Highly heat-conductive IGBT module housing structure

Abstract

The utility model discloses a high heat conduction IGBT module shell structure, including IGBT module shell structure body, the PCB board, chip and substrate are installed in the IGBT module shell structure body, the IGBT module shell structure body includes: the casing, its top and bottom are all set to open, its outside is provided with the annular groove of matrix, and the inside of casing is filled with heat conduction pouring sealant, and heat conduction pouring sealant has the characteristic of heat conduction, the periphery side heat conduction heat dissipation mechanism is installed on the casing, and the periphery side heat conduction heat dissipation mechanism is used to the heat dissipation of the inside of casing from the periphery side heat conduction. The utility model discloses a series of structure's setting can through the periphery side, top and bottom heat conduction mode to the inside of casing carries out effective heat conduction heat dissipation, and can in the process of heat conduction through the mode of blowing to accelerate the speed of first radiating fin and second radiating fin heat conduction heat dissipation, through the heat conduction of many faces cooperation gas blowing heat conduction, can realize the effect of efficient heat conduction heat dissipation.

Description

Technical Field

[0001] This utility model relates to the technical field of IGBT module housing structure, and in particular to a high thermal conductivity IGBT module housing structure. Background Technology

[0002] As the core power switching device of modern power electronic devices, IGBT modules are widely used in new energy vehicles, industrial frequency conversion, new energy power generation and smart grid fields. With the increasing requirements of power density and reliability in these fields, IGBT modules are developing towards high current and high power density, which leads to a sharp increase in heat generation per unit volume. How to efficiently and reliably dissipate the heat generated by the chip has become a key challenge to ensure the long-term stable operation of IGBT modules and extend their service life. Existing IGBT modules usually adopt a multi-layer structure, including a chip, a direct copper-clad ceramic substrate and a metal substrate. Among them, the metal substrate constitutes the main shell structure and mechanical support of the module, and is also a key link in the main heat dissipation path. At present, aluminum or aluminum alloy is generally used as the metal substrate material in the industry, mainly based on the considerations of low cost, light weight and easy processing of aluminum. However, the traditional aluminum housing substrate relies solely on its own thermal conductivity for heat dissipation, which is not ideal. Therefore, in order to improve the thermal conductivity, this application proposes a high thermal conductivity IGBT module housing structure. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high thermal conductivity IGBT module housing structure.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A high thermal conductivity IGBT module housing structure includes an IGBT module housing structure body, wherein a PCB board, a chip, and a substrate are mounted inside the IGBT module housing structure body. The IGBT module housing structure body includes: The shell has openings at the top and bottom, and a rectangular annular groove on its outer side. The interior of the shell is filled with thermally conductive potting compound, which has the property of heat conduction. A peripheral heat conduction and heat dissipation mechanism is installed on the housing and is used to conduct heat and dissipate heat from the periphery to the inside of the housing. The end heat dissipation mechanism consists of two sets, which are installed at the top and bottom of the housing respectively. The end heat dissipation mechanism is used to dissipate heat from the top and bottom of the housing. A connecting pipe is fixed between the two end heat dissipation mechanisms on their sides that are close to each other, and the connecting pipe enables the connection between the two end heat dissipation mechanisms; A miniature fan is fixed to the left side of the upper end heat dissipation mechanism and connected to the upper end heat dissipation mechanism. The miniature fan is used to supply heat into the upper end heat dissipation mechanism.

[0005] Preferably, the peripheral heat dissipation mechanism includes multiple first heat dissipation fins, each of which is embedded and fixed on the inner wall of the rectangular annular groove. The inner wall of the housing is coated with a thermally conductive coating, which is in contact with the thermally conductive potting compound. The sides of two opposing first heat dissipation fins that are close to each other are in contact with the thermally conductive coating. Multiple first air blowing pipes are embedded in the top and bottom inner walls of the rectangular annular groove in a rectangular annular shape. The first air blowing pipes cooperate with the corresponding first heat dissipation fins. Through the cooperation of the thermally conductive potting compound, the thermally conductive coating, and the first heat dissipation fins, the effect of peripheral heat conduction can be achieved.

[0006] Preferably, the end heat dissipation mechanism includes a rectangular annular tube. The top and bottom ends of the connecting tube are respectively connected and fixed to the sides of two rectangular annular tubes that are close to each other. The sides of the two rectangular annular tubes that are close to each other are respectively fixedly connected to the top and bottom of the shell. The ends of two opposing first air blowing pipes that are far apart from each other are respectively connected to the interior of the corresponding rectangular annular tubes. A heat-conducting plate is fixedly sleeved inside the rectangular annular tube. The top of the heat-conducting plate has multiple exhaust holes for discharging hot gas to the outside. Multiple second heat dissipation fins are fixedly connected to the sides of the two heat-conducting plates that are close to each other. The bottoms of multiple second heat dissipation fins are in contact with thermally conductive potting compound, and the tops of multiple second heat dissipation fins located below are in movable contact with the bottom of the substrate. Multiple second air blowing pipes connected to the inside are embedded and fixed in a rectangular ring shape inside the rectangular annular tube. The second air blowing pipes cooperate with the corresponding second heat dissipation fins. A micro fan is fixedly connected to the left side of the upper rectangular annular tube. The exhaust end of the micro fan extends into the upper rectangular annular tube. The micro fan is used to supply gas into the upper rectangular annular tube. Through the cooperation of the second heat dissipation fins and the heat-conducting plate, heat can be conducted to the inside of the shell from the top and bottom.

[0007] Preferably, a first welding thermal conductive coating is provided between the top of the PCB board and the bottom of the chip, and a second welding thermal conductive coating is provided between the top of the substrate and the bottom of the PCB board. Both the first welding thermal conductive coating and the second welding thermal conductive coating are made of pure aluminum. By utilizing the thermal conductivity of the first welding thermal conductive coating and the second welding thermal conductive coating, the heat of the chip can be conducted to the heat-conducting plate below.

[0008] Preferably, the thermally conductive coating is made of high thermal conductivity silicone, and the shell is made of high thermal conductivity plastic, which is a plastic in which engineering plastic PPS is filled with high thermal conductivity filler alumina Al2O3.

[0009] Preferably, the multiple exhaust vents are staggered with the multiple second heat dissipation fins.

[0010] Preferably, both the first and second heat dissipation fins are made of aluminum alloy.

[0011] Compared with existing technologies, the beneficial effects of this utility model are: By combining thermally conductive potting compound, peripheral thermally conductive heat dissipation mechanism and end heat dissipation mechanism, effective heat conduction and heat dissipation of the inside of the shell can be achieved through simultaneous heat conduction from the periphery, top and bottom. In addition, with the addition of a micro fan and connecting pipe, gas can be blown onto the first and second heat dissipation fins during the heat conduction process. By blowing air, the heat conduction speed can be accelerated, and the heat conduction effect can be further improved. Through efficient heat conduction, the heat inside the shell can be quickly dissipated. This utility model, through a series of structural designs, can effectively conduct and dissipate heat inside the shell by conducting heat simultaneously from the periphery, top, and bottom. Furthermore, during the heat conduction process, air blowing can accelerate the heat conduction and dissipation speed of the first and second heat dissipation fins. By combining multi-faceted heat conduction with gas blowing, a highly efficient heat conduction and dissipation effect can be achieved. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the high thermal conductivity IGBT module housing structure proposed in this utility model; Figure 2 This is a front cross-sectional view of the housing structure of a high thermal conductivity IGBT module proposed in this utility model.

[0013] In the diagram: 101, chip; 102, PCB board; 103, substrate; 1, housing; 2, end heat dissipation mechanism; 201, rectangular annular tube; 202, heat-conducting plate; 203, exhaust hole; 204, second air blowing pipe; 205, second heat dissipation fins; 206, connecting pipe; 3, peripheral heat conduction and heat dissipation mechanism; 301, first heat dissipation fins; 302, thermally conductive coating; 303, first air blowing pipe; 304, rectangular annular groove; 4, micro fan; 5, thermally conductive potting compound; 6, second welding thermally conductive coating; 7, first welding thermally conductive coating. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0015] Reference Figure 1-2 A high thermal conductivity IGBT module housing structure includes an IGBT module housing structure body, within which a PCB board 102, a chip 101, and a substrate 103 are mounted. The IGBT module housing structure body includes: The shell 1 has openings at the top and bottom, and a rectangular annular groove 304 is provided on its outer side. The shell 1 is filled with thermally conductive potting compound 5, which has the property of heat conduction. The shell 1 is made of high thermal conductivity plastic, which is a plastic filled with high thermal conductivity filler alumina Al2O3 in engineering plastic PPS. The peripheral heat conduction and heat dissipation mechanism 3 is installed on the housing 1; The peripheral heat dissipation mechanism 3 includes multiple first heat dissipation fins 301, which are all embedded and fixed on the inner wall of the rectangular annular groove 304. The inner wall of the housing 1 is coated with a thermally conductive coating 302, which is in contact with the thermally conductive potting compound 5. The thermally conductive coating 302 is made of high thermal conductivity silicone. The sides of two opposing first heat dissipation fins 301 that are close to each other are in contact with the thermally conductive coating 302. Multiple first air blowing pipes 303 are embedded in the top and bottom inner walls of the rectangular annular groove 304 in a rectangular annular shape. The first air blowing pipes 303 cooperate with the corresponding first heat dissipation fins 301. Through the cooperation of the thermally conductive potting compound 5, the thermally conductive coating 302 and the first heat dissipation fins 301, the effect of peripheral heat conduction can be achieved.

[0016] In this embodiment, the heat inside the shell 1 is also discharged to the outside through the thermally conductive potting compound 5, the thermally conductive coating 302 and multiple first heat dissipation fins 301 in sequence, thereby achieving the effect of heat conduction from the periphery.

[0017] Furthermore: A high thermal conductivity IGBT module housing structure also includes an end heat dissipation mechanism 2, which consists of two sets, respectively installed at the top and bottom of the housing 1; The connecting pipe 206 is fixed between the two end heat dissipation mechanisms 2 on their respective sides, and the connection between the two end heat dissipation mechanisms 2 is achieved through the connecting pipe 206; The miniature fan 4 is fixed to the left side of the upper end heat dissipation mechanism 2 and is connected to the upper end heat dissipation mechanism 2; The end heat dissipation mechanism 2 includes a rectangular annular tube 201. The top and bottom ends of the connecting tube 206 are respectively connected and fixed to the sides of the two rectangular annular tubes 201 that are close to each other. The sides of the two rectangular annular tubes 201 that are close to each other are respectively fixedly connected to the top and bottom of the housing 1. The ends of the two first air blowing pipes 303 that are opposite each other are respectively connected to the interior of the corresponding rectangular annular tubes 201. A heat-conducting plate 202 is fixedly sleeved inside the rectangular annular tube 201. The top of the heat-conducting plate 202 is provided with multiple exhaust holes 203. The exhaust holes 203 are used to discharge heat-generating gas to the outside. Multiple second heat dissipation fins 205 are fixedly connected to the sides of the two heat-conducting plates 202 that are close to each other. The multiple exhaust holes 203 and the multiple second heat dissipation fins 205 are staggered to avoid the situation where the second heat dissipation fins 205 block the exhaust holes 203. The bottom of the multiple second heat dissipation fins 205 located at the top is in contact with the thermally conductive potting compound 5, and the top of the multiple second heat dissipation fins 205 located at the bottom is in contact with the bottom of the substrate 103. The first heat dissipation fin 301 and the second heat dissipation fin 205 are both made of aluminum alloy and are used for heat transfer. Their heat conduction principle is based on the existing characteristics of aluminum alloy, which will not be described separately here. Multiple second air blowing pipes 204 connected to the inside are embedded and fixed in a rectangular ring shape on the inner side of the rectangular annular tube 201. The second air blowing pipes 204 cooperate with the corresponding second heat dissipation fins 205. The micro fan 4 is fixedly connected to the left side of the upper rectangular annular tube 201. The exhaust end of the micro fan 4 extends into the upper rectangular annular tube 201. The micro fan 4 is used to supply gas into the upper rectangular annular tube 201. Through the cooperation of the second heat dissipation fins 205 and the heat conduction plate 202, heat can be conducted to the inside of the shell 1 from the top and bottom. A first welding thermal conductive coating 7 is provided between the top of the PCB board 102 and the bottom of the chip 101, and a second welding thermal conductive coating 6 is provided between the top of the substrate 103 and the bottom of the PCB board 102. Both the first welding thermal conductive coating 7 and the second welding thermal conductive coating 6 are made of pure aluminum. By utilizing the thermal conductivity of the first welding thermal conductive coating 7 and the second welding thermal conductive coating 6, the heat of the chip 101 can be conducted to the heat-conducting plate 202 below.

[0018] In this embodiment: the heat of chip 101 is sequentially transferred to the multiple second heat dissipation fins 205 below through the first welding thermal conductive coating 7, PCB board 102, second welding thermal conductive coating 6 and substrate 103. The heat of the multiple second heat dissipation fins 205 below is transferred to the heat conduction plate 202 below. The heat conduction plate 202 below conducts the heat out. At the same time, some heat inside the housing 1 is sequentially discharged to the outside through the thermally conductive potting compound 5, the multiple second heat dissipation fins 205 above and the heat conduction plate 202 above. Simultaneously, the micro fan 4 is turned on, and the gas it draws is discharged into the upper rectangular annular tube 201. A portion of the gas inside the upper rectangular annular tube 201 enters the lower rectangular annular tube 201 through the connecting pipe 206. A portion of the gas inside the rectangular annular tube 201 is discharged through the corresponding multiple second air blowing pipes 204 to blow agitate the second heat dissipation fins 205. At the same time, the gas blown by the second air blowing pipes 204 can be discharged to the outside through the corresponding multiple exhaust holes 203. Another portion of the gas inside the rectangular annular tube 201 is discharged through the corresponding multiple first air blowing pipes 303 to blow agitate the first heat dissipation fins 301. By blowing gas onto the first heat dissipation fins 301 and the second heat dissipation fins 205, the heat conduction speed of the first heat dissipation fins 301 and the second heat dissipation fins 205 can be accelerated, so that the heat on the first heat dissipation fins 301 and the second heat dissipation fins 205 can be quickly conducted to the outside, improving the heat conduction effect.

[0019] It should be noted that: the micro fan 4 can preferably be a centrifugal fan from the BFB series, and its power supply can be provided by the power supply that powers the IGBT module. The specific power supply principle is existing technology and will not be elaborated here. The principle of dissipating heat through the first heat dissipation fin 301 and the second heat dissipation fin 205 is existing technology and will not be elaborated here.

[0020] Working principle: During use, the heat from chip 101 is sequentially transferred to multiple second heat dissipation fins 205 below through the first welding thermal conductive coating 7, PCB board 102, second welding thermal conductive coating 6 and substrate 103. The heat from the multiple second heat dissipation fins 205 below is transferred to the heat conduction plate 202 below, and the heat conduction plate 202 below conducts the heat out. At the same time, the heat inside the housing 1 is also sequentially discharged to the outside through the thermally conductive potting compound 5, thermally conductive coating 302 and multiple first heat dissipation fins 301. A portion of the heat inside the housing 1 is also sequentially discharged to the outside through the thermally conductive potting compound 5, multiple second heat dissipation fins 205 above and heat conduction plate 202 above. By conducting heat from the periphery, top and bottom simultaneously, the heat inside the housing 1 can be quickly discharged to the outside, thereby improving the heat conduction effect. Simultaneously, the micro fan 4 is activated, and the gas drawn by the micro fan 4 is discharged into the upper rectangular annular tube 201. A portion of the gas inside the upper rectangular annular tube 201 enters the lower rectangular annular tube 201 through the connecting pipe 206. A portion of the gas inside the rectangular annular tube 201 is discharged through the corresponding multiple second air blowing pipes 204 to blow on the second heat dissipation fins 205. At the same time, the gas blown by the second air blowing pipes 204 can be discharged to the outside through the corresponding multiple exhaust holes 203. Another portion of the gas inside the rectangular annular tube 201 is discharged through the corresponding multiple first air blowing pipes. The exhaust pipe 303 blows air onto the first heat sink 301. By blowing air onto the first heat sink 301 and the second heat sink 205, the heat conduction speed of the first heat sink 301 and the second heat sink 205 can be accelerated, so that the heat on the first heat sink 301 and the second heat sink 205 can be quickly conducted to the outside. By blowing air, the heat conduction speed can be accelerated, and the heat conduction effect can be further improved. Through efficient heat conduction, the heat inside the housing 1 can be quickly discharged, improving the stability of the entire IGBT module during use.

[0021] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high thermal conductivity IGBT module housing structure, comprising an IGBT module housing structure body, wherein a PCB board (102), a chip (101), and a substrate (103) are mounted within the IGBT module housing structure body, characterized in that, The IGBT module housing structure includes: The shell (1) has openings at the top and bottom, and a rectangular annular groove (304) is provided on its outer side. The shell (1) is filled with thermally conductive potting compound (5). A peripheral heat conduction and heat dissipation mechanism (3) is installed on the housing (1); The end heat dissipation mechanism (2) consists of two sets, which are respectively installed on the top and bottom of the housing (1); A connecting pipe (206) is fixed between the two end heat dissipation mechanisms (2) on their respective sides that are close to each other; A miniature fan (4) is fixed to the left side of the upper end heat dissipation mechanism (2) and connected to the upper end heat dissipation mechanism (2).

2. The high thermal conductivity IGBT module housing structure according to claim 1, characterized in that, The peripheral heat dissipation mechanism (3) includes multiple first heat dissipation fins (301), which are all embedded and fixed on the inner wall of the rectangular annular groove (304). The inner wall of the housing (1) is coated with a thermally conductive coating (302), which is in contact with the thermally conductive potting compound (5). The sides of the two opposing first heat dissipation fins (301) that are close to each other are in contact with the thermally conductive coating (302). Multiple first air blowing pipes (303) are embedded in the top and bottom inner walls of the rectangular annular groove (304) in a rectangular annular shape. The first air blowing pipes (303) cooperate with the corresponding first heat dissipation fins (301).

3. The high thermal conductivity IGBT module housing structure according to claim 2, characterized in that, The end heat dissipation mechanism (2) includes a rectangular annular tube (201). The top and bottom ends of the connecting tube (206) are respectively connected and fixed to the sides of the two rectangular annular tubes (201) that are close to each other. The sides of the two rectangular annular tubes (201) that are close to each other are respectively fixedly connected to the top and bottom of the shell (1). The ends of the two opposing first air blowing pipes (303) that are far apart from each other are respectively connected to the interior of the corresponding rectangular annular tube (201). A heat-conducting plate (202) is fixedly sleeved inside the rectangular annular tube (201). Multiple exhaust holes (203) are opened on the top of the heat-conducting plate (202). The sides of the two heat-conducting plates (202) that are close to each other are fixed. Multiple second heat dissipation fins (205) are connected. The bottom of the upper multiple second heat dissipation fins (205) is in contact with the thermally conductive potting compound (5). The top of the lower multiple second heat dissipation fins (205) are in movable contact with the bottom of the substrate (103). Multiple second air blowing pipes (204) connected to the inside of the rectangular annular tube (201) are embedded and fixed in a rectangular annular shape. The second air blowing pipes (204) cooperate with the corresponding second heat dissipation fins (205). The micro fan (4) is fixedly connected to the left side of the upper rectangular annular tube (201). The exhaust end of the micro fan (4) extends into the upper rectangular annular tube (201).

4. The high thermal conductivity IGBT module housing structure according to claim 1, characterized in that, A first welding thermal conductive coating (7) is provided between the top of the PCB board (102) and the bottom of the chip (101), and a second welding thermal conductive coating (6) is provided between the top of the substrate (103) and the bottom of the PCB board (102). The first welding thermal conductive coating (7) and the second welding thermal conductive coating (6) are both made of pure aluminum.

5. The high thermal conductivity IGBT module housing structure according to claim 2, characterized in that, The thermally conductive coating (302) is made of high thermally conductive silicone, and the shell (1) is made of high thermally conductive plastic, which is a plastic filled with high thermally conductive alumina Al2O3 in engineering plastic PPS.

6. The high thermal conductivity IGBT module housing structure according to claim 3, characterized in that, Multiple exhaust vents (203) are staggered with multiple second heat dissipation fins (205).

7. The high thermal conductivity IGBT module housing structure according to claim 3, characterized in that, The first heat dissipation fin (301) and the second heat dissipation fin (205) are both made of aluminum alloy.

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