A laser etching device for micro-solder resist opening circuit board

Abstract

The utility model discloses a kind of micro solder-stop windowing circuit board laser etching devices, it is related to circuit board processing equipment technical field, including platen, the top of the platen is equipped with laser generator, the output end of the laser generator is equipped with laser head, the top of the platen is fixedly provided with clamping seat, the top of the clamping seat is clamped and equipped with plate body, the one side of the platen top is rotatably provided with pressing plate by rotating seat;The beneficial effects of the utility model are: by the insertion rod in box body and support component can be firmly locked the position of pressing plate, guarantee fixed reliability, combined with the clamping setting clamping seat, effectively avoid that position deviation occurs in the processing of circuit board, ensure that etching windowing and preset position match, guarantee the welding quality of subsequent circuit board;Setting dust suction component provides power for dust suction operation, causes dust suction cover to suck in dust to enter dust collecting box smoothly, utilize filter bag to carry out effective filtration collection to dust, avoid dust leakage.

Description

Technical Field

[0001] This utility model relates to a laser etching device, and more particularly to a laser etching device for micro-solder resist windowed circuit boards, belonging to the technical field of circuit board processing equipment. Background Technology

[0002] Micro-opening solder mask circuit boards are printed circuit boards (PCBs) that use high-precision processes to create tiny openings in the solder mask layer to expose specific areas of copper foil, meeting the needs of high-density soldering, heat dissipation, electrical testing, or special functions. The core of this technology lies in the refined opening design of the solder mask layer, combining microelectronics, materials science, and precision machining processes in PCB manufacturing; laser etching equipment is used during the PCB fabrication process.

[0003] Existing laser etching equipment has the following problems in practical applications: First, the circuit board is prone to positional shift during transportation and etching, and there is a lack of positioning settings for positioning it, resulting in the etching window not matching the preset position, which affects the subsequent welding quality of the circuit board; Second, debris is generated during the etching process, and if it is not cleaned in time, it will adhere to the surface of the circuit board and affect the etching effect. Utility Model Content

[0004] The purpose of this invention is to provide a laser etching device for micro-solder resist windowed circuit boards, in order to solve the problems mentioned in the background art, such as easy deviation during circuit board transportation and etching, lack of positioning settings leading to mismatch between the window and the preset, and etching debris adhering to the surface and affecting the effect if not cleaned in time.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a laser etching device for micro-solder resist windowed circuit boards, comprising a platform, a laser generator disposed above the platform, a laser head disposed at the output end of the laser generator, a mounting bracket fixedly disposed at the top of the platform, a plate being engaged at the top of the mounting bracket, a pressure plate being rotatably disposed on one side of the top of the platform via a rotating seat, the pressure plate being in contact with one side of the top of the plate, a box being fixedly disposed in the middle of the top of the platform, a rod being slidably disposed inside the box and inserted into the pressure plate, a support assembly being disposed inside the box, dust collection hoods being fixedly disposed on both sides of the top of the platform, a dust collection box being disposed below the platform, a filter bag being disposed inside the dust collection box, and a dust collection assembly being disposed at the bottom of the dust collection box.

[0006] As a preferred embodiment of this utility model, a longitudinal axis moving seat is fixedly provided on one side of the top of the platform, and a transverse axis moving seat is fixedly provided on the slide of the longitudinal axis moving seat. The slide of the transverse axis moving seat is fixedly connected to one side of the laser generator.

[0007] As a preferred embodiment of this utility model, a base is fixedly provided at the bottom of the platform, and a gap is left between the base and the dust collection box.

[0008] As a preferred technical solution of this utility model, a conveying pipe is fixedly provided between the dust collection hood and the dust collection box, and a box door is hinged to one side of the dust collection box by two hinges. The surface of the box door is engaged with the surface of the dust collection box by two buckles.

[0009] As a preferred embodiment of this utility model, a sealing strip is fixedly provided at the connection between the box door and the dust collection box, a handle is fixedly provided in the middle of the box door, and a ventilation groove is provided at the bottom of the dust collection box.

[0010] As a preferred embodiment of this utility model, the support component includes a pull rod, which is slidably disposed inside the box. One end of the pull rod is fixedly provided with a sliding plate, which is fixedly connected to the insert rod and slidably connected to the box.

[0011] As a preferred embodiment of this utility model, a pull ring is fixedly provided at one end of the pull rod, a support spring is sleeved on the surface of the pull rod, one end of the support spring is fixedly connected to one side of the slide plate, and the other end of the support spring is fixedly connected to the inner wall of one side of the box.

[0012] As a preferred technical solution of this utility model, the dust collection assembly includes a motor, which is fixedly installed in the middle of the bottom of the inner wall of the dust collection box. The output shaft of the motor is fixedly provided with a fan blade. The top of the filter bag is fixedly provided with a fixing plate. Slide rails are slidably provided on both sides of the fixing plate. One side of the slide rail is fixedly connected to one side of the inner wall of the dust collection box.

[0013] Compared with related technologies, the laser etching device for micro-solder resist windowed circuit boards provided by this utility model has the following beneficial effects: 1. The insertion rod and support components inside the box can securely lock the pressure plate position, ensuring reliable fixation. Combined with the snap-fit ​​mounting bracket, it effectively prevents the circuit board from shifting position during processing, ensuring that the etched opening matches the preset position and guaranteeing the subsequent soldering quality of the circuit board.

[0014] 2. The device has dust suction hoods fixed on both sides of the top of the platform, which are connected to the dust collection box below through the conveying pipe. The dust collection box is equipped with filter bags. Combined with the dust suction components, it provides power for the dust suction operation, so that the dust sucked in by the dust suction hood can smoothly enter the dust collection box. The filter bags can effectively filter and collect the dust, preventing dust leakage. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is an exploded structural diagram of the platform of this utility model; Figure 3 This is an exploded structural diagram of the card holder of this utility model; Figure 4 This is a cross-sectional structural diagram of the box body of this utility model; Figure 5 This is an exploded structural diagram of the dust collection box of this utility model; Figure 6 This is a cross-sectional structural diagram of the dust collection box of this utility model.

[0016] In the diagram: 1. Platform; 2. Laser generator; 3. Card slot; 4. Plate body; 5. Rotating seat; 6. Pressure plate; 7. Box body; 8. Insert rod; 9. Support assembly; 901. Pull rod; 902. Support spring; 903. Slide plate; 904. Pull ring; 10. Dust hood; 11. Dust collection box; 12. Filter bag; 13. Dust collection assembly; 1301. Motor; 1302. Fan blade; 1303. Fixing plate; 1304. Slide rail; 14. Ventilation slot; 15. Box door; 16. Buckle; 17. Vertical axis moving seat; 18. Horizontal axis moving seat; 19. Base; 20. Conveying pipe. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-6This utility model provides a laser etching device for micro-solder resist windowed circuit boards, including a platform 1, with a laser generator 2 mounted on top of the platform 1. The platform 1 provides a stable support base, and the laser generator 2, in conjunction with a laser head, can perform etching operations. A laser head is mounted at the output end of the laser generator 2. A mounting bracket 3 is fixedly mounted on the top of the platform 1, and a plate 4 is engaged with the top of the mounting bracket 3. The mounting bracket 3, in conjunction with a pressure plate 6, effectively fixes and positions the plate 4. A pressure plate 6 is rotatably mounted on one side of the top of the platform 1 via a rotating seat 5. The pressure plate 6 is in contact with one side of the top of the plate 4. The rotating seat 5 facilitates the opening and closing of the pressure plate 6. The position of the pressure plate 6 is securely locked by a rod 8 and a support component 9 within a housing 7, ensuring reliable fixation and preventing positional shift of the circuit board during processing, thus ensuring that the windowed area matches the preset position. To ensure the quality of subsequent circuit board soldering, a box 7 is fixedly installed at the center of the top of the platform 1. Inside the box 7, a plug rod 8 that is inserted into the pressure plate 6 is slidably installed. Inside the box 7, a support component 9 is installed. Dust collection hoods 10 are fixedly installed on both sides of the top of the platform 1. A dust collection box 11 is installed below the platform 1. The dust collection box 11 contains a filter bag 12. Through the dust collection hoods 10 installed on both sides of the platform 1, combined with the dust collection box 11, filter bag 12 and dust collection component 13 below, dust and impurities generated during etching can be removed in time, maintaining a clean working environment and preventing dust from adhering and affecting the etching quality of the circuit board. A dust collection component 13 is installed at the bottom inside the dust collection box 11. The dust collection component 13 provides power for the dust collection operation, which promotes the dust sucked in by the dust collection hoods 10 to enter the dust collection box 11 smoothly. The filter bag 12 can effectively filter and collect the dust, preventing dust leakage.

[0019] Support assembly 9 includes a pull rod 901, which is slidably disposed inside the box body 7. A slide plate 903 is fixedly attached to one end of the pull rod 901, and the slide plate 903 is fixedly connected to the insert rod 8 and slidably connected to the box body 7. A pull ring 904 is fixedly attached to one end of the pull rod 901, and a support spring 902 is sleeved on the surface of the pull rod 901. One end of the support spring 902 is fixedly connected to one side of the slide plate 903, and the other end of the support spring 902 is fixedly connected to the inner wall of one side of the box body 7. Through the support component 9, the pull ring 904 and the pull rod 901 pull the slide plate 903 to move the insertion rod 8, so as to realize the insertion or separation of the insertion rod 8 and the pressure plate 6, thereby facilitating the opening or fixing of the pressure plate 6. Combined with the card seat 3, it can achieve the effect of positioning and fixing the pressure plate 6. The support spring 902 pushes the slide plate 903 through the elastic force, so that the insertion rod 8 always maintains a tight insertion state with the pressure plate 6, and the sliding cooperation between the slide plate 903 and the box body 7 ensures the smooth movement of the insertion rod 8.

[0020] The dust collection assembly 13 includes a motor 1301, which is fixedly installed in the middle of the bottom of the inner wall of the dust collection box 11. The output shaft of the motor 1301 is fixedly equipped with a fan blade 1302. A fixing plate 1303 is fixedly installed on the top of the filter bag 12. Slide rails 1304 are slidably installed on both sides of the fixing plate 1303. One side of the slide rail 1304 is fixedly connected to one side of the inner wall of the dust collection box 11. The motor 1301 drives the fan blade 1302 to rotate and generate negative pressure, which provides power for the dust collection operation and facilitates the dust sucked in by the dust collection hood 10 to enter the dust collection box 11 smoothly. The filter bag 12 can effectively filter and collect the dust and prevent dust leakage. The sliding cooperation between the fixing plate 1303 and the slide rail 1304 facilitates the installation, disassembly and cleaning of the filter bag 12 and reduces the difficulty of maintenance.

[0021] A conveying pipe 20 is fixedly installed between the dust collection hood 10 and the dust collection box 11. A door 15 is hinged to one side of the dust collection box 11 via two hinges. The surface of the door 15 is engaged with the surface of the dust collection box 11 via two latches 16. A sealing strip is fixedly installed at the connection between the door 15 and the dust collection box 11. A handle is fixedly installed in the middle of the door 15. A ventilation slot 14 is opened at the bottom of the dust collection box 11. The conveying pipe 20 enables effective communication between the dust collection hood 10 and the dust collection box 11, ensuring smooth dust conveying. The hinged door 15 and the latches 16 cooperate to facilitate opening the dust collection box 11 for maintenance operations such as replacing the filter bag 12. The sealing strip enhances the sealing performance between the door 15 and the dust collection box 11, preventing dust from leaking out of gaps. The ventilation slot 14 ensures air circulation inside the dust collection box 11 and ensures the formation of negative pressure.

[0022] A longitudinal axis moving seat 17 is fixedly installed on one side of the top of the platform 1. A transverse axis moving seat 18 is fixedly installed on the slide of the longitudinal axis moving seat 17. The slide of the transverse axis moving seat 18 is fixedly connected to one side of the laser generator 2. The longitudinal axis moving seat 17 drives the transverse axis moving seat 18 to achieve longitudinal movement, and the transverse axis moving seat 18 drives the laser generator 2 to achieve transverse movement. The two work together to allow the laser generator 2 and the laser head to be flexibly adjusted on the horizontal plane to meet the etching requirements of different areas of the circuit board. A CCD vision inspection instrument and a displacement sensor (not shown in the figure) are also installed at the transverse axis moving seat 18 to facilitate precise adjustment of the position of the laser generator 2. The CCD vision inspection instrument and the displacement sensor are controlled by a controller.

[0023] A base 19 is fixedly provided at the bottom of the table 1, and a gap is left between the base 19 and the dust collection box 11; the base 19 provides stable support for the table 1, and the gap between the base 19 and the dust collection box 11 facilitates the exhaust operation.

[0024] When using the equipment, first check its status. Specifically: connect the main power supply to the device, start the laser generator 2, and check whether the laser head can emit laser normally and whether the laser intensity meets the etching requirements; start the motor 1301 of the dust collection component 13, observe whether the fan blade 1302 rotates normally, feel whether there is obvious suction through the dust collection hood 10, and ensure that the air circulation inside the dust collection box 11 is smooth and the negative pressure is formed normally; adjust the vertical axis moving seat 17 and the horizontal axis moving seat 18, check whether their slides move smoothly without any jamming, and at the same time confirm whether the CCD vision inspection instrument and displacement sensor on the horizontal axis moving seat 18 are working properly and whether the data transmission is accurate. Next, the operator pulls the pull ring 904 by hand. The pull ring 904 drives the pull rod 901 to move outward from the box 7. The pull rod 901 pulls the slide plate 903 to slide inside the box 7. At this time, the support spring 902 is compressed. The slide plate 903 drives the insertion rod 8 to move synchronously, so that the insertion rod 8 is disengaged from the pressure plate 6, and the locking of the pressure plate 6 is released. Then, with the rotating seat 5 as the axis, the pressure plate 6 is rotated upward to open it to a position that does not affect the placement of the circuit board. Then, the board 4 to be etched is aligned with the card holder 3 at the top of the platform 1, and the board 4 is placed on the card holder 3, ensuring that the edge of the board 4 is aligned with the positioning edge of the card holder 3 to achieve initial positioning. The pressure plate 6 is rotated downward. The bottom end of the pressure plate 6 is provided with a rubber pad, so that the pressure plate 6 is tightly attached to one side of the top of the board 4 to press the board 4. Release the pull ring 904, and the support spring 902 pushes the slide plate 903 to slide inward to the box 7 under the action of elastic restoring force. The slide plate 903 drives the insertion rod 8 to move in the opposite direction, so that the insertion rod 8 is inserted into the corresponding slot of the pressure plate 6, and the pressure plate 6 is locked, thereby fixing the plate 4 firmly on the platform 1 to prevent position displacement during the etching process. Next, based on the preset position and size requirements of the micro-solder resist openings on the board 4, the movement parameters of the longitudinal axis moving seat 17 and the transverse axis moving seat 18 are set through the device's control system. The CCD vision inspection instrument on the transverse axis moving seat 18 acquires images of the board 4, and compares the acquired images with the preset etching pattern. The displacement sensor detects the position information of the laser generator 2 in real time and feeds the data back to the control system. The control system drives the longitudinal axis moving seat 17 and the transverse axis moving seat 18 to move according to the feedback data, adjusting the laser generator 2 and the laser head. The position allows the laser head to be precisely aligned with the etching start position, and the plate 4 can be etched. At the same time as the etching operation begins, the dust collection component 13 continues to operate. By controlling the motor 1301 to drive the fan blades 1302 to rotate at high speed, a negative pressure is formed in the dust collection box 11. Under the action of negative pressure, the dust and impurities generated during the etching process are sucked in through the dust collection hoods 10 on both sides of the plate 1, and transported to the dust collection box 11 through the conveying pipe 20. The dust is filtered and collected by the filter bag 12 to prevent dust from adhering to the surface of the plate 4 and affecting the etching quality, while maintaining a clean working environment. After the etching operation is completed, first turn off the laser generator 2 to stop laser emission; after the motor 1301 in the dust collection component 13 continues to run for a period of time, ensure that all residual dust generated by etching is removed, then turn off the motor 1301 to stop the dust collection operation. Repeat the above steps to remove the etched board 4.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A laser etching apparatus for micro-solder resist windowed circuit boards, comprising a platform (1), characterized in that, A laser generator (2) is provided above the platform (1). The output end of the laser generator (2) is provided with a laser head. A card seat (3) is fixedly provided at the top of the platform (1). A plate body (4) is engaged at the top of the card seat (3). A pressure plate (6) is rotatably provided on one side of the top of the platform (1) via a rotating seat (5). The pressure plate (6) is in contact with one side of the top of the plate body (4). A box body (7) is fixedly provided in the middle of the top of the platform (1). A plug rod (8) that is inserted into the pressure plate (6) is slidably provided inside the box body (7). A support component (9) is provided inside the box body (7). Dust collection hoods (10) are fixedly provided on both sides of the top of the platform (1). A dust collection box (11) is provided below the platform (1). A filter bag (12) is provided inside the dust collection box (11). A dust collection component (13) is provided at the bottom of the dust collection box (11).

2. The laser etching apparatus for micro-resist solder mask windowed circuit boards according to claim 1, characterized in that: A longitudinal axis moving seat (17) is fixedly provided on one side of the top of the platform (1), and a transverse axis moving seat (18) is fixedly provided on the slide of the longitudinal axis moving seat (17). The slide of the transverse axis moving seat (18) is fixedly connected to one side of the laser generator (2).

3. The laser etching apparatus for micro-solder resist windowed circuit boards according to claim 1, characterized in that: The bottom end of the platform (1) is fixedly provided with a base (19), and there is a gap between the base (19) and the dust collection box (11).

4. The laser etching apparatus for micro-solder resist windowed circuit boards according to claim 1, characterized in that: A conveying pipe (20) is fixed between the dust collection hood (10) and the dust collection box (11). A door (15) is hinged to one side of the dust collection box (11) by two hinges. The surface of the door (15) is engaged with the surface of the dust collection box (11) by two buckles (16).

5. The laser etching apparatus for micro-resist solder mask windowed circuit boards according to claim 4, characterized in that: A sealing strip is fixed at the connection between the box door (15) and the dust collection box (11). A handle is fixed in the middle of the box door (15). A ventilation slot (14) is opened at the bottom of the dust collection box (11).

6. The laser etching apparatus for micro-solder resist windowed circuit boards according to claim 1, characterized in that: The support assembly (9) includes a pull rod (901), which is slidably disposed inside the box body (7). One end of the pull rod (901) is fixedly provided with a sliding plate (903), which is fixedly connected to the insert rod (8) and slidably connected to the box body (7).

7. The laser etching apparatus for micro-solder resist windowed circuit boards according to claim 6, characterized in that: One end of the pull rod (901) is fixedly provided with a pull ring (904), and a support spring (902) is sleeved on the surface of the pull rod (901). One end of the support spring (902) is fixedly connected to one side of the slide plate (903), and the other end of the support spring (902) is fixedly connected to the inner wall of one side of the box body (7).

8. The laser etching apparatus for micro-solder resist windowed circuit boards according to claim 1, characterized in that: The dust collection assembly (13) includes a motor (1301), which is fixedly installed in the middle of the bottom of the inner wall of the dust collection box (11). The output shaft of the motor (1301) is fixedly provided with a fan blade (1302). The top of the filter bag (12) is fixedly provided with a fixing plate (1303). Both sides of the fixing plate (1303) are slidably provided with slide rails (1304). One side of the slide rail (1304) is fixedly connected to one side of the inner wall of the dust collection box (11).

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