A powder feeding system for preparing spherical silicon fine powder

CN224877944UActive Publication Date: 2026-10-23TIANJIN UNIV
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Patent Information

Application Number
CN202521859655.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-29
Publication Date
2026-10-23
Estimated Expiration
2035-08-29

AI Technical Summary

Technical Problem

[0003]送粉是球形硅微粉制备的重要环节,而目前通常使用的送粉方法有气载送粉、机械送粉、离心送粉、刮板送粉等,这些方法极易导致硅微粉粉体团聚、粉体颗粒形态破坏、送粉不均等问题,造成产率和质量下降等后果

Benefits of technology

[0014]根据本实用新型提供的一种用于制备球形硅微粉的送粉系统,首先,第一气流从送粉器腔体侧壁下部的通孔通入后,可在腔体内形成向上的气流场,对罐体供给的硅微粉原料产生均匀扰动,既能打破硅微粉原料颗粒间的分子引力,减少硅微粉原料的团聚,又能与硅微粉原料共同形成载粉气流,分散于载粉气流中的硅微粉原料的颗粒分布更均匀,利于提高后续球形化工序的原料颗粒受热一致程度,帮助提升球形硅微粉的球化度一致性。其次,罐体倒置且罐口与腔体上端连通,可依托重力作用使硅微粉原料自然向下落入腔体,实现对腔体的稳定、持续供粉,减少因供粉不稳定导致的球形硅微粉生产中断或产品粒径、形态偏差,帮助提升生产稳定性与成品合格率。然后,通过管体向外延伸以及设置载粉气流输出口,实现将载粉气流输送至后续球形化工序,同时管体沿腔体上部轴线贯穿腔体,可使管体在腔体内处于对称中心位置,利于减少载粉气流从载粉气流输入口进入管体过程中的管体内粉体局部堆积或稀疏的问题,有效降低因送粉不均导致的球形硅微粉颗粒破损、球化不完整等问题。因此,本实用新型所提供的用于制备球形硅微粉的送粉系统能帮助降低球形硅微粉制备时由送粉环节的缺陷导致的废品率,提高产品质量。

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Abstract

The utility model provides a kind of powder feeding system for preparing spherical silicon micro powder, including powder feeder, tank and pipe body. Powder feeder includes cavity, and the lower part of cavity side wall is equipped with the through hole for passing into first airflow. Tank is inverted and tank mouth is communicated with the upper end of cavity, for supplying silicon micro powder raw material to cavity. Pipe body is along the upper axis of cavity and penetrates cavity and extends outward, and pipe body is provided with powder carrying airflow input port and powder carrying airflow output port.
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Description

Technical Field

[0001] This utility model relates to the field of silicon micropowder preparation technology, and in particular to a powder feeding system for preparing spherical silicon micropowder. Background Technology

[0002] In recent years, the development of the electronic information industry, including 5G communications, semiconductors, and artificial intelligence, has driven the growth of copper-clad laminates and electronic packaging industries. Spherical silicon micropowder, with its advantages of good flowability, low stress, small specific surface area, and high bulk density, has become a major production material in these fields. With the increasing frequency and speed of electronic systems, the electronic information industry has placed higher demands on the performance of raw materials, significantly increasing the demand for spherical silicon micropowder with high sphericity and suitable particle size. Simultaneously, more stringent requirements have been placed on the production process of spherical silicon micropowder.

[0003] Powder feeding is a crucial step in the preparation of spherical silicon micropowder. Currently, commonly used powder feeding methods include air-carrying powder feeding, mechanical powder feeding, centrifugal powder feeding, and scraper powder feeding. These methods are prone to causing problems such as silicon micropowder agglomeration, destruction of powder particle morphology, and uneven powder feeding, resulting in reduced yield and quality. Utility Model Content

[0004] To address at least one of the aforementioned and other technical problems in the prior art, embodiments of this utility model provide a powder feeding system for preparing spherical silicon micropowder, comprising a powder feeder, a tank, and a tube. The powder feeder includes a cavity, with a through hole on the lower part of the side wall for introducing a first airflow. The tank is inverted and its opening communicates with the upper end of the cavity for supplying silicon micropowder raw materials to the cavity. The tube extends outward through the cavity along its upper axis, and has a powder-carrying airflow inlet and a powder-carrying airflow outlet.

[0005] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes an air inlet. The air inlet is located on the upper part of the side wall of the tank and away from the tank opening, and is used to introduce a second airflow into the tank.

[0006] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes an overflow port. The overflow port is located on the side wall of the tank, on the same side of the tank as the gas delivery port.

[0007] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes a vibrating oscillator. The vibrating oscillator is connected to the powder feeder and is connected to a motor with a fixed output frequency.

[0008] According to some embodiments of this utility model, both the powder-carrying gas inlet and the powder-carrying gas outlet are equipped with one-way valves, which are used to disconnect the tube body from the cavity.

[0009] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes an energizing component. The energizing component is disposed at the powder-carrying gas flow outlet and is used to ensure that all flowing silicon micropowder raw materials carry the same charge.

[0010] According to some embodiments of this utility model, the energized component includes electrodes and a high-voltage transformer power supply. The electrodes are plate-shaped, and tungsten needles are arranged on their surface. When the electrodes are connected to the high-voltage transformer power supply, the tungsten needles are able to discharge.

[0011] According to some embodiments of the present invention, tungsten needles are symmetrically arranged in at least two rows on the electrode, and the tungsten needles in each row are arranged in an equally spaced manner.

[0012] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes a sieve. The sieve is disposed inside the cavity and divides the cavity into an upper cavity and a lower cavity. The pore size of the sieve is smaller than the particle size of the silicon micropowder raw material, and is used to prevent the silicon micropowder raw material from entering the lower cavity.

[0013] According to some embodiments of the present invention, the powder-carrying airflow inlet is located on the middle side of the tube body, and the powder-carrying airflow outlet is located on the side of the tube body near the end.

[0014] According to the powder feeding system for preparing spherical silicon micropowder provided by this utility model, firstly, after the first airflow enters through the through hole at the lower part of the side wall of the powder feeder cavity, it can form an upward airflow field in the cavity, generating uniform disturbance on the silicon micropowder raw material supplied by the tank. This can break the molecular attraction between silicon micropowder raw material particles, reduce the agglomeration of silicon micropowder raw material, and form a powder-carrying airflow together with the silicon micropowder raw material. The particle distribution of silicon micropowder raw material dispersed in the powder-carrying airflow is more uniform, which is conducive to improving the heat uniformity of raw material particles in the subsequent spheroidization process, and helps to improve the spheroidization consistency of spherical silicon micropowder. Secondly, the tank is inverted and the tank opening is connected to the upper end of the cavity. The silicon micropowder raw material can fall naturally into the cavity by gravity, realizing a stable and continuous powder supply to the cavity. This reduces the interruption of spherical silicon micropowder production or deviations in product particle size and shape caused by unstable powder supply, and helps to improve production stability and finished product qualification rate. Then, by extending the tube outward and setting a powder-carrying gas outlet, the powder-carrying gas is delivered to the subsequent spheroidization process. Simultaneously, the tube extends through the upper axis of the cavity, placing it at the center of symmetry within the cavity. This helps reduce localized powder accumulation or thinning within the tube during the powder-carrying gas flow from the inlet, effectively mitigating problems such as particle breakage and incomplete spheroidization caused by uneven powder delivery. Therefore, the powder delivery system for preparing spherical silicon micropowder provided by this invention can help reduce the scrap rate caused by defects in the powder delivery process during spherical silicon micropowder preparation, thereby improving product quality. Attached Figure Description

[0015] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0016] Figure 1 A schematic cross-sectional view of a powder feeding system for preparing spherical silicon micropowder according to an embodiment of the present invention is shown.

[0017] Figure 2 A schematic diagram of the structure of an energized component according to an embodiment of the present invention is shown.

[0018] In the accompanying drawings, the meanings of the reference numerals are as follows:

[0019] 1-Powder feeder; 2-Vibrating oscillator; 3-Tank body; 4-Power supply assembly; 5-Gas inlet; 6-Overflow port; 7-Upper chamber; 8-Lower chamber; 9-Through hole; 10-Screen; 11-Tube body; 12-High voltage transformer power supply; 13-Tungsten needle; 14-Electrode. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0021] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The terms “comprising,” “including,” etc., as used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0022] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0023] When using expressions such as "at least one of A, B, and C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C. Similarly, when using expressions such as "at least one of A, B, or C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C.

[0024] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this utility model. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this utility model.

[0025] Figure 1 A schematic cross-sectional view of a powder feeding system for preparing spherical silicon micropowder according to an embodiment of the present invention is shown.

[0026] like Figure 1 As shown, this utility model provides a powder feeding system for preparing spherical silicon micropowder, including a powder feeder 1, a tank 3, and a tube 11. The powder feeder 1 includes a cavity, and the lower part of the side wall of the cavity is provided with a through hole 9 for introducing a first airflow. The tank 3 is inverted and its opening is connected to the upper end of the cavity for supplying silicon micropowder raw materials to the cavity. The tube 11 extends outward through the cavity along the upper axis of the cavity, and the tube 11 has a powder-carrying airflow inlet and a powder-carrying airflow outlet.

[0027] Specifically, the powder feeder 1, the tank 3, and the tube 11 are, but are not limited to, made of stainless steel to avoid chemical reactions with the silicon micropowder or the generation of abrasive impurities. The overall shape of the powder feeder 1 is, but is not limited to, a cuboid. A cavity is formed inside the powder feeder 1, and is, but is not limited to, cylindrical. The extension direction of the through hole 9 is perpendicular to the extension direction of the cavity, and the cross-sectional shape of the through hole 9 is, but is not limited to, circular. The first airflow enters the cavity along the extension direction of the through hole 9. The opening size of the through hole 9 is adapted to the flow rate of the first airflow.

[0028] Tank 3 serves as a storage container for silicon micropowder raw materials. The tank opening and the upper end of the cavity are sealed using, but are not limited to, flange connections to prevent leakage of silicon micropowder raw materials or contamination from external air. The volume of tank 3 is adapted to the powder feeding rate of the subsequent spherical production line.

[0029] The cross-section of the tube 11 is, but is not limited to, cylindrical. The extension direction of the tube 11 is perpendicular to the extension direction of the cavity, and the tube 11 penetrates the cavity and is close to the opening of the tank 3. The powder-carrying gas flow inlet on the tube 11 is located inside the cavity; the powder-carrying gas flow outlet is located outside the cavity, for feeding powder into the subsequent spherical production line.

[0030] The first gas flow is a gas flow exhibiting a state of violent turbulence and uniform tumbling similar to that of a boiling liquid. The medium of the first gas flow includes, but is not limited to, inert gases such as argon and nitrogen. Among them, inert gases can isolate oxygen and prevent damage to the purity of raw materials.

[0031] In this implementation, firstly, the first airflow enters through the through-hole 9 at the lower part of the side wall of the powder feeder 1 cavity, forming an upward airflow field within the cavity. This creates uniform disturbance to the silicon micropowder raw material supplied by the tank 3, breaking the molecular attraction between silicon micropowder particles and reducing agglomeration. It also forms a powder-carrying airflow together with the silicon micropowder raw material, resulting in a more uniform particle distribution. This improves the heat uniformity of the raw material particles in the subsequent spheroidization process, helping to enhance the spheroidization consistency of the spherical silicon micropowder. Secondly, with the tank 3 inverted and its opening connected to the upper end of the cavity, the silicon micropowder raw material can fall naturally into the cavity under gravity, achieving stable and continuous powder supply. This reduces production interruptions or deviations in particle size and morphology caused by unstable powder supply, helping to improve production stability and finished product qualification rate. Then, by extending the tube 11 outward and providing a powder-carrying airflow outlet, the powder-carrying airflow is delivered to the subsequent spheroidizing process. Simultaneously, the tube 11 extends through the upper axis of the cavity, positioning it at the center of symmetry within the cavity. This helps reduce localized powder accumulation or sparseness within the tube 11 during the powder-carrying airflow entry process, effectively mitigating problems such as particle breakage and incomplete spheroidization caused by uneven powder delivery. Therefore, the powder delivery system for preparing spherical silicon micropowder provided by this invention helps reduce the scrap rate caused by defects in the powder delivery process during spherical silicon micropowder preparation, thereby improving product quality.

[0032] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes an air inlet 5. The air inlet 5 is located on the upper part of the side wall of the tank 3, away from the tank opening, and is used to introduce a second airflow into the tank 3. The powder feeding system for preparing spherical silicon micropowder also includes an overflow port 6. The overflow port 6 is located on the side wall of the tank 3, on the same side of the tank 3 as the air inlet 5.

[0033] Specifically, the extension direction of the gas inlet 5 is perpendicular to the extension direction of the tank body 3, and the cross-sectional shape of the gas inlet 5 includes, but is not limited to, an annular shape. One open end face of the gas inlet 5 covers the opening on the side wall of the tank body 3. The opening size of the gas inlet 5 and the opening on the side wall of the tank body 3 is adapted to the flow rate of the second gas flow. The overflow port 6 includes, but is not limited to, a circular hole formed on the side wall of the tank body 3. The size of the overflow port 6 is adapted to the opening size of the gas inlet 5 and the opening on the side wall of the tank body 3, for example, the diameter of the overflow port 6 is set to 0.5 to 2 times the inner diameter of the gas inlet 5.

[0034] Furthermore, the second airflow enters the tank 3 from the other opening end face of the air inlet 5 along the extension direction of the air inlet 5, causing the air pressure inside the tank 3 to continuously increase. At the same time, part of the second airflow is discharged from the tank 3 through the overflow port 6. The second airflow and the first airflow include, but are not limited to, using the same airflow.

[0035] In this implementation, on the one hand, the second airflow enters the tank 3 through the air inlet 5, disturbing the silicon powder material inside the tank 3, helping to break up the agglomeration of the silicon powder material, and simultaneously pushing the silicon powder material towards the tank opening, helping to avoid tank opening blockage, preventing powder supply interruption problems, and promoting the continuous and smooth entry of silicon powder material into the cavity, which is conducive to maintaining the mixing effect of the powder-carrying airflow. On the other hand, excess second airflow in the tank 3 is discharged in time through the overflow port 6, helping to balance the pressure in the tank 3, which is conducive to preventing excessive air pressure in the tank 3 from causing the silicon powder material to fall too quickly or damage to the seals of the tank 3. In addition, the overflow port 6 and the air inlet 5 are located on the same side of the tank 3, reducing the formation of eddies in the second airflow in the tank 3, improving the uniformity of air pressure distribution, which is conducive to achieving continuous and stable powder supply from the tank 3 to the cavity, and helping to improve the continuity and stability of the generation and transportation process of the powder-carrying airflow, thus promoting the improvement of the production efficiency of subsequent spherical silicon powder.

[0036] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes a vibrating oscillator 2. The vibrating oscillator 2 is connected to the powder feeder 1, and the vibrating oscillator 2 is connected to a motor with a fixed output frequency.

[0037] Specifically, the vibrating oscillator 2 is, but is not limited to, fixed to the bottom or lower side wall of the powder feeder 1 by bolts. The output frequency of the motor is set according to the particle size of the silicon micro powder raw material, including but not limited to 50-200Hz. The vibrating oscillator 2 is driven by the motor to vibrate, causing the powder feeder 1, the tank 3, and the tube 11 to vibrate together. The fixed position of the vibrating oscillator 2 avoids the through hole 9 to prevent vibration from affecting the stable flow of the first airflow.

[0038] In this implementation, on the one hand, the vibrating oscillator 2 vibrates at a fixed frequency, which can effectively break the van der Waals forces between silicon micropowder raw material particles and promote the reduction of silicon micropowder raw material agglomeration. On the other hand, through the synergistic effect of the disturbance of the first airflow and the vibrating oscillator 2, the dispersion uniformity of the silicon micropowder raw material is further improved, which is conducive to improving the mixing effect of the powder-carrying airflow and helping to improve the uniformity of the heating of silicon micropowder raw material particles during the subsequent spheroidization process, thereby promoting the improvement of the spheroidization uniformity of the spherical silicon micropowder.

[0039] According to some embodiments of this utility model, both the powder-carrying gas inlet and the powder-carrying gas outlet are provided with one-way valves, which are used to isolate the tube 11 from the cavity.

[0040] Specifically, the check valves include, but are not limited to, those using a spring-loaded check valve structure. The check valve at the powder-carrying gas inlet only allows the powder-carrying gas to enter the pipe body 11, and the check valve at the powder-carrying gas outlet only allows the powder-carrying gas to exit from the pipe body 11 to the subsequent process. The opening pressure of the check valve is adapted to the pressure of the powder-carrying gas. It opens when the powder-carrying gas flows through and closes quickly under the action of spring force when the powder-carrying gas flow is interrupted.

[0041] Furthermore, the check valve uses wear-resistant and corrosion-resistant materials, such as polytetrafluoroethylene (PTFE) or 316L stainless steel, to prevent long-term erosion by silica powder from causing seal failure. The check valve and pipe body 11 are connected by threads, including but not limited to, for easy disassembly, maintenance, or replacement. A fluororubber gasket is provided between the valve core and valve seat of the check valve, including but not limited to, to enhance sealing performance.

[0042] In this implementation, on the one hand, the powder-carrying gas flow enters the tube 11 through the one-way valve at the powder-carrying gas flow inlet. The one-way valve isolates the tube 11 from the cavity, reducing the recurrence of powder agglomeration caused by backflow of the powder-carrying gas flow. This helps maintain the stability of the process in which the first gas flow in the upper part of the cavity mixes with the silicon micropowder raw material to form the powder-carrying gas flow. On the other hand, when the one-way valve at the powder-carrying gas flow outlet is opened, the powder-carrying gas flow flows out along the extension direction of the tube 11 to the subsequent equipment used to prepare spherical silicon micropowder. By closing the one-way valve, the backflow of external air or high-temperature gas flow from the subsequent equipment into the tube 11 is promptly blocked. This helps reduce the adverse effects of external contamination and high-temperature impact on the powder feeding process and the purity or morphology of the silicon micropowder raw material, promoting the continuous supply of high-quality raw materials for the production process of preparing spherical silicon micropowder by the powder feeding system.

[0043] Figure 2 A schematic diagram of the structure of an energized component according to an embodiment of the present invention is shown.

[0044] like Figure 2As shown, the powder feeding system for preparing spherical silicon micropowder also includes an energizing component 4. The energizing component 4 is located at the powder-carrying gas flow outlet and is used to ensure that all flowing silicon micropowder raw materials carry the same type of charge. The energizing component 4 includes an electrode 14 and a high-voltage transformer power supply 12. The electrode 14 is plate-shaped, and tungsten needles 13 are arranged on its surface. When the electrode 14 is connected to the high-voltage transformer power supply 12, the tungsten needles 13 are able to discharge. The tungsten needles 13 are symmetrically arranged in at least two rows on the electrode 14, and each row of tungsten needles 13 is arranged at equal intervals.

[0045] Specifically, the high-voltage transformer 12 outputs a DC high voltage, with a voltage range including but not limited to 10-50kV. The electrode 14 is, but is not limited to, a cuboid shape, with a tungsten needle 13 covering the powder-carrying gas flow outlet, ensuring that the powder-carrying gas flow from the outlet passes through the electric field generated by the tungsten needle 13. The electrode 14 is, but is not limited to, made of 304 stainless steel, with a polished surface to reduce powder adhesion. The electrode 14 is, but is not limited to, fixed by a ceramic insulating support to prevent contact with other metal components that could lead to leakage.

[0046] The tungsten needle 13 has a diameter of, but is not limited to, 0.5-2 mm, and its tip is sharpened to enhance the electric field strength. The tungsten needle 13 is fixed to the electrode 14 by, but is not limited to, welding to prevent the tungsten needle 13 from falling off during discharge.

[0047] In addition, the power-conducting component 4 is equipped with a grounded metal protective shell to prevent operators from accidentally touching high-voltage components.

[0048] In this implementation, an electrode 14 with tungsten needles 13 is placed at the powder-carrying gas outlet, and a high-voltage transformer power supply 12 is used to discharge the tungsten needles 13. The gas around the tungsten needles 13 generates unipolar ions (such as positive ions), forming an electric field. When the silicon micropowder raw material in the powder-carrying gas flows through this electric field, it adsorbs ions and carries the same charge. The Coulomb repulsion generated by the same charge can effectively reduce the agglomeration of powder due to intermolecular forces during the transportation process, maintaining the powder dispersion state. In particular, the symmetrical arrangement of the tungsten needles 13 and the formation of an array with equal spacing facilitates the formation of a uniformly distributed electric field on the surface of the electrode 14. This reduces the risk of powder breakdown due to excessively strong local electric fields or uneven charge due to excessively weak local electric fields. At the same time, it improves the consistency of the charge of each powder particle, reduces local accumulation of powder due to uneven charge, and helps ensure that the silicon micropowder raw material entering the spheroidizing process has a complete morphology and uniform dispersion, thus promoting the improvement of the spheroidization quality and consistency of the spherical silicon micropowder.

[0049] According to some embodiments of this utility model, the powder feeding system for preparing spherical silicon micropowder further includes a sieve 10. The sieve 10 is disposed inside the cavity and divides the cavity into an upper cavity 7 and a lower cavity 8. The aperture of the sieve 10 is smaller than the particle size of the silicon micropowder raw material, and is used to prevent the silicon micropowder raw material from entering the lower cavity 8.

[0050] Specifically, the sieve 10 is horizontally positioned in the middle of the cavity, dividing the cavity into an upper cavity 7 and a lower cavity 8. The sieve 10 is made of stainless steel, among other things, and has high temperature resistance and wear resistance. The aperture of the sieve 10 is, among other things, set to be 10 to 20 μm smaller than the minimum particle size of the silicon micropowder raw material. For example, when the particle size of the silicon micropowder raw material is 100 to 200 μm, the aperture of the sieve 10 is 80 to 90 μm, preventing the silicon micropowder raw material from passing through the sieve 10 into the lower cavity 8.

[0051] Furthermore, including but not limited to, an annular metal frame is provided at the edge of the screen 10, and the frame is connected to the inner wall of the cavity by a slot, which facilitates the disassembly, cleaning or replacement of the screen 10.

[0052] In addition, the opening ratio of the screen 10 is not limited to 30% to 70%, which ensures that the first airflow can pass through smoothly and that the first airflow can be diffused more evenly through the throttling effect.

[0053] In this implementation, an upper chamber 7 and a lower chamber 8 are separated by a screen 10 with a pore size smaller than that of the silicon powder raw material within the cavity. The screen 10 prevents the silicon powder raw material from entering the lower chamber 8, helping to avoid clogging the through-holes 9 of the lower chamber 8, promoting stable flow of the first airflow, and reducing the occurrence of powder delivery interruptions caused by clogging of the through-holes 9. At the same time, the first airflow is uniformly diffused into the upper chamber 7 after being throttled by the screen 10, improving the dispersion of the silicon powder raw material and the mixing effect with the first airflow. This facilitates the provision of a powder-carrying airflow with uniform powder dispersion and airflow for subsequent processes, reducing the scrap rate caused by defects in the cavity process, and promoting the improvement of the quality of the subsequently produced spherical silicon powder.

[0054] According to some embodiments of the present invention, the powder-carrying airflow inlet is located on the middle side of the tube body 11, and the powder-carrying airflow outlet is located on the side of the tube body 11 near the end.

[0055] Specifically, the powder-carrying airflow inlet is located on the side of the tube 11 that penetrates the cavity. This location is in an area within the cavity where the airflow and silicon powder raw material are mixed relatively evenly. The shape of the powder-carrying airflow inlet includes, but is not limited to, a circle, and the aperture includes, but is not limited to, 1 / 3 to 1 / 2 of the diameter of the tube 11. The powder-carrying airflow outlet is located on the side of the tube 11 that extends out of the cavity near the end and passes through the feed inlet of the subsequent sphericalization process equipment, reducing the loss of powder-carrying airflow during the conveying process.

[0056] In this embodiment, by opening the powder-carrying airflow inlet on the side of the middle portion of the tube 11, the powder-carrying airflow efficiently carries the surrounding dispersed silicon micropowder raw material. Simultaneously, the powder-carrying airflow outlet is positioned near the end, reducing airflow resistance and powder accumulation, and promoting efficient delivery of the powder-carrying airflow to subsequent processes. Therefore, this facilitates the continuous spherical processing of spherical silicon micropowder, reducing production delays caused by low conveying efficiency.

[0057] The embodiments of the present invention have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of the present invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the present invention, and all such substitutions and modifications should fall within the scope of the present invention.

Claims

1. A powder feeding system for preparing spherical silica micropowder, characterized in that, include: The powder feeder (1) includes a cavity, and the lower part of the side wall of the cavity is provided with a through hole (9) for introducing the first airflow; Tank (3), the tank (3) is inverted and the opening is connected to the upper end of the cavity, for supplying silicon micro powder raw materials to the cavity; The tube (11) extends outward along the upper axis of the cavity, and the tube (11) is provided with a powder-carrying airflow inlet and a powder-carrying airflow outlet.

2. The powder feeding system for preparing spherical silicon micropowder according to claim 1, characterized in that, Also includes: An air inlet (5) is located on the upper part of the side wall of the tank (3) and away from the tank opening, for introducing a second airflow into the tank (3).

3. The powder feeding system for preparing spherical silicon micropowder according to claim 2, characterized in that, Also includes: An overflow port (6) is located on the side wall of the tank (3) and is on the same side of the tank (3) as the gas inlet (5).

4. The powder feeding system for preparing spherical silicon micropowder according to claim 1, characterized in that, Also includes: A vibrating oscillator (2) is connected to the powder feeder (1), and the vibrating oscillator (2) is connected to a motor with a fixed output frequency.

5. The powder feeding system for preparing spherical silicon micropowder according to claim 1, characterized in that, Both the powder-carrying gas inlet and the powder-carrying gas outlet are equipped with one-way valves, which are used to disconnect the tube (11) from the cavity.

6. The powder feeding system for preparing spherical silicon micropowder according to claim 1, characterized in that, Also includes: The power-conducting component (4) is disposed at the powder-carrying gas flow outlet and is used to ensure that all silicon micropowder raw materials flowing through it carry the same charge.

7. The powder feeding system for preparing spherical silicon micropowder according to claim 6, characterized in that, The energized component (4) includes electrodes (14) and a high-voltage transformer power supply (12); The electrode (14) is plate-shaped and has tungsten needles (13) arranged on its surface; The electrode (14) is connected to the high-voltage transformer power supply (12), which enables the tungsten needle (13) to discharge.

8. The powder feeding system for preparing spherical silicon micropowder according to claim 7, characterized in that, The tungsten needles (13) are symmetrically arranged in at least two rows on the electrode (14), and the tungsten needles (13) in each row are arranged in an equally spaced manner.

9. The powder feeding system for preparing spherical silicon micropowder according to claim 1, characterized in that, Also includes: A screen (10) is disposed inside the cavity and divides the cavity into an upper cavity (7) and a lower cavity (8). The aperture of the screen (10) is smaller than the particle size of the silicon micro powder raw material and is used to prevent the silicon micro powder raw material from entering the lower cavity (8).

10. The powder feeding system for preparing spherical silicon micropowder according to claim 1, characterized in that, The powder-carrying airflow inlet is located on the middle side of the tube (11), and the powder-carrying airflow outlet is located on the side of the tube (11) near the end.