Dispensing head for copper clip bonding package

Abstract

The utility model discloses a kind of dispensing heads of copper clamp bonding packaging, it is related to dispensing technology field, including: glue inlet cylinder, glue distribution block and dispensing block, glue inlet cylinder is set in the top of glue distribution block, dispensing block is set in the bottom of glue distribution block;Two dispensing parts are provided on dispensing block, two dispensing parts are arranged side by side, each dispensing part includes several dispensing holes that are penetrated from top to bottom dispensing block, dispensing tube is provided in the bottom of each dispensing hole of dispensing block;Glue distribution channel is provided in glue distribution block, the inlet of glue distribution channel is communicated with glue inlet cylinder, the outlet of glue distribution channel is communicated with several dispensing holes of two dispensing parts;The utility model sets two dispensing parts, each dispensing part includes multiple dispensing holes, two dispensing parts can simultaneously carry out dispensing work, simultaneously dispensing two chips, improve dispensing efficiency, adapt to higher use demand.

Description

Technical Field

[0001] This utility model relates to the field of sampling device technology, specifically to a copper clip bonding and encapsulation dispensing head. Background Technology

[0002] Semiconductor power devices have been widely used in new energy vehicles, home appliances and industrial control. As the requirements for product performance become higher and higher, higher requirements are also placed on the product packaging structure.

[0003] In copper clip bonding packaging, adhesive must be applied to the surface of the MSOFET chip (source and gate) using a dispensing head. Traditional chip dispensing heads have fixed numbers, positions, and sizes of dispensing holes. This structure is simple and the technology is relatively mature, but it can only dispense adhesive to one chip at a time, resulting in low efficiency.

[0004] In view of this, there is an urgent need for a dispensing head with copper clip bonding and encapsulation. Summary of the Invention

[0005] To address the problems existing in the prior art, this utility model solves the problem using the following technical structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A dispensing head for copper clip bonding and encapsulation includes: a glue inlet cylinder, a glue distribution block, and a dispensing block, wherein the glue inlet cylinder is disposed at the top of the glue distribution block, and the dispensing block is disposed at the bottom of the glue distribution block; The dispensing block is provided with two dispensing parts, which are arranged side by side. Each dispensing part includes several dispensing holes that penetrate the dispensing block from top to bottom. The dispensing block is provided with a dispensing tube at the bottom of each dispensing hole. The dispensing block is provided with a dispensing channel. The inlet of the dispensing channel is connected to the glue inlet cylinder, and the outlet of the dispensing channel is connected to several dispensing holes of the two dispensing parts.

[0007] A glue-splitting block is provided between the glue dispensing block and the glue separating block. The glue-splitting block is provided with two glue-splitting holes, and both glue-splitting holes are connected to the outlet of the glue separating channel. The dispensing holes of the two dispensing sections are respectively connected to the two uniform dispensing holes.

[0008] The dispensing channel has two outlets, which are respectively connected to two uniform dispensing holes.

[0009] The dispensing channel is inverted Y-shaped.

[0010] The bottom of the dispensing block is equipped with baffles on both sides of the two dispensing sections.

[0011] A limiting ring is fitted onto the glue inlet cylinder.

[0012] An installation ring is provided on the side of the glue inlet cylinder away from the glue dispensing block.

[0013] The outer side of the mounting ring is threaded.

[0014] The dispensing block, the dividing block, and the evenly dispensing block are all rectangular parallelepipeds, and are fixed by bolts.

[0015] A plug is provided at the top of each of the aforementioned dispensing holes.

[0016] The above-described structure of this utility model can achieve the following beneficial effects: In use, this application is installed on a dispensing machine, and the glue inlet tube is connected to the glue supply structure. The glue is transported through the glue dispensing channel to the dispensing holes on the two dispensing sections, and the glue is dispensed to the position on the chip to be dispensed through the dispensing tube. Since there are two dispensing sections, each dispensing section includes multiple dispensing holes, the two dispensing sections can perform dispensing work at the same time, dispensing two chips at the same time, improving dispensing efficiency and adapting to higher usage requirements. By replacing the glue dispensing block or glue plate of different thicknesses, the dispensing height or dispensing position can be adjusted (dispensing blocks with different numbers and layouts of dispensing holes) to adapt to different dispensing needs; the dispensing holes of the two dispensing sections can dispense glue to two chips at the same time, improving dispensing efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this embodiment; Figure 2 This is a schematic diagram of the structure at the bottom of the adhesive block in this embodiment; Figure 3 This is a cross-sectional view of the air-insulated block in this embodiment; Figure 4 This is a schematic diagram of the homogenizing block in this embodiment.

[0018] In the diagram: 1. Inlet cartridge; 2. Dispensing block; 21. Inlet; 22. Outlet; 3. Dispensing block; 31. Dispensing hole; 4. Dispensing tube; 5. Mounting ring; 6. Spreading block; 61. Spreading hole; 7. Baffle; 8. Limiting ring. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0020] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products or devices.

[0021] The following is in conjunction with the appendix Figures 1-4 This application will be described in further detail.

[0022] refer to Figures 1-3 The dispensing head for copper clip bonding and encapsulation shown includes: a dispensing cylinder 1, a dispensing block 2, and a dispensing block 3. The dispensing cylinder 1 is disposed on the top of the dispensing block 2, and the dispensing block 3 is disposed on the bottom of the dispensing block 2. The dispensing block 3 is provided with two dispensing sections, which are arranged side by side. Each dispensing section includes several dispensing holes 31 that run from top to bottom through the dispensing block 3 (the several dispensing holes 31 include G pole dispensing holes and S pole dispensing holes. The distribution of the dispensing holes 31 is adapted to the actual use requirements when dispensing the dispensing block 3 during production). A dispensing tube 4 is provided at the bottom of each dispensing hole 31 on the dispensing block 3. The dispensing block 2 is provided with a dispensing channel. The inlet 21 of the dispensing channel is connected to the glue inlet cylinder 1, and the outlet 22 of the dispensing channel is connected to several dispensing holes 31 of the two dispensing parts.

[0023] Based on the above structure, in use, this application is installed on a dispensing machine, and the glue inlet tube 1 is connected to the glue supply structure; the glue is transported through the glue distribution channel to the dispensing holes 31 on the two dispensing sections, and the glue is dispensed to the position on the chip to be dispensed through the dispensing tube 4; since two dispensing sections are set, each dispensing section includes multiple dispensing holes 31, the two dispensing sections can perform dispensing work at the same time, dispensing two chips at the same time, improving dispensing efficiency and adapting to higher usage requirements.

[0024] like Figure 1 and Figure 4As shown, a uniform adhesive block 6 is provided between the dispensing block 3 and the separating block 2. The uniform adhesive block 6 has two uniform adhesive holes 61, both of which are connected to the outlet of the separating channel. The dispensing holes 31 of the two dispensing sections are respectively connected to the two uniform adhesive holes 61. In this way, the adhesive from the separating channel is diverted into the two uniform adhesive holes 61, and then supplied to several dispensing holes 31 of the same dispensing section through the uniform adhesive holes 61, so as to achieve more uniform dispensing of adhesive into several dispensing holes 31.

[0025] Further optimizations include, for example Figure 3 As shown, the glue distribution channel has two outlets 22, which are respectively connected to two glue leveling holes 61. In this embodiment, the glue distribution channel is preferably in the shape of an inverted Y to better distribute the glue.

[0026] like Figure 1 and Figure 2 As shown, baffles 7 (which can be made of flexible material) are provided on both sides of the two dispensing sections at the bottom of the dispensing block 3 to prevent damage to the dispensing hole 31 and dispensing tube 4 due to improper operation during dispensing, and at the same time to protect the chip from being crushed.

[0027] like Figure 1 As shown, a limiting ring 8 is fitted on the glue inlet cylinder 1; an installation ring 5 is provided on the side of the glue inlet cylinder 1 away from the glue dispensing block 2; the outer side of the installation ring 5 is provided with threads, and the installation ring 5 is connected to the syringe-shaped glue outlet through the threads for conveying glue to the glue inlet cylinder 1; the limiting ring 8 is mainly used to limit the position when the present application is installed on the dispensing device; the glue inlet cylinder 1 is used to store glue and convey glue to the glue dispensing block 2.

[0028] like Figure 1 As shown, the dispensing block 3, the dividing block 2, and the evenly dispensing block 6 are all rectangular in shape to facilitate assembly; and the dispensing block 3, the dividing block 2, and the evenly dispensing block 6 are fixed together by multiple bolts to facilitate disassembly and maintenance.

[0029] A further optimization is that each of the dispensing holes 31 is equipped with a plug at its top. This allows for the removal of the dispensing block and the corresponding plug 5 at the dispensing hole 31 to address the issue of different dispensing positions for different chips. This enables the dispensing tube 4 to perform dispensing operations, thus adapting to different usage requirements.

[0030] In summary, this application can adapt to different dispensing needs by replacing the uniform dispensing block 6 or the dispensing block 3 with different thicknesses and adjusting the dispensing height or dispensing position (dispensing blocks 3 with different numbers and layouts of dispensing holes); the dispensing holes 31 of the two dispensing sections can dispense two chips at the same time, improving dispensing efficiency.

[0031] The above are merely preferred embodiments of this application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations that can be directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.

Claims

1. A dispensing head for copper clip bonding and encapsulation, characterized in that, include: The glue inlet cylinder (1), the glue distribution block (2), and the glue dispensing block (3) are provided. The glue inlet cylinder (1) is located on the top of the glue distribution block (2), and the glue dispensing block (3) is located on the bottom of the glue distribution block (2). The dispensing block (3) is provided with two dispensing parts, which are arranged side by side. Each dispensing part includes several dispensing holes (31) that pass through the dispensing block (3) from top to bottom. The dispensing block (3) is provided with a dispensing tube (4) at the bottom of each dispensing hole (31). The dispensing block (2) is provided with a dispensing channel. The inlet (21) of the dispensing channel is connected to the glue inlet cylinder (1), and the outlet (22) of the dispensing channel is connected to several dispensing holes (31) of the two dispensing parts.

2. The dispensing head for copper clip bonding and encapsulation according to claim 1, characterized in that: A glue-splitting block (6) is provided between the glue dispensing block (3) and the glue separating block (2). The glue-splitting block (6) has two glue-splitting holes (61), and both glue-splitting holes (61) are connected to the outlet of the glue separating channel. The dispensing holes (31) of the two dispensing sections are respectively connected to the two uniform dispensing holes (61).

3. The dispensing head for copper clip bonding and encapsulation according to claim 2, characterized in that: The glue distribution channel has two outlets (22), and the two outlets (22) are respectively connected to two glue leveling holes (61).

4. The dispensing head for copper clip bonding and encapsulation according to claim 3, characterized in that: The dispensing channel is inverted Y-shaped.

5. The dispensing head for copper clip bonding and encapsulation according to claim 1, characterized in that: The bottom of the dispensing block (3) is provided with baffles (7) on both sides of the two dispensing parts.

6. The dispensing head for copper clip bonding and encapsulation according to claim 3, characterized in that: A limiting ring (8) is fitted on the glue inlet cylinder (1).

7. The dispensing head for copper clip bonding and encapsulation according to claim 6, characterized in that: An installation ring (5) is provided on the side of the glue inlet cylinder (1) away from the glue distribution block (2).

8. The dispensing head for copper clip bonding and encapsulation according to claim 7, characterized in that: The mounting ring (5) has threads on its outer side.

9. The dispensing head for copper clip bonding and encapsulation according to claim 3, characterized in that: The dispensing block (3), the dividing block (2), and the evenly dispensing block (6) are all rectangular parallelepipeds, and are fixed by bolts.

10. The dispensing head for copper clip bonding and encapsulation according to claim 1, characterized in that: A plug is provided on the top of each of the dispensing holes (31).

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