A manual film loading dispensing jig

Abstract

The utility model discloses a manual loading piece point gum jig, include: accommodation groove, sliding rail and scraper, and accommodation groove includes bottom plate and four lateral walls, and bottom plate and lateral wall constitute the accommodation space of no lid, and this accommodation space is used for placing glue, and sliding rail includes the first track and second track of horizontal setting respectively on the mutually parallel lateral wall, and the height of this sliding rail is higher than glue, and first track is provided with first sliding groove, and second track is provided with second sliding groove, and scraper includes the board body and two clamping heads. Through setting accommodation groove, sliding rail and scraper, make the lower edge of scraper always keep the same interval with the bottom plate of accommodation groove in the sliding process of moving on the sliding rail, ensure that the surface of scraped glue is flush, produce following beneficial effect: the glue amount of each dipping is consistent, reduce the threshold of manual loading piece, the amount of dipping glue point gum is convenient to adjust, avoid short circuit or appear the cavity, make PCB board can exert the maximum thermal conductivity and conductivity, avoid the difference performance between different PCB boards too big.

Description

Technical Field

[0001] This utility model relates to the field of dispensing fixture technology, specifically to a manual dispensing fixture for sheet loading. Background Technology

[0002] In PCB surface mount technology (STM) assembly, manual chip mounting typically involves using a metal needle to apply a suitable amount of adhesive, such as silver paste, to the chip housing and PCB pads before securing the chip to the substrate. To ensure optimal thermal and electrical conductivity between the chip and the pads, voids in the silver paste must be minimized to maximize the contact area between the chip and the pads.

[0003] The current method results in inconsistent glue application rates each time, making it impossible to guarantee the gaps between each manually mounted chip and the pads, as well as the glue's creep. Applying too much glue will cause it to creep onto the chip, leading to short circuits, while applying too little will cause it to overflow, creating gaps and failing to achieve maximum thermal and electrical conductivity. Furthermore, the results are too inconsistent. Utility Model Content

[0004] Therefore, it is necessary to address the problems of inconsistent adhesive application rates during SMT assembly, which lead to short circuits or voids on the PCB, prevent the PCB from achieving its maximum thermal and electrical conductivity, and cause excessive PCB variations. A manual adhesive application fixture should be proposed to ensure consistent adhesive application rates each time and improve PCB performance.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A manual dispensing fixture, comprising: The receiving groove includes a base plate and four side walls, the base plate and the side walls forming an open receiving space for holding glue; The slide rail includes a first track and a second track, which are respectively horizontally arranged on the parallel side walls. The slide rail is higher than the height of the glue. The first track is provided with a first groove and the second track is provided with a second groove. The scraper includes a plate body and two clips. A first clip and a second clip are provided on both sides of the plate body. The first clip and the second clip are perpendicular to the plate body. The first clip is embedded in the first sliding groove, and the second clip is embedded in the second sliding groove. The plate body is vertically arranged and can slide freely on the slide rail while always remaining perpendicular to the slide rail. The lower edge of the scraper maintains the same distance from the base plate and is higher than the upper surface of the adhesive. The upper edge of the scraper extends out of the receiving space.

[0006] In some embodiments, the inner diameter of the slide rail is larger than the diameter of the opening, and the clip is movably embedded in the slide rail.

[0007] In some embodiments, the length of the card head is greater than the thickness of the plate body.

[0008] In some embodiments, the card head is fitted with the first slide groove and the second slide groove with a clearance.

[0009] In some embodiments, the bottom of the scraper is curved.

[0010] In some embodiments, the scraper is an alloy scraper or a plastic scraper.

[0011] By setting up a receiving groove, a slide rail, and a scraper, the lower edge of the scraper always maintains the same distance from the bottom plate of the receiving groove during the scraping process, ensuring that the scraped glue surface is flush, resulting in the following beneficial effects: ① This ensures that the amount of glue applied each time is consistent.

[0012] ②Using this fixture will ensure that the amount of adhesive overflow during manual mounting remains consistent to the greatest extent possible, reducing the barrier to manual mounting.

[0013] ③ It can ensure that the amount of glue on each chip is the same, making it easy to adjust the amount of glue applied and reducing the possibility of glue voids and excessive glue overflow onto the chip surface. This allows the PCB board to achieve maximum thermal conductivity and electrical conductivity, and avoids excessive performance differences between different PCB boards. Attached Figure Description

[0014] in: Figure 1 This is a front structural diagram of a manual dispensing fixture according to an embodiment of the present invention; Figure 2 This is a side view of a manual dispensing fixture according to an embodiment of the present invention; Figure 3 yes Figure 2 Enlarged view of point A; Figure 4 This is a schematic diagram of the overall three-dimensional structure of a manual dispensing fixture according to an embodiment of the present invention.

[0015] The markings in the attached diagram are described below: 1. Receiving groove; 11. Base plate; 12. Side wall; 2. Slide rail; 21. First track; 211. First slide groove; 22. Second track; 221. Second slide groove; 3. Scraper; 31. Plate body; 32. Clamping head; 321. First clamping head; 322. Second clamping head. Detailed Implementation

[0016] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "connected" to another element, it can be directly on the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "left," "right," "upper end," "lower end," "top," and "bottom," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention.

[0018] To address the issues in existing SMT (Surface Mount Technology) technologies where inconsistent adhesive application amounts lead to short circuits or voids on the PCB, hindering optimal thermal and electrical conductivity and causing significant PCB board variations, the following will combine [the following text]... Figures 1 to 4 This invention provides a detailed description of a manual dispensing fixture for loading and dispensing substrates according to an embodiment of the present invention.

[0019] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 This is a front structural diagram of a manual dispensing fixture according to an embodiment of the present invention; Figure 2 This is a side view of a manual dispensing fixture according to an embodiment of the present invention; Figure 3 yes Figure 2 Enlarged view of point A; Figure 4 This is a schematic diagram of the overall three-dimensional structure of a manual dispensing fixture according to an embodiment of the present invention.

[0020] A manual dispensing fixture, comprising: The receiving groove 1 includes a base plate 11 and four side walls 12, wherein the base plate 11 and the side walls 12 form an open receiving space for holding glue. The slide rail 2 includes a first track 21 and a second track 22. The first track 21 and the second track 22 are respectively horizontally arranged on the parallel sidewalls 12. The slide rail 2 is higher than the height of the glue. The first track 21 is provided with a first groove 211 and the second track 22 is provided with a second groove 221. The scraper 3 includes a plate body 31 and two clips 32. The plate body 31 has a first clip 321 and a second clip 322 on both sides. The first clip 321 and the second clip 322 are perpendicular to the plate body 31. The first clip 321 is embedded in the first slide groove 211, and the second clip 322 is embedded in the second slide groove 221. The plate body 31 is vertically arranged and can slide freely on the slide rail 2 and always remain perpendicular to the slide rail 2. The lower edge of the scraper 3 maintains the same distance from the base plate 11 and is higher than the upper surface of the adhesive. The upper edge of the scraper 3 extends out of the receiving space.

[0021] Specifically, PCB surface mount technology (STM) is a technology that automatically mounts chip components (such as resistors, capacitors, and integrated circuits) onto PCB pads using a pick-and-place machine. Reflow soldering then secures and electrically connects the components. Manual mounting typically involves using a metal pin to apply a small amount of adhesive, such as glue, to the chip and PCB pads before attaching the chip. To ensure optimal thermal and electrical conductivity between the chip and pads, voids in the adhesive should be minimized to maximize the contact area between the chip and the pads.

[0022] The current method results in inconsistent glue application rates each time, making it impossible to guarantee the gaps between each manually mounted chip and the pads, as well as the glue's creep. Applying too much glue will cause it to creep onto the chip, leading to short circuits, while applying too little will cause it to overflow, creating gaps and failing to achieve maximum thermal and electrical conductivity. Furthermore, the results are too inconsistent.

[0023] The existing process cannot control the amount of adhesive applied each time, relying solely on experience and intuition. This results in significant differences in the products produced and large gaps in test performance, making it impossible for customers to make appropriate improvements to the chips.

[0024] This fixture allows the glue to be extruded evenly, making it easier to manually control the amount of glue applied per batch and to control the amount of glue overflowing after loading, preventing too much or too little glue. The glue used is generally silver paste.

[0025] Usage process: First, squeeze an appropriate amount of glue into the receiving groove 1, ensuring that the glue does not completely submerge the lower edge of the scraper 3. Then, push the upper part of the scraper 3, moving it from one end of the slide rail 2 to the other. At this time, the first clamping head 321 and the second clamping head 322 slide in the first slide groove 211 and the second slide groove 221. The lower edge of the scraper 3 squeezes the glue that is higher than its lower edge into the recessed area, making the glue height at the protruding position the same and flat. After smoothing the glue surface with the scraper 3, you can perform the glue dispensing operation. After dipping the glue a certain number of times, the amount of glue decreases and the glue surface will return to an uneven state. At this time, you need to squeeze an appropriate amount of glue into the receiving groove 1 again, smooth the glue surface with the scraper 3, and continue to use it for glue dispensing operations.

[0026] By setting up the receiving groove 1, the slide rail 2, and the scraper 3, the lower edge of the scraper 3 is always kept at the same distance from the bottom plate 11 of the receiving groove 1 during the sliding motion of the scraper 3 on the slide rail 2, ensuring that the scraped glue surface is flush, resulting in the following beneficial effects: ①This fixture can smooth out the extruded silver paste, so that the amount of paste picked up each time is consistent.

[0027] ②Using this fixture will ensure that the amount of adhesive overflow during manual mounting remains consistent to the greatest extent possible, and will reduce the barrier to manual mounting.

[0028] ③ It ensures that the amount of adhesive is the same for each chip, making it easier to adjust the amount of adhesive applied and reducing the possibility of adhesive voids and excessive adhesive overflow onto the chip surface. This improves the performance of the PCB board.

[0029] In one embodiment, the inner diameter of the slide rail 2 is larger than the aperture at the opening, and the locking head 32 is movably embedded in the slide rail 2.

[0030] Specifically, embedding the card head 32 into the slide groove can increase the stability of the scraper 3, prevent the scraper 3 from tilting and shaking when sliding to apply glue, avoid uneven glue surface, and ensure that the amount of glue applied each time is the same.

[0031] In one embodiment, the length of the card head 32 is greater than the thickness of the plate body 31.

[0032] Specifically, when the scraper 3 is pushed, the plate 31 will rotate, generating torque on the clamp 32, which increases the friction between the clamp 32 and the slide groove, making it difficult to slide. Therefore, the length of the clamp 32 is set to be relatively long, at least greater than the thickness of the scraper 3. The contact surface between the clamp 32 and the slide groove is increased, reducing friction, which is conducive to sliding, avoiding shaking, and increasing stability.

[0033] In one embodiment, the card head 32 is clearance-fitted with the first slide groove 211 and the second slide groove 221.

[0034] Specifically, the clearance fit can reduce the friction between the clip 32 and the slide rail, which is beneficial for sliding and makes the process of pushing the scraper 3 to smooth the glue smoother.

[0035] In one embodiment, the bottom of the scraper 3 is an arc surface.

[0036] Specifically, the curved surface comes into contact with the adhesive to ensure a smoother hanging surface.

[0037] In one embodiment, the scraper 3 is an alloy scraper 3 or a plastic scraper 3.

[0038] Specifically, the plastic scraper 3 or the alloy scraper 3 is lighter and easier to operate.

[0039] This invention provides a manual die-loading and dispensing fixture. By configuring a receiving groove 1, a slide rail 2, and a scraper 3, the lower edge of the scraper 3 maintains the same distance from the bottom plate 11 of the receiving groove 1 during its movement along the slide rail 2. This ensures the scraped adhesive surface is flush, facilitating manual die loading and control of the amount of adhesive applied per application. It also makes it easier to control the amount of adhesive overflow after die loading, preventing excessive or insufficient adhesive application. This lowers the barrier to entry for manual die loading, allowing the PCB board to achieve maximum thermal and electrical conductivity and avoiding excessive performance differences between different PCB boards. It also facilitates adjustment of the adhesive application amount, reducing the possibility of adhesive voids and excessive adhesive overflow onto the chip surface, thus improving PCB board performance. Embedding the clip 32 into the groove increases the stability of the scraper 3, preventing it from tilting or wobbling during application and ensuring a consistent glue application rate. Setting the length of the clip 32 to be greater than the thickness of the scraper 3 further prevents wobbling and increases stability. The clearance fit reduces friction between the clip 32 and the groove, making the process of smoothing the glue application smoother. The curved surface in contact with the glue ensures a flatter surface.

[0040] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Under the concept of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this utility model as described above. For the sake of brevity, they are not provided in detail. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A manual dispensing fixture for substrate loading, characterized in that, include: The receiving groove includes a base plate and four side walls, the base plate and the side walls forming an open receiving space for holding glue; The slide rail includes a first track and a second track, which are horizontally arranged on the side walls that are parallel to each other. The slide rail is higher than the height of the adhesive. The first track is provided with a first groove and the second track is provided with a second groove. The scraper includes a plate body and two clips. A first clip and a second clip are provided on both sides of the plate body. The first clip and the second clip are perpendicular to the plate body. The first clip is embedded in the first sliding groove, and the second clip is embedded in the second sliding groove. The plate body is vertically arranged and can slide freely on the slide rail while always remaining perpendicular to the slide rail. The lower edge of the scraper maintains the same distance from the base plate and is higher than the upper surface of the adhesive. The upper edge of the scraper extends out of the receiving space.

2. The manual dispensing fixture according to claim 1, characterized in that, The inner diameter of the slide rail is larger than the diameter of the opening, and the clip is movably embedded in the slide rail.

3. The manual dispensing fixture according to claim 1, characterized in that, The length of the card head is greater than the thickness of the plate body.

4. The manual dispensing fixture according to claim 1, characterized in that, The card head is fitted with the first and second sliding grooves with clearance.

5. A manual dispensing fixture according to claim 1, characterized in that, The bottom of the scraper is curved.

6. The manual dispensing fixture according to claim 1, characterized in that, The scraper is an alloy scraper or a plastic scraper.

Images