A cryoneurolysis device

Abstract

The utility model relates to nerve conduction function block technology field discloses a low temperature nerve block device, including the block semiconductor refrigeration piece and with the control unit of block semiconductor refrigeration piece signal connection, the hot end of block semiconductor refrigeration piece is connected with circulating water cooling mechanism, and the cold end fixed connection of block semiconductor refrigeration piece has low temperature and scatters cold department, and the temperature monitor is fixedly connected on low temperature and scatters cold department, and the temperature monitor is connected with control unit signal. The utility model patent solved the problem of low temperature control precision, control speed slow and control stability poor when the living body nerve low temperature block in the prior art.

Description

Technical Field

[0001] This utility model relates to the field of nerve conduction function blockade technology, specifically to a low-temperature nerve blockade device. Background Technology

[0002] Currently, in medical treatment, physical therapy methods for inhibiting pain signal transmission and reducing inflammation and tissue damage mainly include pharmacological nerve block techniques and non-pharmacological nerve block techniques. Pharmacological nerve block techniques involve invasive puncture and injection of medication, utilizing the drug's effect on the nerve periphery to relieve inflammation and pain, or cutting and ligating the nerve, resulting in limited nerve damage and conduction block. However, this method carries risks such as temporary or permanent nerve damage and infection. Local anesthetics and intravenous anesthetics can cause drug toxicity side effects, and their effects typically last only a few hours, failing to meet the long-term treatment needs of patients with acute or chronic pain. Cryotherapy, a non-pharmacological nerve block technique, has advantages over other methods, including fewer side effects, ease of operation, and lower cost, and is widely used.

[0003] Cryotherapy, or local hypothermic analgesia, refers to a physical therapy method that uses localized low temperatures to inhibit pain signal transmission, reduce inflammation, and minimize tissue damage. Its principles primarily include: reducing the activity of sodium ion channels in pain-sensing fibers (Aδ and C fibers) through low temperatures, thereby decreasing action potential generation and blocking pain signal transmission to inhibit nerve conduction; or constricting local blood vessels through low temperatures, reducing the release of inflammatory mediators (such as prostaglandins and bradykinin), reducing tissue edema and pain sensitization; or reducing cellular metabolic rate and oxygen consumption through low temperatures, mitigating ischemia-reperfusion injury and free radical generation. Currently, the core objective of cryotherapy or local hypothermic analgesia is to achieve non-pharmacological pain relief through temperature regulation. It is widely used in acute injury scenarios such as soft tissue contusions, ligament sprains, and muscle strains; postoperative management of local swelling and pain control after joint replacement surgery and fracture reduction; and metabolic relief of delayed onset muscle soreness (DOMS) after high-intensity exercise.

[0004] Currently, methods for achieving low temperature mainly include non-invasive methods such as using ice packs, ice water immersion, low temperature wet compresses, and cold sprays, as well as invasive methods such as using cryoprobes (for deep nerve blocks or lesion ablation below -20℃). Different low temperature methods have different targets, depths of action, low temperature ranges, durations, and operational risks. For example, applying ice packs is typically done to wounds or painful areas. To avoid frostbite, the ice pack is wrapped in a thin towel to prevent direct contact with the skin. While this method can achieve some analgesia, it has the following limitations: 1. The temperature is uncontrollable, the duration of action is short, and the temperature may fluctuate during use, leading to inconsistent low-temperature effects and thus unstable analgesia; 2. Ice packs produce a lot of condensation, which may cause wound infection; 3. Ordinary ice packs (0℃~-10℃) can only penetrate 1-2cm under the skin, failing to effectively reach deep nerve trunks or plexuses (such as the lumbar plexus and sciatic nerve), and the skin surface temperature is difficult to conduct to deep nerves (e.g., the sciatic nerve is located 5-8cm below the gluteal muscles, requiring temperatures below -20℃ to effectively inhibit conduction). Similarly, cryopreservation probes are expensive and their use is limited in ordinary cryotherapy.

[0005] To avoid the drawbacks of existing cryotherapy methods, new heating or cooling devices for medical or human treatment have emerged in the prior art. A typical example is the use of semiconductor components for cooling (e.g., Pellets) to lower the temperature of cooling media such as water, which is then brought into contact with the target area to achieve low-temperature nerve conduction blockade. For instance, patent CN119523722A discloses a dynamic body temperature regulation device and method, which uses a semiconductor cooling pad and a patch that contacts the cold end of the cooling pad. During use, the cold end of the cooling pad cools the patch, and the patch cools the contact area. Another example is a portable cryotherapy device disclosed in patent CN115634095A, where the cooling module consists of a semiconductor Pellet device and a cooling medium. The semiconductor Pellet cools the cooling medium, which then directly contacts the target area to achieve cold compress.

[0006] Although existing technologies using semiconductor cooling pads for cryotherapy can control the temperature compared to ice packs and are less expensive than cryoprobes, the following problems still exist when they are actually applied to hypothermic nerve conduction blockade, such as when a nerve is blocked hypothermically during surgery:

[0007] 1. For example, the invention patent with publication number CN115634095A lacks temperature feedback on the object being cooled by the semiconductor cooling chip. It can only theoretically control the cooling temperature using the control module, resulting in poor accuracy of cooling on the actual object. Although the invention patent with publication number CN119523722A has a temperature sensor, the temperature sensor is located in the electronic control cavity. During detection, it is affected by the external ambient temperature and cannot detect body temperature in a timely and accurate manner. Therefore, it cannot accurately control the low-temperature process.

[0008] 2. During use, a large amount of heat is generated at the hot end of the thermoelectric cooler. Therefore, existing cooling equipment will set up heat dissipation structures or heat dissipation devices at the hot end of the thermoelectric cooler to avoid the hot end temperature being too high and affecting the low temperature blocking effect. For example, invention patents with publication numbers CN115634095A and CN119523722A both incorporate a fan structure to dissipate heat from the hot end of the thermoelectric cooler. However, using a fan for cooling has significant drawbacks: Firstly, the process of blocking low-temperature nerve conduction may be accompanied by surgery, requiring multiple layers of dressing, making it difficult to transfer heat from the hot end of the thermoelectric cooler and thus preventing cooling of the cooling surface. Furthermore, the surgery requires a strictly sterile environment, and using a fan for cooling can easily lead to bacterial contamination, making it unsuitable for the surgical environment. Secondly, for existing cold compress devices with low cooling efficiency, the cooling power requirement of the thermoelectric cooler is not high, and the heat dissipation demand at the hot end of the thermoelectric cooler is not significant. However, for low-temperature nerve conduction blocking, the accuracy and timeliness of temperature control are extremely important. Existing semiconductor component cooling devices lack intelligent sensors and other intelligent monitoring devices for intelligent monitoring and control of temperature and other signals, making it impossible for existing cooling devices to accurately control the effect of low-temperature nerve blockade.

[0009] Therefore, for existing refrigeration equipment used for low-temperature nerve conduction blockade, it is necessary to set up a more precise and faster temperature control system to achieve a better effect in blocking low-temperature nerve conduction. Utility Model Content

[0010] The present invention aims to provide a low-temperature nerve block device to solve the problems of low temperature control accuracy, slow control speed and poor control stability in the prior art when performing low-temperature nerve block.

[0011] To solve the above problems, the present invention adopts the following technical solution: a low-temperature nerve block device, including a control unit and a blocking semiconductor refrigeration chip connected to the control unit by signal. The hot end of the blocking semiconductor refrigeration chip is connected to a circulating water cooling mechanism, and the cold end of the blocking semiconductor refrigeration chip is fixedly connected to a low-temperature cooling section. A temperature monitor is connected to the low-temperature cooling section, and the temperature monitor is connected to the control unit by signal.

[0012] The principle of this solution is as follows: The control unit precisely controls the low temperature value of the cold end of the blocking semiconductor thermoelectric cooler by controlling the power supply (e.g., controlling the current) to the cooling semiconductor thermoelectric cooler. The cold end of the blocking semiconductor thermoelectric cooler is fixedly connected to the low-temperature cooling section. In use, the cold end of the blocking semiconductor thermoelectric cooler is used to cool the low-temperature cooling section, so that the temperature of the low-temperature cooling section is controlled within the set low-temperature range. Then, the low-temperature cooling section can be directly brought into contact with the superficial skin area of ​​the nerve to be blocked (i.e., contact with the target area of ​​the body surface where low temperature action is applied). The low temperature is conducted to the area around the nerve, thereby achieving low-temperature nerve conduction function blockade. In addition, this application includes a temperature monitor connected to the control unit. The temperature monitor is fixedly connected to the low-temperature cooling section and can detect the temperature signal of the low-temperature cooling section in real time. The temperature signal is transmitted to the control unit, and the control unit controls the low temperature value of the cold end of the blocking semiconductor thermoelectric cooler according to the detected temperature signal, ultimately controlling the temperature of the low-temperature cooling section within the predetermined range, thereby achieving a precise and stable low-temperature blocking effect on the relevant nerve. Meanwhile, a circulating water cooling mechanism is connected to the hot end of the blocking semiconductor refrigeration chip, which can circulate cooling water to the hot end of the blocking semiconductor refrigeration chip to quickly dissipate heat.

[0013] The beneficial effects of this plan are:

[0014] 1. More precise control of low temperature: Compared to existing refrigeration equipment that lacks a temperature monitor or whose monitor cannot quickly and accurately monitor the temperature of the target area on the body surface affected by low temperature, this application fixes the low-temperature cooling unit to the cold end of the blocking semiconductor refrigeration chip. The low-temperature cooling unit is in close contact with the blocking semiconductor refrigeration chip. During use, the cold end of the blocking semiconductor refrigeration chip can directly and quickly cool the low-temperature cooling unit, which then directly contacts the target area on the body surface affected by low temperature, quickly achieving low-temperature nerve conduction function blockade. The blockade is more precise and efficient. Simultaneously, this application fixes the temperature monitor to the low-temperature cooling unit, enabling real-time monitoring of the actual temperature of the low-temperature cooling unit. When the monitored temperature of the low-temperature cooling unit differs significantly from the predetermined temperature, the control unit receives the temperature signal and dynamically adjusts the power supply of the blocking semiconductor refrigeration chip. This quickly and accurately adjusts the cooling effect of the blocking semiconductor refrigeration chip on the low-temperature cooling unit, making it an intelligent monitoring device. Through precise monitoring and rapid control, it ensures that the low-temperature cooling unit can accurately and stably produce low-temperature nerve conduction function blockade.

[0015] 2. Efficient and safe heat dissipation: Compared to existing technologies that use fans for heat dissipation, the heat dissipation effect is limited and unsuitable for applications such as low-temperature nerve conduction blockade during surgery. In this application, cooling water from a circulating water cooling system is used to circulate and dissipate heat from the hot end of the blocking semiconductor thermoelectric cooler. This method has high heat dissipation efficiency and can effectively reduce the impact of high temperatures at the hot end of the blocking semiconductor thermoelectric cooler on low-temperature nerve conduction blockade. Moreover, the water cooling method is not only highly efficient, but also does not disturb the airflow in the surrounding space compared to existing fan-based cooling methods. This makes it particularly suitable for applications such as low-temperature nerve conduction blockade during surgery, reducing the risk of bacterial infection.

[0016] 3. Effective intelligent monitoring and control: In this application, by fixing the temperature monitor to the low-temperature cooling unit, the temperature monitor can directly monitor the temperature of the low-temperature cooling unit used for application, such as measuring the temperature of some body parts. The low-temperature cooling unit is in direct contact with the target area of ​​the target low-temperature action body surface. The temperature of the target area of ​​the target low-temperature action body surface is very close to the temperature of the low-temperature cooling unit. Therefore, the temperature monitor can accurately monitor the temperature of the target area of ​​the target low-temperature action body surface by detecting the temperature of the low-temperature cooling unit. Moreover, when the temperature of the low-temperature cooling unit is not within the set value range or when temperature fluctuations occur during use, the temperature monitor can transmit the temperature signal to the control unit in real time. The control unit controls the power supply of the blocking semiconductor refrigeration chip to quickly adjust the cooling effect of the blocking semiconductor refrigeration chip. The whole process can be completed continuously, accurately and quickly.

[0017] Preferably, as an improvement, the low-temperature cooling section includes a low-temperature cooling copper component, one side of which is in contact with the blocking semiconductor cooling chip, and the other side is used to contact the target area on the surface of the low-temperature action body.

[0018] In this solution, a low-temperature cooling copper component is used as the low-temperature cooling unit. The copper material of the low-temperature cooling copper component can conduct low temperature quickly and efficiently. Moreover, the disc-shaped low-temperature cooling copper component is easy to process. During the cooling process, the temperature can be reduced from the center of the low-temperature cooling copper component to the surrounding area of ​​the target area on the surface of the low-temperature body, resulting in a more uniform low temperature. At the same time, the disc-shaped low-temperature cooling copper component can be conveniently and stably installed with a temperature monitor.

[0019] Preferably, as an improvement, a low-temperature cooling copper component is fixedly connected to a low-temperature conductive water bag on one side of the target area of ​​the body surface for low-temperature action, and the low-temperature conductive water bag is provided with cooling water in contact with the low-temperature cooling copper component.

[0020] In this solution, a low-temperature conductive water bag is fixedly connected to one side of the low-temperature cooling copper component used for the target area on the body surface during low-temperature action. During use, the low-temperature conductive water bag can play a role in low-temperature conduction. At the same time, since the low-temperature conductive water bag is a flexible structure, it can fit well with the target area on the body surface during use, improving the effectiveness of the low-temperature action. In addition, the low-temperature conductive water bag is more comfortable to use, making it particularly suitable for cryotherapy applications.

[0021] Preferably, as an improvement, the circulating water cooling mechanism includes a cooling copper component, a circulating cooling medium, a circulating pipeline, and a heat exchange system. The cooling copper component is fixedly connected to the hot end of the blocking semiconductor cooling chip. The circulating pipeline connects the cooling copper component and the heat exchange system. The circulating cooling medium circulates between the heat exchange system and the cooling copper component through the circulating pipeline to dissipate heat from the cooling copper component.

[0022] In this solution, the cooling copper component is fixedly connected to the hot end of the blocking semiconductor refrigeration chip. During use, the cooling copper component can quickly conduct and dissipate heat from the hot end of the blocking semiconductor refrigeration chip, while avoiding direct contact between the circulating cooling medium and the blocking semiconductor refrigeration chip, thus improving the stability of the blocking semiconductor refrigeration chip's operation. In addition, the circulating cooling medium circulates between the heat exchange system and the cooling copper component through a circulation pipeline. The circulating cooling medium's temperature rises at the cooling copper component through heat exchange. The high-temperature circulating cooling medium is cooled when it flows through the heat exchange system, and then the cooled circulating cooling medium flows back to the cooling copper component for continuous heat dissipation. At the same time, with the circulation pipeline in place, the heat exchange system can be kept away from the blocking semiconductor refrigeration chip, which can effectively reduce the impact of the high-temperature heat exchange system on the blocking semiconductor refrigeration chip. This solution is particularly suitable for scenarios with high requirements for low-temperature nerve conduction function blocking, such as surgery.

[0023] Preferably, as an improvement, the heat exchange system includes a circulating cooling water tank, and a circulation pipeline connects the circulating cooling water tank and the cooling copper components.

[0024] In this solution, the circulating cooling water tank has a built-in pumping function, which can quickly cool the high-temperature circulating cooling medium and pump it back to the cooling copper parts, achieving a highly efficient and stable circulating heat dissipation effect.

[0025] Preferably, as an improvement, the heat exchange system includes a heat exchange semiconductor cooling chip and a heat exchange copper plate. The heat exchange semiconductor cooling chip is signal-connected to the control unit. The heat exchange copper plate is fixedly connected to the cold end of the heat exchange semiconductor. The heat exchange copper plate is provided with a heat exchange flow channel. A circulation pipeline connects the heat exchange copper plate and the cooling copper component. A circulation pump is connected to the circulation pipeline.

[0026] In this scheme, the heat exchange system employs a heat exchange semiconductor refrigeration chip and a heat exchange copper plate. The heat exchange semiconductor refrigeration chip is signal-connected to the control unit. The control unit can control not only the power supply to the blocking semiconductor refrigeration chip but also the power supply to the heat exchange semiconductor refrigeration chip, thereby controlling the cooling effect of the cold end of the heat exchange semiconductor refrigeration chip on the heat exchange copper plate. Ultimately, the heat exchange copper plate is used to cool the circulating cooling medium, effectively ensuring the cooling effect on the hot end of the blocking semiconductor refrigeration chip. By adding a semiconductor refrigeration chip, this scheme can achieve efficient cooling of the hot end of the blocking semiconductor refrigeration chip using a single control unit, resulting in a simpler structure and lower cost for the entire device.

[0027] Preferably, as an improvement, the temperature monitor includes an external temperature sensor connected to the outside of the low-temperature cooling copper component. The distance between the external temperature sensor and the outer wall of the low-temperature cooling copper component is Z, and the distance Z is adjustable. The nerve fibers of the target area of ​​the low-temperature action are located at a subcutaneous depth of d, Z = d. The control unit dynamically adjusts the output power of the blocking semiconductor cooling chip according to the temperature signal monitored by the external temperature sensor.

[0028] In this solution, an external temperature sensor is installed on the outside of the low-temperature cooling copper component. The external temperature sensor is used to monitor the temperature signal at a distance Z from the outer wall of the low-temperature cooling copper component, where Z = d. Subcutaneous tissue heat conduction is radially symmetrical. By using the temperature signal at the monitored Z position to map the temperature signal at a depth d under the skin, the detection method in this solution is simpler, more efficient, and lower in cost compared to directly detecting the temperature at a depth d under the skin. In actual detection, the distance Z can be adjusted according to the size of the depth d under the skin, thereby completing the detection more accurately. Dynamic monitoring is achieved, and the output power of the blocking semiconductor cooling chip is dynamically adjusted according to the monitored temperature signal to control the temperature of the target tissue at a depth d under the skin within the set range, so that the low-temperature nerve conduction function blocking effect is stable.

[0029] Preferably, as an improvement, the temperature monitor further includes an internal temperature sensor, which is fixedly connected to the side of the low-temperature cooling copper component away from the blocking semiconductor cooling chip. The number of internal temperature sensors is at least two, and the internal temperature sensors are arranged radially along the bottom surface of the low-temperature cooling copper component.

[0030] In this scheme, an internal temperature sensor is fixedly connected to the side of the low-temperature cooling copper component away from the blocking semiconductor refrigeration chip. The internal temperature sensor monitors the temperature of the contact surface between the low-temperature cooling copper component and the target area of ​​the low-temperature action body. There are at least two internal temperature sensors, and all internal temperature sensors are arranged radially along the bottom surface of the low-temperature cooling copper component. Multiple internal low-temperature sensors can detect the temperature of different diameter ranges of the low-temperature cooling copper component. When the control unit receives the temperature monitoring signal from the internal temperature sensor, it only indicates that the low-temperature cooling copper component has uniformly cooled the target area of ​​the low-temperature action body when the temperature signals monitored by all internal temperature sensors are equal (or within the allowable difference range, such as 0.5℃). Only then does it collect the temperature signal from the external temperature sensor and dynamically adjust the output power of the blocking semiconductor refrigeration chip to effectively ensure the effect of blocking low-temperature nerve conduction function.

[0031] Preferably, as an improvement, a fixed guide plate is fixedly connected to the low-temperature cooling copper component, the fixed guide plate is arranged radially along the low-temperature cooling copper component, the position of the external temperature sensor is adjustable along the length direction of the fixed guide plate, and an elastic support is connected between the external temperature sensor and the fixed guide plate.

[0032] In this solution, by setting a fixed guide plate, the external temperature sensor can be easily fixedly connected to the fixed guide plate. Under the elastic support of the elastic support component, the external temperature sensor is effectively kept in contact with the target area of ​​the body surface under low temperature action, ensuring the accuracy of temperature detection by the external temperature sensor and effectively ensuring the effect of blocking the low temperature nerve conduction function.

[0033] Preferably, as an improvement, the number of the blocking semiconductor refrigeration chips is multiple, all of which are signal-connected to the control unit, and each blocking semiconductor refrigeration chip is connected to the cooling mechanism, the low-temperature heat dissipation section and the temperature monitor.

[0034] This solution incorporates multiple blocking semiconductor cooling pads. During use, these pads can be applied to different areas to block nerves in various locations, thus meeting a wider range of application scenarios. For example, in cryotherapy applications, multiple areas can be treated simultaneously (e.g., the hand and shoulder can be treated at the same time). Similarly, in low-temperature nerve conduction blockade during surgery, multiple nerves can be blocked at low temperatures, synergistically supporting perioperative analgesia. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of Embodiment 1 of the present utility model.

[0036] Figure 2 for Figure 1Exploded view of medium-impedance semiconductor refrigeration chip, temperature monitor, low-temperature cooling copper component, and cooling copper component.

[0037] Figure 3 This is a schematic diagram of the low-temperature cooling copper component acting on nerve fibers in Embodiment 1 of this utility model.

[0038] Figure 4 This is a schematic diagram of embodiment two of the utility model.

[0039] Figure 5 This is a schematic diagram of Embodiment 3 of the present invention.

[0040] Figure 6 This is a schematic diagram of Embodiment 4 of the present invention. Detailed Implementation

[0041] The following detailed description illustrates the specific implementation method:

[0042] The reference numerals in the accompanying drawings include: control unit 1, blocking semiconductor refrigeration chip 2, temperature monitor 3, low-temperature cooling copper component 4, cooling copper component 5, cooling flow channel 501, liquid inlet port 502, liquid outlet port 503, sealing head 504, circulating cooling water tank 6, hot circulation pipe 7, cold circulation pipe 8, heat exchange semiconductor refrigeration chip 9, heat exchange copper sheet 10, circulating pump 11, heat sink 12, heat sink 1201, and low-temperature conductive water bag 13.

[0043] Example 1

[0044] This embodiment is as shown in the appendix. Figure 1 and Figure 2 As shown: A low-temperature nerve block device includes a control unit 1 and a blocking semiconductor refrigeration chip 2 connected to the control unit 1 by a signal. The blocking semiconductor refrigeration chip 2 has the Peltier effect. The control unit 1 can be a microcontroller, PLC controller, etc. In this embodiment, the control unit 1 and the blocking semiconductor refrigeration chip 2 are connected by wires. The control unit 1 can control the temperature of the cold end and the hot end of the blocking semiconductor refrigeration chip 2 by controlling the power supply of the blocking semiconductor refrigeration chip 2 (in this embodiment, the cooling intensity is controlled by controlling the current of the blocking semiconductor refrigeration chip 2).

[0045] Combination Figure 1 and Figure 2The cold end of the blocking semiconductor cooling chip 2 is fixedly connected to a low-temperature cooling section, and a temperature monitor 3 is fixedly connected to the low-temperature cooling section. The temperature monitor 3 is signal-connected to the control unit 1. Specifically, the blocking semiconductor cooling chip 2 has a square plate structure, and the low-temperature cooling section is a disc-shaped copper low-temperature cooling copper component 4. The blocking semiconductor cooling chip 2 is located at the top center of the low-temperature cooling copper component 4. The diameter of the low-temperature cooling copper component 4 is larger than the side length of the blocking semiconductor cooling chip 2, so that the bottom surface of the blocking semiconductor cooling chip 2 can completely contact the low-temperature cooling copper component 4. The bottom surface of the low-temperature cooling copper component 4 is used to contact the target area of ​​the body surface under low temperature, so that the nerve fibers under the skin of the target area of ​​the body surface under low temperature are subjected to low temperature and the low-temperature nerve conduction function is blocked.

[0046] When conducting at low temperatures, the area of ​​the disc-shaped low-temperature cooling copper component 4 is:

[0047] Where A Cu The area of ​​the low-temperature cooling copper component is 4 square meters. 2 ;k eff The equivalent thermal conductivity of the tissue ranges from 0.35 to 0.49 W / m·K (layered weighted average); k CU d represents the thermal conductivity of copper, ranging from 386 to 413 W / m·K, with 400 W / m·K being the preferred value; d represents the subcutaneous target depth, ranging from 1 to 10 cm.

[0048] The heat flow and metabolic heat production from the cooling center region to the subcutaneous depth d are as follows:

[0049] Where q cool For heat flow and metabolic heat production from the cooling center region to the subcutaneous depth d; T core The core body temperature is 37°C; T target q represents the target tissue temperature at a subcutaneous depth d; met The metabolic heat production rate is taken as 500–1000 W / m². 3 ;

[0050] The power of the blocking semiconductor refrigeration chip 2 is:

[0051] Where P input η is the input power of the Peltier; η is the safety factor, ranging from 1.5 to 2; COP is the cooling efficiency of the blocking semiconductor refrigeration chip 2, ranging from 0.5 to 0.7.

[0052] In summary, the power of the blocking semiconductor cooler 2 is:

[0053] P input =(k eff ·(Tcore -T target ) / d+q met ·d)·(η·π·k eff ·d / k Cu ) / COP.

[0054] like Figure 1 As shown, in this embodiment, a circulating water cooling mechanism is connected to the hot end face of the top of the blocking semiconductor refrigeration chip 2. The circulating water cooling mechanism circulates heat to dissipate heat from the hot end face of the top of the blocking semiconductor refrigeration chip 2, preventing the temperature of the hot end of the blocking semiconductor refrigeration chip 2 from becoming too high, which could affect the cooling effect or cause combustion. Specifically, the circulating water cooling mechanism includes a cooling copper component 5, a circulating cooling medium, a circulation pipeline, and a heat exchange system. The cooling copper component 5 has a square block structure, and the side length of the cooling copper component 5 is greater than the side length of the blocking semiconductor refrigeration chip 2 to ensure that the hot end of the top surface of the blocking semiconductor refrigeration chip 2 is in full contact with the bottom end of the cooling copper component 5. Meanwhile, in this embodiment, a cooling channel 501 is formed inside the cooling copper component 5 (to facilitate the processing of the cooling channel 501, multiple blind holes are drilled on the side of the cooling copper component 5, and the multiple blind holes are interconnected to form the cooling channel 501. Then, a sealing head 504 is welded to seal the excess blind hole openings, leaving only two holes for connecting the circulation pipeline). An inlet port 502 and an outlet port 503 communicating with the cooling channel 501 are connected to the side wall of the cooling copper component 5 by a threaded connection. The heat exchange system includes a circulating cooling water tank 6. In this embodiment, to make the system more organized, the control unit 1 can be installed and fixed inside the circulating cooling water tank 6 to achieve integration. The circulation pipeline includes a hot circulation pipe 7 and a cold circulation pipe 8. The hot circulation pipe 7 is connected to... Between the liquid outlet port 503 and the circulating cooling water tank 6, the cold circulation pipe 8 connects the liquid inlet port 502 and the circulating cooling water tank 6. The circulating cooling water tank 6 is used to cool the hot water. The cooled water flows through the cold circulation pipe 8 to the cooling copper part 5. After heat exchange between the cold water and the cooling copper part 5, the temperature rises and hot water is formed. During the heat exchange, the cooling copper part 5 is cooled. The hot water with the increased temperature flows back to the circulating cooling water tank 6 through the hot circulation pipe 7 to be cooled down again. In this cycle, the continuous cooling of the cooling copper part 5 can be completed, and heat dissipation can be achieved efficiently and stably. The circulating cooling water tank 6 can adopt an intelligent constant temperature circulator with built-in pump function and cooling fan, which can achieve stable cooling circulation. Further details are omitted here.

[0055] Combination Figure 1 and Figure 2In this embodiment, the temperature monitor 3 includes an internal temperature sensor 301 and an external temperature sensor 302. The internal temperature sensor 301 is fixedly connected to the low-temperature cooling copper component 4 on the side opposite to the blocking semiconductor cooling chip 2 by a threaded connection. The number of internal temperature sensors 301 is at least two. Multiple internal temperature sensors 301 are arranged radially along the low-temperature cooling copper component 4, and the multiple internal temperature sensors 301 can be divided into multiple groups. The internal temperature sensors 301 in each group are arranged along the same circumference of the low-temperature cooling copper component 4 (e.g., ...). Figure 2 The number of internal temperature sensors 301 is one group, and there are three internal temperature sensors 301 in one group. In other embodiments besides this one, the number and arrangement of internal temperature sensors 302 can be set according to the size of the bottom surface of the low-temperature cooling copper component 4. Other settings will not be described here. The external temperature sensor 302 is connected to the outside of the low-temperature cooling copper component 4 and its radial position is adjustable. Figure 3 The distance between the external temperature sensor 302 and the outer wall of the low-temperature cooling copper component 4 is Z. The nerve fibers in the target area of ​​the body surface under low temperature are located at a subcutaneous depth of d, where Z = d. The control unit 1 dynamically adjusts the output power of the blocking semiconductor cooling chip 2 according to the temperature signals monitored by the internal temperature sensor 301 and the external temperature sensor 302, so as to ensure that the low-temperature cooling copper component 4 can play a stable low-temperature role on the nerve fibers at a subcutaneous depth of d, so that the nerve fibers can stably achieve the low-temperature nerve conduction function blocking effect.

[0056] In specific adjustments, multiple internal temperature sensors 301 are positioned at different locations on the bottom surface of the low-temperature cooling copper component 4. After the tissue thermoelectric cooler 2 is powered on, the temperature of the low-temperature cooling copper component 4 gradually decreases. Only when all internal temperature sensors 301 have the same temperature (or a small temperature difference, for example, less than or equal to 0.3℃), indicating uniform temperature on the bottom surface of the low-temperature cooling copper component 4, does it receive the temperature signal from the external temperature sensor 302. Once all internal temperature sensors 301 have the same temperature, the distance Z between the external temperature sensor 302 and the outer wall of the low-temperature cooling copper component 4 is adjusted so that Z = d. Then, the external temperature sensor 302 monitors the temperature value of the target area on the body surface affected by the low temperature. After receiving the temperature signal monitored by the external temperature sensor 302, the control unit 1 adjusts the temperature according to the set target tissue temperature T. target and the monitored temperature T of the external temperature sensor 302 test The output power of the semiconductor cooling chip 2 is controlled by a PID algorithm to keep the temperature value at the location monitored by the external temperature sensor 302 within T. target Within the set range, for example, the temperature range is ±0.3℃. Since the combination of PID algorithm and temperature control is an existing technology, its specific control process will not be described in detail here.

[0057] In addition, in this embodiment, the internal temperature sensor 301 is fixed to the low-temperature cooling copper component 4. To facilitate the installation and use of the internal temperature sensor 301, in this embodiment, the internal temperature sensor 301 can be a flat-top screw-head temperature probe (NTC temperature sensor, temperature monitoring range -20~105℃) of the brand SST CWF-S26. Meanwhile, since the external temperature sensor 302 is located on the outside of the low-temperature cooling copper component 4, different Z values ​​need to be set according to different values ​​of the subcutaneous depth d of the nerve fibers in the target area of ​​the low-temperature action. Therefore, the position of the external temperature sensor 302 needs to be adjusted during use. To facilitate and accurately adjust the position of the external temperature sensor 302, a guide plate can be fixed to the top surface of the low-temperature cooling copper component 4, and guide grooves or multiple fixing holes can be opened on the guide plate. Figure 2 The diagram illustrates a configuration with multiple fixing holes. These holes are arranged radially along the low-temperature cooling copper component 4, with spacing options of 0.3cm, 0.5cm, etc. Alternatively, guide grooves can be provided radially along the low-temperature cooling copper component 4. The external temperature sensor 302 is then fixed to different fixing holes or located at different positions within the guide grooves, allowing for position adjustment. This embodiment only illustrates the use of fixing holes or guide grooves. In other embodiments, the external temperature sensor 302 can be configured in other ways, as long as it is positioned in relation to the low-temperature cooling copper component 4. The distance between the outer walls of the cooling copper component 4 can be adjusted, and after adjustment, the external temperature sensor 302 can detect the temperature signal at the location of the target area on the surface of the low-temperature action body. To facilitate accurate monitoring by the external temperature sensor 302, an infrared temperature sensor or a PT100 temperature sensor can be used. Furthermore, to ensure that the external temperature sensor 302 can maintain close contact with the target area on the surface of the low-temperature action body at different positions, an elastic support member is connected between the external temperature sensor 301 and the fixed guide plate in this embodiment. The elastic support member can be a spring, etc. Figure 3 (The spring structure is not shown in the figure). When in use, the spring and other components apply pressure to the external temperature sensor 301 to ensure that the temperature sensor is in close contact with the target area of ​​the low-temperature action body for accurate temperature monitoring. This will not be described in detail here.

[0058] The specific implementation process is as follows:

[0059] It should be noted that the hypothermic nerve conduction blockade in this protocol utilizes a hypothermic device applied to nerve fibers at the target location to achieve a reversible blockade. Based on nerve function classification, nerves subject to conduction blockade can be categorized as sensory nerves (e.g., pain fibers (Aδ, C fibers), temperature fibers, touch / pressure fibers (Aβ fibers), etc.), motor nerves (e.g., alpha motor fibers (Aα fibers)), and autonomic nerves (e.g., sympathetic nerves (B fibers), parasympathetic nerves (some C fibers)). Based on anatomical location classification, nerves subject to conduction blockade can be categorized as peripheral nerves (common target sites include the upper limbs, lower limbs, trunk, etc.), ganglia and plexuses (common target sites include the dorsal root ganglia, stellate ganglia, celiac plexus, etc.), and cranial nerves (common target sites include branches of the trigeminal nerve (e.g., infraorbital nerve, mandibular nerve), facial nerve, etc.). Table 1 shows the diameter and functional classification of common nerve blocks, as well as the differences in the effectiveness of cryotherapy for nerve conduction blockade. Table 2 shows common wound areas and corresponding nerve target sites / target fibers / target regions. The number of nerve fibers blocked by cryotherapy depends on the nerve distribution density of the area of ​​action and the depth of cold penetration.

[0060] Table 1. Diameter and functional classification of blocked nerves, and differences in the blocking effect of cryotherapy.

[0061]

[0062] Table 2 Common wound areas and corresponding nerve targets

[0063]

[0064]

[0065] In practical applications, the number of nerve fibers blocked by cryotherapy depends on the nerve distribution density of the treatment area and the depth of cold penetration:

[0066] 1. For skin and superficial tissues with high nerve density (especially pain nerve endings and autonomic nerve endings): By applying a superficial cold compress (0℃~-10℃), a large number of Aδ and C fiber endings can be inhibited simultaneously, blocking 80% to 90% of local pain signals; when acting on touch (Aβ fibers), some are retained, with a retention rate of about 50% to 70% (due to insufficient temperature for complete blockage).

[0067] 2. For deep muscles and nerve trunks with low nerve density: large nerve trunks are concentrated, such as the sciatic nerve and median nerve. Low temperature (below -20℃) and longer time are required to penetrate to the deep nerves. This may selectively block the fine fibers (pain and autonomic nerves) in the nerve trunk, while the coarse motor fibers (Aα) retain their function.

[0068] 3. Indications for nerve block in clinical applications:

[0069] (1) Acute injury (such as ankle sprain): For Aδ, C fibers (pain sensation) and some autonomic nerve (vasoconstriction) target fibers, after applying local cold for 15 minutes, the pain signal is reduced by 60% to 80%, and the touch sensation (Aβ fibers) is reduced by only 20% to 30%, while the protective sensation is preserved.

[0070] (2) Postoperative analgesia (such as knee replacement surgery): For the target area of ​​nerve endings and superficial nerve branches around the surgical incision, ice pack cold compresses can reduce the amount of opioids used in the first 24 hours after surgery by 30% to 40%. Deep joint capsule nerves (Aδ fibers) need to be combined with invasive cryotherapy (such as intra-articular hypothermic perfusion).

[0071] (3) Chronic pain (such as osteoarthritis): If the coarse fibers (Aβ) do not completely block the nerve endings that target the Aδ / C fibers and inflammatory mediators around the joint, mechanical hyperalgesia (such as touch-induced pain) may remain.

[0072] Key influencing factors in the process of low-temperature nerve conduction blockade include temperature gradient, cold compress time, and individual differences. Regarding temperature gradient, for every 1°C decrease in skin surface temperature, the temperature 1 cm below the skin decreases by approximately 0.5°C, and deeper nerves require even lower surface temperatures. Regarding cold compress time, it is divided into short-term (less than 10 minutes, e.g., inhibiting superficial C fibers) and long-term (e.g., penetrating deep Aδ fibers, but may cause rebound congestion). Regarding individual differences, obese individuals have a significant thermal insulation effect from subcutaneous fat, requiring extended cold compress time or increased cold source intensity.

[0073] In practical application of the temperature-controlled nerve block system in this embodiment, based on the functional classification of the blocked nerves, highly sensitive blocked nerves are preferred. First, the nerve innervation relationship is clarified. For example, based on the wound location (e.g., hand, foot, and trunk), the source of sensory and motor innervation is determined (e.g., the hand is innervated by branches of the brachial plexus). Then, the proximal nerve trunk or nerve plexus is selected as the blocking target point / target fiber / target region. The depth d of the target tissue is measured using existing ultrasound positioning technology. The temperature-controlled nerve block system in this embodiment is then fixed at the selected target point / target fiber / target region. During fixation, existing straps or similar devices can be used to secure the device, ensuring that the low-temperature cooling copper component 4 contacts the skin surface of the blocking target point / target fiber / target region. Then, the control unit determines the target based on the subcutaneous target depth d and the target tissue temperature T of the target point / target fiber / target region. targetThe cooling power of the blocking semiconductor thermoelectric cooler 2 is calculated. The control unit 1 controls the blocking semiconductor thermoelectric cooler 2 to be energized according to the calculated power. When the blocking semiconductor thermoelectric cooler 2 is energized, the temperature of the cold end of the blocking semiconductor thermoelectric cooler 2 decreases. The temperature of the low-temperature cooling copper component 4 also decreases and acts on the target position. At the same time, the circulating cooling water tank 6 is activated to continuously dissipate heat from the hot end of the blocking semiconductor thermoelectric cooler 2, ensuring that the entire device can stably and continuously complete the temperature control. The low temperature of the low-temperature cooling copper component 4 is conducted to the target point / target fiber / target area, achieving a stable low-temperature nerve conduction function blocking effect.

[0074] In this embodiment, during the low-temperature conduction process of the low-temperature cooling copper component 4, the external temperature sensor 302 can monitor the temperature of the low-temperature cooling copper component 4 in real time (the detection period can be set to 1 second), ensuring that the measured temperature value at the position Z, which is a distance from the outer wall of the low-temperature cooling copper component 4, is within the range of T. target Within a predetermined range, the temperature of the target area at a subcutaneous depth d is equal to the temperature of the target tissue. The nerve fibers at that location are subjected to low temperature, resulting in a low-temperature nerve conduction blockade effect. When the external temperature sensor 302 detects that the temperature is higher or lower than the allowable range, the control unit 1 adjusts the Peltier current through a PID algorithm to ensure that the temperature of the blocking target point / target fiber / target area is always within the target tissue temperature range.

[0075] In this embodiment, d = 2cm, T target =15℃, q met =1000W / m 3 k eff =0.4W / m·K, k CU =400W / m·K, η safety factor is taken as 1.5, COP is taken as 0.6, and the area of ​​the low-temperature cooling copper component 4 is 1.26cm². 2 (The safety factor η = 1.5 is already included) Example calculation:

[0076]

[0077] Therefore, the Peltier model used is TEC1-12706 (cooling power 0.8W), the Peltier input power is 0.097W (a 50% margin needs to be reserved in actual use), and the PID (sampling period of 1 second) is adopted. Using the technical parameters of this solution can guarantee T target When the temperature range is within 15℃, low-temperature nerve conduction function blockade can be effectively achieved.

[0078] Table 3 shows a comparison between nerve blockade achieved through a temperature-controlled nerve blockade system in this embodiment and other nerve blockade techniques.

[0079]

[0080] Table 4. Key differences between hypothermic nerve block and conventional ice application.

[0081]

[0082] As shown in Tables 3 and 4, when the low-temperature nerve block device in this embodiment is used to block nerve conduction function, not only is the blockage rate very high, but the duration is also longer than that of conventional ice pack cryotherapy and local anesthetic techniques. Moreover, compared with conventional ice pack cryotherapy, the low-temperature nerve block in this embodiment has a wider temperature range and a greater depth of action, which has obvious technical advantages.

[0083] Example 2

[0084] The difference between Example 2 and Example 1 is as follows: Figure 4 As shown, the heat exchange system in Embodiment 1 includes a circulating cooling water tank 6. In this embodiment, the heat exchange system includes a heat exchange semiconductor refrigeration chip 9 and a heat exchange copper plate 10. The heat exchange semiconductor refrigeration chip 9 is signal-connected to the control unit 1. The heat exchange copper plate 10 is fixedly connected to the cold end of the heat exchange semiconductor refrigeration chip. A heat exchange flow channel is provided inside the heat exchange copper plate 10. A circulation pipeline connects the heat exchange copper plate 10 and the cooling copper component 5, and a circulation pump 11 is connected to the circulation pipeline. Correspondingly, the circulation pipeline includes a hot circulation pipe 7 and a cold circulation pipe 8. The water circulation process is the same as in Embodiment 1 and will not be described again here. In this embodiment, the circulation pump 11 is used as the circulation driving force, causing water to circulate between the heat exchange copper plate 10 and the cooling copper component 5, continuously dissipating heat from the cooling copper component 5, effectively ensuring the stable operation of the entire device. Furthermore, in this embodiment, the control unit 1 simultaneously controls the blocking semiconductor refrigeration chip 2 and the heat exchange semiconductor refrigeration chip 9, resulting in precise control and low cost.

[0085] Example 3

[0086] The difference between Example 3 and Example 1 is that in Example 1, the number of blocking semiconductor refrigeration chips 2 is one, while in this example, the number of blocking semiconductor refrigeration chips 2 is multiple, such as three or four. Figure 5 The illustration shows a scenario with two blocking semiconductor thermoelectric coolers 2. All blocking semiconductor thermoelectric coolers 2 are signal-connected to the control unit 1, and each blocking semiconductor thermoelectric cooler 2 is connected to a cooling mechanism, a low-temperature cooling copper component 4, and a temperature monitor 3. On the one hand, multiple blocking semiconductor thermoelectric coolers 2 can be combined to achieve a larger area of ​​low-temperature nerve conduction function blockade, such as low-temperature conduction function blockade of certain nerve fibers with larger diameters, ensuring the effect of low-temperature conduction function blockade. On the other hand, in certain special cases, multiple blocking semiconductor thermoelectric coolers 2 can simultaneously or sequentially block low-temperature nerve conduction function of multiple nerve fibers to meet the application scenarios such as synergistic perioperative analgesia.

[0087] Example 4

[0088] The difference between Example 6 and Example 1 is as follows: Figure 6 As shown, in this embodiment, a low-temperature conduction water bladder 13 is fixedly connected to the side of the low-temperature cooling copper component 4 used for low-temperature nerve conduction function blockade. The low-temperature conduction water bladder 13 is fixedly connected to the side wall of the low-temperature cooling copper component 4 by means of bonding, round steel ring snapping, etc., and the low-temperature conduction water bladder 13 is filled with water. In this design, the water in the low-temperature conductive water bladder 13 contacts the bottom surface of the low-temperature cooling copper component 4. The low temperature of the low-temperature cooling copper component 4 allows the water in the low-temperature conductive water bladder 13 to cool down rapidly. When in use, the low-temperature conductive water bladder 13 comes into contact with the skin. Because the low-temperature conductive water bladder 13 is flexible, it can form a better fit with the skin. For example, for irregular tissues such as the upper limbs, the low-temperature conductive water bladder 13 can effectively block the low-temperature nerve conduction function at the target location. Moreover, the skin is more comfortable when in contact with the low-temperature conductive water bladder 13 than when in direct contact with the low-temperature cooling copper component 4. The fixed connection between the low-temperature conductive water bladder 13 and the side wall of the low-temperature cooling copper component 4 can effectively reduce the ineffective lateral heat exchange of the low-temperature cooling copper component 4, thereby enabling the low-temperature cooling copper component 4 to achieve a more precise low-temperature nerve conduction function blocking effect.

[0089] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A low-temperature nerve block device, characterized in that: The device includes a control unit and a blocking semiconductor refrigeration chip connected to the control unit via a signal. The hot end of the blocking semiconductor refrigeration chip is connected to a circulating water cooling mechanism, and the cold end of the blocking semiconductor refrigeration chip is fixedly connected to a low-temperature cooling unit. A temperature monitor is connected to the low-temperature cooling unit via a signal, and the temperature monitor is connected to the control unit via a signal.

2. The low-temperature nerve block device according to claim 1, characterized in that: The low-temperature cooling section includes a low-temperature cooling copper component, one side of which is in contact with the blocking semiconductor cooling chip, and the other side is used to contact the target area on the surface of the low-temperature action body.

3. The low-temperature nerve block device according to claim 2, characterized in that: The low-temperature cooling copper component is fixedly connected to a low-temperature conductive water bag on one side of the target area of ​​the body surface for low-temperature action. The low-temperature conductive water bag contains cooling water that is in contact with the low-temperature cooling copper component.

4. The low-temperature nerve block device according to claim 2, characterized in that: The circulating water cooling mechanism includes a cooling copper component, a circulating cooling medium, a circulating pipeline, and a heat exchange system. The cooling copper component is fixedly connected to the hot end of the blocking semiconductor cooling chip. The circulating pipeline connects the cooling copper component and the heat exchange system. The circulating cooling medium circulates between the heat exchange system and the cooling copper component through the circulating pipeline to dissipate heat from the cooling copper component.

5. A low-temperature nerve block device according to claim 4, characterized in that: The heat exchange system includes a circulating cooling water tank, and a circulation pipeline connects the circulating cooling water tank and the cooling copper components.

6. A low-temperature nerve block device according to claim 4, characterized in that: The heat exchange system includes a heat exchange semiconductor cooling chip and a heat exchange copper plate. The heat exchange semiconductor cooling chip is signal-connected to the control unit. The heat exchange copper plate is fixedly connected to the cold end of the heat exchange semiconductor. The heat exchange copper plate has a heat exchange flow channel inside. A circulation pipeline connects the heat exchange copper plate and the cooling copper component. A circulation pump is connected to the circulation pipeline.

7. A low-temperature nerve block device according to claim 4, characterized in that: The temperature monitor includes an external temperature sensor connected to the outside of the low-temperature cooling copper component. The distance between the external temperature sensor and the outer wall of the low-temperature cooling copper component is Z, and the distance Z is adjustable. The nerve fibers of the target area of ​​the body surface under low temperature are located at a subcutaneous depth of d, Z=d. The control unit dynamically adjusts the output power of the blocking semiconductor cooling chip according to the temperature signal monitored by the external temperature sensor.

8. A low-temperature nerve block device according to claim 7, characterized in that: The temperature monitor also includes an internal temperature sensor, which is fixedly connected to the side of the low-temperature cooling copper component away from the blocking semiconductor cooling chip. There are at least two internal temperature sensors, which are arranged on the bottom surface of the low-temperature cooling copper component.

9. A low-temperature nerve block device according to claim 8, characterized in that: A fixed guide plate is fixedly connected to the low-temperature cooling copper component. The fixed guide plate is arranged radially along the low-temperature cooling copper component. The position of the external temperature sensor is adjustable along the length of the fixed guide plate, and an elastic support is connected between the external temperature sensor and the fixed guide plate.

10. A low-temperature nerve block device according to claim 1, characterized in that: The number of the blocking semiconductor refrigeration chips is multiple, and all the blocking semiconductor refrigeration chips are connected to the control unit. Each blocking semiconductor refrigeration chip is connected to a cooling mechanism, a low-temperature heat dissipation section and a temperature monitor.

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