A novel heating platform curing carrier

Abstract

The utility model relates to heating solidification equipment technical field especially relates to a novel heating platform solidification carrier, include: heating equipment, heating equipment includes the casing, is installed with the heating plate of heating wire on the casing, the carrier is installed on the heating plate of heating equipment, and the carrier is composed of the bottom plate and the cover plate, and the bottom plate and the cover plate are hinged between the activity, are equipped with a plurality of nylon pressure strips in the cover plate inboard, the utility model can ensure that the solder paste is fully melted and is evenly laid on entire substrate, avoids the problem that the solder paste is bubbled, and the thickness is uneven, also effectively solved the solidification quality problem that the existing heating platform temperature control is not improper results in, and the solder paste layer that the solder paste after melting can completely cover the substrate that the light reflection performance is poor, significantly improves the light reflection effect of entire substrate area, also makes it have better heat conductivity, finally guarantees the luminous effect and long -term use stability of LED light source structure.

Description

Technical Field

[0001] This utility model relates to the field of heating and curing equipment technology, specifically a novel heating platform curing carrier. Background Technology

[0002] In the field of solder paste curing for LED chips and substrates, existing technologies mainly rely on two types of solutions to achieve solder paste curing: one is the vacuum reflow oven. This equipment can eliminate porosity caused by flux volatilization or gas residue through a vacuum environment, ensuring the density and reliability of the solder joints. It is widely used in fields with extremely high requirements for soldering quality, such as aerospace, automotive electronics, and medical equipment. However, it has significant drawbacks, such as high equipment procurement, maintenance, and operating costs, a significant increase in the time of a single production cycle due to the vacuuming process, and limited space inside the oven, making it difficult to meet the centralized curing needs of large-volume, large-size panels. The other is the ordinary heating platform. Although this solution is cheaper than the vacuum reflow oven, it has the problem of temperature control. Too high a temperature can easily cause burns and damage to the PPA material of the bracket, while too low a temperature will cause the solder paste to not melt sufficiently, making it impossible to achieve effective soldering. It is difficult to balance curing quality and bracket safety. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a novel heating platform curing carrier, which solves the technical problems of high procurement and maintenance costs, long production cycles and limited capacity of vacuum reflow oven equipment, and the tendency of ordinary heating platforms to burn the PPA support or fail to melt solder paste due to improper temperature control.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a novel heating platform curing carrier, comprising: A heating device, the heating device including a housing, on which a heating plate with heating wire is mounted; The carrier is mounted on the heating plate of the heating equipment. The carrier consists of a base plate and a cover plate, which are hinged to each other. Several positioning grooves are provided on the base plate, and several nylon strips are fixed on the inner side of the cover plate. The LED bracket is placed in a positioning groove. The LED bracket includes a frame, on which several arrays of LED units are arranged. Each LED unit includes a substrate and an LED chip. The bottom of the LED chip has positive and negative electrodes, and solder paste is provided between the positive and negative electrodes at the bottom of the LED and the substrate.

[0005] Preferably, the front of the housing is provided with a thermostat for controlling the operation of the heating wire and a switch for controlling the opening and closing of the entire heating device.

[0006] Preferably, the temperature controller controls the heating wire to a heating temperature range of 260℃-280℃ and a heating time range of 10s-20s.

[0007] Preferably, the nylon strips are spaced apart along the length of the cover plate, and the positions of the nylon strips correspond to those of the LED brackets.

[0008] Preferably, a fixing post is fixedly provided on the base plate, and an elliptical locking block is rotatably connected to the fixing post.

[0009] Preferably, the cover plate is provided with a locking groove that is adapted to the locking block.

[0010] By employing the above technical solution, this utility model provides a novel heating platform curing carrier, which has at least the following beneficial effects: 1. This utility model uses a nylon pressure strip inside the carrier to ensure stable contact between the LED bracket and the carrier. With the help of a temperature controller, the heating wire is precisely heated within the range of 260℃-280℃ for 10s-20s, ensuring that the solder paste is fully melted and evenly spread on the entire substrate. This avoids problems such as solder paste bubbling and uneven thickness, and also effectively solves the curing quality problems caused by improper temperature control of existing heating platforms. At the same time, the solder paste layer formed after melting can completely cover the substrate with poor reflectivity, significantly improving the reflectivity of the entire substrate area. Moreover, the uniform solder paste layer has better thermal conductivity, which is beneficial to the heat conduction of the LED chip, ultimately ensuring the luminous effect and long-term stability of the LED light source structure.

[0011] 2. This utility model has a simple and reasonable structure, does not require a complex vacuum system, significantly reduces equipment cost, and has a small size and occupies little space, reducing site and equipment investment costs. It not only improves production efficiency, but can also be flexibly adapted to scenarios such as sample making and small-batch production. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application: Figure 1 This is a three-dimensional structural diagram of the entire utility model; Figure 2 This is a schematic diagram of the planar structure of the LED bracket of this utility model; Figure 3 This is a schematic diagram of the LED unit of this utility model; Figure 4 This utility model Figure 1 Enlarged structural diagram at point A in the middle.

[0013] Figure label: 1. Heating equipment; 11. Housing; 111. Thermostat; 112. Switch; 12. Heating plate; 2. Carrier; 21. Base plate; 211. Positioning groove; 212. Fixing column; 213. Locking block; 22. Cover plate; 221. Nylon strip; 222. Locking groove; 3. LED bracket; 31. Frame; 32. LED unit; 321. Substrate; 322. Solder paste; 323. Chip; 324. Positive and negative electrodes. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Due to the inherent limitations of existing technologies, such as high procurement and maintenance costs, long production cycles, limited capacity, and susceptibility to PPA burns or incomplete melting of solder paste 322 caused by improper temperature control, please refer to [the relevant documentation / reference]. Figures 1-4This embodiment provides a novel heating platform curing carrier 2, which ensures that the solder paste 322 is fully melted and evenly spread on the entire substrate 321, avoiding problems such as bubbling and uneven thickness of the solder paste 322. It also effectively solves the curing quality problems caused by improper temperature control of existing heating platforms. Furthermore, the solder paste 322 layer formed after melting can completely cover the substrate 321 with poor reflectivity, significantly improving the reflectivity of the entire substrate 321 area. The uniform solder paste 322 layer also has better thermal conductivity, which is beneficial for the heat conduction of the LED chip 323, ultimately ensuring the luminous effect and long-term stability of the LED light source structure. The curing carrier 2 includes: a heating device 1, which includes a housing 11, on which a heating plate 12 with heating wire is installed; and a carrier 2, which is installed on the heating plate 12 of the heating device 1. The carrier 2 consists of a base plate 21 and a cover plate 22, which are hinged together. The cover plate 22 has several positioning grooves 211 and several nylon strips 221 fixed on its inner side. The LED bracket 3 is placed in the positioning grooves 211. The LED bracket 3 includes a frame 31, on which several arrays of LED units 32 are arranged. The LED unit 32 includes a substrate 321 and an LED chip 323. The bottom of the LED chip 323 is provided with positive and negative electrodes 324. Solder paste 322 is provided between the positive and negative electrodes 324 at the bottom of the LED and the substrate 321. The basic heating structure is formed by the housing 11 and the heating plate 12 with heating wire. With the hinged carrier 2, the positioning grooves 211 on the base plate 21 are used to achieve precise positioning of the LED bracket 3. The nylon strips 221 on the cover plate 22 can ensure stable contact between the LED bracket 3 and the carrier 2, and ensure that the solder paste 322 is heated evenly. It is adapted to the curing requirements of the substrate 321, chip 323 and solder paste 322 in the LED unit 32, which can improve the welding accuracy and curing stability.

[0016] Existing conventional heating platforms lack precise temperature control devices, which can easily lead to problems such as burns to the PPA support or unmelted solder paste 322. To address this issue, a temperature controller 111 for controlling the operation of the heating wire and a switch 112 for controlling the on / off state of the entire heating device 1 are provided on the front of the housing 11. The integrated temperature controller 111 and on / off switch 112 on the front of the housing 11 enable convenient operation and precise control of the heating state, avoid the problem of temperature runaway in existing solutions, and improve the ease of use and curing reliability of the equipment.

[0017] Existing conventional heating platforms are prone to issues such as burns to the PPA support or incomplete melting of the 322 solder paste, failing to balance curing efficiency and quality. To address this problem, the temperature controller 111 controls the heating wire's temperature range to 260℃-280℃ and the heating time range to 10s-20s. By clearly defining the temperature range of 260℃-280℃ and the time range of 10s-20s, the system precisely matches the requirement for complete melting of the 322 solder paste, avoiding support damage or incomplete curing of the 322 solder paste caused by abnormal temperatures. This significantly shortens the production cycle and balances curing quality and efficiency.

[0018] The existing carrier 2 lacks a pressing component, resulting in uneven local pressure on the LED bracket 3 during heating, leading to gaps in contact with the carrier 2. This, in turn, causes insufficient heating of the solder paste 322 in certain areas and poor flatness after melting. To address this issue, nylon pressure strips 221 are spaced along the length of the cover plate 22, and their positions correspond to those of the LED bracket 3. The nylon pressure strips 221 ensure that they act precisely on the LED bracket 3 after the cover plate 22 is closed, avoiding uneven local pressure on the LED bracket 3, ensuring stable contact between the LED bracket 3 and the carrier 2, allowing the solder paste 322 to melt evenly, improving the flatness of the melted solder paste 322, and solving the problem of uneven contact in the existing pressing structure.

[0019] The existing locking structures of the cover plate 22 and the base plate 21 of the carrier 2 are mostly snap-fit ​​or bolt-fit. Snap-fit ​​structures are prone to loosening, and bolt-fit structures are cumbersome to operate, resulting in unstable pressing force after the cover plate 22 is closed, which affects the curing effect of the solder paste 322. To address this issue, a fixing post 212 is fixed on the base plate 21, and an elliptical locking block 213 is rotatably connected to the fixing post 212. The cover plate 22 is provided with a locking groove 222 that matches the locking block 213. The locking groove 222 and the locking block 213 are precisely matched, enabling the carrier 2 cover plate 22 to lock quickly and stably, avoiding locking misalignment or detachment, and simplifying the locking operation process. At the same time, it ensures continuous and stable pressing after the cover plate 22 is closed, ensuring that the LED bracket 3 and the carrier 2 are in a stable contact state, providing a stable pressing environment for the solder paste 322 to be heated evenly, and improving the reliability of the production process.

[0020] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0021] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel heating platform curing carrier, characterized in that, include: Heating device (1), the heating device (1) includes a housing (11), and a heating plate (12) with heating wire is installed on the housing (11). The carrier (2) is installed on the heating plate (12) of the heating device (1). The carrier (2) consists of a base plate (21) and a cover plate (22). The base plate (21) and the cover plate (22) are hinged together. Several positioning grooves (211) are provided on the base plate (21), and several nylon strips (221) are fixed on the inner side of the cover plate (22). LED bracket (3), the LED bracket (3) is placed in positioning groove (211), the LED bracket (3) includes frame (31), the frame (31) is provided with a number of arrayed LED units (32), the LED unit (32) includes substrate (321) and LED chip (323), the bottom of the LED chip (323) is provided with positive and negative electrodes (324), and solder paste (322) is provided between the positive and negative electrodes (324) at the bottom of the LED and the substrate (321).

2. The novel heating platform curing carrier according to claim 1, characterized in that, The front of the housing (11) is provided with a thermostat (111) for controlling the operation of the heating wire and a switch (112) for controlling the opening and closing of the entire heating device (1).

3. The novel heating platform curing carrier according to claim 2, characterized in that, The temperature controller (111) controls the heating temperature range of the heating wire to be 260℃-280℃ and the heating time range to be 10s-20s.

4. The novel heating platform curing carrier according to claim 1, characterized in that, The nylon strips (221) are distributed at intervals along the length of the cover plate (22), and the positions of the nylon strips (221) and the LED brackets (3) correspond to each other.

5. The novel heating platform curing carrier according to claim 1, characterized in that, A fixing post (212) is fixed on the base plate (21), and an elliptical locking block (213) is rotatably connected to the fixing post (212).

6. The novel heating platform curing carrier according to claim 5, characterized in that, The cover plate (22) is provided with a locking groove (222) that is compatible with the locking block (213).

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