A model PCB board laser drilling device

CN224879641UActive Publication Date: 2026-10-23DONGGUAN WEIHAO MODEL TECH CO LTD
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Patent Information

Application Number
CN202522501858.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-25
Publication Date
2026-10-23
Estimated Expiration
2035-11-25

AI Technical Summary

Technical Problem

[0004]有鉴于此,本实用新型提供一种模型PCB板激光打孔装置,能克服现有的激光打孔装置在使用时,熔融态的材料极易发生飞溅,从而会影响孔壁质量与电气性能的缺点

Benefits of technology

[0015]有益效果:1、本实用新型通过设置安装筒、环形喷管及连接管,在激光打孔过程中,环形喷管喷出的水幕与飞溅的熔融材料接触,使其迅速冷却固化,避免熔渣附着于PCB板表面或孔口边缘,显著改善孔壁质量与电气性能。

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Abstract

The utility model relates to the technical field of PCB board punching, especially a model PCB board laser punching device. It comprises: a support frame; a fixed frame connected to the support frame; a mounting cylinder arranged on the inner side of the fixed frame; a ring-shaped spray pipe mounted on the inner side of the mounting cylinder; a connecting pipe connected to the mounting cylinder, with one end of the connecting pipe connected to the ring-shaped spray pipe and kept in communication; a moving assembly arranged on the fixed frame for driving the mounting cylinder to move; a clamping assembly arranged on the fixed frame for clamping the PCB board; and a punching assembly arranged on the support frame for punching the PCB board. The utility model sets the mounting cylinder, the ring-shaped spray pipe and the connecting pipe, and in the laser punching process, the water curtain sprayed by the ring-shaped spray pipe contacts the splashed molten material, which is cooled and solidified rapidly, avoiding the molten slag from adhering to the surface of the PCB board or the edge of the hole, and significantly improving the hole wall quality and electrical performance.
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Description

Technical Field

[0001] This utility model relates to the technical field of PCB board drilling, and in particular to a laser drilling device for model PCB boards. Background Technology

[0002] In the manufacturing process of printed circuit boards (PCBs), laser drilling technology is widely used in the production of high-density interconnect (HDI) boards and multilayer boards due to its advantages such as high precision, non-contact processing, and suitability for micro-hole processing.

[0003] In existing technologies, such as the PCB board laser automatic drilling device disclosed in patent publication number CN217046747U, the PCB board is placed on a fixed mounting plate, and then a laser head above it is aimed at the target position to perform the drilling operation. Although this type of device can achieve certain results in terms of structural design and positioning accuracy, it still has significant technical defects in the actual drilling process. Specifically, the physical mechanism of laser drilling is to focus a high-energy laser beam on the surface of the PCB material, causing it to rapidly heat up locally to a molten or even vaporized state. At the same time, an auxiliary gas (such as compressed air or inert gas) is used to blow away the molten material, thereby forming a through hole. However, at the moment of penetrating the PCB board, due to the release of internal stress and airflow disturbance, the molten resin, copper foil or other composite materials are very prone to splashing. Slag will adhere to the area below the PCB board, and some slag will also adhere to the edge of the hole or other areas of the board surface. These residues not only affect the hole wall quality and electrical performance, but may also cause defects in subsequent electroplating, etching and other processes, and in severe cases, lead to product scrap. In addition, the slag adhering to the plate surface needs to be treated manually or with additional cleaning equipment, which increases the complexity of the process and production costs, and reduces the overall processing efficiency. Utility Model Content

[0004] In view of this, the present invention provides a laser drilling device for model PCB boards, which can overcome the shortcomings of existing laser drilling devices, where molten material is prone to splashing during use, thus affecting the hole wall quality and electrical performance.

[0005] The technical solution is as follows: A laser drilling device for a model PCB board includes: a support frame; a fixed frame connected to the support frame; a mounting cylinder disposed inside the fixed frame; an annular nozzle disposed inside the mounting cylinder; a connecting pipe connected to the mounting cylinder, with one end of the connecting pipe connected to and maintaining communication with the annular nozzle; a moving component disposed on the fixed frame for driving the mounting cylinder to move; a clamping component disposed on the fixed frame for clamping the PCB board; and a drilling component disposed on the support frame for drilling holes in the PCB board.

[0006] As an improvement to the above solution, the moving component includes: a first guide rod connected to the inner side of the fixed frame; a first lead screw motor mounted on the fixed frame; moving seats symmetrically and slidably connected to the inner side of the fixed frame, one of the moving seats being slidably connected to the first guide rod, and the other moving seat being threadedly connected to the lead screw of the first lead screw motor; a second guide rod connected between the two moving seats; a second lead screw motor mounted between the two moving seats; and a moving plate slidably connected to the second guide rod, and the moving plate being threadedly connected to the lead screw of the second lead screw motor.

[0007] As an improvement to the above solution, the clamping assembly includes: a sliding rod, symmetrically slidably connected to the fixed frame; a pressure plate, connected to the bottom of the sliding rod; and a connecting spring, with its two ends connected to the pressure plate and the fixed frame respectively.

[0008] As an improvement to the above solution, the drilling assembly includes: a protective cover connected to the top of the support frame; a three-axis moving module installed inside the protective cover; and a laser drilling device installed on the moving platform of the three-axis moving module.

[0009] As an improvement to the above solution, it also includes: rollers that are evenly spaced and rotated on the pressure plate.

[0010] As an improvement to the above solution, it also includes: a corrugated baffle, symmetrically connected to the top of the guide rail of the three-axis moving module.

[0011] As an improvement to the above solution, it also includes: an electric push rod, symmetrically mounted on the moving platform of the three-axis moving module; and a pressure ring, connected to the telescopic rod of the electric push rod, with the pressure ring located directly above the mounting cylinder.

[0012] As an improvement to the above solution, it also includes: an annular hollow frame connected to the inside of the pressure ring; and a fixed tube connected to the moving platform of the three-axis moving module, with the lower end of the fixed tube connected to and maintaining communication with the annular hollow frame.

[0013] As an improvement to the above solution, it also includes: ball bearings, which are rotatably connected to the top of the mounting cylinder and the bottom of the pressure ring at uniform intervals.

[0014] As an improvement to the above solution, it also includes: a filter plate connected to a fixed frame.

[0015] Beneficial effects: 1. By setting up an installation cylinder, an annular nozzle and a connecting pipe, the water curtain sprayed by the annular nozzle comes into contact with the splashed molten material during the laser drilling process, so that it cools and solidifies rapidly, avoiding slag from adhering to the PCB board surface or the edge of the hole, and significantly improving the hole wall quality and electrical performance.

[0016] 2. This utility model uses the first lead screw motor, the second lead screw motor and the guide rod in the moving component to drive the mounting cylinder to move synchronously with the laser drilling equipment, so that it is always located directly below the drilling position. This effectively collects molten slag while avoiding interference with the processing. At the same time, the fixed tube and the annular hollow frame can be used to remove the fumes generated during the drilling process.

[0017] 3. This utility model can quickly clamp the PCB board by cooperating with the pressure plate and connecting spring in the clamping assembly. Combined with the pressing effect of the pressure ring and the electric push rod, the ball bearings contact the board surface during drilling, reducing friction and suppressing board resonance, thus ensuring drilling accuracy.

[0018] 4. This utility model can separate cooled solid residue from water flow through the filter plate set at the bottom of the fixed frame. The inclined design facilitates the automatic sliding out of residue, reduces the frequency of manual cleaning, and improves the continuous operation efficiency of the equipment. At the same time, the corrugated baffle on the top of the guide rail of the three-axis moving module can effectively prevent the intrusion of debris and ensure the movement accuracy. The setting of ball bearings and rollers reduces the frictional wear between the plate and the components, further improving the service life and reliability of the device. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0020] Figure 2 This is a schematic diagram of the installation of the mobile component of this utility model.

[0021] Figure 3 This is a schematic diagram of the installation of the annular nozzle and connecting pipe of this utility model.

[0022] Figure 4 This is a schematic diagram of the installation of the clamping assembly of this utility model.

[0023] Figure 5 This is a schematic diagram of the specific structure of the punching component of this utility model.

[0024] Figure 6 This is a schematic diagram of the installation of the annular hollow frame and the fixing tube of this utility model.

[0025] Figure 7 This is a schematic diagram of the installation of the ball bearings of this utility model.

[0026] The following are the labels in the diagram: 1. Support frame, 2. Fixed frame, 3. Mounting cylinder, 4. Annular nozzle, 5. Connecting pipe, 6. First guide rod, 7. First lead screw motor, 8. Moving seat, 9. Second guide rod, 10. Second lead screw motor, 11. Moving plate, 12. Sliding rod, 13. Pressure plate, 14. Connecting spring, 15. Protective cover, 16. Three-axis moving module, 17. Laser drilling equipment, 18. Roller, 19. Corrugated baffle, 20. Electric push rod, 21. Pressure ring, 22. Annular hollow frame, 23. Fixed pipe, 24. Ball bearing, 25. Filter plate. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example: A laser drilling device for a model PCB board, such as Figures 1-5 As shown, the assembly includes a support frame 1, a fixed frame 2, an mounting cylinder 3, an annular nozzle 4, a connecting pipe 5, a filter plate 25, a moving assembly, a clamping assembly, and a drilling assembly. The fixed frame 2 is connected to the support frame 1. The bottom of the fixed frame 2 is inclined, and a square hole is opened on the front side of the bottom of the fixed frame 2. The filter plate 25 is connected to the square hole. The top of the filter plate 25 is flush with the bottom of the fixed frame 2, that is, the top of the filter plate 25 is also inclined. The mounting cylinder 3 is provided on the inner side of the fixed frame 2. The annular nozzle 4 is installed on the upper part of the inner side of the mounting cylinder 3. The connecting pipe 5 is connected to the rear side of the upper part of the mounting cylinder 3, and the front end of the connecting pipe 5 is connected to and maintains communication with the annular nozzle 4. The fixed frame 2 is provided with a moving assembly for driving the mounting cylinder 3 to move. The fixed frame 2 is provided with a clamping assembly for clamping the PCB board. The support frame 1 is provided with a drilling assembly for drilling holes in the PCB board.

[0029] like Figure 2As shown, the moving assembly includes a first guide rod 6, a first lead screw motor 7, a moving seat 8, a second guide rod 9, a second lead screw motor 10, and a moving plate 11. The first guide rod 6 is connected to the rear inner side of the fixed frame 2, and the first lead screw motor 7 is installed on the front inner side of the fixed frame 2. The moving seats 8 are symmetrically slidably connected to the front and rear inner sides of the fixed frame 2. The rear moving seat 8 is slidably connected to the first guide rod 6, and the front moving seat 8 is threadedly connected to the lead screw of the first lead screw motor 7. The second guide rod 9 is connected between the left sides of the two moving seats 8. The second lead screw motor 10 is installed on the right side of the rear moving seat 8. The front end of the lead screw of the second lead screw motor 10 is rotatably connected to the front moving seat 8. The moving plate 11 is slidably connected to the second guide rod 9, and the moving plate 11 is threadedly connected to the lead screw of the second lead screw motor 10.

[0030] like Figure 4 As shown, the clamping assembly includes a sliding rod 12, a pressure plate 13, a connecting spring 14, and rollers 18. The upper part of the fixed frame 2 is symmetrically connected to the sliding rod 12. The bottom of each sliding rod 12 is connected to a pressure plate 13. The front ends of each pressure plate 13 are inclined upwards. The outer sides of each sliding rod 12 are wrapped with a connecting spring 14, and the two ends of the connecting spring 14 are respectively connected to the pressure plate 13 and the fixed frame 2. Multiple rollers 18 are rotatably connected to each of the two pressure plates 13 at intervals.

[0031] like Figure 1 and Figure 5 As shown, the drilling assembly includes a protective cover 15, a three-axis moving module 16, a laser drilling device 17, and a corrugated baffle 19. The protective cover 15 is connected to the top of the support frame 1. The three-axis moving module 16 is installed inside the protective cover 15. The laser drilling device 17 is installed on the moving platform of the three-axis moving module 16. The corrugated baffle 19 is symmetrically connected to the top of the three guide rails of the three-axis moving module 16.

[0032] When the device is needed, first connect the connecting pipe 5 to an external water source. The connecting pipe 5 can deliver clean water to the annular nozzle 4, so that the annular nozzle 4 sprays a water curtain inside the mounting cylinder 3. Then, the worker can place the PCB board in front of the pressure plate 13 and push the PCB board backward. When the PCB board contacts the inclined part at the front end of the pressure plate 13, the PCB board will push the pressure plate 13 upward, the connecting spring 14 will be compressed, and the bottom of the PCB board will contact the top of the fixing frame 2. When the PCB board contacts the roller 18, the PCB board passes through the space between it and the roller 18. The friction force drives the roller 18 to rotate. The roller 18 is used to reduce the friction between the PCB board and the pressure plate 13, making it easier for workers to push the PCB board between the pressure plate 13 and the fixing frame 2. When the PCB board is completely pushed between the pressure plate 13 and the fixing frame 2, the bottom of the PCB board will contact the top of the mounting cylinder 3. At the same time, under the elastic force of the connecting spring 14, the pressure plate 13 and the fixing frame 2 can cooperate to clamp and fix the PCB board. Then, the laser drilling device 17 is driven by the three-axis moving module 16 to move directly above the position to be drilled on the PCB board. The corrugated shield 19 will adaptively extend and retract. The corrugated shield 19 protects the guide rails of the three-axis moving module 16, preventing debris from entering the guide rails and affecting the movement of the laser drilling equipment 17. Simultaneously, through the cooperation of the first lead screw motor 7 and the second lead screw motor 10, the moving plate 11 and the mounting cylinder 3 can be driven to move forward, backward, left, and right, ensuring that the mounting cylinder 3 is always directly below the laser drilling equipment 17, i.e., directly below the drilling position on the PCB board. Then, the laser drilling equipment 17 can be controlled to drill the PCB board. During the drilling process, molten material is blown downwards into the inner side of the mounting cylinder 3. When the molten material comes into contact with the water curtain, it can be cooled quickly. The cooled solid material and water will fall down to the top of the filter plate 25 at the same time. The water will continue to flow downwards through the filter plate 25, while the cooled solid material will remain on the top of the filter plate 25 and slide forward along the inclined surface of the top of the filter plate 25. After the PCB board is drilled, the PCB board can be pulled forward to separate from the pressure plate 13. The connecting spring 14 will return to its original state, driving the pressure plate 13 to move downwards to reset.

[0033] like Figures 5-7As shown, it also includes an electric push rod 20, a pressure ring 21, an annular hollow frame 22, a fixing tube 23, and ball bearings 24. The electric push rods 20 are symmetrically installed on the moving platform of the three-axis moving module 16. The pressure ring 21 is connected between the telescopic rods of the two electric push rods 20, and the pressure ring 21 is located directly above the mounting cylinder 3. The annular hollow frame 22 is connected inside the pressure ring 21. The fixing tube 23 is connected to the moving platform of the three-axis moving module 16. The fixing tube 23 is used to connect an external air pump, and the lower end of the fixing tube 23 is connected to and maintains communication with the rear side of the annular hollow frame 22. Multiple ball bearings 24 are circumferentially rotatably connected to the top of the mounting cylinder 3 and the bottom of the pressure ring 21.

[0034] When the pressure plate 13 and the fixing frame 2 clamp the PCB board, the bottom of the PCB board will contact the ball bearing 24 on the top of the mounting cylinder 3. The ball bearing 24 is used to reduce the friction between the PCB board and the mounting cylinder 3, making it easier for the mounting cylinder 3 to move under the PCB board and preventing the bottom of the PCB board from being scratched. When the three-axis moving module 16 drives the laser drilling device 17 to move, the moving platform of the three-axis moving module 16 will drive the electric push rod 20 and the pressure ring 21 to move synchronously, and then drive the pressure ring 21 to move through the electric push rod 20. The downward movement causes the ball bearing 24 at the bottom of the pressure ring 21 to contact the top of the PCB board. Then, the laser drilling device 17 can be controlled to drill holes in the PCB board. During the drilling process, the pressure ring 21 and the mounting cylinder 3 cooperate to clamp the periphery of the position to be drilled on the PCB board, thereby stabilizing the position to be drilled on the PCB board and preventing the PCB board from resonating due to the air blowing of the laser drilling device 17. In addition, the air pump can generate suction on the inner side of the annular hollow frame 22 through the fixed tube 23, thereby removing the smoke generated during the drilling process.

[0035] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A laser drilling device for a model PCB board, comprising: a support frame (1); a fixing frame (2) connected to the support frame (1); characterized in that, It also includes: a mounting cylinder (3), which is located inside the fixed frame (2); an annular nozzle (4), which is installed inside the mounting cylinder (3); a connecting pipe (5), which is connected to the mounting cylinder (3), and one end of the connecting pipe (5) is connected to the annular nozzle (4) and kept in communication; a moving component, which is located on the fixed frame (2) and is used to drive the mounting cylinder (3) to move; a clamping component, which is located on the fixed frame (2) and is used to clamp the PCB board; and a drilling component, which is located on the support frame (1) and is used to drill holes in the PCB board.

2. The laser drilling device for a model PCB board according to claim 1, characterized in that, The moving assembly includes: a first guide rod (6) connected to the inner side of the fixed frame (2); a first lead screw motor (7) mounted on the fixed frame (2); a moving seat (8) symmetrically slidably connected to the inner side of the fixed frame (2), one of the moving seats (8) being slidably connected to the first guide rod (6), and the other moving seat (8) being threadedly connected to the lead screw of the first lead screw motor (7); a second guide rod (9) connected between the two moving seats (8); a second lead screw motor (10) mounted between the two moving seats (8); and a moving plate (11) slidably connected to the second guide rod (9), and the moving plate (11) being threadedly connected to the lead screw of the second lead screw motor (10).

3. The laser drilling device for a model PCB board according to claim 1, characterized in that, The clamping assembly includes: a sliding rod (12) symmetrically slidably connected to the fixed frame (2); a pressure plate (13) connected to the bottom of the sliding rod (12); and a connecting spring (14) connected at both ends to the pressure plate (13) and the fixed frame (2).

4. The laser drilling device for a model PCB board according to claim 1, characterized in that, The drilling assembly includes: a protective cover (15) connected to the top of the support frame (1); a three-axis moving module (16) installed inside the protective cover (15); and a laser drilling device (17) installed on the moving platform of the three-axis moving module (16).

5. The laser drilling device for a model PCB board according to claim 3, characterized in that, It also includes: rollers (18), which are evenly spaced and rotated on the pressure plate (13).

6. The laser drilling device for a model PCB board according to claim 4, characterized in that, It also includes: a corrugated shield (19), symmetrically connected to the top of the guide rail of the three-axis moving module (16).

7. The laser drilling device for a model PCB board according to claim 4, characterized in that, It also includes: an electric push rod (20), symmetrically mounted on the moving platform of the three-axis moving module (16); and a pressure ring (21), connected to the telescopic rod of the electric push rod (20), with the pressure ring (21) located directly above the mounting cylinder (3).

8. The laser drilling device for a model PCB board according to claim 7, characterized in that, It also includes: an annular hollow frame (22), connected to the inside of the pressure ring (21); and a fixed tube (23), connected to the moving platform of the three-axis moving module (16), with the lower end of the fixed tube (23) connected to and maintaining communication with the annular hollow frame (22).

9. A laser drilling device for a model PCB board according to claim 7, characterized in that, It also includes: ball bearings (24), which are evenly spaced and rotated to connect the top of the mounting cylinder (3) and the bottom of the pressure ring (21).

10. The laser drilling device for a model PCB board according to claim 1, characterized in that, It also includes: a filter plate (25), which is connected to the fixed frame (2).

Citation Information

Patent Citations

  • Automatic laser drilling equipment for PCB (Printed Circuit Board)

    CN217046747U