An integrated circuit package structure

Abstract

The utility model discloses an integrated circuit packaging structure, including the packaging substrate, the packaging substrate top welding is provided with multiple groups of chips, the packaging substrate top is provided with the plastic package body, the plastic package body is provided with multiple groups of perforation communication, multiple groups of perforation all are provided with the heat conduction rod, multiple groups of heat conduction rod bottom and multiple groups of chip top contact, and every group of chip is established straight -through type heat dissipation path alone, avoid the heat accumulation in the plastic package body, and multiple groups of heat conduction rod are as rigid thermal bridge, and the stable, heat resistance lower than traditional heat conduction silicone grease, support the heterogeneous chip differentiation heat dissipation (such as CPU uses thick heat conduction rod, and the sensor uses the thin pole).

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging technology, and more specifically, to an integrated circuit packaging structure. Background Technology

[0002] An integrated circuit is a miniature circuit system that integrates a large number of tiny electronic components (such as transistors, resistors, capacitors, diodes, etc.) onto a single semiconductor material (usually silicon). It is the core of modern electronic devices and is widely used in computers, communications, consumer electronics, automobiles, industrial control, medical equipment, and other fields.

[0003] Integrated circuit (IC) packaging refers to a complete technical system that connects, protects, and leads the manufactured bare die to external circuits through physical and electrical means. Packaging not only provides mechanical support and environmental protection (moisture-proof, dust-proof, and shock-resistant), but also undertakes key functions such as heat dissipation, signal transmission, and power distribution. With the improvement of chip performance and the reduction of size, packaging technology has evolved from traditional forms to advanced packaging stages with high density, multiple functions, and three-dimensional integration.

[0004] Under high power or high frequency operating conditions, the heat generated by the chip is difficult to dissipate effectively, leading to local temperature rise, which affects the reliability and lifespan of the device. Furthermore, the existing packaging structure is not convenient for installation and disassembly, so when the integrated circuit board fails, it is not easy for people to disassemble and repair the integrated circuit board, which increases the workload of people. Utility Model Content

[0005] (a) Technical problems to be solved To address the problems existing in the prior art, this utility model provides an integrated circuit packaging structure to solve the technical problem mentioned in the background art, which is that the heat generated by the chip is difficult to dissipate effectively, resulting in local temperature rise and affecting the reliability and lifespan of the device.

[0006] Technical solution To achieve the above objectives, this utility model provides the following technical solution: An integrated circuit packaging structure includes a packaging substrate, a plurality of chips are soldered to the top of the packaging substrate, a molding compound is disposed above the packaging substrate, a plurality of through holes are disposed on the molding compound, a heat-conducting rod is disposed in each of the plurality of through holes, and the bottom end of the plurality of heat-conducting rods contacts the top end of the plurality of chips.

[0007] This invention is further configured such that mounting plates are provided on the lower front and lower rear sides of the left and right ends of the molding compound, and bolts are movably mounted on the four sets of mounting plates. Threaded grooves are provided on the left front, left rear, right front, and right rear of the top of the packaging substrate. The four sets of bolts are threadedly connected to the four sets of threaded grooves. When the molding compound needs to be installed, it is snapped onto the top of the packaging substrate, aligning the multiple sets of heat-conducting rods with the positions of the multiple sets of chips. Then, the four sets of bolts pass through the four sets of mounting plates and are threadedly connected to the four sets of threaded grooves on the top of the packaging substrate, thereby installing the molding compound. This facilitates the installation and removal of the molding compound, which in turn facilitates chip maintenance. Furthermore, the four sets of bolts are symmetrically fixed at four points, ensuring uniform force distribution and preventing warping or localized stress concentration in the molding compound. The four sets of bolts can be repeatedly installed and removed, making it suitable for testing, repair, or upgrade scenarios.

[0008] The present invention is further configured such that a metal heat dissipation cover is provided at the top of the plastic encapsulation body, and the bottom end of the metal heat dissipation cover is connected to the top of multiple sets of heat-conducting rods. By providing the metal heat dissipation cover, a low thermal resistance series path of "chip → heat-conducting rod → metal heat dissipation cover" can be formed, which significantly improves the overall heat dissipation efficiency. The metal heat dissipation cover can also serve as an electromagnetic shield to suppress high-frequency interference.

[0009] The present invention is further configured such that each of the multiple sets of heat-conducting rods is provided with two sets of limiting rings at the upper part. The multiple sets of limiting rings on the upper side and the multiple sets of limiting rings on the lower side correspond to the position of the molding body. By setting the limiting rings, the heat-conducting rods can be prevented from moving up and down or falling off during transportation or thermal expansion and contraction, ensuring that the heat-conducting rods always maintain surface contact with the chip and the metal heat sink cover, and maintaining the continuity of heat conduction.

[0010] The present invention is further configured such that T-shaped long plates are provided on the left and right sides of the bottom end of the molding compound, and T-shaped sliding grooves are provided on the left and rear sides of the top end of the encapsulation substrate. The rear ends of the two sets of T-shaped sliding grooves are connected and have openings. The two sets of T-shaped long plates are slidably engaged with the two sets of T-shaped sliding grooves respectively. When the molding compound needs to be installed, the two sets of T-shaped long plates at the bottom end of the molding compound are slid into the two sets of T-shaped sliding grooves of the encapsulation substrate. Then, four sets of bolts are threaded through the four sets of mounting plates and threaded into the four sets of threaded grooves of the encapsulation substrate, thereby installing the molding compound. This can effectively prevent the molding compound from shifting or loosening due to vibration in the horizontal direction. The sliding engagement method allows the molding compound to be installed by horizontal movement along the direction of the T-shaped sliding groove, reducing the assembly difficulty. The T-shaped sliding groove provides horizontal limit, and the bolts provide vertical clamping force. The combination of the two achieves complete constraint of six degrees of freedom.

[0011] The present invention is further provided that a sealing ring is provided between the metal heat dissipation cover and the plastic encapsulation body. By providing the sealing ring, an environmentally sealed cavity is formed to prevent dust, moisture and corrosive gases from entering the interior, thereby improving reliability. The sealing ring can also absorb minor assembly errors and relieve stress on the contact surface.

[0012] The present invention is further configured such that each of the four sets of bolts is provided with a handle at the top. By providing the handle, the four sets of bolts can be rotated, realizing tool-free quick disassembly and assembly, greatly improving maintenance efficiency, reducing the skill requirements of operators, and reducing reliance on tools.

[0013] Beneficial effects Compared with the prior art, the present invention provides an integrated circuit packaging structure with the following advantages: 1. Multiple chips are soldered to the top of the packaging substrate. A molding compound is disposed above the packaging substrate. Multiple through holes are connected to the molding compound. Each of the through holes contains a heat-conducting rod. The bottom of the heat-conducting rod contacts the top of the chips. When the chips generate heat, the heat is conducted to the outside of the molding compound through the heat-conducting rod. This establishes a direct heat dissipation path for each chip, preventing heat accumulation within the molding compound. Furthermore, the heat-conducting rods act as rigid thermal bridges, which are more stable and have lower thermal resistance than traditional thermal grease, supporting differentiated heat dissipation for heterogeneous chips.

[0014] 2. Mounting plates are provided on the lower front and lower rear sides of the left and right ends of the molding compound. Bolts are movably mounted on the four mounting plates. Threaded grooves are provided on the left front, left rear, right front, and right rear of the top of the packaging substrate. The four sets of bolts are threadedly connected to the four sets of threaded grooves. When the molding compound needs to be installed, it is snapped onto the top of the packaging substrate, aligning the multiple sets of heat-conducting rods with the positions of the multiple sets of chips. Then, the four sets of bolts pass through the four sets of mounting plates and are threadedly connected to the four sets of threaded grooves on the top of the packaging substrate, thereby installing the molding compound. This facilitates the installation and removal of the molding compound, which in turn facilitates chip maintenance. Furthermore, the four sets of bolts are symmetrically fixed at four points, ensuring uniform force distribution and preventing warping or localized stress concentration in the molding compound. The four sets of bolt connections can be repeatedly installed and removed, making it suitable for testing, repair, or upgrade scenarios.

[0015] 3. A metal heat dissipation cover is provided at the top of the plastic encapsulation body. The bottom end of the metal heat dissipation cover is connected to the top of multiple sets of heat-conducting rods. By setting the metal heat dissipation cover, a low thermal resistance series path of "chip → heat-conducting rod → metal heat dissipation cover" can be formed, which significantly improves the overall heat dissipation efficiency. The metal heat dissipation cover can also serve as an electromagnetic shield to suppress high-frequency interference. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of an integrated circuit packaging structure according to the present invention; Figure 2 This is a schematic diagram of the connection structure between the plastic sealant, the mounting plate, and the bolts in this utility model; Figure 3This is a schematic diagram of the connection structure between the chip, the encapsulation body, and the heat-conducting rod in this utility model; Figure 4 This is a schematic diagram of the connection structure between the heat-conducting rod, the metal heat dissipation cover plate, and the sealing ring in this utility model; Figure 5 This is a schematic diagram of the connection structure between the metal heat dissipation cover, the heat-conducting rod, and the limiting ring in this utility model.

[0017] In the diagram: 1. Packaging substrate; 2. Chip; 3. Molded body; 4. Heat-conducting rod; 5. Perforation; 6. Mounting plate; 7. Bolt; 8. Threaded groove; 9. Metal heat sink cover; 10. Limiting ring; 11. T-shaped long plate; 12. T-shaped slide; 13. Sealing ring; 14. Tightening handle. Detailed Implementation

[0018] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0019] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0020] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0021] Please see Figure 1-5 An integrated circuit packaging structure includes a packaging substrate 1, with multiple sets of chips 2 soldered to the top of the packaging substrate 1, and a molding compound 3 disposed above the packaging substrate 1. Multiple sets of through holes 5 are connected to the molding compound 3, and each set of through holes 5 contains a heat-conducting rod 4. The bottom ends of the heat-conducting rods 4 contact the top ends of the multiple sets of chips 2. Two sets of limiting rings 10 are disposed on the upper part of each set of heat-conducting rods 4, with the upper and lower sets of limiting rings 10 corresponding to the positions of the molding compound 3. In this embodiment, when multiple sets of chips 2 generate heat, the heat is conducted to the outside of the molded body 3 through multiple sets of heat-conducting rods 4, establishing a direct heat dissipation path for each set of chips 2, avoiding heat accumulation inside the molded body 3. Furthermore, the multiple sets of heat-conducting rods 4 act as rigid thermal bridges, which are more stable and have lower thermal resistance than traditional thermal grease, supporting differentiated heat dissipation for heterogeneous chips, such as using thick heat-conducting rods for CPUs and thin rods for sensors. By setting a limiting ring 10, the heat-conducting rods 4 can be prevented from moving up and down or falling off during transportation or thermal expansion and contraction, ensuring that the heat-conducting rods 4 always maintain surface contact with the chips 2 and the metal heat sink 9, maintaining the continuity of heat conduction.

[0022] Please see Figures 1-3 As one embodiment of the encapsulation body 3, the encapsulation body 3 in this utility model is provided with mounting plates 6 on the lower front and lower rear sides of the left and right ends, and bolts 7 are movably provided on the four sets of mounting plates 6. Threaded grooves 8 are provided on the left front, left rear, right front, and right rear of the top of the encapsulation substrate 1. The four sets of bolts 7 are threadedly connected to the four sets of threaded grooves 8. T-shaped long plates 11 are provided on the left and right sides of the bottom end of the encapsulation body 3. T-shaped sliding grooves 12 are provided on the left and rear sides of the top of the encapsulation substrate 1. The rear ends of the two sets of T-shaped sliding grooves 12 are connected and have openings. The two sets of T-shaped long plates 11 are slidably engaged with the two sets of T-shaped sliding grooves 12 respectively. The top of the four sets of bolts 7 is provided with a handle 14. Specifically, when the molding compound 3 needs to be installed, it is snapped onto the top of the packaging substrate 1, aligning the multiple sets of heat-conducting rods 4 with the positions of the multiple sets of chips 2. Then, four sets of bolts 7 are threaded through four sets of mounting plates 6 and connected to the four sets of threaded grooves 8 at the top of the packaging substrate 1, thereby installing the molding compound 3. This facilitates the installation and removal of the molding compound 3, which in turn facilitates the inspection and repair of the chips 2. Furthermore, the four sets of bolts 7 are symmetrically fixed at four points, ensuring even force distribution and preventing warping or localized stress concentration in the molding compound 3. The connection of the four sets of bolts 7 allows for repeated installation and removal, making it suitable for testing, repair, or upgrade scenarios. When the molding compound 3 needs to be installed, the two sets of T-shaped plates 11 at the bottom of the molding compound 3 are slid onto the packaging substrate 1. Within the two sets of T-shaped grooves 12, four sets of bolts 7 pass through four sets of mounting plates 6 and are threadedly connected to the four sets of threaded grooves 8 of the encapsulation substrate 1, thereby installing the encapsulation body 3. This effectively prevents the encapsulation body 3 from shifting or loosening due to vibration in the horizontal X / Y directions. The sliding clamping method allows the encapsulation body 3 to be installed by moving along the T-shaped grooves 12, reducing assembly difficulty. The T-shaped grooves 12 provide horizontal limits, and the bolts 7 provide vertical clamping force. The combination of the two achieves complete constraint of six degrees of freedom. By setting the handles 14, the four sets of bolts 7 can be rotated through the four sets of handles 14, realizing tool-free quick disassembly and assembly, greatly improving maintenance efficiency, reducing the skill requirements of operators, and reducing tool dependence.

[0023] Please see Figures 1-5As one embodiment of the encapsulated body 3, the top of the encapsulated body 3 in this utility model is provided with a metal heat dissipation cover plate 9, and the bottom end of the metal heat dissipation cover plate 9 is connected to the top end of multiple sets of heat-conducting rods 4. Specifically, by setting up the metal heat sink cover 9, a low thermal resistance series path of "chip 2 → heat conduction rod 4 → metal heat sink cover 9" can be formed, which significantly improves the overall heat dissipation efficiency. The metal heat sink cover 9 can also serve as an electromagnetic shield to suppress high-frequency interference.

[0024] Please refer to Figure 2 , Figure 4 and Figure 5 As a further embodiment of the encapsulated body 3 and the metal heat dissipation cover 9: a sealing ring 13 is provided between the metal heat dissipation cover 9 and the encapsulated body 3; Specifically, by setting the sealing ring 13, an environmentally sealed cavity is formed to prevent dust, moisture, and corrosive gases from entering the interior, thereby improving reliability. The sealing ring can also absorb minor assembly errors and alleviate stress on the contact surface.

[0025] In summary, when using the overall equipment: When multiple chip groups 2 generate heat, the heat is conducted to the outside of the molding compound 3 through multiple heat conduction rods 4, establishing a direct heat dissipation path for each chip group 2 to avoid heat accumulation inside the molding compound 3.

[0026] When it is necessary to install the molding compound 3, slide the two sets of T-shaped long plates 11 at the bottom of the molding compound 3 into the two sets of T-shaped sliding grooves 12 of the packaging substrate 1, so that the multiple sets of heat conduction rods 4 correspond to the positions of multiple sets of chips 2. Then, let the four sets of bolts 7 pass through the four sets of mounting plates 6 and be threadedly connected to the four sets of threaded grooves 8 at the top of the packaging substrate 1, thereby installing the molding compound 3, which facilitates the assembly and disassembly of the molding compound 3, and thus facilitates the maintenance of the chips 2.

[0027] In all the solutions mentioned above, the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although the embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents. In all the solutions mentioned above, the operation of electrical components is controlled by a controller. Since the devices matched with the controllers are common devices, their control principles and circuit connections are existing, well-known, and mature technologies. Therefore, their electrical connection relationships and specific circuit structures will not be elaborated here.

Claims

1. An integrated circuit packaging structure, comprising a packaging substrate (1), characterized in that: Multiple chips (2) are soldered to the top of the packaging substrate (1). A plastic encapsulation body (3) is provided above the packaging substrate (1). Multiple through holes (5) are provided on the plastic encapsulation body (3). Each of the multiple through holes (5) is provided with a heat-conducting rod (4). The bottom of the multiple heat-conducting rods (4) is in contact with the top of the multiple chips (2).

2. The integrated circuit packaging structure according to claim 1, characterized in that: Mounting plates (6) are provided on the lower front and lower rear sides of the left and right ends of the encapsulation body (3). Bolts (7) are movably provided on the four sets of mounting plates (6). Threaded grooves (8) are provided on the left front, left rear, right front and right rear of the top of the encapsulation substrate (1). The four sets of bolts (7) are threadedly connected to the four sets of threaded grooves (8).

3. The integrated circuit packaging structure according to claim 1, characterized in that: The top of the encapsulated body (3) is provided with a metal heat dissipation cover plate (9), and the bottom of the metal heat dissipation cover plate (9) is connected to the top of multiple sets of heat-conducting rods (4).

4. An integrated circuit packaging structure according to claim 1, characterized in that: multiple sets The upper part of the heat-conducting rod (4) is provided with two sets of limiting rings (10), and the upper and lower sets of limiting rings (10) correspond to the position of the encapsulated body (3).

5. An integrated circuit packaging structure according to claim 2, characterized in that: T-shaped long plates (11) are provided on the left and right sides of the bottom end of the encapsulation body (3), and T-shaped sliding grooves (12) are provided on the left and rear sides of the top end of the encapsulation substrate (1). The rear ends of the two sets of T-shaped sliding grooves (12) are connected and have openings. The two sets of T-shaped long plates (11) are respectively slidably engaged with the two sets of T-shaped sliding grooves (12).

6. An integrated circuit packaging structure according to claim 3, characterized in that: A sealing ring (13) is provided between the metal heat dissipation cover (9) and the plastic seal (3).

7. An integrated circuit packaging structure according to claim 2, characterized in that: Each of the four sets of bolts (7) has a handle (14) at its top.

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