An embedded IGBT module package structure

Abstract

The utility model discloses an embedded IGBT module packaging structure, including the packaging structure body of embedding in the outside of IGBT module main part, IGBT module main part includes DBC board, the chip of fixed setting in the top of DBC board and a plurality of metal terminals, the packaging structure body includes: the substrate is fixedly connected in the bottom of DBC board through welding heat conduction coating. The utility model discloses a series of structures are set up, utilize heat conduction pouring sealant to solidify after pre -injection U -shaped shell to the internal DBC board and chip carry out insulation solid seal, realize embedded IGBT module packaging effect, and it is convenient to utilize hollow heat conduction board cooperation cooling water and form horizontal large -area heat conduction, cooperation cooling water has the principle characteristic of liquid quick even heat conduction, realizes three -way large -area heat conduction and even quick heat dissipation's effect, avoids the phenomenon that chip gathers a large amount of heat and cannot promptly radiate and leads to high temperature influence its performance, improves heat conduction effect and use effect.

Description

Technical Field

[0001] This utility model relates to the field of IGBT module packaging technology, specifically to an embedded IGBT module packaging structure. Background Technology

[0002] As the core power switching device of modern power electronic devices, IGBT modules are widely used in new energy vehicles, industrial frequency conversion, new energy power generation and smart grid fields. With the increasing requirements of power density and reliability of equipment in these fields, IGBT modules are developing towards high current and high power density, which leads to a sharp increase in heat generation per unit volume. How to efficiently and reliably dissipate the heat generated by the chip has become a key challenge to ensure the long-term stable operation of IGBT modules and extend their service life.

[0003] Existing IGBT module packaging structures typically employ a simple encapsulation method using silicone gel and epoxy resin within the outer shell. However, this method has the following drawbacks: it lacks an effective heat conduction and dissipation mechanism after encapsulation. Relying solely on the heat conduction of the gel and the outer shell makes it difficult to dissipate heat quickly and evenly, which can easily lead to heat accumulation that severely affects performance and results in poor heat dissipation. Therefore, in order to improve thermal conductivity, this application proposes an embedded IGBT module packaging structure. Utility Model Content

[0004] The purpose of this invention is to provide an embedded IGBT module packaging structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an embedded IGBT module packaging structure, comprising a packaging structure body packaged on the outside of the IGBT module body, wherein the IGBT module body includes a DBC board, a chip fixedly disposed on the top of the DBC board, and multiple metal terminals, and the packaging structure body includes: The substrate is fixedly connected to the bottom of the DBC board by welding a thermally conductive coating: The side panels consist of two sets, which are fixedly connected to the top two sides of the base plate respectively; The U-shaped shell is fixedly connected between the two side plates and the top of the substrate, and is fixedly sleeved on multiple metal terminals. The DBC board and the chip are both located inside the U-shaped shell. The U-shaped shell is filled with thermally conductive potting compound that wraps around the outside of the DBC board and the chip. The thermally conductive potting compound is used to insulate and seal the internal DBC board and chip after pre-injection and solidification. The enclosed heat dissipation component is embedded and fixed on the outside of the U-shaped shell, and is in contact with the front, back and top of the chip respectively; the enclosed heat dissipation component is used to conduct heat and dissipate heat evenly when the chip generates heat.

[0006] Preferably, the enclosed heat conduction and heat dissipation assembly includes three hollow heat conduction plates, which are respectively embedded and fixed on the front, rear, and top sides of the U-shaped shell. Multiple heat dissipation fins are fixedly connected at equal intervals on the side of the three hollow heat conduction plates away from the chip. Three U-shaped heat conduction sheets are movably sleeved on the outside of the chip. Multiple heat conduction pipes are fixedly connected on the front, rear, and top sides of the U-shaped heat conduction sheets. The end of the heat conduction pipe away from the chip extends into the corresponding hollow heat conduction plate. The hollow heat conduction plate is filled with cooling water.

[0007] Preferably, the side plate on the right side is also provided with an auxiliary heat dissipation enhancement component. The auxiliary heat dissipation enhancement component is used to connect an external air supply structure or a blower-type heat dissipation fan to enhance the rapid heat dissipation of the enclosed heat conduction heat dissipation component. The auxiliary heat dissipation enhancement component includes an air inlet pipe. A rectangular groove is opened at the top of the side plate on the right side and a top sealing plate is fixedly connected thereto. The air inlet pipe is embedded and fixed on the right side of the side plate and communicates with the rectangular groove. Multiple air blowing holes are opened on the front left side, the rear left side, and the top left side of the side plate on the right side. The air blowing holes are horizontally aligned with the corresponding multiple heat dissipation fins.

[0008] Preferably, a U-shaped thermal conductive sheet is bonded and fixed to the inner side of the U-shaped thermal conductive sheet, and the front inner wall, rear inner wall and top inner wall of the U-shaped thermal conductive sheet are pressed and adhered to the front, rear and top of the chip respectively.

[0009] Preferably, the hollow heat-conducting plate has a threaded water injection hole on the side away from the chip, and a T-shaped threaded plug is screwed into the threaded water injection hole. A sealing gasket is bonded and fixed on the inner wall of the T-shaped threaded plug on the side away from the chip, which is in tight contact with the outer side of the corresponding hollow heat-conducting plate.

[0010] Preferably, the top left side of the U-shaped shell has multiple terminal through holes, which are respectively bonded and fixed to the outer side of the corresponding metal terminals.

[0011] Preferably, a sealing strip is bonded and fixed between the outer side of the U-shaped shell and the side of the two side plates, as well as the top of the substrate.

[0012] Compared with the prior art, the beneficial effects of this utility model are: 1. By setting up a substrate, side plate, thermally conductive potting compound, U-shaped shell, hollow thermally conductive plate and heat dissipation fins, the thermally conductive potting compound is used to insulate and seal the internal DBC board and chip after solidification in the pre-injected U-shaped shell, thereby achieving the packaging effect of embedded IGBT module. The thermally conductive potting compound is used to transfer heat to three hollow thermally conductive plates, and multiple heat dissipation fins are used for heat dissipation, thereby achieving preliminary heat conduction and heat dissipation. 2. Combined with the enclosed heat conduction and heat dissipation components, the hollow heat conduction plate and cooling water can form a large horizontal heat conduction area. With the cooling water having the principle of rapid and uniform heat conduction, the three-way large-area heat conduction and uniform and rapid heat dissipation effect is achieved. This avoids the phenomenon of the chip accumulating a large amount of heat that cannot be dissipated in time, which will cause high temperature and affect its performance, and further improves the heat conduction effect and the use effect. 3. By using a side panel designed in another way and in conjunction with auxiliary heat dissipation components, a channel is provided to connect to an external air supply structure or a blower-type cooling fan. This allows for airflow to be blown onto multiple heat dissipation fins on the upper, front, and rear sides in combination with the air supply structure, thereby improving the heat dissipation effect and efficiency, and increasing the flexibility of use.

[0013] This invention employs a series of structures to insulate and seal the internal DBC board and chip using thermally conductive potting compound that has solidified after being pre-injected into a U-shaped shell. This achieves the encapsulation effect of an embedded IGBT module and facilitates the use of a hollow heat-conducting plate in conjunction with cooling water to form a large lateral heat conduction area. The cooling water, with its rapid and uniform heat conduction properties, achieves a three-way large-area heat conduction and uniform and rapid heat dissipation effect. This prevents the chip from accumulating a large amount of heat that cannot be dissipated in time, which could lead to high temperatures that affect its performance, thus improving the thermal conductivity and usability. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of an embedded IGBT module packaging structure proposed in Embodiment 1 of this utility model; Figure 2 This is a front cross-sectional view of an embedded IGBT module packaging structure proposed in Embodiment 1 of this utility model. Figure 3 This is a schematic diagram of an embedded IGBT module packaging structure proposed in Embodiment 2 of this utility model; Figure 4 For the present utility model Figure 3 A schematic diagram of the rear view structure; Figure 5 This is a front cross-sectional view of an embedded IGBT module packaging structure proposed in Embodiment 2 of this utility model.

[0015] In the diagram: 1. DBC board; 101. Chip; 102. Metal terminal; 2. Substrate; 201. Side plate; 202. Rectangular groove; 203. Air inlet pipe; 204. Air vent; 3. U-shaped shell; 301. Hollow heat-conducting plate; 302. Heat dissipation fins; 303. U-shaped heat-conducting sheet; 304. Heat-conducting pipe; 4. Thermally conductive potting compound. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Example 1 like Figures 1 to 2 As shown, this embodiment proposes an embedded IGBT module packaging structure, including a packaging structure body packaged on the outside of the IGBT module body. The IGBT module body includes a DBC board 1, a chip 101 fixedly disposed on the top of the DBC board 1, and multiple metal terminals 102. The packaging structure body includes: Substrate 2 is fixedly connected to the bottom of DBC board 1 by welding a thermally conductive coating: Side plates 201, which consist of two sets, are fixedly connected to the top two sides of the base plate 2 respectively; The U-shaped shell 3 is fixedly connected between the two side plates 201 and the top of the substrate 2, and is fixedly sleeved on multiple metal terminals 102. The DBC board 1 and the chip 101 are both located inside the U-shaped shell 3. The U-shaped shell 3 is filled with thermally conductive potting compound 4 that wraps around the outside of the DBC board 1 and the chip 101. The thermally conductive potting compound 4 is used to insulate and seal the internal DBC board 1 and chip 101 after pre-injection and solidification. The enclosed heat conduction and heat dissipation component is embedded and fixed on the outside of the U-shaped shell 3, and is in contact with the front, rear and top of the chip 101 respectively; the enclosed heat conduction and heat dissipation component is used to conduct heat and dissipate heat evenly when the chip 101 generates heat. In this embodiment, the top left side of the U-shaped shell 3 is provided with multiple terminal through holes that are respectively bonded and fixed to the outer side of the corresponding metal terminal 102, so as to allow the metal terminal 102 to pass through; sealing strips are bonded and fixed between the outer side of the U-shaped shell 3 and the side of the two side plates 201 and the top of the substrate 2, so as to seal the outer side of the U-shaped shell 3 and the two side plates 201 and the substrate 2.

[0018] It should be noted that DBC board stands for Direct Copper Ceramic Substrate, which is a composite substrate in which copper foil is directly sintered onto the surface of alumina or aluminum nitride ceramic at high temperature (such as 1063℃).

[0019] Furthermore, such as Figure 1 and 2As shown, the enclosed heat conduction and heat dissipation assembly includes three hollow heat conduction plates 301. The three hollow heat conduction plates 301 are respectively embedded and fixed on the front, rear and top sides of the U-shaped shell 3. Multiple heat dissipation fins 302 are fixedly connected at equal intervals on the side of the three hollow heat conduction plates 301 away from the chip 101. Three U-shaped heat conduction sheets 303 are movably sleeved on the outside of the chip 101. Multiple heat conduction pipes 304 are fixedly connected on the front, rear and top sides of the U-shaped heat conduction sheets 303. The end of the heat conduction pipe 304 away from the chip 101 extends into the corresponding hollow heat conduction plate 301. In addition, the hollow heat conduction plate 301 is also fixedly fitted on the outside of the heat conduction pipe 304. The hollow heat conduction plate 301 is filled with cooling water. In this embodiment, a U-shaped heat-conducting sheet is bonded and fixed to the inner side of the U-shaped heat-conducting sheet 303. The inner walls of the front, rear, and top sides of the U-shaped heat-conducting sheet are pressed tightly against the front, rear, and top sides of the chip 101, respectively, to achieve a stable heat conduction effect. A threaded water injection hole is provided on the side of the hollow heat-conducting plate 301 away from the chip 101. A T-shaped threaded plug is screwed into the threaded water injection hole. A sealing gasket is bonded and fixed to the inner wall of the T-shaped threaded plug on the side away from the chip 101, which is pressed tightly against the outer side of the corresponding hollow heat-conducting plate 301, so as to allow personnel to inject cooling water into the hollow heat-conducting plate 301 and to seal the threaded water injection hole. The top, front, and rear sides of the U-shaped shell 3 are provided with mounting holes, and the inner walls of the mounting holes are fixedly connected to the outer sides of the corresponding hollow heat-conducting plate 301. In this embodiment, the hollow heat-conducting plate 301, heat dissipation fins 302, U-shaped heat-conducting sheet 303, and heat pipe 304 work together to conduct heat to the U-shaped heat-conducting sheet 303 when the chip 101 generates heat during operation. The heat is then quickly transferred to the three hollow heat-conducting plates 301 and the cooling water inside them through multiple heat pipes 304. The heat is then dissipated outward through multiple heat dissipation fins 302 on the upper and front and rear sides. The hollow heat-conducting plate 301 and the cooling water form a large-area lateral heat conduction. Combined with the principle characteristics of rapid and uniform heat conduction of liquids, the three-way large-area heat conduction and uniform and rapid heat dissipation are achieved. This avoids the phenomenon that the chip 101 accumulates a large amount of heat that cannot be dissipated in time, which may lead to high temperature affecting its performance, thus improving the heat conduction effect and the performance of the chip.

[0020] It should be noted that both the hollow heat-conducting plate 301 and the heat-conducting pipe 304 are preferably made of copper, which has a good heat conduction effect.

[0021] In this embodiment, thermally conductive potting compound 4 is used to insulate and seal the internal DBC board 1 and chip 101 after solidification within the pre-injected U-shaped shell 3, achieving the encapsulation effect of the embedded IGBT module. The thermally conductive potting compound 4 is used to transfer heat to three hollow heat-conducting plates 301, and multiple heat dissipation fins 302 are used for heat dissipation, achieving preliminary heat conduction and heat dissipation. Furthermore, it is convenient to use the hollow heat-conducting plates 301 in conjunction with cooling water to form a large-area lateral heat conduction. Combined with the principle characteristics of rapid and uniform heat conduction of liquids, the effect of three-way large-area heat conduction and uniform and rapid heat dissipation is achieved, avoiding the phenomenon that the chip 101 accumulates a large amount of heat that cannot be dissipated in time, resulting in high temperature affecting its performance, thus improving the heat conduction effect and the performance of use.

[0022] The usage method of this embodiment is as follows: When using the embedded IGBT module packaging structure, the heat is transferred to three hollow heat-conducting plates 301 using thermally conductive potting compound 4, and heat dissipation is carried out using multiple heat dissipation fins 302 to achieve initial heat conduction and heat dissipation. In addition, when the chip 101 generates heat during operation, the heat is also conducted to the U-shaped heat-conducting sheet 303, and then the heat is quickly transferred to the three hollow heat-conducting plates 301 and the cooling water inside them through multiple heat-conducting pipes 304. The heat is then dissipated outward through multiple heat dissipation fins 302 on the upper and front and rear sides. The hollow heat-conducting plates 301 and the cooling water form a large-area transverse heat conduction. Combined with the principle characteristics of rapid and uniform heat conduction of liquids, the three-way large-area heat conduction and uniform and rapid heat dissipation effect are achieved, avoiding the phenomenon that the chip 101 accumulates a large amount of heat that cannot be dissipated in time, resulting in high temperature affecting its performance, and further improving the heat conduction effect and the usage effect.

[0023] Example 2 like Figures 3 to 5 As shown, this embodiment differs from Embodiment 1 in that: an auxiliary heat dissipation enhancement component is also provided on the right-side side plate 201. The auxiliary heat dissipation enhancement component is used to connect an external air supply structure or a blower-type heat dissipation fan to enhance the rapid heat dissipation of the enclosed heat conduction heat dissipation component. The auxiliary heat dissipation enhancement component includes an air inlet pipe 203. A rectangular groove 202 is opened at the top of the right-side side plate 201 and a top sealing plate is fixedly connected thereto. The air inlet pipe 203 is embedded and fixed on the right side of the right-side side plate 201 and communicates with the rectangular groove 202. Multiple air blowing holes 204 are opened on the left front, left rear and left top of the right-side side plate 201. The air blowing holes 204 are horizontally aligned with the corresponding multiple heat dissipation fins 302.

[0024] This embodiment provides a channel for connecting an external air supply structure or a blower-type cooling fan, which facilitates the air supply structure to blow airflow onto the multiple heat dissipation fins 302 on the upper, front, and rear sides respectively, so as to better dissipate heat from the multiple heat dissipation fins 302, thereby further improving the heat dissipation effect and efficiency, and increasing the flexibility of use.

[0025] The usage method of this embodiment is as follows: The difference from Embodiment 1 is that it also has the following functions: In addition, by using the provided air inlet pipe 203, rectangular slot 202 and multiple air blowing holes 204 in combination, when the air inlet pipe 203 is connected to an external air supply structure or a blower-type cooling fan, air is supplied to the rectangular slot 202 through the air inlet pipe 203, and the air is blown out through the multiple air blowing holes 204 to blow airflow onto the multiple heat dissipation fins 302 on the upper, front and rear sides respectively, so as to better dissipate heat from the multiple heat dissipation fins 302, thereby further improving the heat dissipation effect and efficiency.

[0026] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An embedded IGBT module packaging structure, comprising a packaging structure body packaged on the outside of an IGBT module body, wherein the IGBT module body includes a DBC board (1), a chip (101) fixedly disposed on the top of the DBC board (1), and a plurality of metal terminals (102), characterized in that, The packaging structure body includes: The substrate (2) is fixedly connected to the bottom of the DBC board (1) by welding a thermally conductive coating: Side plates (201) are in two sets and are fixedly connected to the top two sides of the base plate (2); The U-shaped shell (3) is fixedly connected between the two side plates (201) and the top of the substrate (2), and is fixedly sleeved on multiple metal terminals (102). The DBC board (1) and the chip (101) are both located inside the U-shaped shell (3). The U-shaped shell (3) is filled with thermally conductive potting compound (4) that wraps around the outside of the DBC board (1) and the chip (101). The enclosed heat conduction and heat dissipation component is embedded and fixed on the outside of the U-shaped shell (3), and is in contact with the front, back and top of the chip (101) respectively.

2. The embedded IGBT module packaging structure according to claim 1, characterized in that: The enclosed heat conduction and heat dissipation assembly includes three hollow heat conduction plates (301). The three hollow heat conduction plates (301) are respectively embedded and fixed on the front, rear and top sides of the U-shaped shell (3). Multiple heat dissipation fins (302) are fixedly connected at equal intervals on the side of the three hollow heat conduction plates (301) away from the chip (101). Three U-shaped heat conduction sheets (303) are movably sleeved on the outside of the chip (101). Multiple heat conduction pipes (304) are fixedly connected on the front, rear and top sides of the U-shaped heat conduction sheets (303). The end of the heat conduction pipe (304) away from the chip (101) extends into the corresponding hollow heat conduction plate (301). The hollow heat conduction plate (301) is filled with cooling water.

3. The embedded IGBT module packaging structure according to claim 2, characterized in that: An auxiliary heat dissipation enhancement assembly is also provided on the side plate (201) located on the right side. The auxiliary heat dissipation enhancement assembly includes an air inlet pipe (203). A rectangular groove (202) is opened at the top of the side plate (201) located on the right side and a top sealing plate is fixedly connected thereto. The air inlet pipe (203) is embedded and fixed on the right side of the side plate (201) and communicates with the rectangular groove (202). Multiple air blowing holes (204) are opened on the front left side, the rear left side, and the top left side of the side plate (201) located on the right side. The air blowing holes (204) are horizontally aligned with the corresponding multiple heat dissipation fins (302).

4. The embedded IGBT module packaging structure according to claim 2, characterized in that: The inner side of the U-shaped heat-conducting sheet (303) is bonded and fixed with a U-shaped heat-conducting adhesive sheet that is compatible with it. The front inner wall, rear inner wall and top inner wall of the U-shaped heat-conducting adhesive sheet are pressed and adhered to the front, rear and top of the chip (101) respectively.

5. The embedded IGBT module packaging structure according to claim 2, characterized in that: The hollow heat-conducting plate (301) has a threaded water injection hole on the side away from the chip (101). A T-shaped threaded plug is screwed into the threaded water injection hole. A sealing gasket is bonded and fixed on the inner wall of the T-shaped threaded plug on the side away from the chip (101) and is pressed tightly against the outer side of the corresponding hollow heat-conducting plate (301).

6. The embedded IGBT module packaging structure according to claim 1, characterized in that: The top left side of the U-shaped shell (3) has multiple terminal through holes that are respectively bonded and fixed to the outside of the corresponding metal terminals (102).

7. The embedded IGBT module packaging structure according to claim 1, characterized in that: Sealing strips are glued and fixed between the outer side of the U-shaped shell (3) and the side of the two side plates (201) and the top of the base plate (2).

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