Cold forging die avoiding sticking

Abstract

The utility model discloses an avoid cold -forging die of sticking, belongs to cold -forging technical field, including upper die holder, the lower end of upper die holder is provided with lower die holder, the lower end fixedly connected with pressure dynamic mould of upper die holder, the upper end fixedly connected with two telescopic rods of lower die holder, mould cooling mechanism, the mould cooling mechanism sets up between two telescopic rods, the mould cooling mechanism installs in the upper end of lower die holder, wherein, the mould cooling mechanism includes the lower die of installing in the upper end of lower die holder. Through above -mentioned mode, the heat conduction block carries out the auxiliary cooling to lower die, and the heat dissipation copper pipe in the heat conduction block is helical, has increased the path of heat exchange of the liquid in the heat dissipation copper pipe to the heat conduction block, has strengthened the cooling effect of the heat conduction block to the surface of lower die, has improved the overall heat dissipation effect of lower die, has reduced the situation that mould temperature is higher, has relieved the sticking effect that metal cold -forging stamping produces, and further improved the qualified rate of cold -forging finished product.

Description

Technical Field

[0001] This utility model relates to the field of cold forging technology, specifically to a cold forging die that avoids sticking. Background Technology

[0002] Cold forging, also known as cold volume forming, is a manufacturing process and a processing method. It is basically the same as cold stamping. Copper needle fin heat dissipation is a heat dissipation technology designed based on the properties of copper material. It achieves efficient heat exchange through a densely arranged needle-like fin structure. It consists of a copper substrate with densely distributed upright needle-like fins, which improves heat dissipation efficiency by increasing the surface area and fluid turbulence.

[0003] A search of existing Chinese patent technology reveals a device called "An Easily Formable Niobium Alloy Cold Forging Die" (publication number CN222198764U). This device activates a telescopic component, which causes the upper die to move downwards, thus initiating cold forging through the upper and lower dies. However, continuous cold forging will cause the metal die to absorb a large amount of heat. Due to the high die temperature, the metal will become sticky during cold forging, which will affect the yield of the cold-forged product.

[0004] Based on this, the present invention designs a cold forging die that avoids adhesion to solve the above problems. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a cold forging die that avoids adhesion.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A cold forging die for preventing adhesion includes an upper die base, a lower die base at the lower end of the upper die base, a pressing die fixedly connected to the lower end of the upper die base, two telescopic rods fixedly connected to the upper end of the lower die base, and a die cooling mechanism disposed between the two telescopic rods and installed at the upper end of the lower die base. The die cooling mechanism includes a lower die installed at the upper end of the lower die base, a heat dissipation assembly sleeved on the surface of the lower die, a liquid distribution assembly connected to the lower end of the heat dissipation assembly, the liquid distribution assembly sleeved on the surface of the lower die, and an outlet assembly at the upper end of the heat dissipation assembly, the surface of the heat dissipation assembly extending into the interior of the outlet assembly.

[0008] Furthermore, the heat dissipation assembly includes multiple fixing plates fixedly connected to the surface of the lower mold. The multiple fixing plates are evenly distributed in a ring along the surface of the lower mold, and a heat-conducting block is fixedly connected between adjacent fixing plates. The heat-conducting block is fixedly connected to the surface of the lower mold.

[0009] Furthermore, the liquid distribution assembly includes a base fixedly connected to the upper end of the lower mold base, the base being fixedly connected to the surface of the lower mold, an upper sleeve being fixedly connected to the upper end of the base, the upper sleeve being fixedly connected to the lower end of the heat-conducting block, and a liquid equalization chamber being opened at the lower end of the upper sleeve.

[0010] Furthermore, the export component includes an upper ring fixedly connected to the surface of the lower mold, the upper ring being fixedly connected to the upper end of the heat-conducting block, and a liquid collection cavity being fixedly connected to the surface of the upper ring away from the lower mold.

[0011] Furthermore, a heat dissipation copper pipe is embedded inside the heat-conducting block, and the heat dissipation copper pipe is spiral in shape.

[0012] Furthermore, an inlet copper pipe is fixedly connected to the lower end of the heat dissipation copper pipe, and an outlet copper pipe is fixedly connected to the upper end of the heat dissipation copper pipe.

[0013] Furthermore, the lower end of the upper ring is provided with an outlet channel, which communicates with the interior of the liquid collection chamber.

[0014] Furthermore, the upper end of the base is provided with a liquid inlet channel, and the liquid equalization chamber is connected to the liquid inlet channel.

[0015] The beneficial effects of this utility model are:

[0016] The heat-conducting block is designed to assist in cooling the lower mold. The heat dissipation copper pipe inside the heat-conducting block is spiral-shaped, which increases the path for heat exchange between the liquid inside the heat dissipation copper pipe and the heat-conducting block. This enhances the cooling effect of the heat-conducting block on the surface of the lower mold, improves the overall heat dissipation effect of the lower mold, reduces the high temperature of the mold, alleviates the adhesion effect caused by cold forging of metal, and thus improves the qualification rate of cold forged products.

[0017] The liquid is introduced into the interior of the upper sleeve through the inlet channel. The liquid distribution chamber at the lower end of the upper sleeve is connected to multiple inlet copper tubes. The liquid is evenly distributed into the inlet copper tubes through the liquid distribution chamber. The liquid is then guided into the heat dissipation copper tubes through the inlet copper tubes, so that the liquid inside the heat dissipation copper tubes can quickly exchange heat with the heat inside the heat conduction block. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a cold forging die structure that avoids adhesion according to the present invention;

[0019] Figure 2 This is a schematic diagram of a cooling mechanism for a cold forging die to prevent adhesion, according to the present invention.

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 This is an exploded cross-sectional view of a cold forging die ejection assembly designed to prevent adhesion according to this utility model.

[0022] Figure 5 This is an exploded cross-sectional view of a heat dissipation component for a cold forging die that prevents adhesion, according to the present invention.

[0023] The labels in the diagram represent:

[0024] 1. Upper mold base; 11. Pressing mold; 2. Lower mold base; 21. Telescopic rod; 3. Mold cooling mechanism; 31. Lower mold; 32. Heat dissipation assembly; 321. Fixing plate; 322. Heat-conducting block; 323. Outlet copper pipe; 324. Heat dissipation copper pipe; 325. Inlet copper pipe; 33. Outlet assembly; 331. Upper ring; 332. Liquid collection chamber; 333. Outlet channel; 34. Liquid distribution assembly; 341. Base; 342. Upper sleeve; 343. Liquid inlet channel; 344. Liquid equalization chamber. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0026] In some embodiments, please refer to the appendix to the instruction manual. Figure 1-5 A cold forging die for preventing adhesion includes an upper die base 1, a lower die base 2 at the lower end of the upper die base 1, a pressing die 11 fixedly connected to the lower end of the upper die base 1, two telescopic rods 21 fixedly connected to the upper end of the lower die base 2, and a die cooling mechanism 3 disposed between the two telescopic rods 21 and installed at the upper end of the lower die base 2. The die cooling mechanism 3 includes a lower die 31 installed at the upper end of the lower die base 2, a heat dissipation component 32 sleeved on the surface of the lower die 31, a liquid distribution component 34 connected to the lower end of the heat dissipation component 32, the liquid distribution component 34 sleeved on the surface of the lower die 31, and an outlet component 33 provided at the upper end of the heat dissipation component 32, the surface of the heat dissipation component 32 extending into the interior of the outlet component 33.

[0027] like Figure 1 , Figure 2 , Figure 4 , Figure 5As shown, in a preferred embodiment of the present invention, the heat dissipation assembly 32 includes a plurality of fixing plates 321 fixedly connected to the surface of the lower mold 31. The plurality of fixing plates 321 are evenly distributed in a ring shape along the surface of the lower mold 31. A heat-conducting block 322 is fixedly connected between adjacent fixing plates 321. The heat-conducting block 322 is fixedly connected to the surface of the lower mold 31. A heat dissipation copper pipe 324 is embedded inside the heat-conducting block 322. The heat dissipation copper pipe 324 is spiral in shape. An inlet copper pipe 325 is fixedly connected to the lower end of the heat dissipation copper pipe 324, and an outlet copper pipe 323 is fixedly connected to the upper end of the heat dissipation copper pipe 324.

[0028] The export component 33 includes an upper ring 331 fixedly connected to the surface of the lower mold 31. The upper ring 331 is fixedly connected to the upper end of the heat-conducting block 322. A liquid collection cavity 332 is fixedly connected to the surface of the upper ring 331 away from the lower mold 31. An export channel 333 is opened at the lower end of the upper ring 331, and the export channel 333 communicates with the interior of the liquid collection cavity 332.

[0029] In this embodiment of the invention, the device uses a heat-conducting block 322 to assist in cooling the lower mold 31, and a fixing plate 321 to assist in positioning the heat-conducting block 322. The heat-dissipating copper pipe 324 inside the heat-conducting block 322 is spiral-shaped, which improves the path for heat exchange between the liquid inside the heat-dissipating copper pipe 324 and the heat-conducting block 322, thereby enhancing the cooling effect of the heat-conducting block 322 on the surface of the lower mold 31. The liquid is guided through the heat-dissipating copper pipe 324 to the outlet copper pipe 323, so that the outlet channel 333 absorbs heat into the upper ring 331, and finally injected into the liquid collection cavity 332 and discharged to the outside through the conduit on the surface of the liquid collection cavity 332, thereby improving the overall heat dissipation effect of the lower mold 31.

[0030] like Figure 1 , Figure 2 , Figure 3 As shown, in a preferred embodiment of the present invention, the liquid distribution assembly 34 includes a base 341 fixedly connected to the upper end of the lower mold base 2, the base 341 fixedly connected to the surface of the lower mold 31, an upper sleeve 342 fixedly connected to the upper end of the base 341, the upper sleeve 342 fixedly connected to the lower end of the heat-conducting block 322, a liquid equalization chamber 344 opened at the lower end of the upper sleeve 342, and a liquid inlet channel 343 opened at the upper end of the base 341, the liquid equalization chamber 344 communicating with the liquid inlet channel 343.

[0031] In this embodiment of the present invention, liquid is introduced into the interior of the upper sleeve 342 through the liquid inlet channel 343. The liquid distribution chamber 344 at the lower end of the upper sleeve 342 is connected to multiple inlet copper pipes 325. The liquid is evenly distributed into the inlet copper pipes 325 through the liquid distribution chamber 344. The liquid is guided into the heat dissipation copper pipe 324 through the inlet copper pipe 325, so that the liquid inside the heat dissipation copper pipe 324 can quickly exchange heat with the heat inside the heat conduction block 322.

[0032] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A cold forging die to prevent adhesion, comprising an upper die base (1), a lower die base (2) provided at the lower end of the upper die base (1), a pressing die (11) fixedly connected to the lower end of the upper die base (1), and two telescopic rods (21) fixedly connected to the upper end of the lower die base (2), characterized in that: A mold cooling mechanism (3) is provided between two telescopic rods (21) and is installed on the upper end of the lower mold base (2). The mold cooling mechanism (3) includes a lower mold (31) installed on the upper end of the lower mold base (2). A heat dissipation component (32) is sleeved on the surface of the lower mold (31). A liquid distribution component (34) is connected to the lower end of the heat dissipation component (32). The liquid distribution component (34) is sleeved on the surface of the lower mold (31). An outlet component (33) is provided at the upper end of the heat dissipation component (32). The surface of the heat dissipation component (32) extends into the interior of the outlet component (33).

2. The cold forging die for preventing adhesion according to claim 1, characterized in that, The heat dissipation assembly (32) includes a plurality of fixing plates (321) fixedly connected to the surface of the lower mold (31). The plurality of fixing plates (321) are evenly distributed in a ring along the surface of the lower mold (31). A heat-conducting block (322) is fixedly connected between adjacent fixing plates (321). The heat-conducting block (322) is fixedly connected to the surface of the lower mold (31).

3. A cold forging die for preventing adhesion according to claim 2, characterized in that, The liquid distribution assembly (34) includes a base (341) fixedly connected to the upper end of the lower mold base (2). The base (341) is fixedly connected to the surface of the lower mold (31). An upper sleeve (342) is fixedly connected to the upper end of the base (341). The upper sleeve (342) is fixedly connected to the lower end of the heat-conducting block (322). A liquid equalization chamber (344) is opened at the lower end of the upper sleeve (342).

4. A cold forging die for preventing adhesion according to claim 2, characterized in that, The export component (33) includes an upper ring (331) fixedly connected to the surface of the lower mold (31), the upper ring (331) being fixedly connected to the upper end of the heat-conducting block (322), and a liquid collection cavity (332) being fixedly connected to the surface of the upper ring (331) away from the lower mold (31).

5. A cold forging die for preventing adhesion according to claim 2, characterized in that, The heat-conducting block (322) is internally fitted with a heat-dissipating copper pipe (324), which is spiral in shape.

6. A cold forging die for preventing adhesion according to claim 5, characterized in that, The lower end of the heat dissipation copper pipe (324) is fixedly connected to an inlet copper pipe (325), and the upper end of the heat dissipation copper pipe (324) is fixedly connected to an outlet copper pipe (323).

7. A cold forging die for preventing adhesion according to claim 4, characterized in that, The lower end of the upper ring (331) is provided with an outlet channel (333), which is connected to the interior of the liquid collection chamber (332).

8. A cold forging die for preventing adhesion according to claim 3, characterized in that, The upper end of the base (341) is provided with a liquid inlet channel (343), and the liquid equalization chamber (344) is connected to the liquid inlet channel (343).

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