Wafer level package bumping apparatus

Abstract

The utility model provides a kind of wafer level packaging bump manufacturing equipment, it is related to the field of semiconductor packaging.The utility model includes the manufacturing assembly for processing wafer bump, the feed assembly for wafer feeding is installed in the front end of the manufacturing assembly, the moving assembly for moving wafer is installed in the inside of the manufacturing assembly, and the lifting assembly for adjusting the height of moving assembly is installed in the rear end of the moving assembly;The manufacturing assembly includes device shell, the inside of the device shell is fixed with processing table, the top of the processing table is provided with two groups of placing table, and the top of one group of the placing table is provided with ball mounting device for ball mounting.The utility model sets manufacturing assembly to closed state, by opening protective door to carry out feeding, after closing protective door, realize the ball mounting and ball shaking operation of wafer, avoid the influence of open type manufacturing device to the ball mounting and ball shaking operation of wafer, to affect the manufacturing effect of wafer bump.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, specifically a wafer-level packaging bump fabrication device. Background Technology

[0002] Wafer bumps are key structures in semiconductor packaging used to achieve electrical connections between chips and external circuits. They are typically made of metal or alloy materials and formed on pads on the surface of a wafer using precision processes. Their core function is to provide a solderable interface for the chip, replacing traditional lead frames and enabling shorter, more efficient signal transmission.

[0003] Solder ball attaching machines are the most commonly used devices in wafer bump fabrication. Before attaching the balls, flux is applied to the wafer pads using ultra-precision metal stencil printing technology. Then, a metal stencil with tiny mesh holes corresponding to the wafer pad layout is used to tightly adhere to the wafer surface. Under precise control, the solder balls fall through the mesh holes into the corresponding pad positions.

[0004] Currently, during wafer bump fabrication, the ball-planting device and ball-shaping platform are set on the worktable, which is mostly in an open state. When fabricating wafer bumps, the open worktable is easily affected by the surrounding environment, thus affecting the fabrication effect of wafer bumps. Utility Model Content

[0005] The purpose of this invention is to provide a wafer-level packaging bump fabrication device to solve the problems mentioned in the background section and overcome its technical defects.

[0006] To solve the above technical problems, the technical solution adopted by this utility model is: a wafer-level packaging bump fabrication device, including a fabrication component for processing wafer bumps, a feeding component installed at the front end of the fabrication component for feeding wafers, a moving component installed inside the fabrication component for moving wafers, and a lifting component installed at the rear end of the moving component for adjusting the height of the moving component. The manufacturing assembly includes a device housing, inside which a processing table is fixed. Two sets of placement platforms are provided on the top of the processing platform. One set of placement platforms is equipped with a ball-planting device for planting balls, and the other set of placement platforms is equipped with a ball-shaking platform device for shaking balls.

[0007] As a further improvement of this utility model, the manufacturing component also includes a support platform fixed to the front end of the device housing, and a protective compartment door is rotatably connected to the top of the support platform via a hinge.

[0008] As a further embodiment of this utility model: the feeding assembly is installed on the top of the support platform, the feeding assembly includes a feeding platform that is slidably installed on the top of the support platform, and a lead screw slider is provided at the connection between the feeding platform and the support platform.

[0009] As a further embodiment of this utility model: the inside of the lead screw slider is connected to the feed lead screw through a lead screw sleeve, and the front end of the feed lead screw is fixed to the power output end of the feed motor, and the feed lead screw passes through the inside of the processing table.

[0010] As a further embodiment of this utility model: the lifting assembly includes a lifting guide rail fixed inside the device housing, a lifting chamber slidably connected to the front end of the lifting guide rail, and a lifting cylinder fixed to the top of the lifting chamber, the lifting cylinder being fixed to the device housing by bolts.

[0011] As a further improvement of this utility model: the front end of the lifting chamber is provided with a movable slot, and the movable component is disposed inside the lifting chamber.

[0012] As a further embodiment of this utility model: the moving component includes a stepper motor fixed inside the lifting chamber by external bolts, a connecting rod fixed to the power output end of the stepper motor, and a fixing member fixed vertically to the connecting rod, and a sliding cylinder fixed to the front end of the fixing member by external bolts.

[0013] As a further improvement of this utility model: the telescopic end of the sliding cylinder is fixed with a support plate, and the bottom of the connecting rod is fixed with a support shaft that is rotatably installed inside the lifting chamber.

[0014] Compared with the prior art, the beneficial effects of this utility model include: 1. This utility model sets the fabrication components to a closed state, feeds materials by opening the protective chamber door, and performs the ball-planting and ball-shaking operations on the wafer after closing the protective chamber door. This avoids the open fabrication device from affecting the ball-planting and ball-shaking operations on the wafer, thereby affecting the fabrication effect of the wafer bumps. 2. This utility model provides a feeding assembly on the support platform, which can move the wafer into the interior of the device housing, facilitating feeding. 3. This utility model, through the combination of a lifting component and a moving component, can move wafers of different heights to the placement platform, thereby realizing the moving and picking of wafers and moving the wafers below the ball-planting device and the ball-shaking platform device. Attached Figure Description

[0015] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein: Figure 1 The schematic diagram shows an overall structural schematic diagram according to one embodiment of the present invention; Figure 2 A schematic diagram of a processing table according to one embodiment of the present invention is shown. Figure 3 The schematic diagram shows a moving component rotating according to one embodiment of the present invention. Figure 4 The illustration shows a half-sectional view of a manufacturing component according to one embodiment of the present invention.

[0016] The diagram is labeled as follows: 1. Manufacturing component; 101. Device housing; 102. Protective chamber door; 103. Support platform; 104. Processing table; 2. Feeding component; 201. Feeding motor; 202. Feeding screw; 203. Feeding platform; 204. Screw slider; 3. Ball planting device; 4. Placement platform; 5. Ball shaking platform device; 6. Lifting component; 601. Lifting guide rail; 602. Lifting cylinder; 603. Lifting chamber; 604. Movable groove; 7. Moving component; 701. Support plate; 702. Connecting rod; 703. Support shaft; 704. Sliding cylinder; 705. Stepper motor; 706. Fixing component. Detailed Implementation

[0017] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0018] An embodiment of the present invention is shown in conjunction with the accompanying drawings.

[0019] Example 1 Please see Figure 1 and Figure 4 This is the first embodiment of the present invention, which provides a wafer-level packaging bump fabrication device, comprising: Fabrication component 1 for processing wafer bumps, feeding component 2 installed at the front end of fabrication component 1 for wafer feeding, moving component 7 installed inside fabrication component 1 for moving wafers, and lifting component 6 installed at the rear end of moving component 7 for adjusting the height of moving component 7. The manufacturing component 1 includes a device housing 101, and a processing table 104 is fixed inside the device housing 101. Two sets of placement platforms 4 are provided on the top of the processing platform 104. One set of placement platforms 4 is provided with a ball-planting device 3 for planting balls, and the other set of placement platforms 4 is provided with a ball-shaking platform device 5 for shaking balls.

[0020] Specifically, the manufacturing component 1 also includes a support platform 103 fixed to the front end of the device housing 101, and a protective compartment door 102 is rotatably connected to the top of the support platform 103 via a hinge.

[0021] Furthermore, the protective door 102 is mounted on the front end of the device housing 101 via a hinge, and the bottom of the protective door 102 fits against the top of the support platform 103. In order to improve the sealing performance of the protective door 102, sealing strips can be provided around the protective door 102.

[0022] In this embodiment, by setting the fabrication component 1 to a closed state, the material is fed by opening the protective chamber door 102 and then closing the protective chamber door 102 to realize the ball placement and ball shaking operations on the wafer. This avoids the open fabrication device from affecting the ball placement and ball shaking operations on the wafer, thereby affecting the fabrication effect of the wafer bumps.

[0023] Example 2 Please see Figure 2 and Figure 4 This is the second embodiment of the present invention, which provides a wafer-level packaging bump fabrication device, comprising: Specifically, the feeding assembly 2 is installed on the top of the support platform 103. The feeding assembly 2 includes a feeding platform 203 that is slidably installed on the top of the support platform 103, and a lead screw slider 204 is provided at the connection between the feeding platform 203 and the support platform 103.

[0024] Furthermore, the feed table 203 can slide on top of the support table 103. A wafer carrier can be installed on the feed table 203. After the wafer is placed on the wafer carrier, it can be moved above the processing table 104 through the feed table 203 to realize wafer feeding.

[0025] Specifically, the inside of the lead screw slider 204 is connected to the feed lead screw 202 through a lead sleeve, and the front end of the feed lead screw 202 is fixed to the power output end of the feed motor 201. The feed lead screw 202 passes through the inside of the processing table 104.

[0026] Furthermore, the end of the feed screw 202 is located inside the processing table 104. When the feed motor 201 is working, it can drive the feed screw 202 to rotate. The feed screw 202 can drive the screw slider 204 to slide through the screw sleeve, thereby adjusting the position of the feed table 203.

[0027] In this embodiment, by providing a feeding component 2 on the support platform 103, the feeding component 2 can move the wafer into the device housing 101, which facilitates feeding.

[0028] Example 3 Please see Figure 2 and Figure 3 This is the third embodiment of the present invention, which provides a wafer-level packaging bump fabrication device, comprising: Specifically, the lifting assembly 6 includes a lifting guide rail 601 fixed inside the device housing 101. The front end of the lifting guide rail 601 is slidably connected to a lifting chamber 603, and a lifting cylinder 602 is fixed to the top of the lifting chamber 603. The lifting cylinder 602 is fixed to the device housing 101 by bolts.

[0029] Furthermore, during wafer processing, the height of the moving component 7 can be adjusted by the lifting component 6, thereby picking up wafers at different heights.

[0030] Specifically, the front end of the lifting chamber 603 is provided with a movable slot 604, and the moving component 7 is located inside the lifting chamber 603.

[0031] Furthermore, after the lifting cylinder 602 is activated, it can push the lifting chamber 603 to slide on the lifting guide rail 601. When the lifting chamber 603 moves, it can drive the moving component 7 to move up and down. The height of the moving component 7 is adjusted according to the height of the wafer. After the moving component 7 moves to below the wafer, the moving component 7 is lifted up to drive the wafer and make the wafer leave the wafer carrier.

[0032] Specifically, the moving component 7 includes a stepper motor 705 fixed inside the lifting chamber 603 by external bolts. A connecting rod 702 is fixed to the power output end of the stepper motor 705, and a fixing member 706 is vertically fixed to the connecting rod 702. A sliding cylinder 704 is fixed to the front end of the fixing member 706 by external bolts.

[0033] Furthermore, when the stepper motor 705 is working, the power output end of the stepper motor 705 can drive the connecting rod 702 to rotate, and the connecting rod 702 swings inside the movable groove 604, thereby driving the sliding cylinder 704 to adjust the angle.

[0034] Specifically, the telescopic end of the sliding cylinder 704 is fixed with a support plate 701, and the bottom of the connecting rod 702 is fixed with a support shaft 703 that is rotatably installed inside the lifting chamber 603.

[0035] Furthermore, when the sliding cylinder 704 is started, it can push the support plate 701 forward, extending the support plate 701 under the wafer, while the support shaft 703 can support the connecting rod 702.

[0036] In this embodiment, the lifting component 6 and the moving component 7 can move wafers of different heights onto the placement stage 4, thereby realizing the moving and picking of wafers and moving the wafers below the ball-planting device 3 and the ball-shaking platform device 5.

[0037] Working principle: The ball-planting device 3 and the ball-shaking platform device 5 directly adopt existing devices. A cylinder can be installed above the ball-planting device 3 and the ball-shaking platform device 5 to adjust their height. The wafer carrier is placed on the feeding platform 203 on top of the support table 103. At this time, the protective chamber door 102 is in the open state. When the feeding motor 201 is working, it can drive the feeding screw 202 to rotate. The feeding screw 202 can drive the screw slider 204 to slide through the screw sleeve. The feeding platform 203 moves into the inside of the device housing 101. Then the protective chamber door 102 closes. At this time, the height of the moving component 7 is adjusted according to the height of the wafer. The lifting cylinder 602 pushes the lifting chamber 603 on the lifting guide rail 601. When the lifting chamber 603 moves, it can drive the moving component 7 to move up and down. Then, the sliding cylinder 704 can push the support plate 701 forward, extending the support plate 701 under the wafer. Then, the moving component 7 moves upward, driving the wafer upward through the support plate 701. The sliding cylinder 704 can drive the wafer to move backward through the support plate 701. Afterward, the power output end of the stepper motor 705 can drive the connecting rod 702 to rotate. The connecting rod 702 swings inside the movable slot 604, thereby driving the sliding cylinder 704 to adjust the angle and move the wafer to the placement stage 4, thereby realizing the moving and picking of the wafer. The wafer is moved to the bottom of the ball-mounting device 3 and the ball-shaking platform device 5, thereby processing the wafer bumps.

[0038] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A wafer-level packaging bump fabrication device, characterized in that, It includes a fabrication assembly (1) for processing wafer bumps, a feeding assembly (2) installed at the front end of the fabrication assembly (1) for wafer feeding, a moving assembly (7) installed inside the fabrication assembly (1) for moving the wafer, and a lifting assembly (6) installed at the rear end of the moving assembly (7) for adjusting the height of the moving assembly (7). The manufacturing component (1) includes a device housing (101), inside which a processing table (104) is fixed. Two sets of placement tables (4) are provided on the top of the processing table (104). One set of placement tables (4) is provided with a ball-planting device (3) for planting balls, and the other set of placement tables (4) is provided with a ball-shaking platform device (5) for shaking balls.

2. The wafer-level packaging bump fabrication equipment according to claim 1, characterized in that, The manufacturing component (1) also includes a support platform (103) fixed to the front end of the device housing (101), and a protective compartment door (102) is rotatably connected above the support platform (103) via a hinge.

3. The wafer-level packaging bump fabrication equipment according to claim 2, characterized in that, The feeding assembly (2) is installed on the top of the support platform (103). The feeding assembly (2) includes a feeding platform (203) that is slidably installed on the top of the support platform (103), and a lead screw slider (204) is provided at the connection between the feeding platform (203) and the support platform (103).

4. The wafer-level packaging bump fabrication equipment according to claim 3, characterized in that, The inside of the lead screw slider (204) is connected to the feed lead screw (202) through the lead screw sleeve, and the front end of the feed lead screw (202) is fixed to the power output end of the feed motor (201). The feed lead screw (202) passes through the inside of the processing table (104).

5. The wafer-level packaging bump fabrication equipment according to claim 4, characterized in that, The lifting assembly (6) includes a lifting guide rail (601) fixed inside the device housing (101). The front end of the lifting guide rail (601) is slidably connected to a lifting chamber (603), and a lifting cylinder (602) is fixed to the top of the lifting chamber (603). The lifting cylinder (602) is fixed to the device housing (101) by bolts.

6. The wafer-level packaging bump fabrication equipment according to claim 5, characterized in that, The front end of the lifting chamber (603) is provided with a movable slot (604), and the moving component (7) is disposed inside the lifting chamber (603).

7. The wafer-level packaging bump fabrication equipment according to claim 6, characterized in that, The moving component (7) includes a stepper motor (705) fixed inside the lifting chamber (603) by external bolts. The power output end of the stepper motor (705) is fixed with a connecting rod (702), and a fixing member (706) is vertically fixed to the connecting rod (702). The front end of the fixing member (706) is fixed with a sliding cylinder (704) by external bolts.

8. The wafer-level packaging bump fabrication equipment according to claim 7, characterized in that, The telescopic end of the sliding cylinder (704) is fixed with a support plate (701), and the bottom of the connecting rod (702) is fixed with a support shaft (703) that is rotatably installed inside the lifting chamber (603).

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