A soldering nozzle

Abstract

The utility model belongs to laser solder ball welding technical field discloses a kind of solder ball welding nozzles, including nozzle and solder ball, nozzle includes shell, shell is equipped with nozzle lower ball area opening angle, shell is equipped with lower ball area, shell is connected with nozzle extension area, shell is equipped with nozzle mouth, solder ball is built-in shell and nozzle extension area, the strength of the periphery of spout can be enhanced, the speed of spout diameter expansion caused by using through needle is greatly delayed, the service life of nozzle is increased, after liquid tin is sprayed from spout, a airflow is formed around liquid tin, a certain guiding effect is achieved, the problem that the direction of liquid tin after leaving spout is deflected due to the tin dregs accumulated at spout position and nearby is improved.

Description

Technical Field

[0001] This utility model relates to the field of laser solder ball bonding technology, and in particular to a solder ball bonding nozzle. Background Technology

[0002] Laser solder ball bonding technology has been widely used in the electrode placement of 3C electronics and integrated circuits. Solder balls are moved one by one into the nozzle by a moving disk inside the pump head. As the solder ball descends to the nozzle orifice, its radius, slightly larger than the orifice radius, blocks the nozzle. A continuous supply of pure nitrogen gas enters the nozzle. Once the orifice is blocked, the gas pressure inside the pump head rises. When the pressure reaches a set value, the system determines that the solder ball has reached the designated orifice position, activates the laser, and irradiates the solder ball. The solder ball's temperature rises rapidly, liquefying. The pressurized gas then pushes the liquid solder ball out of the nozzle orifice. With gravity, it moves downwards to the solder pad position, where heat exchange cools it into a solid state, completing the solder ball placement.

[0003] Traditional nozzles have a conical internal cross-section and are made of tungsten steel or ceramic. However, residual solder balls accumulate near and around the nozzle opening, affecting the trajectory and direction of the molten solder balls. Common practices include removing the residual solder dross with a cleaning needle or acid cleaning after a certain period of time. Acid cleaning typically adds additional environmental treatment steps, making the process complex. Using a cleaning needle usually gradually enlarges the nozzle opening, eventually causing it to fail and unable to hold the solder balls. During the accumulation of solder dross, its irregular shape deflects the vertically downward direction of the ejected molten solder, resulting in poor solder ball quality.

[0004] Increasing the frequency of nozzle replacement is one way to solve this problem. However, frequent nozzle replacement increases consumable costs and can also cause frequent interruptions or pauses in assembly line systems, affecting work efficiency. Utility Model Content

[0005] The present invention aims to provide a solder ball soldering nozzle to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A solder ball soldering nozzle includes a nozzle and a solder ball. The nozzle includes a housing, the housing has a nozzle lower ball area angle, the housing has a lower ball area, the housing is connected to a nozzle extension area, and the housing has a nozzle orifice. The solder ball is built into the housing and the nozzle extension area.

[0008] Preferably, the exit angle formed by the conical generatrix of the nozzle extension region is the same as the angle between the conical generatrix of the lower ball region.

[0009] Preferably, the nozzle is made of tungsten carbide or alumina ceramic.

[0010] Preferably, the diameter of the solder ball is 0.2 to 1 mm.

[0011] Preferably, the included angle of the conical generatrix of the lower spherical region is 10 degrees to 25 degrees.

[0012] Preferably, the nozzle diameter is 90% to 98% of the solder ball diameter.

[0013] The beneficial effects of this technical solution compared to existing technologies are as follows:

[0014] (1) This solution designs an extended short-cavity nozzle structure at the nozzle position of a traditional nozzle. This structure enhances the strength of the nozzle periphery and greatly slows down the rate at which the nozzle diameter expands due to the use of a needle, thereby increasing the service life of the nozzle.

[0015] (2) By setting up a nozzle extension area, this solution forms an airflow around the liquid tin after it is sprayed out of the nozzle, which plays a certain guiding role. This improves the problem that the direction of the liquid tin after it leaves the nozzle is deflected by the nozzle position and the tin dross accumulated nearby, thus improving the quality of the ball planting and solving the defects of traditional technology products. Attached Figure Description

[0016] Figure 1 This is a front sectional view of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of this utility model;

[0018] Figure label:

[0019] Nozzle 1, housing 2, lower ball area 3, nozzle extension area 4, nozzle orifice 5, solder ball 6, nozzle lower ball area angle 7. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments:

[0021] like Figures 1-2As shown, this utility model discloses a solder ball soldering nozzle, including a nozzle 1 and a solder ball 6. The nozzle 1 includes a housing 2, the housing 2 has a nozzle lower ball area angle 7, the housing 2 has a lower ball area 3, the housing 2 is connected to a nozzle extension area 4, and the housing 2 has a nozzle orifice 5. The solder ball 6 is built into the housing 2 and the nozzle extension area. The nozzle 4 can enhance the strength of the outer periphery of the nozzle orifice 5, greatly slowing down the rate of nozzle orifice diameter expansion caused by the use of a needle, thus increasing the service life of the nozzle 1. After the liquid solder is ejected from the nozzle orifice 5, an airflow is formed to surround the liquid solder, playing a certain guiding role and improving the problem that the solder dross accumulated at and near the nozzle orifice 5 causes the liquid solder to deflect in the direction after leaving the nozzle orifice 5.

[0022] The ejection angle formed by the conical generatrix of the nozzle extension zone 4 is the same as the angle between the conical generatrix of the lower ball zone 3.

[0023] Nozzle 1 is made of tungsten carbide or alumina ceramic.

[0024] The diameter of the solder ball 6 is 0.2-1mm.

[0025] The angle between the conical generatrices of the lower ball area 3 is 10 degrees and 25 degrees.

[0026] The diameter of nozzle orifice 5 is 90% to 98% of the diameter of the solder ball.

[0027] In this embodiment, the diameter of the solder ball 6 is 0.76 mm, the ejection angle formed by the generatrix of the nozzle extension area 4 and the conical generatrix of the lower ball area 3 at the upper end of the nozzle 1 are both 18 degrees, the length of the nozzle extension area 4 is 1.2 mm, and the nozzle of the solder ball 6 is 0.72 mm.

[0028] The specific implementation process is as follows:

[0029] In use, first replace nozzle 1 in this embodiment, control the spraying of liquid tin, so that when the liquid tin is sprayed out of nozzle 5, an airflow is formed around the liquid tin, which plays a certain guiding role, improving the problem that the tin dross accumulated at and near nozzle 5 causes the liquid tin to deflect in the direction after leaving nozzle 5, and then soldering can be performed.

[0030] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A solder ball nozzle, characterized in that: Includes a nozzle (1) and a solder ball (6). The nozzle (1) includes a housing (2). The housing (2) has a nozzle lower ball area angle (7). The housing (2) has a lower ball area (3). The housing (2) is connected to a nozzle extension area (4). The housing (2) has a nozzle opening (5). The solder ball (6) is built into the housing (2) and the nozzle extension area (4).

2. The solder ball nozzle according to claim 1, characterized in that: The ejection angle formed by the conical generatrix of the nozzle extension area (4) is the same as the angle between the conical generatrix of the lower ball area (3).

3. A solder ball nozzle according to claim 1, characterized in that: The nozzle (1) is made of tungsten carbide or alumina ceramic.

4. A solder ball nozzle according to claim 1, characterized in that: The diameter of the solder ball (6) is 0.2 to 1 mm.

5. A solder ball nozzle according to claim 1, characterized in that: The included angle of the conical generatrix of the lower sphere region (3) is 10 degrees to 25 degrees.

6. A solder ball nozzle according to claim 1, characterized in that: The diameter of the nozzle (5) is 90% to 98% of the diameter of the solder ball (6).

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