Flip chip bonder including a chip thermocompression bonding head

Abstract

The utility model relates to chip packaging equipment field, concretely to a flip -chip bonder including chip hot press welding head, including two -way adjusting clamping component, height adjusting assembly, hot press welding head, cooling assembly and flip -chip bonder, and the top of mounting plate is equipped with support seat, and the top of support seat is equipped with side baffle symmetrically, and the inside of side baffle is equipped with the sliding block of sliding, and one end of sliding block is equipped with electric push rod, and the one end close to electric push rod of sliding block is equipped with drive motor no.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging equipment, specifically a flip bonding machine including a chip thermoforming head. Technical Background

[0002] In the chip manufacturing industry, flip-chip bonding technology is an important chip packaging technology. It directly aligns and connects the chip's pads with the pads of the substrate or lead frame, which can effectively reduce the package size and improve electrical and heat dissipation performance. It is widely used in the manufacturing process of various high-end chips. In the prior art, the device disclosed in Chinese Patent Publication No. CN201711020865.4 uses a pressure-applying method and a pressure-reducing process to apply pressure to the solder. This device provides a simpler structure, is easier to operate, produces smooth and well-formed solder joints, and has higher quality and reliability of workpiece solder joints. It also solves the problems of solder splatter and solder balls.

[0003] However, this device has several problems during use. On the one hand, when clamping and positioning the chip, it can only adjust in one direction, making it difficult to precisely adjust the chip's position. This results in low alignment accuracy between the chip and the hot-pressing head, which can easily lead to welding deviations and affect the chip's welding quality. On the other hand, the hot-pressing head generates a lot of heat during operation. If it cannot be effectively cooled in time, it will not only affect the lifespan of the hot-pressing head but may also damage the chip due to overheating, reducing the chip yield. In addition, the overall structural design of the device is not reasonable enough, and there are certain defects in material storage and equipment support stability, which brings inconvenience to operators and restricts the improvement of chip flip bonding production efficiency.

[0004] Therefore, there is an urgent need for a chip hot-press bonding head and flip-chip bonding machine that can solve the above problems. Utility Model Content

[0005] This invention provides a flip bonding machine including a chip hot-pressing bonding head, which aims to solve problems such as unstable clamping, poor heat dissipation, and inconvenient material and storage in the prior art.

[0006] This utility model provides a flip bonding machine including a chip thermoforming head, comprising a bidirectional adjustable clamping assembly, a height adjustable assembly, a thermoforming head, a cooling assembly, and a flip bonding machine.

[0007] As a further description of the above technical solution: The bidirectional adjustable clamping assembly includes a mounting plate, a support base, side strips, a slider, an electric push rod, a first drive motor, a first threaded rod, a guide rod, a placement plate, a fixing block, a second drive motor, a bidirectional threaded rod, and a clamping plate. The mounting plate has a support base at its top, and side strips are symmetrically positioned at the top of the support base. A slider slides inside the side strips, and an electric push rod is located at one end of the slider. A first drive motor is located near the end of the slider close to the electric push rod, and a first threaded rod is located at the output end of the first drive motor. A guide rod is located on one side of the first threaded rod.

[0008] As a further description of the above technical solution: The placement plate is set on the top of the mounting plate. One end of the placement plate has a threaded hole that matches the threaded rod. The end of the placement plate near the threaded hole has a through hole that matches the guide rod. Fixing blocks are symmetrically arranged at both ends of the placement plate. One end of the fixing block is equipped with a second drive motor. The output end of the second drive motor is equipped with a bidirectional threaded rod. Clamping plates are symmetrically arranged at the outer ends of the bidirectional threaded rod.

[0009] As a further description of the above technical solution: The height adjustment component is located on one side of the bidirectional adjustment clamping component and includes a bracket, a third drive motor, a second threaded rod, a guide rail, a movable block, and a lifting plate. The bracket is located on the mounting plate near the placement plate. The top of the bracket is equipped with the third drive motor, and the output end of the third drive motor is equipped with the second threaded rod. One end of the bracket is equipped with a guide rail, and the outer end of the second threaded rod is equipped with a movable block. Both ends of the movable block are equipped with lifting plates, and one end of the lifting plate is equipped with a sliding groove that matches the guide rail.

[0010] As a further description of the above technical solution: The hot-press welding head is located at the bottom of the height adjustment assembly and includes a hot-press welding head seat and a damper. The top of the hot-press welding head is equipped with a hot-press welding head seat, and the top of the hot-press welding head seat is symmetrically equipped with dampers. The top of the damper is fixedly connected to the bottom of the lifting plate, and a spring is sleeved on the outer end of the damper.

[0011] As a further description of the above technical solution: The cooling assembly is located at one end of the hot-press welding head and includes an outer shell, a heat sink, an air duct, a cooling fan, a fixing plate, and a filter plate. The heat sink is located inside the outer shell, and the air duct runs through the bottom of the outer shell. The cooling fan is located at one end of the outer shell, and the fixing plate is located at one end of the cooling fan. The filter plate is located inside the fixing plate, and the top of the fixing plate has a positioning groove that matches the filter plate.

[0012] As a further description of the above technical solution: The inverted bonding machine is located at the bottom of the bidirectional adjusting clamping assembly, and the mounting plate is installed at the top of the inverted bonding machine. The hot-press welding head is located on the upper side of the mounting plate. It includes a housing, a protective cover, a door panel, a mounting groove, a material box, a connecting plate, a drive cylinder, an outer shell, and a support plate. The top of the housing is equipped with a protective cover, and observation windows are opened at both ends of the protective cover. A door panel is installed at one end of the housing via a hinge. Mounting grooves are opened at both ends of the housing, and a material box is slidably installed inside the mounting groove.

[0013] As a further description of the above technical solution: The connecting plates are symmetrically arranged at both ends of the box. The bottom end of the connecting plate is equipped with a driving cylinder. The outer end of the driving cylinder is equipped with a shell. The bottom end of the driving cylinder is equipped with a support plate.

[0014] The present invention has the following advantages: 1. The present invention can achieve precise adjustment and stable clamping of the chip in two directions through the bidirectional adjustment clamping component, which can effectively improve the alignment accuracy between the chip and the hot press welding head, reduce welding deviation, and ensure the welding quality of the chip.

[0015] 2. This utility model, through the cooperation of a cooling component, a cooling fan, a heat sink, and a blower, can quickly cool the hot-press welding head after operation, extend the service life of the hot-press welding head, prevent the chip from being damaged by overheating, and improve the chip yield.

[0016] 3. This utility model facilitates the storage and retrieval of materials through the design of the material box; the cooperation between the drive cylinder and the support plate can enhance the overall support stability of the equipment and adapt to the needs of different working environments. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the overall structure of the bidirectional adjustment clamping assembly of this utility model; Figure 3 This is a partial enlarged view of the bidirectional adjustment clamping assembly of this utility model; Figure 4 This is a schematic diagram of the overall structure of the height adjustment component of this utility model; Figure 5 This is a schematic diagram of the overall structure of the hot-press welding head and cooling assembly of this utility model; Figure 6 This is a partial structural schematic diagram of the present invention; Figure 7 This is an enlarged view of a partial structure of the present invention.

[0018] The attached figures are labeled as follows: 1. Bidirectional adjustable clamping assembly; 11. Mounting plate; 12. Support base; 13. Side strip plate; 14. Electric push rod; 15. Drive motor one; 16. Threaded rod one; 17. Drive motor two; 18. Placement plate; 19. Clamping plate; 110. Fixing block; 111. Bidirectional threaded rod; 2. Height adjustment assembly; 21. Bracket; 22. Drive motor three; 23. Threaded rod two; 24. Guide rail; 25. Lifting plate; 26. Movable block; 3. Hot press welding head; 31. Spring; 32. Damping; 4. Cooling assembly; 41. Outer shell; 42. Heat sink; 43. Air duct; 44. Cooling fan; 45. Fixing plate; 46. Filter plate; 5. Inverted bonding machine; 51. Box; 52. Protective cover; 53. Material box; 54. Connecting plate; 55. Drive cylinder; 56. Support plate; 57. Outer shell. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0021] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] As attached Figure 1 To be continued Figure 7The present invention provides a flip bonding machine including a chip hot press welding head, comprising a bidirectional adjustable clamping assembly 1, a height adjustment assembly 2, a hot press welding head 3, a cooling assembly 4, and a flip bonding machine 5. Example

[0023] Specifically, the bidirectional adjustable clamping assembly 1 includes a mounting plate 11, with a support base 12 at the top of the mounting plate 11. The support base 12 provides a stable mounting foundation for the side strip plate 13, ensuring the positional stability of the side strip plate 13 during subsequent operations. The side strip plate 13 is symmetrically arranged at the top of the support base 12, and a slider is slidably arranged inside the side strip plate 13. The side strip plate 13 provides a sliding track for the slider, enabling the slider to slide stably within the side strip plate 13, laying the foundation for subsequently moving related components.

[0024] The slider has an electric push rod 14 at one end, which drives the slider to slide within the side plate 13, thereby adjusting the position of the component connected to the slider. A drive motor 15 is located at the end of the slider near the electric push rod 14, and a threaded rod 16 is located at the output end of the drive motor 15. The drive motor 15 provides power for the rotation of the threaded rod 16, and the rotation of the threaded rod 16 can drive the component that cooperates with it to move. A guide rod is located on one side of the threaded rod 16, which guides the movement of the component that cooperates with it, preventing the component from deviating during movement and ensuring the accuracy of movement.

[0025] In addition, the bidirectional adjustment clamping assembly 1 also includes a placement plate 18, which is disposed at the top of the mounting plate 11. One end of the placement plate 18 is provided with a threaded hole that is adapted to the threaded rod 16. The end of the placement plate 18 near the threaded hole is provided with a through hole that is adapted to the guide rod. When the threaded rod 16 rotates, it drives the placement plate 18 to move along the direction of the guide rod through the threaded engagement, thereby realizing the position adjustment of the placement plate 18 in one direction. The guide rod ensures the stability and straightness of the placement plate 18 during the movement.

[0026] The placement plate 18 is symmetrically equipped with fixing blocks 110 at both ends. The fixing blocks 110 provide mounting support for the second drive motor 17, ensuring that the second drive motor 17 will not shift its position during operation. The second drive motor 17 is installed at one end of the fixing block 110. The output end of the second drive motor 17 is equipped with a bidirectional threaded rod 111. The second drive motor 17 drives the bidirectional threaded rod 111 to rotate, providing a power source for the rotation of the bidirectional threaded rod 111. The outer end of the bidirectional threaded rod 111 is symmetrically equipped with clamping plates 19. When the bidirectional threaded rod 111 rotates, it drives the two clamping plates 19 to move in opposite directions along the bidirectional threaded rod 111, thereby clamping or releasing the chip placed on the placement plate 18 and ensuring that the chip is fixed in position during the soldering process.

[0027] Specifically, the height adjustment component 2 is located on one side of the bidirectional adjustment clamping component 1. The height adjustment component 2 includes a bracket 21, which is located on the mounting plate 11 near the placement plate 18. The bracket 21 provides a mounting carrier for components such as the drive motor 22, the threaded rod 23, and the guide rail 24, ensuring the structural stability of the entire height adjustment component 2. The top of the bracket 21 is equipped with the drive motor 22, and the output end of the drive motor 22 is equipped with the threaded rod 23. When the drive motor 22 is working, it drives the threaded rod 23 to rotate, providing power for height adjustment.

[0028] The bracket 21 has a guide rail 24 at one end, and a movable block 26 at the outer end of the threaded rod 23. The movable block 26 has lifting plates 25 at both ends. One end of the lifting plate 25 has a sliding groove that matches the guide rail 24. When the threaded rod 23 rotates, it drives the movable block 26 to move up and down. The movable block 26 then drives the lifting plate 25 to slide up and down along the guide rail 24. The guide rail 24 guides and limits the movement of the lifting plate 25, ensuring that the lifting plate 25 can achieve stable and precise height adjustment, thereby meeting the welding height requirements of chips of different thicknesses.

[0029] Specifically, the hot-press welding head 3 is located at one end of the height adjustment component 2. The top of the hot-press welding head 3 is provided with a hot-press welding head seat, which provides an installation position for the damper 32 and connects the hot-press welding head 3 to the lifting plate 25. The top of the hot-press welding head seat is symmetrically provided with dampers 32. The top of the damper 32 is fixedly connected to the bottom of the lifting plate 25. A spring 31 is sleeved on the outer end of the damper 32. The damper 32 and the spring 31 work together to provide a buffer when the hot-press welding head 3 is performing welding operations. When the hot-press welding head 3 contacts the chip, the spring 31 and the damper 32 can absorb some of the pressure, preventing the hot-press welding head 3 from applying excessive pressure to the chip and damaging it. At the same time, it ensures the uniformity and stability of the welding pressure and ensures the welding quality. Example

[0030] Based on Example 1, in order to further prevent the chip from being damaged by overheating and improve the chip yield, a cooling component was provided at one end of the hot-press welding head.

[0031] Specifically, the cooling component 4 is located at one end of the hot press welding head 3. The cooling component 4 includes an outer shell 41. The outer shell 41 provides installation and protection space for components such as the heat sink 42, the air blowing duct 43, and the cooling fan 44, preventing external dust and impurities from entering the component and affecting the cooling effect. The heat sink 42 is provided inside the outer shell 41. The heat sink 42 can absorb the heat transferred by the hot press welding head 3 and dissipate the heat into the air inside the outer shell 41, accelerating the diffusion of heat.

[0032] The outer casing 41 has a blower duct 43 running through its bottom end. The blower duct 43 can guide the cold air generated by the cooling fan 44 to the hot press welding head 3 to directly cool the hot press welding head 3. The outer casing 41 has a cooling fan 44 at one end. The cooling fan 44 provides a source of cold air for the cooling component 4. The cold air generated by the cooling fan 44 is guided by relevant components to cool the hot press welding head 3.

[0033] In addition, a fixing plate 45 is provided at one end of the cooling fan 44. The fixing plate 45 provides installation support for the filter plate 46 and ensures the structural stability of the air inlet end of the cooling fan 44. The filter plate 46 is installed inside the fixing plate 45. The filter plate 46 can filter the air entering the cooling fan 44, remove dust and impurities from the air, and prevent dust and impurities from entering the cooling fan 44 or adhering to the hot press welding head 3, which would affect the service life of the cooling fan 44 and the working performance of the hot press welding head 3. The top of the fixing plate 45 is provided with a positioning groove that matches the filter plate 46. The positioning groove facilitates the installation and removal of the filter plate 46, and makes it convenient for operators to clean or replace the filter plate 46 to ensure the filtration effect.

[0034] Specifically, the flip bonding machine 5 is located at the bottom of the mounting plate 11. The flip bonding machine 5 includes a housing 51, which provides a mounting base for components such as the protective cover 52, door panel, material box 53, and connecting plate 54. It also provides space for other internal components of the equipment, playing a protective and supporting role. The top of the housing 51 is equipped with a protective cover 52, which can prevent impurities generated during the welding process from splashing, protect the safety of operators, and avoid interference from the external environment on the welding process.

[0035] The protective cover 52 has observation windows at both ends, allowing operators to monitor the chip soldering process in real time and promptly identify and address any issues that arise. One end of the housing 51 has a door panel connected by a hinge, enabling operators to easily open the housing 51 for maintenance, repair, or replacement of internal components. Both ends of the housing 51 have mounting slots, within which material boxes 53 slide. These material boxes 53 conveniently store chips, soldering materials, and other related materials. The sliding design facilitates the removal and insertion of the material boxes 53, improving material accessibility and work efficiency.

[0036] In addition, the flip bonding machine 5 includes a connecting plate 54, which is symmetrically arranged at both ends of the housing 51. The connecting plate 54 provides installation support for the drive cylinder 55, connects the drive cylinder 55 to the housing 51, and ensures the installation stability of the drive cylinder 55. The drive cylinder 55 is provided at the bottom of the connecting plate 54, and the outer end of the drive cylinder 55 is provided with a housing 57. The housing 57 can protect the drive cylinder 55 and prevent external collisions or impurities from entering the drive cylinder 55 and affecting the normal operation of the drive cylinder 55.

[0037] Furthermore, a support plate 56 is provided at the bottom of the drive cylinder 55. When it is necessary to adjust the overall height of the flip bonding machine 5 or enhance the stability of the equipment on uneven ground, the drive cylinder 55 can push the support plate 56 up and down to make the support plate 56 in close contact with the ground, thereby enhancing the support stability of the equipment, ensuring that the equipment will not shake during operation, and ensuring the smooth progress of welding operations.

[0038] It should also be noted that the thermocompression welding head in this application can be a flat thermocompression welding head, a non-standard thermocompression welding head, a heating type thermocompression welding head, etc. Figure 1 In this embodiment, a planar thermopress welding head is used as an example for description. Of course, other types of thermopress welding heads can also adopt a similar structure, which will not be described in detail below.

[0039] Understandable Figure 1 The diagram only schematically illustrates some of the components included in a flip bonder; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, flip-chip bonding machines can also include, compared to... Figure 1 More or fewer parts.

[0040] It should also be understood that drive motor 15, drive motor 2 17 and drive motor 3 22 are all electrically connected to the controller. The controller is a common existing controller, and the opening of each component is adjusted by setting the time.

[0041] In actual use, at the beginning of the operation, the operator places the chip to be soldered steadily on the top of the placement plate 18 of the bidirectional adjustment clamping assembly 1, and then starts the drive motor 17 on the fixing block 110. Its output shaft drives the bidirectional threaded rod 111 to rotate. Since the threads at both ends of the bidirectional threaded rod 111 turn in opposite directions, it will drive the outer clamping plate 19 to move in opposite directions until the clamping plate 19 is tightly attached to both sides of the chip, and the chip is firmly fixed.

[0042] To achieve precise alignment between the chip and the hot-press welding head 3, the drive motor 15 drives the threaded rod 16 to rotate. Combined with the limiting effect of the guide rod, the placement plate 18 is driven to make a fine adjustment along the axis of the threaded rod 16. At the same time, the electric push rod 14 is activated to push the slider to slide within the side plate 13, thereby moving the placement plate 18 along the length of the side plate 13, and finally completing the precise positioning of the chip in two vertical directions.

[0043] Thermopress welding head height adaptation: Based on the thickness of the chip to be welded, the drive motor 22 at the top of the bracket 21 in the height adjustment component 2 is activated. Its output shaft drives the threaded rod 23 to rotate. The movable block 26 sleeved on the threaded rod 23 will drive the lifting plates 25 at both ends to slide up and down along the guide rail 24 on the bracket 21 under the action of the thread. The thermopress welding head 3 is connected to the bottom end of the lifting plate 25 through the thermopress welding head seat. Therefore, the movement of the lifting plate 25 will synchronously adjust the height of the thermopress welding head 3 until the distance between the bottom end of the thermopress welding head 3 and the top end of the chip reaches the set welding gap, which meets the welding process requirements.

[0044] Hot-press welding operation: After the height of the hot-press welding head 3 is adjusted to the correct position, its heating function is activated. After the temperature rises to the set welding temperature and stabilizes, the drive motor 22 is activated again to make the hot-press welding head 3 slowly descend and contact the chip welding area. During this process, the damper 32 at the top of the hot-press welding head seat and the spring 31 sleeved outside the damper 32 play a key buffering role, which can absorb the impact force generated when the hot-press welding head 3 contacts the chip, avoid the chip being damaged due to excessive instantaneous pressure, and at the same time ensure that the welding pressure is uniform and stable, ensuring a reliable connection between the chip pads and the substrate or lead frame pads.

[0045] Thermopress welding head cooling: During welding operations, the cooling fan 44 at one end of the outer casing 41 in the cooling assembly 4 is started simultaneously. External air is filtered by the filter plate 46 inside the air inlet fixing plate 45 of the cooling fan 44 to remove dust and impurities before entering the cooling fan 44. After being pressurized, it forms cold air and is sent into the interior of the outer casing 41. The cold air fully exchanges heat with the heat sink 42 inside the outer casing 41 (which is in close contact with the side of the thermopress welding head 3 to absorb its heat), and then is guided to the welding end of the thermopress welding head 3 through the air blowing pipe 43 at the bottom of the outer casing 41 to quickly remove heat, preventing the thermopress welding head 3 from being damaged due to high temperature, and preventing the chip from overheating and affecting the welding quality.

[0046] Equipment Reset and Chip Removal: After welding is completed, drive motor 3 22 reverses, driving the hot-press welding head 3 back to its initial height; drive motor 2 17 reverses, causing clamping plate 19 to move in the opposite direction to release the chip, allowing the operator to remove the welded chip from the placement plate 18. In addition, if the equipment is placed on uneven ground, the drive cylinder 55 at the bottom of the connecting plate 54 at both ends of the flip bonding machine 5 housing 5 can be activated to push the support plate 56 up and down, making the support plate 56 in close contact with the ground and enhancing the stability of the equipment. During the operation, the operator can also monitor the chip welding status in real time through the observation windows at both ends of the protective cover 52 and deal with abnormal situations in a timely manner.

[0047] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0048] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flip-chip bonding machine including a chip thermoforming head, characterized in that, include: The bidirectional adjustable clamping assembly (1), the height adjustment assembly (2), the hot press welding head (3) and the cooling assembly (4) are provided. The bidirectional adjustable clamping assembly (1) is located on one side of the height adjustment assembly (2), the hot press welding head (3) is located at one end of the height adjustment assembly (2), and the cooling assembly (4) is located at one end of the hot press welding head (3). The bidirectional adjustable clamping assembly (1) includes a mounting plate (11), a support base (12) is provided at the top of the mounting plate (11), a side strip plate (13) is symmetrically provided at the top of the support base (12), a slider is slidably provided inside the side strip plate (13), an electric push rod (14) is provided at one end of the slider, a drive motor (15) is provided at the end of the slider near the electric push rod (14), a threaded rod (16) is provided at the output end of the drive motor (15), and a guide rod is provided on one side of the threaded rod (16).

2. A flip-chip bonding machine including a chip thermoforming head according to claim 1, characterized in that: The bidirectional adjustment clamping assembly (1) also includes a placement plate (18), which is located at the top of the mounting plate (11). One end of the placement plate (18) is provided with a threaded hole that is compatible with the threaded rod (16). The end of the placement plate (18) near the threaded hole is provided with a through hole that is compatible with the guide rod. Fixing blocks (110) are symmetrically provided at both ends of the placement plate (18). One end of the fixing block (110) is provided with a second drive motor (17). The output end of the second drive motor (17) is provided with a bidirectional threaded rod (111). Clamping plates (19) are symmetrically provided at the outer end of the bidirectional threaded rod (111).

3. A flip-chip bonding machine including a chip thermoforming head according to claim 2, characterized in that: The height adjustment component (2) includes a bracket (21), which is located on the mounting plate (11) near the placement plate (18). The top of the bracket (21) is provided with a drive motor (22), the output end of the drive motor (22) is provided with a threaded rod (23), one end of the bracket (21) is provided with a guide rail (24), the outer end of the threaded rod (23) is provided with a movable block (26), both ends of the movable block (26) are provided with lifting plates (25), and one end of the lifting plate (25) is provided with a sliding groove that is compatible with the guide rail (24).

4. A flip-chip bonding machine including a chip thermoforming head according to claim 3, characterized in that: The hot-press welding head (3) is provided with a hot-press welding head seat at the top. The top of the hot-press welding head seat is symmetrically provided with a damper (32). The top of the damper (32) is fixedly connected to the bottom of the lifting plate (25). The outer end of the damper (32) is fitted with a spring (31).

5. A flip-chip bonding machine including a chip thermoforming head according to claim 4, characterized in that: The cooling assembly (4) includes an outer shell (41), a heat sink (42) is provided inside the outer shell (41), a blower pipe (43) is provided through the bottom of the outer shell (41), a cooling fan (44) is provided at one end of the outer shell (41), a fixing plate (45) is provided at one end of the cooling fan (44), a filter plate (46) is provided inside the fixing plate (45), and a positioning groove that matches the filter plate (46) is provided at the top of the fixing plate (45).

6. A flip-chip bonding machine including a chip thermoforming head according to claim 1, characterized in that, Also includes: The inverted bonding machine (5) is located at the bottom of the mounting plate (11). The inverted bonding machine (5) includes a housing (51), a protective cover (52) is provided at the top of the housing (51), observation windows are provided at both ends of the protective cover (52), a door panel is provided at one end of the housing (51) via a hinge, and mounting grooves are provided at both ends of the housing (51). A material box (53) is slidably provided inside the mounting groove.

7. A flip-chip bonding machine including a chip thermoforming head according to claim 6, characterized in that: The flip bonding machine (5) also includes a connecting plate (54), which is symmetrically arranged at both ends of the housing (51). The bottom end of the connecting plate (54) is provided with a driving cylinder (55), the outer end of the driving cylinder (55) is provided with a housing (57), and the bottom end of the driving cylinder (55) is provided with a support plate (56).

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