A laser rubber cutting device

Abstract

The utility model relates to a kind of laser cutting gum device, relate to PCB board field.Laser cutting gum device is movably arranged in conveying device both sides, for cutting gum to the board on conveying device, rotating lifting mechanism is equipped in the middle of conveying device, for supporting and rotating the position of switching board, corresponding to rotating lifting mechanism upper side is equipped with down pressure mechanism.The utility model forms lower limit by rotating lifting mechanism itself lifting assembly, down pressure mechanism installation height forms upper limit, board lifting stroke is constrained in pre-set interval, without artificial calibration can ensure and laser emission position accurate matching, avoid equipment failure and board damage.

Description

Technical Field

[0001] This utility model relates to the field of PCB boards, specifically to a laser adhesive cutting device. Background Technology

[0002] In the PCB manufacturing industry, after drilling, laminated PCBs need to be de-adhesive-cut to separate them. Laser de-adhesive cutting is gradually replacing traditional blade cutting methods in related equipment due to its advantages such as not requiring frequent blade changes and stable cutting quality. However, existing laser de-adhesive cutting equipment still has significant technical defects in the rotation switching process: When the rotation speed is increased to improve work efficiency, the large centrifugal force generated by high-speed rotation can easily cause the PCB board to shift or sway relative to the rotating lifting mechanism, and even cause the edges of the board to be bumped and damaged, which will have an adverse effect on the processing quality of the workpiece. If the rotation speed is reduced to avoid damage to the workpiece by centrifugal force, the time for each rotation switch will be too long, which will significantly extend the overall glue cutting operation cycle, making it difficult for the equipment to adapt to the efficiency requirements of mass production scenarios and not in line with the consideration of economic production of enterprises.

[0003] Therefore, how to avoid the displacement and damage to the PCB board caused by centrifugal force during high-speed rotation in the rotation switching process of laser glue cutting equipment, while ensuring the rotation switching efficiency to meet the needs of economical production, and enhancing the fixation stability of the PCB board during rotation, has become an urgent problem to be solved in the industry. Utility Model Content

[0004] To address the shortcomings of the prior art, this utility model provides a laser glue cutting device.

[0005] The technical solution of this utility model is as follows: A laser adhesive cutting device includes a conveying device, with the laser adhesive cutting device movably mounted on both sides of the conveying device for cutting adhesive on the sheet material on the conveying device. A rotary lifting mechanism is located in the middle of the conveying device to support and rotate the sheet material, and a pressing mechanism is located above the rotary lifting mechanism. This invention constrains the sheet material's lifting stroke within a preset range by using the lower limit formed by the lifting component of the rotary lifting mechanism and the upper limit formed by the installation height of the pressing mechanism. This ensures precise matching with the laser emission position without manual calibration, avoiding equipment malfunctions and sheet material damage.

[0006] As a preferred embodiment, the conveying device is equipped with an adjustment station and a cutting station. Both the adjustment station and the cutting station are equipped with the aforementioned rotary lifting mechanism and pressing mechanism. The laser cutting device is installed on both sides of the cutting station.

[0007] As a preferred embodiment, the rotary lifting mechanism includes a disc and an adsorption through-hole at the bottom of the disc for adsorbing the bottom of the plate.

[0008] As a preferred embodiment, the pressing mechanism includes a circular plate near the rotary lifting mechanism and a micro-pressure cylinder movably connected to the circular plate.

[0009] As a preferred embodiment, the conveying device has a first plane above the plate when conveying the plate, and a second plane below the plate when the disc is micro-pressed, and the lifting stroke of the disc includes at least the first plane to the second plane.

[0010] As a preferred embodiment, the pressing mechanism is provided with a support frame located above the rotary lifting mechanism. The bottom of the support frame is provided with a connecting through hole, through which a micro-pressure cylinder passes and is connected to the circular plate via a transmission mechanism.

[0011] As a preferred embodiment, the rotary lifting mechanism is equipped with a guide platform, which is fixed to the bottom of the conveying device. The guide platform is equipped with a first clearance position. When the disc reaches the lowest side through the rotary lifting mechanism, the top plane of the disc is equal to or less than the height of the conveying surface of the conveying device, so that the plate can finally fall into the upper surface of the conveying device for conveying.

[0012] As a preferred embodiment, the rotary lifting mechanism includes a lifting mechanism and a rotating mechanism, with an adsorption mechanism provided between the rotating mechanism and the disc; the lifting mechanism connects the adsorption mechanism and the disc through the rotating mechanism.

[0013] As a preferred option, a first clearance position is provided on one side of the guide platform.

[0014] As a preferred embodiment, a detection device is provided on the other side of the guide table to detect the matching distance between the board and the workstation. This device includes a first detection device located at the adjustment workstation or a second detection device located at the glue cutting workstation. The second detection device includes a glue cutting sensor and a moving mechanism for enabling the glue cutting sensor to move.

[0015] As a preferred embodiment, the guide table on the glue cutting station includes a second clearance position, and the moving mechanism includes a motor installed below the guide table, a transmission mechanism extending above the second clearance position, and a lead screw parallel to the upper surface of the guide table. A nut is connected below the glue cutting sensor, one side of the lead screw is movably connected to the transmission mechanism, and the main body of the lead screw is connected to the nut in a transmission connection.

[0016] Furthermore, guide rods are provided on both sides of the lead screw, and a slide is connected below the glue cutting sensor. The bottom of the slide is provided with a nut and sliding parts located on both sides of the slide. The bottom of the sliding parts is movably connected to the guide rods.

[0017] Furthermore, the rotating mechanism has angle markings on its side.

[0018] The advantages of this utility model based on the above solution are as follows: In this invention, the conveying device transports the board material to the rotary lifting mechanism, which then lifts the board material and rotates it above the conveying device. Combined with the pressing mechanism on the upper side, the PCB board material is partially fixed during the switching process, avoiding displacement and positioning problems caused by centrifugal force during rotation. This allows the laser adhesive cutting devices on both sides to cut adhesive on all four sides, preventing board deformation caused by concentrated local forces and limiting vertical movement and horizontal offset. This ensures that the board material is coaxial with the rotation center, solving the problem of misalignment between the board material and the laser cutter after rotation in the prior art. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the rubber cutting workshop of this utility model; Figure 2 This is a three-dimensional structural diagram of the laser cutting device, conveying device, and rotary lifting mechanism of this utility model; the arrows indicate the processing direction. Figure 3 This is a schematic diagram of the first structure of the guide table on the glue cutting station of this utility model; Figure 4 This is a schematic diagram of the second structure of the guide platform on the adjustment station of this utility model; Figure 5 This is a three-dimensional structural diagram of the laser cutting device, conveying device, pressing mechanism, and rotary lifting mechanism of this utility model; the arrows indicate the processing direction. Figure 6 This is a top view of the processing steps of the square plate of this utility model at the adjustment station and the glue cutting station; solid arrows indicate the processing movement direction; dashed curved arrows indicate rotation adjustment actions or directions, and dashed straight arrows indicate the laser glue cutting direction.

[0020] In the diagram, 100. Conveying device; 110. Adjustment station; 120. Glue cutting station; 200. Laser glue cutting device; 300. Rotary lifting mechanism; 310. Disc; 311. Adsorption through hole; 320. Guide platform; 321. First clearance position; 322. Second clearance position; 330. First detection device; 340. Second detection device; 341. Elastic sensor; 350. Moving mechanism; 400. Pressing mechanism; 410. Circular plate; 420. Support frame; 430. Micro-pressure cylinder. Detailed Implementation

[0021] To better understand the purpose, technical solution, and technical effects of this utility model, the following description, in conjunction with the accompanying drawings and embodiments, will provide further explanation. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need further definition and explanation in subsequent drawings. It is also stated that the embodiments described below are only for explaining this utility model and are not intended to limit it.

[0022] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as "connected to" another component, it can be directly connected to the other component or there may be an intermediate component.

[0023] The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product is usually placed when in use, or the orientation or positional relationship in which a person skilled in the art would normally understand it, or the orientation or positional relationship in which the product is usually placed when in use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Example

[0024] like Figures 1-5 As shown, a glue-cutting workshop includes a main frame and an internal conveying device 100. To adapt to the needs of assembly line operation, the conveying device 100 has an adjustment station 110 and a glue-cutting station 120 arranged sequentially along the conveying direction of the board. The conveying paths of the two stations are connected in a straight line. Both the adjustment station 110 and the glue-cutting station 120 are equipped with a set of the aforementioned rotary lifting mechanism 300 and pressing mechanism 400. Only the two sides of the glue-cutting station 120 are movably equipped with the laser glue-cutting device 200. The adjustment station 110 is used for the initial first posture calibration of the board, while the glue-cutting station 120 focuses on the tape cutting and second posture calibration of the board. The continuous operation of posture adjustment and glue cutting is achieved through the division of labor among the stations.

[0025] like Figure 1-3As shown, a laser adhesive cutting device 200 is further provided with a rotary lifting mechanism 300 and a pressing mechanism 400; wherein, the conveying device 100 is used to carry and convey the board to be cut, and the laser adhesive cutting device 200 is movably arranged on both sides of the conveying device 100, and can move closer to or away from the board in a direction perpendicular to the board conveying, so as to cut the board of different widths on the conveying device 100 with tape; the rotary lifting mechanism 300 is embedded in the middle of the conveying device 100, and is used to support the board from the bottom and drive the board to switch positions for lifting and rotating; the pressing mechanism 400 is fixed above the rotary lifting mechanism 300, and is used to apply micro-pressure from the top of the board. In this embodiment, the rotary lifting mechanism 300 is equipped with a lifting component. The extension stroke of the lifting component forms the lower limit of the board, and the installation height of the pressing mechanism 400 forms the upper limit of the board. Through the cooperation of the upper and lower limits, the lifting stroke of the board can be constrained within a preset range. Without the need for repeated manual calibration of the board height, it can ensure that the position of the glue to be cut on the board is accurately matched with the laser emission position of the laser glue cutting device 200. This effectively avoids equipment component interference failure caused by overtravel and prevents the board from being damaged by cutting due to height deviation.

[0026] In this embodiment, the rotary lifting mechanism 300 includes a lifting mechanism, a rotating mechanism, an adsorption mechanism, and a disc 310, with each component connected sequentially from top to bottom. The lifting mechanism is a cylinder assembly, with its cylinder body fixed to the frame below the conveying device 100. The top of the piston rod is fixed to the housing of the rotating mechanism, driving the entire rotary lifting mechanism 300 to rise and fall vertically. The rotating mechanism is a servo motor-driven rotating assembly, with its output end facing upwards and fixed to the adsorption mechanism, driving the adsorption mechanism and the disc 310 to rotate around a vertical axis. The adsorption mechanism is a negative pressure adsorption assembly, used to generate negative pressure to adsorb the plate material. The top surface of the disc 310 is used to adhere to and support the bottom of the plate material, and the upper bottom surface of the disc 310 is evenly provided with several adsorption through holes 311. The adsorption through holes 311 are connected to the inlet of the airflow channel of the adsorption mechanism. The negative pressure from the adsorption through holes 311 acts on the bottom of the plate material, causing the plate material to stably adhere to the disc 310.

[0027] like Figure 1 , 5 As shown in Figure 6, the pressing mechanism 400 includes a circular plate 410, a micro-pressure cylinder 430, and a support frame 420. The support frame 420 is a portal frame structure, with both ends fixed to the frame on both sides of the conveying device 100, spanning above the rotary lifting mechanism 300. The circular plate 410 is horizontally positioned below the support frame 420. The top of the circular plate 410 is connected to the micro-pressure cylinder 430 via a connecting through hole, and the circular plate is movably connected to the output end of the micro-pressure cylinder 430. The micro-pressure cylinder 430 and the lifting mechanism work synchronously to improve the rotational stability of the plate, specifically including: When the plate needs to be rotated, the cylinder at the bottom of the lifting mechanism is activated, allowing the plate to rise and detach from the conveying device 100. At the same time, the micro-pressure cylinder 430 drives the circular plate 410 to move downward, ultimately causing the circular plate 410 and the disc 310 to cooperate to form a bidirectional constraint on the plate. Subsequently, the rotating mechanism at the bottom of the disc 310 is activated, causing the plate and the circular plate to rotate, for example, 90°. Then, the cylinder of the lifting mechanism is activated in the opposite direction, moving downward so that the plate returns to the conveying surface of the conveying device 100.

[0028] The rotation angle is adaptively matched according to the actual shape of the board and the number of workstations. This utility model takes the processing procedure of a common long board shape as an example.

[0029] In this embodiment, the conveying device 100 includes a belt conveyor. The belt of the conveying device 100 and the top surface of the plate together form a first plane, which is the plane on which the upper surface of the plate is located when the plate is conveyed on the conveying device 100. The bottom surface of the circular plate 410 forms a second plane, which is the plane on which the lower surface of the plate is located when the pressing mechanism 400 applies a slight pressure to the plate. In order to ensure that the plate can accurately cooperate with the pressing mechanism 400 during the lifting process, the lifting stroke of the disc 310 at least covers the distance from the first plane to the second plane, ensuring that after the disc 310 drives the plate to rise, the plate can just contact the disc 410 and be constrained by its slight pressure.

[0030] The rotary lifting mechanism 300 is also equipped with a guide platform 320, which is a block structure and fixed to the bottom of the conveying device 100. A first clearance position 321 is provided in the middle of the guide platform 320. The first clearance position 321 is a square groove used to avoid the lifting and lowering movements of the disc 310 and the adsorption mechanism, and to prevent the guide platform 320 from interfering with the disc 310 and the adsorption mechanism. When the disc 310 is lowered to the lowest position by the lifting mechanism of the rotary lifting mechanism 300, the top plane of the disc 310 is equal to or less than the height of the conveying surface of the conveying device 100, ensuring that the plate can smoothly transition from the conveying surface of the conveying device 100 to the top surface of the disc 310, and avoiding collisions of the plate during the transfer process.

[0031] To monitor the relative position of the board material and the upper station of the rotary lifting mechanism 300 in real time, a detection device is provided on the side of the guide platform 320 opposite to the first clearance position 321. The top of the rotary lifting mechanism 300 forms a station for placing the board material. The detection device is used to detect the matching distance between the edge of the board material and the baseline of the station to assist in adjusting the posture of the board material. The detection device includes a first detection device 330 located at the adjustment station and a second detection device 340 located at the cutting station, as well as a moving mechanism 350 for moving the second detection device 340. The first detection device 330 is used to detect the matching distance between the board and the adjustment station and to check the processing status of the bottom of the board. The first detection device 330 includes an inner camera, an outer supplementary light ring, and a middle displacement sensor. The second detection device 340 is a laser displacement cutting sensor with its detection end facing upward, which can collect the position data of the edge of the board in real time. Furthermore, the second detection device 340 includes an elastic sensor 341. The elastic sensor 341 is provided on the upper surface of the conveying device on one side of the disc 310. When the board reaches the preset position on the disc 310, one side of the board abuts against the elastic sensor 341 to achieve matching and positioning of the board and the cutting station. The moving mechanism 350 is used to move the second detection device 340 in a direction parallel to the board conveying direction to adapt to the detection requirements of boards of different lengths.

[0032] To achieve positioning sensing for different types of sheet materials, a second clearance position 322 is provided on the guide table 320 of the glue cutting station 120, corresponding to the moving mechanism 350. The second clearance position 322 is a long strip-shaped through groove extending parallel to the direction of sheet material conveying. The moving mechanism 350 includes a motor, a transmission mechanism, and a lead screw. The motor is mounted on the frame below the guide table 320. The transmission mechanism is a gear set, the input end of which is connected to the output shaft of the motor. The output end of the motor output shaft extends above the second clearance position 322 and is movably connected to one end of the lead screw. The lead screw is horizontally positioned, and its axis is parallel to the upper surface of the guide table 320. A nut is provided below the second detection device 340. The nut is threadedly connected to the lead screw. When the motor drives the lead screw to rotate, the nut can drive the second detection device 340 to move along the axis of the lead screw, causing the elastic sensor 341 above it to move on the upper surface of the conveying device 100, and causing the upper surface of the conveying device 100 to have a corresponding moving elongated hole.

[0033] Furthermore, to ensure the stability of the second detection device 340 during movement, two guide rods are provided parallel to both sides of the lead screw. A slide is also connected below the second detection device 340. The nut is embedded in the bottom of the slide. Sliding elements are provided on both sides of the bottom of the slide corresponding to the guide rods. The sliding elements are linear bearings and are movably connected to the guide rods. When the lead screw drives the slide to move, the guide rods limit and guide the slide through the sliding elements to prevent the slide from deviating and ensure the accuracy of the detection data of the second detection device 340.

[0034] Before the laser cutting device 200 is put into actual operation, it needs to be pre-treated and adjusted according to the specifications of the board to be processed: For the thickness of the board, the control system presets the upper and lower stroke thresholds of the rotary lifting mechanism 300 and the pressing mechanism 400 to ensure that when the disc 310 drives the board to rise and fall, it can accurately reach the second plane, that is, the plane where the lower surface of the board is located when the pressing mechanism 400 applies pressure, and form a stable cooperation with the pressing mechanism 400; According to the width and length of the board, the initial position of the laser cutting device 200 on both sides of the conveying device 100 is adjusted so that the laser emission path is pre-aligned with the edge tape position of the board to avoid subsequent cutting The laser port is repeatedly calibrated during cutting; by adjusting the sensor to detect whether the board passes and the displacement of the board at the adjustment station 110, the control parameters of the laser sensor are set, and the board enters the cutting station 120 in the first processing form with the long side; for boards of different sizes, the moving mechanism 350 of the detection device drives the lead screw to rotate through the motor, driving the second detection device 340 to move along the guide rod to the appropriate detection position - the second detection device 340 is only set at the adjustment station 110, and is used to sense the relative position of the rear end of the board and the station reference, ensuring that the detection range covers the rear edge of the board.

[0035] To accommodate edge cutting of different lengths, a second moving shaft is provided for the first moving shaft where the laser cutting device is located. The cutting device is horizontally connected to the first moving shaft, and the end of the first moving shaft is connected to the second moving shaft to adjust the spacing of the first moving shaft. This includes a spacing motor, a spacing screw connected to the spacing motor, and spacing nuts connected to both ends of the spacing screw. The two spacing nuts are installed at the end of the first moving shaft.

[0036] In actual operation, the laser cutting device 200 of this embodiment: If only the two opposite sides of the square PCB board need to be cut with glue, then the board can be directly transported to the glue cutting station 120 without any processing, along the conveying direction of the conveying device 100. The laser glue cutting device 200 will then cut the glue on both sides of the board. Throughout the process, two detection devices monitor the position of the board in real time to ensure accurate cutting.

[0037] If it is necessary to cut glue on the four opposite sides of a square PCB board: Once the device is started, the external conveyor line will send the sheet material to be cut into the conveyor device 100, and the belt mechanism will drive the sheet material to the adjustment station 110. When the rear end of the board moves to the detection area of ​​the second detection device 340 in the adjustment station 110, the first detection device 330 triggers a signal and feeds it back to the control system. The control system controls the belt mechanism to stop operating. At this time, the board is exactly above the rotary lifting mechanism 300 in the adjustment station 110, completing the precise positioning of the board in the adjustment station 110. Then the adsorption mechanism starts, the disc 310 adsorbs the board, and the lifting mechanism of the rotary lifting mechanism 300 drives the disc 310 and the board to rise. The lifting mechanism drives the disc 310 to rise to the second plane. The pressing mechanism 400 applies micro pressure at the same time. Then the rotary mechanism drives the disc 310 to rotate the board by a preset angle, such as 90°, so that the board has the first processing form with the long side facing the glue cutting station. Then the pressing mechanism 400 resets upward while the lifting mechanism of the rotary lifting mechanism 300 drives the disc 310 to descend until the top surface of the disc 310 is flush with or lower than the conveying surface of the belt mechanism. The adsorption mechanism is then driven to release the negative pressure adsorption state, and the board re-adheres to the conveying surface of the belt mechanism. After the board is positioned at the adjustment station 110, the belt mechanism restarts, smoothly transferring the board to the cutting station 120. Before transferring to the cutting station 120, the spacing motor is connected to the second moving shaft via the spacing screw drive to adjust the distance between the two first moving shafts, so that the inner side of the opposite first moving shaft is used to match and fix the long side shape of the board, and the outer side of the opposite first moving shaft is movably connected to the laser cutting device 200. When the cutting operation is started for the first time, the laser is activated to cut the two sides of the tape of the first processing form, such as the two short sides. After the tape of the first processing form is cut, the laser cutting device 200 returns to the initial position. The adsorption mechanism is activated to adsorb the board, and the lifting mechanism of the rotary lifting mechanism 300 drives the disc 310 to rise, and then drives the disc 310 to rise again to the first... The two planes are simultaneously subjected to micro-pressure by the pressing mechanism 400. Then, the rotating mechanism drives the disc 310 to rotate the plate and the disc 410 by a preset angle, such as 90°, completing the position switch to the second processing form, which is equivalent to restoring the plate to the second form with one short side facing forward. The lifting mechanism of the rotating lifting mechanism 300 drives the disc 310 to descend, and the disc 410 of the pressing mechanism 400 detaches from the surface of the plate and no longer applies pressure to the plate until the top surface of the disc 310 is flush with the conveying surface of the belt mechanism. The negative pressure adsorption state has not yet been released, and the plate re-adheres to the belt conveying surface. The laser adhesive cutting device 200 is then activated to cut the tape of the second processing form on both sides along the length of the plate. After the tape of the second processing form is cut, the laser adhesive cutting device 200 returns to its initial position. After the tapes of the first and second processing forms are cut, the negative pressure adsorption state of the adsorption mechanism of the rotary lifting mechanism 300 is released, the belt mechanism restarts, and the cut sheet is transferred to the subsequent process until the sheet completely leaves the cutting station 120; at the same time, the rotary lifting mechanism on the adjustment station 110 repeats the rotary lifting process, and the next sheet of the first processing form is transported to the cutting station 120 to start a new cycle of cutting operations, realizing continuous operation flow.

[0038] Through the above-described structural design, the dual-station layout of the conveying device 100 in this embodiment enables streamlined operation of sheet metal cutting. The bidirectional constraints of the rotary lifting mechanism 300 and the pressing mechanism 400 effectively prevent dislocation and positioning deviation caused by centrifugal force when the sheet metal rotates. There is no need to repeatedly rotate and switch at the cutting station 120, effectively dividing the process. The limit design of the lifting stroke can ensure the matching degree between the sheet metal and the laser emission position without manual calibration, especially the matching in height. At the same time, the detection device further assists in improving the cutting accuracy, effectively solving the problems of misalignment between the sheet metal and the laser cutter after rotation and low operating efficiency in the prior art, thus balancing the sheet metal cutting quality and production efficiency.

[0039] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A laser adhesive cutting device, characterized in that, The device is equipped with a conveying device, and a laser cutting device is movably installed on both sides of the conveying device to cut the board on the conveying device. A rotating lifting mechanism is provided in the middle of the conveying device to support and rotate the position of the board. A pressing mechanism is provided above the rotating lifting mechanism.

2. The laser cutting device according to claim 1, characterized in that, The conveying device is equipped with an adjustment station and a cutting station. Both the adjustment station and the cutting station are equipped with the aforementioned rotary lifting mechanism and pressing mechanism. The laser cutting device is installed on both sides of the cutting station.

3. The laser cutting device according to claim 1, characterized in that, The rotary lifting mechanism includes a disc and an adsorption through hole at the bottom of the disc for adsorbing the bottom of the plate.

4. The laser glue cutting device according to claim 3, characterized in that, The pressing mechanism includes a circular plate near the rotary lifting mechanism and a micro-pressure cylinder movably connected to the circular plate.

5. A laser cutting device according to claim 4, characterized in that, The pressing mechanism is equipped with a support frame located above the rotary lifting mechanism. The bottom of the support frame has a connecting through hole, through which a micro-pressure cylinder passes and is connected to the circular plate via a transmission mechanism.

6. The laser glue cutting device according to claim 3, characterized in that, The rotary lifting mechanism includes a lifting mechanism and a rotating mechanism, with an adsorption mechanism between the rotating mechanism and the disc; the lifting mechanism is used to support and movably connect the rotating mechanism, the adsorption mechanism, and the disc.

7. A laser adhesive cutting device according to claim 3, characterized in that, The rotary lifting mechanism is equipped with a guide platform, which is fixed to the bottom of the conveying device. When the disc reaches the lowest side through the lifting mechanism, the top plane of the disc is equal to or less than the height of the conveying surface of the conveying device.

8. A laser adhesive cutting device according to claim 7, characterized in that, The first clearance position is provided on one side of the guide platform.

9. A laser cutting device according to claim 7, characterized in that, The other side of the guide table is equipped with a detection device, including a first detection device located at the adjustment station or a second detection device located at the glue cutting station. The second detection device includes a glue cutting sensor and a moving mechanism for moving the glue cutting sensor.

10. A laser cutting apparatus according to claim 9, characterized in that, The guide table on the glue cutting station includes a second clearance position. The moving mechanism includes a motor installed below the guide table, a transmission mechanism extending above the second clearance position, and a lead screw parallel to the upper surface of the guide table. A nut is connected below the glue cutting sensor. One side of the lead screw is movably connected to the transmission mechanism, and the main body of the lead screw is connected to the nut in a transmission connection.

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