 through the medium inlet 11 and flows out of the cavity 12 through the medium outlet 13, exchanging heat with the inner wall of the cavity 12. Multiple magnetic components 3 are distributed within the cavity 12. When the cooling medium 2 flows through the cavity 12, the magnetic components 3 move under the influence of the magnetic field. In this embodiment, the magnetic components 3 are magnetic beads. The microchannel array 5 is disposed in the cavity 12 and connected to the heat source 200 through the cooling chamber 1, increasing the heat transfer surface area in contact with the surrounding flowing fluid and improving the overall heat exchange efficiency of the heat dissipation device 100. The magnetic field generating device 4 provides a magnetic field, causing the magnetic component 3 to move in the cooling medium 2, thereby increasing the convective heat transfer of the cooling medium 2 and improving the heat dissipation efficiency of the heat dissipation device 100. Suspended particles 6 are distributed in the cooling medium 2 to increase the thermal conductivity of the cooling medium 2. In this embodiment, the heat source 200 is a chip.

[0032] like Figure 1 As shown, the cooling chamber 1 has a rectangular structure with a rectangular cavity 12. The medium inlet 11 and medium outlet 13 are both located on the front side of the cavity 12, making them relatively close together. This allows for faster heat transfer from the medium outlet 13 to the medium inlet 11 via the front side, further reducing the heat at the medium outlet 13 and thus the overall heat dissipation device 100. The medium inlet 11 and medium outlet 13 are spaced apart at the left and right ends of the front side of the cavity 12 to prevent excessive heat exchange between the medium inlet 11 and medium outlet 13, which could affect the initial temperature of the medium flowing into the cavity 12.

[0033] like Figure 1 and Figure 3As shown, the cooling medium 2 can be selected from, but is not limited to, one or more of water, fluorocarbons (such as ethylene glycol or oil), electronic fluorinated liquids, and methoxy-nonafluorobutane. The cooling medium 2 can also be an electrically insulating dielectric fluid. The cooling medium 2 can also be a two-phase fluid (i.e., a phase change material). Specifically, the phase change material switches between a liquid state and a gas state. When the phase change material flows into the medium inlet 11, it is in a liquid state; when it flows out of the medium outlet 13, it is in a gaseous state. This allows the pressure at the medium outlet 13 to be atmospheric pressure (1 atm) or higher (1-5 atm), increasing the number of molecules per unit volume, improving heat conduction and convection within the gas, and increasing the number of collisions between gas molecules, thus making energy transfer more efficient. Furthermore, the liquid-to-gas conversion increases the gas pressure in the cooling chamber 1, thereby accelerating the flow of the cooling medium 2 out of the cooling chamber 1 and increasing heat exchange efficiency. It is understandable that when the phase change material flows out of the medium outlet 13, part of the cooling medium 2 may be in a gaseous state and another part of the cooling medium 2 may be in a liquid state; or all of the cooling medium 2 may be in a gaseous state.

[0034] like Figure 1 and Figure 3 As shown, multiple magnetic components 3 can flow out of the cooling medium 2 from the medium outlet 13 and then flow into the cavity 12 from the medium inlet 11 with the circulating cooling medium 2. The multiple magnetic components 3 can also be confined within the cavity 12 by the action of a magnetic field. Alternatively, a one-way valve that can filter the magnetic components 3 can be installed at the medium outlet 13 to confine the magnetic components 3 within the cavity 12. The multiple magnetic components 3 can be composed of a single magnetic particle, multiple magnetic particles, or multiple magnetic components 3 interconnected to form a magnetic chain. Specifically, the magnetic components 3 can be selected from, but are not limited to, one or more of magnetite, nickel-iron alloy, and artificial cilia.

[0035] like Figure 1 and Figure 2As shown, the magnetic field generating device 4 provides a magnetic field to drive the magnetic particles to move in the cooling medium 2. The magnetic field generating device 4 can be an electromagnet, a permanent magnet, or a coil. In this embodiment, the magnetic field generating device 4 generates an alternating magnetic field, causing the magnetic component 3 to move in the cooling medium 2 under the action of the magnetic field, thereby increasing the convective heat transfer between the cooling medium 2 and the inner wall of the cavity 12. In other embodiments, the direction a of the magnetic field generated by the magnetic field generating device 4 in the cavity 12 is perpendicular to the flow direction of the cooling medium 2, so that the movement direction of the magnetic component 3 is inconsistent with the flow direction of the cooling medium 2 in the cavity 12, thereby enhancing the turbulence of the cooling medium 2; alternatively, the magnetic field generated by the magnetic field generating device 4 in the cavity 12 causes the magnetic component 3 to flow along the flow direction of the cooling medium 2 in the cavity 12, thereby accelerating the flow rate of the cooling medium 2; or the magnetic field generated by the magnetic field generating device 4 in the cavity 12 causes the flow direction of the magnetic component 3 in the cavity 12 to be opposite to the flow direction of the cooling medium 2, thereby increasing the turbulence of the cooling medium 2.

[0036] like Figure 1 and Figure 2 As shown, the microchannel array 5 can be composed of multiple small, narrow microchannels etched or fabricated into a substrate. Its small size allows for a compact heat dissipation device 100 while also providing better heat dissipation efficiency. The microchannel array 5 can be made of materials such as silicon, copper, or aluminum, preferably using materials with high thermal conductivity such as copper, single-crystal diamond, polycrystalline diamond, diamond-like carbon, graphene, or carbon nanotube sintered copper to increase thermal conductivity and improve heat dissipation efficiency. The microchannel array 5 includes multiple channel inlets 51 and multiple channel outlets 52. The multiple channel inlets 51 are connected to the medium inlet 11, and the multiple channel outlets 52 are connected to the medium outlet 13. The cooling medium 2 flows into the microchannel array 5 from the multiple channel inlets 51 and flows out through the multiple channel outlets 52, carrying away heat from the microchannel array 5 and thus cooling the heat source 200. In this embodiment, multiple magnetic components 3 are located within the microchannel array 5. Under the action of the magnetic field, the magnetic components 3 move within the microchannel array 5, increasing the turbulence of the cooling medium 2 within the microchannel array 5, increasing the convective heat transfer between the cooling medium 2 within the microchannel array, and improving the heat dissipation efficiency.

[0037] like Figure 2 and Figure 3As shown, suspended particles 6 are distributed in the cooling medium 2 to increase the thermal conductivity of the cooling medium 2. It is understood that when the cooling medium 2 is a liquid, suspended particles 6 can be added; when the cooling medium 2 is a gas, suspended particles 6 are not added. The suspended particles 6 can be selected from, but are not limited to, one or more of the following: titanium dioxide nanoparticles, alumina nanoparticles, silica nanoparticles, zinc oxide nanoparticles, copper oxide nanoparticles, zirconium oxide nanoparticles, cerium oxide nanoparticles, copper nanoparticles, aluminum nanoparticles, silver nanoparticles, aluminum nitride nanoparticles, boron nitride nanoparticles, silicon carbide nanoparticles, single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerene nanoparticles, graphite nanoparticles, graphene nanoparticles, and diamond nanoparticles.

[0038] Figure 4-6 This is the second embodiment of the present invention, which differs from the first embodiment in that:

[0039] like Figure 4 and Figure 5 As shown, this embodiment presents a heat dissipation device 100 for dissipating heat from a heat source 200, comprising: a cooling chamber 1, a cooling medium 2, a magnetic component 3, and a magnetic field generating device 4. The cooling chamber 1 does not have a microchannel array 5. The magnetic field generating device 4 is located below the cavity 12, and the magnetic component 3 is located at the bottom of the cavity 12. The magnetic field generated by the magnetic field generating device 4 in the cavity 12 causes the magnetic component 3 to rotate under the influence of the magnetic field, thereby increasing the heat exchange efficiency of the cooling medium 2 in the cavity 12. The medium outlet 13 is located at the end of the cavity 12 furthest from the magnetic field generating device 4 in the vertical direction, preventing the magnetic component 3 from flowing out of the medium outlet 13.

[0040] like Figure 6 As shown, in other embodiments, the magnetic component 3 may be a magnetic stirring rod (usually placed inside the stirred cavity). When a magnetic field is applied, the stirring rod rotates horizontally, thereby effectively mixing the cooling medium 2 and improving heat dissipation efficiency.

[0041] In summary, the heat dissipation device of this utility model has the following beneficial effects:

[0042] (1) The heat dissipation device 100 of this utility model is provided with magnetic components 3 distributed in the cavity 12, and a magnetic field generating device 4 is provided to provide an alternating magnetic field, so that the magnetic components 3 move in the cooling medium 2, thereby increasing the fluid mixing of the cooling medium 2, increasing the convective heat transfer of the cooling medium 2, and thus improving the heat transfer efficiency of the heat dissipation device 100.

[0043] (2) The cavity 12 includes a microchannel array 5. Because the channel size of the microchannel array 5 is small, the larger pipe size has a larger heat transfer area under the same volume, thereby improving the heat exchange efficiency. Multiple magnetic components 3 are located in the microchannel array 5. Under the action of the magnetic field, they can stir the cooling medium 2, increase the convective heat transfer of the cooling medium 2, and further improve the heat exchange efficiency of the heat dissipation device 100.

[0044] (3) The cooling medium 2 is a phase change material. The phase change material can switch between liquid and gas states, which can increase the convective heat transfer between the cooling media 2. The liquid to gas conversion can increase the gas pressure of the cooling chamber 1, thereby accelerating the flow of the cooling medium 2 out of the cooling chamber 1 and increasing the heat transfer efficiency.

[0045] (4) The magnetic field direction a provided by the magnetic field generating device 4 is perpendicular to the flow direction of the cooling medium 2, so that the movement direction of the magnetic component 3 is inconsistent with the flow direction of the cooling medium 2 in the cavity 12, so as to enhance the turbulence of the cooling medium 2 and thereby increase the convective heat transfer of the cooling medium 2.

[0046] (5) The magnetic field generating device 4 is set below the cavity 12, and the magnetic component 3 is located at the bottom of the cavity 12. The magnetic field generated by the magnetic field generating device 4 in the cavity 12 causes the magnetic component 3 to rotate under the action of the magnetic field, which can increase the heat exchange efficiency of the cooling medium 2.

[0047] (6) The magnetic field direction a of the magnetic field generated by the magnetic field generating device 4 is parallel to the flow direction of the cooling medium 2. When the magnetic field generated by the magnetic field generating device 4 in the cavity 12 causes the magnetic element 3 to flow in the cavity 12 along the flow direction of the cooling medium 2, the flow velocity of the cooling medium 2 can be increased, thereby increasing the heat exchange efficiency. When the magnetic field generated by the magnetic field generating device 4 in the cavity 12 causes the flow direction of the magnetic element 3 in the cavity 12 to be opposite to the flow direction of the cooling medium 2, the convective heat transfer of the cooling medium 2 can be increased, thereby increasing the heat exchange efficiency.

[0048] (7) Adding suspended particles 6 to the cooling medium 2 can increase the thermal conductivity and heat transfer coefficient of the cooling medium 2, thereby improving the heat dissipation effect.

[0049] The above detailed description is only a description of the preferred embodiment of this utility model and is not intended to limit the patent scope of this utility model. Therefore, all equivalent technical changes made using the content of this invention's specification and illustrations are included within the patent scope of this invention.

Claims

1. A heat dissipation device, characterized in that, include: A cooling chamber includes a medium inlet, a cavity, and a medium outlet, wherein the medium inlet is connected to the cavity, and the medium outlet is connected to the cavity; Cooling medium, which enters the cavity from the medium inlet and flows out of the cavity from the medium outlet; At least one magnetic element is distributed within the cavity; A magnetic field generating device is used to provide an alternating magnetic field, causing the magnetic component to move in the cooling medium under the action of the magnetic field, thereby increasing the convective heat transfer of the cooling medium. The magnetic component is a magnetic bead and there are multiple of them. The magnetic field generated by the magnetic field generating device in the cavity causes the magnetic component to rotate under the action of the magnetic field, so as to increase the heat exchange efficiency of the cooling medium in the cavity.

2. The heat dissipation device as described in claim 1, characterized in that: The heat dissipation device includes a microchannel array located within the cavity. The microchannel array includes multiple channel inlets and multiple channel outlets. The multiple channel inlets are connected to the medium inlet, and the multiple channel outlets are connected to the medium outlet. The magnetic element is a magnetic bead and multiple magnetic elements are located within the microchannel array.

3. The heat dissipation device as described in claim 1, characterized in that: The cooling medium is a phase change material that switches between liquid and gas states. When the cooling medium flows in from the medium inlet, it is in a liquid state, and when it flows out from the medium outlet, it is at least partially in a gas state.

4. The heat dissipation device as described in claim 1, characterized in that: The magnetic field generating device is located below the cavity, and the magnetic component is a magnetic stirring rod located at the bottom of the cavity. The medium outlet is located at the end of the cavity away from the magnetic field generating device in the vertical direction. The magnetic component rotates and stirs the cooling medium under the action of the magnetic field to increase the heat exchange efficiency of the cooling medium in the cavity.

5. The heat dissipation device as described in claim 1, characterized in that: The magnetic components are provided in multiple quantities, and the multiple magnetic components are interconnected to form a magnetic chain. The magnetic components are selected from magnetite, nickel-iron alloy and artificial cilia. The cooling medium is selected from water, fluorocarbon compound, electronic fluorinated liquid and methoxy-nonafluorobutane.

6. The heat dissipation device as described in claim 1, characterized in that: The heat dissipation device further includes suspended particles distributed in the cooling medium to increase the thermal conductivity of the cooling medium. The suspended particles are selected from one of the following: titanium dioxide nanoparticles, alumina nanoparticles, silicon dioxide nanoparticles, zinc oxide nanoparticles, copper oxide nanoparticles, zirconium oxide nanoparticles, cerium oxide nanoparticles, copper nanoparticles, aluminum nanoparticles, silver nanoparticles, aluminum nitride nanoparticles, boron nitride nanoparticles, silicon carbide nanoparticles, single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerene nanoparticles, graphite nanoparticles, graphene nanoparticles, and diamond nanoparticles.

Images