Heterojunction pvd carrier plate cleaning apparatus

CN224878711UActive Publication Date: 2026-10-23ANHUI HUASUN ENERGY CO LTD
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Patent Information

Application Number
CN202522048600.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-24
Publication Date
2026-10-23
Estimated Expiration
2035-09-24

AI Technical Summary

Technical Problem

[0004]本申请提供了一种异质结PVD载板清洁装置,以解决现有技术中在对PVD载板的C型槽清洁时不够彻底的问题

Benefits of technology

[0014]应用本申请的技术方案,异质结PVD载板清洁装置,包括:支撑组件、吹扫组件和清洁组件。支撑组件包括第一支撑板和第二支撑板。吹扫组件设置在第一支撑板和第二支撑板上,吹扫组件用于对PVD载板C型槽内的粉尘进行吹扫使其扬起。清洁组件包括清扫结构和吸尘结构,清扫结构设置在第一支撑板上,吸尘结构设置在第二支撑板上,清扫结构包括清扫毛刷和放置壳体,放置壳体具有清扫口,清扫口朝向PVD载板的C型槽,清扫毛刷可转动地设置在清扫口处,清扫毛刷能够将C型槽内的粉尘扫起,吸尘结构包括吸尘管道,吸尘管道和放置壳体相连通,吸尘管道能够将扬起的粉尘吸走避免二次污染,使得清洁更加彻底。本申请的技术方案有效地解决了现有技术中在对PVD载板的C型槽清洁时不够彻底的问题。

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Abstract

The application relates to a kind of heterojunction PVD carrier plate cleaning devices, comprising: support assembly, blowing assembly and cleaning assembly.Support assembly includes first support plate and second support plate.Blowing assembly is arranged on the first support plate and the second support plate.Cleaning assembly includes cleaning structure and dust extraction structure, cleaning structure is arranged on the first support plate, dust extraction structure is arranged on the second support plate, cleaning structure includes cleaning brush and placement shell, placement shell has cleaning mouth, cleaning mouth is towards C-shaped groove of PVD carrier plate, cleaning brush is rotatably arranged at cleaning mouth, dust extraction structure includes dust extraction pipeline, and dust extraction pipeline and placement shell are communicated.The technical scheme of the application effectively solves the problem that the C-shaped groove of the PVD carrier plate is not cleaned thoroughly in the prior art.
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Description

Technical Field

[0001] This application relates to the technical field of heterojunction solar cell production equipment, and more specifically, to a heterojunction PVD carrier cleaning device. Background Technology

[0002] Heterojunction solar cells mainly involve four processes: texturing and cleaning, PECVD, PVD, and screen printing. PVD, or Physical Vapor Deposition, deposits a TCO film (transparent conductive oxide film, also known as the blue film) on a silicon wafer surface under vacuum conditions using magnetron sputtering. The TCO film possesses both optical transparency and conductivity, playing a crucial role in the collection of effective charge carriers. PVD is divided into automated loading equipment, a main loading equipment, and an automated unloading equipment. The function of the PVD carrier is to transport silicon wafers within the main machine chamber, enabling the deposition of TCO films on both sides of the wafers. Carrier transport is achieved through the combined action of a motor, conveyor rollers, guide rollers, and conductive rollers. During production, coating particles and dust from the conveyor rollers, guide rollers, and conductive rollers fall into the C-grooves of the carrier. Furthermore, the conductive rollers, typically made of metal for better charge conduction, experience wear when in contact with the C-grooves during carrier transport, and the resulting metal shavings also fall into the C-grooves. These coating particles, dust, and metal shavings are transported along with the carrier to the automated loading and unloading machine, where they can fall onto the silicon wafers, causing scratches or foreign matter defects during the screen printing process, thus affecting product yield.

[0003] In existing technical solutions, when cleaning the C-groove of a PVD substrate, a vertically positioned brush can be used, placed inside the C-groove for cleaning. (For example, patent number CN 215696051 U, titled "A Dust-Removing Cleaning Device for Electronic Chips"). The brush is rotated by a screw, and can be positioned on both sides of the C-groove for cleaning. While this method can remove coating particles and dust from the C-groove, it also causes these particles and dust to be stirred up, resulting in secondary pollution and incomplete cleaning. Utility Model Content

[0004] This application provides a heterojunction PVD carrier cleaning device to solve the problem that the existing technology is not thorough enough in cleaning the C-groove of the PVD carrier.

[0005] A heterojunction PVD carrier cleaning device according to this application includes: a support assembly, a blowing assembly, and a cleaning assembly. The support assembly includes a first support plate and a second support plate. The blowing assembly is disposed on the first support plate and the second support plate. The cleaning assembly includes a sweeping structure and a suction structure. The sweeping structure is disposed on the first support plate, and the suction structure is disposed on the second support plate. The sweeping structure includes a sweeping brush and a placement housing. The placement housing has a sweeping port facing a C-shaped groove of the PVD carrier. The sweeping brush is rotatably disposed at the sweeping port. The suction structure includes a suction pipe that is connected to the placement housing.

[0006] In some embodiments, the housing has a receiving space, and the housing includes a first plate, a second plate, a third plate, a fourth plate, and a fifth plate. The first plate and the second plate are arranged opposite to each other, the third plate and the fourth plate are arranged opposite to each other, and the fifth plate is circumferentially connected to the first plate, the second plate, the third plate, and the fourth plate, respectively. The dust suction pipe is connected to the receiving space through the mounting hole on the fifth plate. In some embodiments, the cleaning assembly further includes a drive structure, which includes a drive motor, a drive gear, a gear ring, a rotating sleeve, and a support base. The drive motor is placed on the fourth plate, the drive gear is connected to the output shaft of the drive motor, the support base is placed on the fourth plate, the rotating sleeve is rotatably mounted on the support base, the gear ring is fixed on the rotating sleeve, and the gear ring meshes with the drive gear.

[0007] In some embodiments, the drive structure further includes a first rotating ring, a second rotating ring, and a limiting member. The first rotating ring and the second rotating ring are both sleeved on the rotating sleeve, and the first rotating ring and the second rotating ring are respectively located on both sides of the toothed ring. The first rotating ring and the second rotating ring are fixed by the limiting member and the first plate and the second plate.

[0008] In some embodiments, the cleaning structure further includes a rotating shaft and a limiting block. The rotating shaft is provided with a limiting protrusion along the axial direction. The cleaning brush is provided with a first mating hole and a first limiting groove is opened at the first mating hole. The rotating sleeve is provided with a second mating hole and a second limiting groove is opened at the second mating hole. The rotating shaft passes through the first mating hole and the second mating hole in sequence, and the limiting protrusion engages with the first limiting groove and the second limiting groove.

[0009] In some embodiments, the cleaning assembly further includes a limiting structure, which includes two sets of limiting springs, two sets of mating plates, and two sets of semi-circular clamping plates. A fixing groove is provided on the third plate. Both sets of limiting springs are disposed in the fixing groove, and the first ends of both sets of limiting springs are fixedly connected to the side wall of the fixing groove, and the second ends are fixedly connected to the two sets of mating plates. The two sets of semi-circular clamping plates are fixedly connected to the two sets of mating plates respectively, and the two sets of semi-circular clamping plates are assembled into a ring.

[0010] In some embodiments, the limiting block is provided with a slot along the circumference, and two sets of semi-arc plates are placed in the slot to fix the limiting block. The bottom of the fixing slot is provided with a through hole to facilitate the passage of the rotating shaft.

[0011] In some embodiments, the suction structure further includes a vacuum cleaner, and the vacuum cleaner and suction pipe are connected.

[0012] In some embodiments, the purging assembly includes a blower, an air pipe, a distribution box, and multiple nozzles. The second support plate has two sets of mating holes. The air pipe passes through one set of mating holes, and both ends of the air pipe are connected to the blower and the distribution box, respectively. The multiple nozzles are all connected to the distribution box, and the distribution box is placed on the first support plate.

[0013] In some embodiments, the support assembly further includes an electric telescopic rod and a limiting post. The two ends of the electric telescopic rod are connected to the first support plate and the second support plate, respectively. The first end of the limiting post passes through another set of mating holes and is connected to the second support plate, and the second end of the limiting post is provided with a stop.

[0014] The present application provides a heterojunction PVD carrier cleaning device, comprising a support assembly, a blowing assembly, and a cleaning assembly. The support assembly includes a first support plate and a second support plate. The blowing assembly is disposed on the first and second support plates and is used to blow away dust within the C-groove of the PVD carrier, causing it to rise. The cleaning assembly includes a cleaning structure and a suction structure. The cleaning structure is disposed on the first support plate, and the suction structure is disposed on the second support plate. The cleaning structure includes a cleaning brush and a placement housing. The placement housing has a cleaning port facing the C-groove of the PVD carrier. The cleaning brush is rotatably disposed at the cleaning port and can sweep away dust within the C-groove. The suction structure includes a suction pipe connected to the placement housing. The suction pipe can suck away the raised dust to avoid secondary pollution, making the cleaning more thorough. The present application's technical solution effectively solves the problem of insufficient cleaning of the C-groove of PVD carriers in the prior art. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1This illustration shows a schematic diagram of the positions of the heterojunction PVD carrier cleaning device and the PVD carrier according to an embodiment of this application. Figure 2 A schematic diagram of the structure of a heterojunction PVD carrier cleaning device according to an embodiment of this application is shown; Figure 3 It shows Figure 2 Enlarged structural diagram at point A; Figure 4 A schematic diagram of the structure of the cleaning component according to an embodiment of this application is shown; Figure 5 A schematic diagram of the driving structure according to an embodiment of this application is shown; Figure 6 A schematic diagram of the purging assembly according to an embodiment of this application is shown.

[0018] The above figures include the following reference numerals: 10. Support assembly; 11. First support plate; 12. Second support plate; 13. Electric telescopic rod; 14. Limiting post; 20. Blowing assembly; 21. Blower; 22. Air pipe; 23. Distribution box; 24. Nozzle; 30. Cleaning assembly; 31. Cleaning structure; 311. Cleaning brush; 3111. First mating hole; 3112. First limiting groove; 312. Housing placement; 3121. Cleaning port; 3122. First plate; 3123. Third plate; 3124. Fourth plate; 3125. Fifth plate; 3126. Fixing groove; 3 13. Rotating shaft; 3131. Limiting protrusion; 314. Limiting block; 3141. Slot; 32. Dust suction structure; 321. Dust suction pipe; 33. Drive structure; 331. Drive motor; 332. Drive gear; 333. Gear ring; 334. Rotating sleeve; 3341. Second mating hole; 3342. Second limiting groove; 335. Support base; 336. First rotating ring; 337. Second rotating ring; 34. Limiting structure; 341. Limiting spring; 342. Mating plate; 343. Semi-arc-shaped clamping plate; 100. PVD carrier plate; 101. C-shaped groove. Detailed Implementation

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0021] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0022] like Figure 1 , Figure 2 and Figure 4 As shown, the embodiment relates to a heterojunction PVD carrier cleaning device, including: a support assembly 10, a blowing assembly 20, and a cleaning assembly 30. The support assembly 10 includes a first support plate 11 and a second support plate 12. The blowing assembly 20 is disposed on the first support plate 11 and the second support plate 12. The cleaning assembly 30 includes a cleaning structure 31 and a suction structure 32. The cleaning structure 31 is disposed on the first support plate 11, and the suction structure 32 is disposed on the second support plate 12. The cleaning structure 31 includes a cleaning brush 311 and a placement housing 312. The placement housing 312 has a cleaning port 3121 facing the C-groove 101 of the PVD carrier 100. The cleaning brush 311 is rotatably disposed at the cleaning port 3121. The suction structure 32 includes a suction pipe 321, which is connected to the placement housing 312.

[0023] The heterojunction PVD carrier cleaning device according to this embodiment includes a support assembly 10, a blowing assembly 20, and a cleaning assembly 30. The support assembly 10 includes a first support plate 11 and a second support plate 12. The blowing assembly 20 is disposed on the first support plate 11 and the second support plate 12, and is used to blow away dust in the C-groove 101 of the PVD carrier 100 and cause it to be lifted. The cleaning assembly 30 includes a sweeping structure 31 and a vacuuming structure 32. The sweeping structure 31 is mounted on a first support plate 11, and the vacuuming structure 32 is mounted on a second support plate 12. The sweeping structure 31 includes a sweeping brush 311 and a housing 312. The housing 312 has a sweeping opening 3121 facing the C-groove 101 of the PVD carrier plate 100. The sweeping brush 311 is rotatably mounted at the sweeping opening 3121 and can sweep up dust in the C-groove 101. The vacuuming structure 32 includes a vacuuming pipe 321 connected to the housing 312. The vacuuming pipe 321 can suck up the raised dust to avoid secondary pollution, making the cleaning more thorough. The technical solution of this embodiment effectively solves the problem of insufficient cleaning of the C-groove 101 of the PVD carrier plate 100 in the prior art.

[0024] It should also be noted that the support plates can be added to support the first support plate 11 and the second support plate 12 to make the whole device more stable, or the first support plate 11 and the second support plate 12 can be connected to the support plate of the carrier plate conveying device by mounting bolts.

[0025] like Figure 2 and Figure 3 As shown, in some embodiments, the housing 312 has a receiving space. The housing 312 includes a first plate 3122, a second plate, a third plate 3123, a fourth plate 3124, and a fifth plate 3125. The first plate 3122 and the second plate are arranged opposite to each other, the third plate 3123 and the fourth plate 3124 are arranged opposite to each other, and the fifth plate 3125 is circumferentially connected to the first plate 3122, the second plate, the third plate 3123, and the fourth plate 3124 respectively. The dust suction pipe 321 is connected to the receiving space through the mounting hole on the fifth plate 3125.

[0026] It should be noted that both the first plate 3122 and the second plate are provided with C-shaped openings, which are arranged opposite each other to form a cleaning port 3121. This arrangement allows it to match the C-shaped groove, and the C-shaped groove is placed inside the cleaning port, so that the cleaning brush 311 can clean the C-shaped groove well.

[0027] It should also be noted that the heterojunction PVD carrier cleaning device is set on both sides corresponding to the C-shaped groove 101 of the PVD carrier 100, and the number can be flexibly set.

[0028] like Figure 4 and Figure 5 As shown, in some embodiments, the cleaning component 30 further includes a drive structure 33, which includes a drive motor 331, a drive gear 332, a gear ring 333, a rotating sleeve 334, and a support base 335. The drive motor 331 is placed on the fourth plate 3124, and the drive gear 332 is connected to the output shaft of the drive motor 331. The support base 335 is placed on the fourth plate 3124, and the rotating sleeve 334 is rotatably mounted on the support base 335. The support base 335 raises the height of the rotating sleeve 334 to a position that matches the height of the drive gear 332. The gear ring 333 is fixed on the rotating sleeve 334, and the gear ring 333 meshes with the drive gear 332. The drive gear 332 drives the gear ring 333 to rotate, and the gear ring 333 drives the rotating sleeve 334 to rotate synchronously.

[0029] like Figure 4 and Figure 5 As shown, in some embodiments, the drive structure 33 further includes a first rotating ring 336, a second rotating ring 337, and a limiting member. Both the first rotating ring 336 and the second rotating ring 337 are sleeved on the rotating sleeve 334, and are located on opposite sides of the toothed ring 333. The first rotating ring 336 and the second rotating ring 337 can vertically limit the toothed ring 333, preventing it from dislodging. The first rotating ring 336 and the second rotating ring 337 are fixed to the first plate 3122 and the second plate by the limiting member. The limiting member can be a limiting rod or a limiting ring.

[0030] like Figure 4 As shown, in some embodiments, the cleaning structure 31 further includes a rotating shaft 313 and a limiting block 314. The rotating shaft 313 is provided with a limiting protrusion 3131 along the axial direction. The cleaning brush 311 is provided with a first mating hole 3111, and a first limiting groove 3112 is formed at the first mating hole 3111. The rotating sleeve 334 is provided with a second mating hole 3341, and a second limiting groove 3342 is formed at the second mating hole 3341. The rotating shaft 313 passes through the first mating hole 3111 and the second mating hole 3341 in sequence, and the limiting protrusion 3131 engages with the first limiting groove 3112 and the second limiting groove 3342. This arrangement allows the rotating sleeve 334 to drive the rotating shaft 313 to rotate synchronously during rotation, ultimately driving the cleaning brush 311 to rotate.

[0031] like Figure 4As shown, in some embodiments, the cleaning component 30 further includes a limiting structure 34, which includes two sets of limiting springs 341, two sets of mating plates 342, and two sets of semi-circular clamping plates 343. A fixing groove 3126 is provided on the third plate 3123. Both sets of limiting springs 341 are disposed within the fixing groove 3126, with the first end of each set fixedly connected to the side wall of the fixing groove 3126 and the second end fixedly connected to the two sets of mating plates 342. The two sets of semi-circular clamping plates 343 are respectively fixedly connected to the two sets of mating plates 342, and the two sets of semi-circular clamping plates 343 are joined together to form a ring. At this time, the limiting springs 341 are in a compressed state, but not to their limit. Under the rebound force of the limiting springs 341, the two sets of semi-circular clamping plates 343 can be joined together.

[0032] like Figure 3 and Figure 4 As shown, in some embodiments, the limiting block 314 is provided with a slot 3141 along the circumferential direction, and two sets of semi-arc-shaped plates 343 are placed in the slot 3141 to fix the limiting block 314 and prevent the limiting block 314 from coming out along the axial direction. The bottom of the fixing slot is provided with a through hole to facilitate the passage of the rotating shaft 313, so that the cooperation between the rotating shaft 313 and the cleaning brush 311 is not affected.

[0033] It should be noted that when the cleaning brush 311 needs to be replaced, the two sets of mating plates 342 are pulled away from each other. At this time, the limit spring 341 is further compressed, the two sets of semi-circular clamping plates 343 are separated, and the limit block 314 is no longer fixed. The rotating shaft 313 can be pulled out to replace the cleaning brush 311.

[0034] In some embodiments, the suction structure 32 further includes a vacuum cleaner, which is connected to the suction pipe 321 to absorb dust. The vacuum cleaner is prior art, and its specific structure and working principle will not be described in detail here.

[0035] like Figure 2 and Figure 6 As shown, in some embodiments, the purging assembly 20 includes a blower 21, an air pipe 22, a distribution box 23, and multiple nozzles 24. The second support plate 12 has two sets of mating holes. The air pipe 22 passes through one set of mating holes, and both ends of the air pipe 22 are connected to the blower 21 and the distribution box 23, respectively. The multiple nozzles 24 are all connected to the distribution box 23, which is placed on the first support plate 11. The gas blown out by the blower 21 flows into the distribution box 23 through the air pipe 22 to achieve uniform distribution, and is then sprayed out through the multiple nozzles 24 to blow up the dust in the C-shaped groove.

[0036] It should be noted that a distribution plate is installed inside the distribution box 23, and the blower 21 can be placed on the ground.

[0037] It should also be noted that the blowing assembly 20 is used to blow away dust with low adhesion. For dust with high adhesion, the cleaning brush 311 is used for cleaning, and the dust is eventually sucked away through the suction pipe 321.

[0038] like Figure 2 As shown, in some embodiments, the support assembly 10 further includes an electric telescopic rod 13 and a limiting post 14. The two ends of the electric telescopic rod 13 are connected to the first support plate 11 and the second support plate 12, respectively. This arrangement allows the distance between the first support plate 11 and the second support plate 12 to be adjustable, thus enabling adjustment of the distance between the sweeping structure 31 and the vacuuming structure 32 and the C-shaped groove. The first end of the limiting post 14 passes through another set of mating holes and connects to the second support plate 12, and the second end of the limiting post 14 is provided with a stop. This arrangement is to prevent the limiting post 14 from dislodging from the mating holes if the movement distance is too far.

[0039] It should be noted that the electric telescopic rod 13 can also be replaced by a pneumatic cylinder or a hydraulic cylinder.

[0040] It should also be noted that the vacuum duct 321 may be provided with a flexible hose section or a folded section to match the movement of the first support plate 11.

[0041] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0042] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0043] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heterojunction PVD carrier cleaning device, characterized in that, include: Support assembly (10), the support assembly (10) includes a first support plate (11) and a second support plate (12); A purging assembly (20) is disposed on the first support plate (11) and the second support plate (12); The cleaning component (30) includes a sweeping structure (31) and a vacuuming structure (32). The sweeping structure (31) is disposed on the first support plate (11), and the vacuuming structure (32) is disposed on the second support plate (12). The sweeping structure (31) includes a sweeping brush (311) and a placement housing (312). The placement housing (312) has a sweeping port (3121) facing the C-groove (101) of the PVD carrier plate (100). The sweeping brush (311) is rotatably disposed at the sweeping port (3121). The vacuuming structure (32) includes a vacuuming pipe (321) and the placement housing (312) are connected.

2. The heterojunction PVD carrier cleaning device according to claim 1, characterized in that, The placement housing (312) has a receiving space. The placement housing (312) includes a first plate (3122), a second plate, a third plate (3123), a fourth plate (3124), and a fifth plate (3125). The first plate (3122) and the second plate are arranged opposite to each other. The third plate (3123) and the fourth plate (3124) are arranged opposite to each other. The fifth plate (3125) is circumferentially connected to the first plate (3122), the second plate, the third plate (3123), and the fourth plate (3124). The dust suction pipe (321) is connected to the receiving space through the mounting hole on the fifth plate (3125).

3. The heterojunction PVD carrier cleaning device according to claim 2, characterized in that, The cleaning component (30) further includes a drive structure (33), which includes a drive motor (331), a drive gear (332), a gear ring (333), a rotating sleeve (334), and a support base (335). The drive motor (331) is placed on the fourth plate (3124), the drive gear (332) is connected to the output shaft of the drive motor (331), the support base (335) is placed on the fourth plate (3124), the rotating sleeve (334) is rotatably mounted on the support base (335), the gear ring (333) is fixed on the rotating sleeve (334), and the gear ring (333) meshes with the drive gear (332).

4. The heterojunction PVD carrier cleaning device according to claim 3, characterized in that, The drive structure (33) further includes a first rotating ring (336), a second rotating ring (337), and a limiting member. The first rotating ring (336) and the second rotating ring (337) are both sleeved on the rotating sleeve (334), and the first rotating ring (336) and the second rotating ring (337) are respectively located on both sides of the toothed ring (333). The first rotating ring (336) and the second rotating ring (337) are fixed by the limiting member and the first plate (3122) and the second plate.

5. The heterojunction PVD carrier cleaning device according to claim 3, characterized in that, The cleaning structure (31) further includes a rotating shaft (313) and a limiting block (314). The rotating shaft (313) is provided with a limiting protrusion (3131) along the axial direction. The cleaning brush (311) is provided with a first mating hole (3111) and a first limiting groove (3112) is opened at the first mating hole (3111). The rotating sleeve (334) is provided with a second mating hole (3341) and a second limiting groove (3342) is opened at the second mating hole (3341). The rotating shaft (313) passes through the first mating hole (3111) and the second mating hole (3341) in sequence, and the limiting protrusion (3131) engages with the first limiting groove (3112) and the second limiting groove (3342).

6. The heterojunction PVD carrier cleaning device according to claim 5, characterized in that, The cleaning component (30) also includes a limiting structure (34), which includes two sets of limiting springs (341), two sets of mating plates (342), and two sets of semi-circular clamping plates (343). A fixing groove (3126) is provided on the third plate (3123). Both sets of the limiting springs (341) are disposed in the fixing groove (3126), and the first end of each set of the limiting springs (341) is fixedly connected to the side wall of the fixing groove (3126), and the second end is fixedly connected to each of the two sets of mating plates (342). The two sets of semi-circular clamping plates (343) are fixedly connected to each of the two sets of mating plates (342), and the two sets of semi-circular clamping plates (343) are assembled into a ring.

7. The heterojunction PVD carrier cleaning device according to claim 6, characterized in that, The limiting block (314) is provided with a slot (3141) along the circumference. Both sets of the semi-arc-shaped plates (343) are placed in the slot (3141) to fix the limiting block (314). The bottom of the fixing slot is provided with a through hole to facilitate the passage of the rotating shaft (313).

8. The heterojunction PVD carrier cleaning device according to any one of claims 1 to 7, characterized in that, The vacuuming structure (32) also includes a vacuum cleaner, which is connected to the vacuuming pipe (321).

9. The heterojunction PVD carrier cleaning device according to any one of claims 1 to 7, characterized in that, The purging assembly (20) includes a blower (21), an air pipe (22), a distribution box (23), and multiple nozzles (24). The second support plate (12) has two sets of mating holes. The air pipe (22) passes through one set of the mating holes. The two ends of the air pipe (22) are respectively connected to the blower (21) and the distribution box (23). The multiple nozzles (24) are all connected to the distribution box (23). The distribution box (23) is placed on the first support plate (11).

10. The heterojunction PVD carrier cleaning device according to claim 9, characterized in that, The support assembly (10) also includes an electric telescopic rod (13) and a limiting post (14). The two ends of the electric telescopic rod (13) are connected to the first support plate (11) and the second support plate (12) respectively. The first end of the limiting post (14) passes through another set of mating holes and is connected to the second support plate (12). The second end of the limiting post (14) is provided with a stop.

Citation Information

Patent Citations

  • Dust removal type cleaning equipment for electronic chip

    CN215696051U