IC loading handler

Abstract

The utility model discloses an IC loading sorting machine, including frame and trolley and two loading sorting combined equipment, the frame is equipped with the upper disc area, lower disc area, the upper board area, is equipped with the sorting area in the middle part, and the trolley is set between the upper board area and the sorting area, loading sorting combined equipment, upper disc area and lower disc area are respectively symmetrically set on the opposite sides of sorting area, loading sorting combined equipment includes tray conveying device, transfer conveying device, IC transfer manipulator and IC transfer manipulator, tray conveying device is connected between the upper disc area and lower disc area of same side, and transfer conveying device is equipped with first transfer position and second transfer position, IC transfer manipulator is set between tray conveying device and first transfer position, and transfer conveying device is set between sorting area and tray conveying device, and IC transfer manipulator is set between second transfer position and sorting area, the utility model has the advantages of high degree of automation, saves production space, improves production efficiency, and reduces production cost.

Description

Technical Field

[0001] This utility model relates to a semiconductor sorting machine, and more particularly to an IC loading and sorting machine. Background Technology

[0002] In semiconductor manufacturing, chips or ICs require testing during production. After testing, they need to be classified based on the results. Classification can be done in various ways, such as by performance or quality. Therefore, timely sorting of chips or ICs is necessary to inform subsequent production. However, in current technology, chip or IC testing often requires manual assistance. For example, workers need to place the chip or IC into a testing machine for testing, and then remove it and place new chips or ICs for testing. After testing, workers also need to manually classify the chips or ICs based on the measurement results. Therefore, this existing method has low automation, requires multiple independent machines, has large equipment size, occupies a significant amount of production space, and results in high worker workload and low production efficiency, making it unsuitable for mass production. Utility Model Content

[0003] The purpose of this invention is to provide an IC loading and sorting machine that is highly automated, saves production space, improves production efficiency, and reduces production costs.

[0004] To achieve the above objectives, the IC loading and sorting machine provided by this utility model includes a frame, a trolley mounted on the frame, and two loading and sorting combination devices. The frame has an upper tray area, a lower tray area, and an upper plate area, with a sorting area in the middle. The trolley is positioned between the upper plate area and the sorting area to transfer test plates. The loading and sorting combination devices, the upper tray area, and the lower tray area are symmetrically arranged on opposite sides of the sorting area. The loading and sorting combination devices include a pallet conveying device, a transfer conveying device, an IC transfer robot, and an IC transfer robot. The pallet conveying device is connected to the upper tray area and the lower tray area on the same side. The system is configured to transport a pallet for loading ICs between the upper and lower pallet areas; the transfer conveyor is provided with a first transfer position and a second transfer position; the IC transfer robot is disposed between the pallet conveyor and the first transfer position to transfer the ICs between the latter two; the transfer conveyor is disposed between the sorting area and the pallet conveyor, and moves the fixture of the transfer conveyor between the first transfer position and the second transfer position; the IC transfer robot is disposed between the second transfer position and the sorting area to transfer the ICs between the test plates on the second transfer position and the sorting area.

[0005] Compared with existing technologies, this invention symmetrically arranges pallet conveying devices, transfer conveying devices, IC transfer robots, and IC transfer robots on both sides of the sorting area, connecting the pallet conveying devices between the upper and lower tray areas on the same side. This allows the ICs to be loaded from the pallets to the transfer positions using the pallet conveying and transfer conveying devices. Furthermore, by setting up trolleys on the sorting area, these trolleys are movably positioned between the upper tray area and the sorting area, allowing test boards to be loaded onto the sorting area. The IC transfer robot then transfers the ICs between the pallets and the test boards. Therefore, this invention can utilize the aforementioned devices for IC loading, unloading, and synchronous loading and unloading production, suitable for different production modes, greatly satisfying various production requirements, demonstrating strong applicability, and the entire process is fully automated, requiring no manual operation and resulting in extremely high production efficiency. In addition, due to the rational arrangement of the various devices, the overall structure of the machine is very compact, small in size, and occupies little production space, thus significantly saving on labor, equipment, and production space rental costs.

[0006] Preferably, the IC loading and sorting machine further includes a pallet transfer device, which is disposed between the two lower pallet areas to unload pallets delivered to the lower pallet areas by the pallet conveyor or to transport pallets from one pallet conveyor to the other. By providing the pallet transfer device, pallets from one pallet conveyor can be quickly transferred to the other, thereby fully utilizing empty pallets on the equipment and improving pallet turnover rate. Therefore, ICs can be loaded onto one pallet transfer device while unloaded onto the other, achieving a synchronous IC loading and unloading mode, greatly improving production efficiency.

[0007] Preferably, the IC loading and sorting machine further includes a board feeding device and a material cart. The material cart is used to load the test boards, and the board feeding device is located in the loading area and connected to the material cart to transfer test boards from the material cart to the trolley or vice versa. By setting up the board feeding device and the material cart, the material cart can load a large number of test boards at once, achieving the purpose of stable material supply for a long time. The board feeding device can take test boards from the material cart and transport them to the trolley, achieving the purpose of automatic test board loading. Therefore, automatic test board loading is realized, effectively improving the loading efficiency.

[0008] Preferably, the IC loading and sorting machine further includes an NG pallet transfer device and an IC sorting robot located between the two pallet conveying devices and symmetrically arranged on opposite sides of the trolley. The transfer conveying device has a third transfer position, and the IC sorting robot is positioned between one end of the NG pallet transfer device and the third transfer position to transfer ICs from the third transfer position to the tray of the NG pallet transfer device. By setting up the third transfer position and the NG pallet transfer device, the IC sorting robot transfers ICs of different grades obtained after testing on the trolley, thereby sorting or classifying the tested ICs. This allows for automatic grading of ICs, eliminating the need for manual sorting, greatly improving production efficiency, and providing accurate information for subsequent IC reprocessing, ensuring the quality of the finished IC products.

[0009] Specifically, the IC loading and sorting machine also includes several tray collection devices, which are located at one end of the NG tray transfer device to collect the trays on the NG tray transfer device. By setting up the tray collection devices, the IC sorting robot can allocate different types of ICs to different tray collection devices for collection. Therefore, different types of ICs can be sorted to facilitate subsequent collection and centralized processing of ICs of the same type.

[0010] Specifically, the IC loading and sorting machine also includes a tray bin and a tray transfer robot. The tray bin is located on one side of the tray collecting device, and the tray transfer robot is located between the tray bin and the tray collecting device to facilitate the transfer of trays between the two. By incorporating the tray bin and the tray transfer robot, empty trays can be automatically fed to the tray collecting device, thereby achieving fully automated sorting and collection of ICs, greatly improving the automation level of the equipment and increasing production efficiency.

[0011] Preferably, the IC loading and sorting machine further includes a socket opening device, which is disposed above the sorting area to open the sockets on the test board used for connecting ICs. Since each socket on the test board needs to have its opening opened before the IC can be inserted, the socket opening device allows the opening to be automatic, facilitating the placement of ICs onto the test board of the trolley without manual operation, further improving automation.

[0012] Preferably, the trolley includes a transfer device, a trolley assembly, and a prediction device. The transfer device is located on the side of the trolley assembly near the upper plate area, and the prediction device is located on the other end of the trolley assembly away from the transfer device. The transfer device, the trolley assembly, and the prediction device each have an upper conveying mechanism and a lower conveying mechanism. The upper conveying mechanisms of the transfer device, the trolley assembly, and the prediction device form an upper conveying channel to transport the test plate from the transfer device to the trolley assembly and the prediction device. A lower conveying channel is formed between the lower conveying mechanisms of the transfer device, the trolley assembly, and the prediction device to transport the test plate from the prediction device to the trolley assembly and the transfer device. By incorporating a transfer device, a trolley device, and a prediction device on a trolley, forming an upper and lower conveyor structure, the transfer device automatically transports test boards to the trolley device or the prediction device. The trolley device receives ICs from a tray, transferring a large number of ICs to the test boards for subsequent processing, achieving automatic board loading and unloading, significantly improving automation. Furthermore, the trolley device can automatically transport the test boards to the prediction device, which performs batch pre-testing on the ICs, preparing them for the next step of IC sorting, improving the accuracy of IC sorting, and achieving the goal of IC sorting, thus making it suitable for different production modes.

[0013] Specifically, the transfer device includes a first base, an upper pushing mechanism, a lower pulling mechanism, an upper conveying mechanism, and a lower conveying mechanism. The upper and lower conveying mechanisms of the transfer device are mounted on the first base and arranged vertically. The upper pushing mechanism is mounted on the first base and pushes the test board located on the upper conveying mechanism of the transfer device to the upper conveying mechanism of the trolley device. The lower pulling mechanism is mounted on the first base and pulls the test board located on the lower conveying mechanism of the trolley device to the lower conveying mechanism of the transfer device. The upper pushing mechanism allows the test board to move from the upper conveying mechanism of the transfer device to the upper conveying mechanism of the trolley device, achieving automatic loading of the test board. The lower pulling mechanism allows the test board to move from the lower conveying mechanism of the trolley device to the lower conveying mechanism of the transfer device, achieving automatic unloading of the test board.

[0014] Specifically, the trolley device includes a second base, an X-axis drive mechanism, a Y-axis drive mechanism, a second support seat, a second lifting mechanism, a second clearance cylinder, an upper conveying mechanism, and a lower conveying mechanism. The X-axis drive mechanism is disposed on the second base to drive the test plate to move along the X direction. The Y-axis drive mechanism is disposed at the output end of the X-axis drive mechanism to drive the test plate to move along the Y direction. The second support seat is disposed at the output end of the Y-axis drive mechanism. The upper conveying mechanism and the lower conveying mechanism of the trolley device are disposed on the second support seat and arranged vertically. The second lifting mechanism is disposed on the surface of the second support seat to drive the test plate to rise and fall. The second clearance cylinder is disposed on the second support seat and drives the upper conveying mechanism of the trolley device to clear the test plate when it descends. By setting up X-axis and Y-axis drive mechanisms, the trolley device can adjust its position on the test board in a horizontal direction, thereby enabling it to automatically dock with the transfer device, prediction device, and IC transfer robot, playing a transfer and connection role and ensuring the stable and smooth flow of the test board and IC.

[0015] Specifically, the trolley device further includes a rotary drive mechanism, which is disposed between the Y-axis drive mechanism and the second support base to drive the second support base to rotate in the horizontal direction. By providing the rotary drive mechanism, the test board can be adapted to different IC placement orientations, improving the adaptability of the equipment.

[0016] Specifically, the trolley device further includes a front limiting cylinder and a rear limiting cylinder. The rear limiting cylinder is mounted on the second support seat and located at the end of the upper conveying mechanism of the trolley device away from the transfer device, driving its output end to extend or retract to block or release the test board. The front limiting cylinder is mounted on the lifting platform of the second lifting mechanism near the transfer device. The output ends of the front and rear limiting cylinders together restrict the lateral position of the test board. Using the front and rear limiting cylinders, the test board can be accurately placed on the trolley device, allowing the IC transfer robot to precisely align the IC with the corresponding socket on the test board, greatly improving the accuracy and efficiency of IC placement.

[0017] Specifically, the trolley device further includes side-push cylinders, which are respectively disposed on both sides of the second support seat. The output ends of the two side-push cylinders extend out and can jointly limit the longitudinal position of the test board. The side-push cylinders further ensure the positional accuracy of the test board on the trolley device, thereby ensuring the accuracy of IC board mounting.

[0018] Specifically, the prediction device includes a third base, a third lifting mechanism, a push-pull mechanism, a third avoidance cylinder, an upper conveying mechanism, a lower conveying mechanism, and a testing device. The testing device is located at the end of the upper conveying mechanism of the prediction device away from the trolley, to connect with and test the test plate. The upper and lower conveying mechanisms of the prediction device are mounted on the third base and arranged vertically. The third lifting mechanism is mounted on the third base and its output end is connected to the push-pull mechanism to drive the push-pull mechanism and the test plate to rise and fall. The push-pull mechanism drives the test plate to move along the upper conveying mechanism of the prediction device to connect the test plate with the testing device, or drives the test plate away from the testing device and moves along the conveying direction of the lower conveying mechanism of the prediction device. The third avoidance cylinder is mounted on the third base and drives the upper conveying mechanism of the prediction device to avoid the test plate when it descends. The third lifting mechanism allows the test board to move from the upper conveying mechanism to the lower conveying mechanism, while the push-pull mechanism allows the test board to enter the upper conveying mechanism, be inserted into the testing device, or leave the prediction device from the lower conveying mechanism. This achieves automatic connection, automatic measurement, and automatic departure of the test board without the need for manual operation, resulting in extremely high efficiency. Attached Figure Description

[0019] Figure 1 This is a perspective view of the IC loading and sorting machine of this utility model.

[0020] Figure 2 This is a top view of the IC loading and sorting machine of this utility model.

[0021] Figure 3 This is a structural schematic diagram of the IC loading and sorting machine of this utility model.

[0022] Figure 4 This is a structural diagram of the transfer conveying device of the IC loading and sorting machine of this utility model.

[0023] Figure 5 This is a structural diagram of the trolley of the IC loading and sorting machine of this utility model.

[0024] Figure 6 This is a top view of the trolley of the IC loading and sorting machine of this utility model.

[0025] Figure 7 This is a structural diagram of the transfer device of the IC loading and sorting machine of this utility model.

[0026] Figure 8 This is a right view of the transfer device of the IC loading and sorting machine of this utility model.

[0027] Figure 9 This is a structural diagram of the trolley device of the IC loading and sorting machine of this utility model.

[0028] Figure 10 This is a right view of the trolley device of the IC loading and sorting machine of this utility model.

[0029] Figure 11 This is an exploded view of the trolley device of the IC loading and sorting machine of this utility model.

[0030] Figure 12 This is a structural diagram of the predictive device of the IC loading and sorting machine of this utility model.

[0031] Figure 13 This is a right view of the predictive device of the IC loading and sorting machine of this utility model.

[0032] Figure 14 This is a flow diagram of the loading plate mode of the IC loading and sorting machine of this utility model.

[0033] Figure 15 This is a flow diagram of the unloading mode of the IC loading and sorting machine of this utility model.

[0034] Figure 16 This is a flow diagram of the synchronous loading and unloading mode of the IC loading and sorting machine of this utility model. Detailed Implementation

[0035] To explain in detail the technical content, structural features, objectives and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0036] like Figures 1 to 4As shown, this utility model discloses an IC loading and sorting machine 100, which is used to load ICs from a tray onto a test board, or load ICs from a test board onto a tray, or sort ICs from a test board and load them onto a material tray. The test board is an aging test board used for batch aging tests on multiple ICs. The tray is used for batch loading ICs to facilitate IC transfer. The material tray is used to load sorted ICs of the same type to facilitate IC transfer. The IC loading and sorting machine 100 includes a frame 1, a trolley 2 mounted on the frame 1, and two sets of loading and sorting combination devices 3. The frame 1 is divided into an upper layer 1a and a lower layer 1b. The two sets of loading and sorting combination devices 3 are mounted on the upper layer 1a, and the trolley 2 is mounted on the lower layer 1b. The frame 1 has upper tray areas 11 at its front left and right ends, lower tray areas 12 at its rear left and right ends, an upper plate area 13 at the rear right side, and a sorting area 14 in the middle. A trolley 2 is positioned between the upper plate area 13 and the sorting area 14 to transfer test plates. When loading a test plate, the trolley 2 is located in the upper plate area 13 and loads the test plate; when loading an IC, the trolley 2 drives the test plate to the sorting area 14. The loading and sorting assembly 3, the upper tray area 11, and the lower tray area 12 are symmetrically arranged on opposite sides of the sorting area 14. Both loading and sorting combination devices 3 have the same structure. Taking one of the loading and sorting combination devices 3 as an example, it includes a pallet conveying device 4, a transfer conveying device 5, an IC transfer robot 6, and an IC transfer robot 7. The pallet conveying device 4 is distributed on the left and right sides of the frame 1 and connected between the upper pallet area 11 and the lower pallet area 12 on the same side to convey pallets for loading ICs between the upper pallet area 11 and the lower pallet area 12. The transfer conveying device 5 is located on the side of the pallet conveying device 4 close to the sorting area 14. The conveying direction of the transfer conveying device 5 is parallel to the conveying direction of the pallet conveying device 4. The transfer conveying device 5 has a first transfer position 51 and a second transfer position 52. Specifically, the transfer conveying device 5 is provided with a fixture for positioning the IC. The fixture is movably located on the first transfer position 51 or the second transfer position 52 to receive the IC. The IC transfer robot 6 is positioned transversely between the pallet conveyor 4 and the first transfer position 51 in a left-right direction to transfer ICs between the two. The transfer conveyor 5 is positioned between the sorting area 14 and the pallet conveyor 4, and moves the fixture between the first transfer position 51 and the second transfer position 52. The IC transfer robot 7 is positioned between the second transfer position 52 and the sorting area 14 to transfer ICs between the second transfer position 52 and the test plate on the trolley 2 located in the sorting area 14.

[0037] For example Figure 3As shown, the IC loading and sorting machine 100 also includes a socket opening device 8, which is located on the upper layer of the frame 1 and above the sorting area 14, to open the sockets on the test board used for connecting ICs. Since each socket on the test board needs to have its opening opened before the IC can be inserted, the socket opening device 8 allows the sockets to open automatically, facilitating the placement of ICs onto the test board of the trolley 2 without manual operation, further improving automation.

[0038] Please see again Figures 1 to 3 The IC loading and sorting machine 100 also includes a pallet transfer device 9. The pallet transfer device 9 is located on the upper rear side of the frame 1 and connected between the two lower pallet areas 12. It is used to unload pallets delivered to the lower pallet area 12 by the pallet conveyor 4 or to transport pallets from one pallet conveyor 4 to the other. The pallet transfer device 9 can be a conveyor chain or a robotic arm, etc. By setting up the pallet transfer device 9, pallets from one pallet conveyor 4 can be quickly transferred to the other pallet conveyor 4, thereby making full use of empty pallets running on the equipment and improving pallet turnover rate. Therefore, ICs can be loaded onto one pallet conveyor 4 while unloaded onto the other, achieving a synchronous IC loading and unloading mode, greatly improving production efficiency.

[0039] Please see again Figures 1 to 3 The IC loading and sorting machine 100 also includes a board feeding device 10 and a material cart 110. The material cart 110 is used to load the test boards. The board feeding device 10 is located in the upper board area 13 and connected to the material cart 110 to transfer the test boards on the material cart 110 to the trolley 2 or to transfer the test boards on the trolley 2 to the material cart 110. By setting up the board feeding device 10 and the material cart 110, the material cart 110 can load a large number of test boards at once, achieving the purpose of stable material supply for a long time. The board feeding device 10 can take out the test boards from the material cart 110 and transport them to the trolley 2, achieving the purpose of automatic test board loading. Therefore, automatic test board loading is realized, effectively improving the board loading efficiency.

[0040] Please refer to the following: Figures 1 to 3The IC loading and sorting machine 100 also includes an NG pallet transfer device 120 and an IC sorting robot 130 located between the two pallet conveying devices 4 and symmetrically arranged on opposite sides of the trolley 2. There are multiple NG pallet transfer devices 120, each used to convey different types of IC trays. The conveying direction of the NG pallet transfer devices 120 is parallel to the conveying direction of the transfer conveying device 5. The NG pallet transfer devices 120 and the IC sorting robot 130 are located on the upper layer of the frame 1. The transfer conveying device 5 has a third transfer position 53, located on the side of the first transfer position 51 away from the second transfer position 52. The IC sorting robot 130 is positioned between one end of the NG pallet transfer device 120 and the third transfer position 53 to transfer the ICs on the third transfer position 53 to the trays of one of the NG pallet transfer devices 120. By setting up a third transfer station 53 and an NG tray transfer device 120, the IC sorting robot 130 transfers ICs of different grades obtained after testing on the trolley 2, thereby sorting or classifying the tested ICs. This allows for automatic grading of ICs without the need for manual sorting, greatly improving production efficiency and providing accurate information for subsequent IC reprocessing, ensuring the quality of finished IC products.

[0041] Please see again Figures 1 to 3 The IC loading and sorting machine 100 also includes several tray collecting devices 140, tray bins 150, and tray transfer robots 160. In this embodiment, there are multiple tray collecting devices 140, arranged in a left-right configuration. Each tray collecting device 140 is located at one end of the NG tray transfer device 120 and on the upper front side of the frame 1, to collect trays from the NG tray transfer device 120. By using the tray collecting devices 140, the IC sorting robot 130 can distribute different types of ICs to different tray collecting devices 140 for collection. This allows for the sorting of different types of ICs, facilitating subsequent collection and centralized processing of ICs of the same type. The tray bins 150 are located on one side of the tray collecting devices 140, and the tray transfer robot 160 is located between the tray bins 150 and the tray collecting devices 140, enabling the transfer of trays between the latter two. By setting up a material tray hopper 150 and a material tray transfer robot 160, empty material trays can be automatically transported to the material tray collection device 140, thereby achieving the purpose of fully automatic sorting and collection of ICs, greatly improving the automation level of the equipment and increasing production efficiency.

[0042] Please see Figures 5 to 6The trolley 2 includes a transfer device 21, a trolley device 22, and a prediction device 23. The transfer device 21 is located on the side of the trolley device 22 near the upper plate area 13 to connect with the plate supply device 10. The prediction device 23 is located at the other end of the trolley device 22 away from the transfer device 21. The transfer device 21, the trolley device 22, and the prediction device 23 are arranged sequentially from right to left, and each has an upper conveying mechanism and a lower conveying mechanism. The upper conveying mechanisms of the transfer device 21, the trolley device 22, and the prediction device 23 form the upper conveying channel of the trolley 2 to deliver the test plate from the upper plate area 13 to the transfer device 21, the trolley device 22, or the prediction device 23. The lower conveying mechanism of the transfer device 21, the trolley device 22, and the prediction device 23 forms a lower conveying channel for the trolley 2, so as to send the test board from the prediction device 23 to the trolley device 22, the transfer device 21, and the upper board area 13. By setting the transfer device 21, the trolley device 22, and the prediction device 23 on the trolley 2, and making the three form an upper and lower conveying structure, the upper conveying channel is used to input the test board into the trolley 2, and the lower conveying channel is used to output the test board from the trolley 2. Therefore, the transfer device 21 can automatically convey the test board to the trolley device 22 or the prediction device 23, and the trolley device 22 can receive ICs from the tray, thereby transferring a large number of ICs to the test board for subsequent IC processing, realizing automatic board loading and unloading, and greatly improving automation. Furthermore, the trolley device 22 can automatically transport test boards to the prediction device 23. The prediction device 23 can perform batch pre-testing on ICs using the test boards, thereby preparing for the next step of IC sorting, improving the accuracy of IC sorting, achieving the purpose of IC sorting, and thus being applicable to different production modes. Specifically, as follows: Please see Figure 7 and Figure 8The transfer device 21 includes a first base 213, an upper pushing mechanism 214, a lower pulling mechanism 215, an upper conveying mechanism 211, and a lower conveying mechanism 212. The upper conveying mechanism 211 and the lower conveying mechanism 212 are disposed on the first base 213 and arranged vertically. The upper conveying mechanism 211 and the lower conveying mechanism 212 are composed of multiple arranged rollers, which are disposed on opposite sides of the first base 213, and the test plate is supported on the rollers on both sides. The upper pushing mechanism 214 pushes the test plate located on the upper conveying mechanism 211 to the upper conveying mechanism 221 of the trolley device 22. The lower pulling mechanism 215 is disposed in the middle of the first base 213 and pulls the test plate located on the lower conveying mechanism 222 of the trolley device 22 to the lower conveying mechanism 212 of the transfer device 21. The upper-level pushing mechanism 214 allows the test board to move from the upper conveying mechanism 211 of the transfer device 21 to the upper conveying mechanism 221 of the trolley device 22, achieving automatic loading of the test board. The lower-level pulling mechanism 215 allows the test board to move from the lower conveying mechanism 222 of the trolley device 22 to the lower conveying mechanism 212 of the transfer device 21, achieving automatic unloading of the test board. The upper-level pushing mechanism 214 uses a motor-driven belt to move a pushing plate, thus pushing the test board forward. The lower-level pushing mechanism can also use a motor-driven belt or chain to move a hook, thus hooking the test board and moving it.

[0043] Please see Figures 9 to 11The trolley device 22 includes a second base 223, an X-axis drive mechanism 224, a Y-axis drive mechanism 225, a second support seat 226, a second lifting mechanism 227, a second clearance cylinder 228, an upper conveying mechanism 221, and a lower conveying mechanism 222. The X-axis refers to the left and right directions of the frame 1, and the Y-axis refers to the front and rear directions of the frame 1. The X-axis drive mechanism 224 is disposed on the second base 223 to drive the test plate to move along the X-axis. The Y-axis drive mechanism 225 is disposed at the output end of the X-axis drive mechanism 224 to drive the test plate to move along the Y-axis. The second support seat 226 is disposed at the output end of the Y-axis drive mechanism 225; the upper conveying mechanism 221 and the lower conveying mechanism 222 are disposed on the second support seat 226 and arranged vertically. The upper conveying mechanism 221 and lower conveying mechanism 222 of the trolley device 22 have the same structure as the upper conveying mechanism 211 and lower conveying mechanism 212 of the transfer device 21. The second lifting mechanism 227 is disposed on the surface of the second support seat 226 to drive the test board to rise and fall; the second avoidance cylinder 228 is disposed on the second support seat 226 and drives the upper conveying mechanism 221 to avoid the test board when it descends. By setting the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, the trolley device 22 can adjust its position on the test board in a horizontal direction, so that it can automatically dock with the transfer device 21, the prediction device 23 and the IC transfer robot 7, playing a role in transfer and connection, and ensuring the stable and smooth flow of the test board and IC. Specifically, the trolley device 22 also includes a rotary drive mechanism 229, which is disposed between the Y-axis drive mechanism 225 and the second support seat 226 to drive the second support seat 226 to rotate in the horizontal direction. By setting up the rotary drive mechanism 229, the test board can be adapted to different IC placement orientations, improving the adaptability of the equipment. The X-axis drive mechanism 224 and the Y-axis drive mechanism 225 are implemented by a servo motor driving a lead screw nut, and the rotary drive mechanism 229 is rotated by a motor 2291 driving a drive gear 2292, which in turn drives a driven gear 2293. The trolley device 22 further includes a front limiting cylinder 2210, a rear limiting cylinder 2220, and a side pushing cylinder 2230. The rear limiting cylinder 2220 is mounted on the second support seat 226 and is located at the end of the upper conveying mechanism 221 of the trolley device 22 away from the transfer device 21, and drives the output end to extend and retract to block or release the test board. The front limiting cylinder 2210 is mounted on the lifting platform of the second lifting mechanism 227 near the transfer device 21. The output end of the front limiting cylinder 2210 and the output end of the rear limiting cylinder 2220 together restrict the lateral position of the test board.By utilizing the front limiting cylinder 2210 and the rear limiting cylinder 2220, the test board can be accurately placed on the trolley device 22, thereby enabling the IC transfer robot 7 to precisely align the IC with the corresponding socket on the test board, greatly improving the accuracy and efficiency of IC loading. The side-push cylinders 2230 are respectively disposed on both sides of the second support 226, and the extended output ends of the two side-push cylinders 2230 together restrict the longitudinal position of the test board. The side-push cylinders 2230 further ensure the positional accuracy of the test board on the trolley device 22, thus ensuring the accuracy of IC loading. Furthermore, the trolley device 22 also includes a pressing cylinder 2240, which is respectively disposed on opposite sides of the second support 226. When the lifting platform of the second lifting mechanism 227 lifts the test board, the extended end of the second pressing cylinder drives the pressing block on its extended end to position the test board on the lifting platform.

[0044] Please see Figure 12 and Figure 13The prediction device 23 includes a third base 233, a third lifting mechanism 234, a push-pull mechanism 235, a third avoidance cylinder 236, an upper conveying mechanism 231, a lower conveying mechanism 232, and a testing device 237. The testing device 237 is located at the end of the upper conveying mechanism 231 away from the trolley 2 to connect with the test plate and test the test plate. The upper conveying mechanism 231 and the lower conveying mechanism 232 are located on the third base 233 and are arranged vertically. The structure of the upper conveying mechanism 231 and the lower conveying mechanism 232 of the prediction device 23 is the same as the structure of the upper conveying mechanism 211 and the lower conveying mechanism 212 of the transfer device 21. The third lifting mechanism 234 is located in the middle of the third base 233 and its output end is connected to the push-pull mechanism 235 to drive the push-pull mechanism 235 and the test plate to rise and fall. The push-pull mechanism 235 drives the test plate to move along the upper conveying mechanism 231 to connect the test plate to the testing device 237, or drives the test plate away from the testing device 237 and moves along the conveying direction of the lower conveying mechanism 232. The push-pull mechanism 235 is implemented by a motor driving a belt, which drives a hook, and the hook drives the test plate to move. The third clearance cylinder 236 is located on the third base 233 and drives the upper conveying mechanism 231 to clear the test plate when it descends, so that the test plate can smoothly descend to the lower conveying mechanism 232. The third lifting mechanism 234 allows the test board to move from the upper conveying mechanism 231 to the lower conveying mechanism 232. The push-pull mechanism allows the test board to enter the upper conveying mechanism 231, be inserted into the test device 237, or leave the prediction device 23 from the lower conveying mechanism 232. This achieves automatic connection, automatic measurement, and automatic departure of the test board without the need for manual transfer, resulting in extremely high efficiency.

[0045] In summary and in conjunction with the above figures, Figure 2 and Figure 3 The working principle of this utility model is described in detail below: The IC loading and sorting machine 100 of this utility model can operate in multiple modes, such as loading mode, unloading mode, and synchronous loading and unloading mode. In loading mode, empty test boards are loaded onto the trolley device 22 of the sorting area 14, while simultaneously loading trays filled with ICs onto both sides of the sorting area 14. Then, the ICs on the trays are transferred to the test boards, and finally, the fully loaded test boards and empty trays are unloaded. In unloading mode, test boards filled with ICs are loaded onto the trolley device 22 of the sorting area 14, while simultaneously loading empty trays. Then, the ICs on the test boards are transferred to the trays, and finally, the empty test boards and fully loaded trays are unloaded. The synchronous loading and unloading mode involves loading a fully loaded test board onto the trolley device 22 in sorting area 14, simultaneously loading a fully loaded pallet on one side of sorting area 14 and loading an empty pallet on the other side. Then, ICs from the test board are transferred to the empty pallet on the other side of sorting area 14, and ICs from the fully loaded pallet on one side of sorting area 14 are transferred to empty positions on the test board. Finally, the reloaded test board, the reloaded pallet, and the empty pallet are unloaded. More detailed steps are as follows: Combination Figure 14As shown, when operating in the upper pallet mode, the loading and sorting combination devices 3 on the left and right sides operate simultaneously with the same actions. Taking one side of the loading and sorting combination device 3 as an example, firstly, the pallet conveying device 4 transports a pallet fully loaded with ICs from one end of the upper pallet area 11 to the central suction position. After the IC transfer robot 6 picks up the ICs, it places them on the fixture at the first transfer position 51 of the transfer conveying device 5. Then, the transfer conveying device 5 moves the fixture containing the ICs to the second transfer position 52. At the same time, the plate feeding device 10 hooks out an empty test plate from the material cart 110 and pushes the test plate onto the upper conveying mechanism 211 of the transfer device 21. At this time, the trolley device 22 on the trolley 2, driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, approaches the transfer device 21, so that the upper conveying mechanism 221 and the lower conveying mechanism 222 of the trolley device 22 are correspondingly connected to the upper conveying mechanism 211 and the lower conveying mechanism 212 on the transfer device 21. Then, the upper pushing mechanism 214 on the transfer device 21 pushes the test plate onto the upper conveying mechanism 221 of the trolley device 22. The X-axis drive mechanism 224 and the Y-axis drive mechanism 225 drive the second support seat 226 to move directly below the socket opening device 8 in the sorting area 14. The front limiting cylinder 2210 and the rear limiting cylinder 2220 on the trolley 2 conveying device limit the test plate in the X-axis direction. Then, the second lifting mechanism 227 lifts the test board, while the side-push cylinder 2230 positions the test board in the Y direction. Finally, the pressing cylinder 2240 presses and positions the test board. At this time, the output end of the socket opening device 8 moves downward towards the test board and opens the socket on the test board. Next, the IC transfer robot 7 picks up and transfers the IC from the second transfer position 52 and places it on the socket of the test board on the trolley device 22. Afterward, the socket opening device 8 moves away from the test board, thus fixing the IC in the socket of the test board. When the test board on the trolley device 22 is full of ICs, the front limit cylinder 2210, rear limit cylinder 2220, side push cylinder 2230, and pressing cylinder 2240 actuate to release the test board. Simultaneously, the second avoidance cylinder 228 drives the rollers of the upper conveying mechanism 221 to retract, avoiding the test board. At this time, the second lifting mechanism 227 lowers the test board onto the rollers of the lower conveying mechanism 222. Driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, the trolley device 22 approaches the transfer device 21 again and docks with it.Subsequently, the lower-level material pulling mechanism 215 on the transfer device 21 pulls the test board from the lower-level conveying mechanism 222 of the trolley device 22 to the lower-level conveying mechanism 212 of the transfer device 21. Then, the lower-level material pulling mechanism 215 pushes the test board onto the board feeding device 10, and the board feeding device 10 pushes the fully loaded test board onto the material cart 110. In addition, after the pallet feeding on the pallet conveying device 4 is completed, the pallet conveying device 4 transports the empty pallet to the lower pallet area 12 for unloading.

[0046] Combination Figure 15As shown, when operating in unloading mode, the loading and sorting combination devices 3 on both the left and right sides operate simultaneously with the same actions. Taking one side of the loading and sorting combination device 3 as an example: First, the pallet conveying device 4 transports an empty pallet from one end of the lower pallet area 12 to the middle. At the same time, the pallet feeding device 10 hooks a fully loaded test pallet from the material cart 110 and pushes the test pallet onto the upper conveying mechanism 211 of the transfer device 21. At this time, the trolley device 22, driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, approaches the transfer device 21, so that the upper conveying mechanism 221 and the lower conveying mechanism 222 of the trolley device 22 are correspondingly connected to the upper conveying mechanism 211 and the lower conveying mechanism 212 of the transfer device 21. Then, the upper pushing mechanism 214 on the transfer device 21 pushes the test pallet onto the upper conveying mechanism 221 of the trolley device 22. The X-axis drive mechanism 224 and Y-axis drive mechanism 225 drive the second carrier 226 to move directly below the socket opening device 8 in the sorting area 14. Then, the output end of the socket opening device 8 moves downwards towards the test board and opens the socket on the test board. Next, the IC transfer robot 7 picks up and transfers the IC from the socket on the test board on the trolley device 22 and places it on the fixture of the second transfer position 52 of the transfer conveying mechanism. Afterwards, the transfer conveying mechanism drives the fixture to the first transfer position 51 or the third transfer position 53 according to the test results. The IC transfer robot 7 picks up and transfers the IC from the first transfer position 51 and places it on the tray of the tray conveying device 4. The IC sorting robot 130 picks up the IC from the third transfer position 53 and places it on the corresponding tray of the tray collection device 140 according to the IC's test category. The tray collection device 140 transports the full tray to the tray bin 150 for unloading. Furthermore, when the pallet conveyor 4 is full of ICs, it transports the fully loaded pallet to the upper pallet area 11 for unloading. After all ICs have been removed from the test plate of the trolley device 22, the front limit cylinder 2210, rear limit cylinder 2220, side push cylinder 2230, and pressing cylinder 2240 actuate to release the test plate. Simultaneously, the second avoidance cylinder 228 drives the rollers of the upper conveying mechanism 221 to retract, avoiding the test plate. At this time, the second lifting mechanism 227 lowers the test plate onto the rollers of the lower conveying mechanism 222. Driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, the trolley device 22 approaches the transfer device 21 again and docks with it.Subsequently, the lower material pulling mechanism 215 on the transfer device 21 pulls the test board from the lower conveying mechanism 222 of the trolley device 22 to the lower conveying mechanism 212 of the transfer device 21. Then, the lower material pulling mechanism 215 pushes the test board onto the board feeding device 10, and the board feeding device 10 pushes the empty test board back to the material cart 110.

[0047] Combination Figure 16As shown, when operating in synchronous loading and unloading mode, the test board of ICs that has completed testing is transported to the trolley 2, and then the ICs are transferred to an empty IC tray provided by the loading and sorting combination device 3 on the left. Afterwards, the ICs to be tested on the loading and sorting combination device 3 on the right are transferred to an empty test board. Specifically, firstly, the board supply device 10 hooks out a test board full of tested ICs from the material cart 110 and pushes the test board onto the upper conveying mechanism 211 of the transfer device 21. At this time, the trolley device 22 on the trolley 2 approaches the transfer device 21 under the drive of the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, so that the upper conveying mechanism 221 and the lower conveying mechanism 222 of the trolley device 22 are correspondingly connected to the upper conveying mechanism 211 and the lower conveying mechanism 212 of the transfer device 21. Subsequently, the upper pushing mechanism 214 on the transfer device 21 pushes the test plate onto the upper conveying mechanism 221 of the trolley device 22. The X-axis drive mechanism 224 and the Y-axis drive mechanism 225 drive the second support seat 226 to move directly below the socket opening device 8 in the sorting area 14. The front limit cylinder 2210 and the rear limit cylinder 2220 on the trolley 2 conveying device limit the test plate in the X-axis. Then, the second lifting mechanism 227 lifts the test plate, while the side push cylinder 2230 positions the test plate in the Y-axis. Finally, the pressing cylinder 2240 presses and positions the test plate. At this time, the output end of the socket opening device 8 moves downward toward the test plate and opens the socket on the test plate. At the same time, the tray conveying device 4 on the left side conveys an empty tray from one end of the upper tray area 11 on that side to the central suction position. After the IC transfer robot 6 on the left picks up an IC, it places the IC onto the fixture at the first transfer position 51 of the transfer conveyor 5 on the left. Then, the transfer conveyor 5 on the left moves the fixture containing the IC to the second transfer position 52. Next, the IC transfer robot 7 on the left picks up and transfers the IC from the test board on the trolley device 22 and places it onto the fixture at the second transfer position 52. Once the fixture on the left transfer conveyor 5 is full of ICs, the left transfer conveyor 5 moves the fixture back to the first transfer position 51 or the third transfer position 53. The left IC transfer robot 7 picks up and transfers the IC from the first transfer position 51 and places it onto the tray of the left pallet conveyor 4. Alternatively, the left IC sorting robot 130 picks up the IC from the third transfer position 53 and places it onto the corresponding tray of the tray collection device 140 according to the IC's test category. The tray collection device 140 then transports the full tray to the tray bin 150 for unloading. In addition, when the left pallet conveyor 4 is full of ICs, the left pallet conveyor 4 will transport the full-loaded pallet to the upper pallet area 11 for unloading.Meanwhile, the right-side tray conveyor 4 transports a tray fully loaded with ICs to be tested from one end of the upper tray area 11 to the central suction position. The right-side IC transfer robot 6 picks up the ICs and places them onto the fixture at the first transfer position 51 of the right-side transfer conveyor 5. Then, the right-side transfer conveyor 5 moves the fixture containing the ICs to the second transfer position 52. Next, the right-side IC transfer robot 7 picks up and transfers the ICs from the second transfer position 52 and places them into the socket of an empty test board on the trolley device 22. Afterward, the socket opening device 8 moves away from the test board, securing the ICs in the test board's socket. When the test board on the trolley device 22 is full of ICs, the trolley device 22 moves and docks with the prediction device 23. The push-pull mechanism 235 on the prediction device 23 pulls the test board from the upper conveying mechanism 221 of the trolley device 22 onto the upper conveying mechanism 231 of the prediction device 23 and inserts the test board into the test device 237. The test device 237 tests the ICs on the test board. After the test is completed, the push-pull mechanism 235 pulls the test board out of the test device 237. Then, the third clearance cylinder 236 drives the rollers of the upper conveying mechanism 231 of the test device 237 to avoid the test board, and the third lifting mechanism 234 lowers the test board onto the lower conveying mechanism 232. Afterward, the push-pull mechanism 235 pushes the test board from the lower conveying mechanism 232 of the test device 237 to the lower conveying mechanism of the trolley device 22. Driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, the trolley device 22 approaches the transfer device 21 again and docks with it. Then, the lower-level material pulling mechanism 215 on the transfer device 21 pulls the test board from the lower-level conveying mechanism 222 of the trolley device 22 onto the lower-level conveying mechanism 212 of the transfer device 21. The lower-level material pulling mechanism 215 then pushes the test board onto the board feeding device 10, which pushes the fully loaded test board onto the material cart 110. Additionally, after the pallet feeding on the pallet conveying device 4 on the right side is completed, the pallet conveying device 4 transports the empty pallet to the lower pallet area 12 for unloading.

[0048] Compared with the prior art, this utility model symmetrically arranges a pallet conveyor 4, a transfer conveyor 5, an IC transfer robot 6, and an IC transfer robot 7 on both sides of the sorting area 14, connecting the pallet conveyor 4 between the upper and lower pallet areas 11 and 12 on the same side. This allows the pallet conveyor 4 and transfer conveyor 5 to load ICs from the pallet to the transfer position. Furthermore, by setting a trolley 2 on the sorting area 14, which is movably positioned between the upper plate area 13 and the sorting area 14, the trolley 2 loads test plates into the sorting area 14. The IC transfer robot 7 then allows the ICs to be transferred between the pallet and the test plate. Therefore, this utility model can utilize the above-mentioned devices for IC loading, unloading, and synchronous loading and unloading of ICs, suitable for different production modes, greatly satisfying various production requirements, with strong applicability. The entire process is fully automated, requiring no manual operation, resulting in extremely high production efficiency. Furthermore, due to the reasonable arrangement of each device, the overall structure of the machine is very compact, small in size, and occupies less production space, thus greatly saving the costs of labor, equipment, and production space rental.

[0049] The structures of the pallet conveying device 4, IC transfer robot 6, IC transfer robot 7, socket opening device 8, pallet transfer device 9, plate feeding device 10, material cart 110, NG pallet transfer device 120, IC sorting robot 130, material tray collecting device 140, material tray bin 150, and material tray transfer robot 160 involved in this utility model IC loading and sorting machine are not the focus of this patent, and their structures are well known to those skilled in the art, so they will not be described in detail here.

[0050] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. An IC loading and sorting machine, characterized in that: The system includes a frame, a trolley mounted on the frame, and two loading and sorting assembly units. The frame has an upper tray area, a lower tray area, and an upper plate area, with a sorting area in the middle. The trolley is positioned between the upper plate area and the sorting area to transfer test plates. The loading and sorting assembly units, the upper tray area, and the lower tray area are symmetrically arranged on opposite sides of the sorting area. The loading and sorting assembly units include a pallet conveyor, a transfer conveyor, an IC transfer robot, and an IC transfer robot. The pallet conveyor is connected between the upper tray area and the lower tray area on the same side to transfer test plates between the upper tray area and the lower tray area. The system transports trays for loading ICs between zones; the transfer conveyor is provided with a first transfer position and a second transfer position; the IC transfer robot is positioned between the tray conveyor and the first transfer position to transfer the ICs between the latter two; the transfer conveyor is positioned between the sorting zone and the tray conveyor, and moves the fixture of the transfer conveyor between the first transfer position and the second transfer position; the IC transfer robot is positioned between the second transfer position and the sorting zone to transfer the ICs between the test plates on the second transfer position and the sorting zone.

2. The IC loading and sorting machine as described in claim 1, characterized in that: The IC loading and sorting machine also includes a pallet transfer device, which is disposed between the two lower pallet areas to unload pallets delivered to the lower pallet areas by the pallet conveyor or to transport pallets from one pallet conveyor to the other pallet conveyor.

3. The IC loading and sorting machine as described in claim 1, characterized in that: The IC loading and sorting machine also includes a board feeding device and a material cart. The material cart is used to load the test boards. The board feeding device is located in the upper board area and connected to the material cart to transfer the test boards on the material cart to the trolley or to transfer the test boards on the trolley to the material cart.

4. The IC loading and sorting machine as described in claim 1, characterized in that: The IC loading and sorting machine also includes an NG pallet transfer device located between the two pallet conveying devices and symmetrically arranged on opposite sides of the trolley, and an IC sorting robot. The transfer conveying device is provided with a third transfer position. The IC sorting robot is arranged between one end of the NG pallet transfer device and the third transfer position to transfer the IC on the third transfer position to the pallet of the NG pallet transfer device.

5. The IC loading and sorting machine as described in claim 4, characterized in that: The IC loading and sorting machine also includes several tray collection devices, which are located at one end of the NG tray transfer device to collect the trays on the NG tray transfer device.

6. The IC loading and sorting machine as described in claim 5, characterized in that: The IC loading and sorting machine also includes a material tray bin and a material tray transfer robot. The material tray bin is located on one side of the material tray collecting device, and the material tray transfer robot is located between the material tray bin and the material tray collecting device so that the material tray can be transferred between the latter two.

7. The IC loading and sorting machine as described in claim 1, characterized in that: The IC loading and sorting machine also includes a socket opening device, which is disposed above the sorting area to open the socket on the test board used for connecting ICs.

8. The IC loading and sorting machine as described in claim 1, characterized in that: The trolley includes a transfer device, a trolley assembly, and a prediction device. The transfer device is located on the side of the trolley assembly near the upper plate area, and the prediction device is located on the other end of the trolley assembly away from the transfer device. The transfer device, the trolley assembly, and the prediction device each have an upper conveying mechanism and a lower conveying mechanism. The upper conveying mechanisms of the transfer device, the trolley assembly, and the prediction device form an upper conveying channel to transport the test plate from the transfer device to the trolley assembly and the prediction device. The lower conveying mechanisms of the transfer device, the trolley assembly, and the prediction device form a lower conveying channel to transport the test plate from the prediction device to the trolley assembly and the transfer device.

9. The IC loading and sorting machine as described in claim 8, characterized in that: The transfer device includes a first base, an upper pushing mechanism, a lower pulling mechanism, an upper conveying mechanism, and a lower conveying mechanism. The upper and lower conveying mechanisms of the transfer device are disposed on the first base and arranged vertically. The upper pushing mechanism is disposed on the first base and pushes the test plate located on the upper conveying mechanism of the transfer device to the upper conveying mechanism of the trolley device. The lower pulling mechanism is disposed on the first base and pulls the test plate located on the lower conveying mechanism of the trolley device to the lower conveying mechanism of the transfer device.

10. The IC loading and sorting machine as described in claim 8, characterized in that: The trolley device includes a second base, an X-axis drive mechanism, a Y-axis drive mechanism, a second support seat, a second lifting mechanism, a second clearance cylinder, an upper conveying mechanism, and a lower conveying mechanism. The X-axis drive mechanism is disposed on the second base to drive the test plate to move along the X direction. The Y-axis drive mechanism is disposed at the output end of the X-axis drive mechanism to drive the test plate to move along the Y direction. The second support seat is disposed at the output end of the Y-axis drive mechanism. The upper conveying mechanism and the lower conveying mechanism of the trolley device are disposed on the second support seat and arranged vertically. The second lifting mechanism is disposed on the surface of the second support seat to drive the test plate to rise and fall. The second clearance cylinder is disposed on the second support seat and drives the upper conveying mechanism of the trolley device to clear the test plate when it descends.

11. The IC loading and sorting machine as described in claim 10, characterized in that: The trolley device further includes a rotary drive mechanism, which is disposed between the Y-axis drive mechanism and the second support seat to drive the second support seat to rotate in the horizontal direction.

12. The IC loading and sorting machine as described in claim 10, characterized in that: The trolley device further includes a front limiting cylinder and a rear limiting cylinder. The rear limiting cylinder is mounted on the second support seat and is located at the end of the upper conveying mechanism of the trolley device away from the transfer device, and drives the output end to extend and retract to block or release the test board. The front limiting cylinder is mounted on the lifting platform of the second lifting mechanism at the end near the transfer device. The output end of the front limiting cylinder and the output end of the rear limiting cylinder together restrict the lateral position of the test board.

13. The IC loading and sorting machine as described in claim 10, characterized in that: The trolley device also includes side-push cylinders, which are respectively disposed on both sides of the second support seat. The output ends of the two side-push cylinders extend out and can jointly limit the longitudinal position of the test plate.

14. The IC loading and sorting machine as described in claim 8, characterized in that: The prediction device includes a third base, a third lifting mechanism, a push-pull mechanism, a third avoidance cylinder, an upper conveying mechanism, a lower conveying mechanism, and a testing device. The testing device is located at the end of the upper conveying mechanism of the prediction device away from the trolley, to connect with and test the test plate. The upper and lower conveying mechanisms of the prediction device are mounted on the third base and arranged vertically. The third lifting mechanism is mounted on the third base and its output end is connected to the push-pull mechanism to drive the push-pull mechanism and the test plate to rise and fall. The push-pull mechanism drives the test plate to move along the upper conveying mechanism of the prediction device to connect the test plate with the testing device, or drives the test plate away from the testing device and moves along the conveying direction of the lower conveying mechanism of the prediction device. The third avoidance cylinder is mounted on the third base and drives the upper conveying mechanism of the prediction device to avoid the test plate when it descends.

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