Carrier device and laser processing apparatus

Abstract

The application is suitable for the technical field of semiconductor processing, and provides a supporting device and a laser processing equipment. The supporting device comprises a driving assembly, a lifting piece, a top flat piece and a positioning piece. The lifting piece is arranged at the output end of the driving assembly, and the driving assembly is used for driving the lifting piece to lift. The top flat piece is arranged at the top surface of the lifting piece. The positioning piece is arranged at the top surface of the lifting piece. In the lifting process of the lifting piece, the positioning piece is inserted into the positioning groove at the back of the tray to position the tray. Meanwhile, the top flat piece is also inserted into the bottom of the placing groove of the tray to lift the inclined and curved semiconductor material, improve the flatness of the laser processing surface of the semiconductor material, and thus improve the processing quality of the semiconductor material.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a support device and laser processing equipment. Background Technology

[0002] In the semiconductor processing industry, IC chips can be placed in a tray, and then the tray is transported to a laser processing station for processing.

[0003] However, some semiconductor materials are relatively soft, such as the signal cables for mobile phone cameras. When the signal cables are placed naturally in a tray, they may bend or tilt under their own weight, resulting in uneven laser processing surfaces and affecting the processing quality of the product. Utility Model Content

[0004] This application provides a support device and a laser processing equipment, which can improve the flatness of the laser-processed surface of semiconductor materials.

[0005] In a first aspect, embodiments of this application provide a support device, the support device comprising:

[0006] Driver components;

[0007] A lifting component is disposed at the output end of the drive assembly, and the drive assembly is used to drive the lifting component to rise and fall.

[0008] A top flat member, wherein the top flat member is disposed on the top surface of the supporting member;

[0009] The positioning element is provided in at least two parts, and the positioning element is disposed on the top surface of the lifting element.

[0010] In some possible implementations of the first aspect, the carrier device further includes:

[0011] The adjustment plate has a mounting groove on the top surface of the supporting member, and the adjustment plate is detachably installed in the mounting groove.

[0012] A gasket is disposed between the adjustment plate and the bottom wall of the mounting groove.

[0013] In some possible implementations of the first aspect, a plurality of adjustment plates are provided, with the plurality of adjustment plates spaced apart at the top edge of the support member.

[0014] In some possible implementations of the first aspect, the carrier device further includes:

[0015] A buffer assembly is provided on the supporting member, and a positioning member is provided on the buffer assembly. The buffer assembly can elastically extend and retract in the vertical direction to adjust the height of the positioning member.

[0016] In some possible embodiments of the first aspect, the lifting member is provided with a first through hole extending in a vertical direction, the buffer assembly is disposed on the back side of the lifting member, and the positioning member movably passes through the first through hole.

[0017] In some possible implementations of the first aspect, the buffer component includes:

[0018] A fixing seat is disposed on the back of the lifting member;

[0019] A fixing plate is disposed on the fixing base, and a second through hole extending in a vertical direction is provided on the fixing plate; the positioning member includes a positioning section and a limiting section, the limiting section is disposed on the positioning section, and the diameters of the positioning section, the first through hole, and the second through hole are all smaller than the diameter of the limiting section, one end of the positioning section passes through the first through hole, and the other end of the positioning section passes through the second through hole;

[0020] An elastic element is disposed between the limiting segment and the fixing plate.

[0021] In some possible implementations of the first aspect, the carrier device further includes:

[0022] A sensor is disposed on the buffer assembly and is used to detect the bottom of the positioning element when the buffer assembly is elastically compressed.

[0023] In some possible implementations of the first aspect, the driving component includes:

[0024] Mounting base;

[0025] A driver, the driver being disposed in the mounting base;

[0026] An adapter is disposed at the output end of the driver, and the driver is used to drive the adapter to move up and down;

[0027] A connecting seat is provided on the adapter, and the lifting member is provided on the connecting seat.

[0028] In some possible embodiments of the first aspect, the adapter is disposed below the mounting base, and the connecting base and the mounting base are spaced apart in a direction perpendicular to the vertical direction.

[0029] Secondly, embodiments of this application provide a laser processing device, which includes a support device as described in any of the above technical solutions.

[0030] The carrier device and laser processing equipment provided in this application embodiment include a drive component used to drive the lifting component to rise and fall. After the pallet is transported to the laser processing position and stopped, the drive component drives the lifting component to rise. During the rising process of the lifting component, the positioning component is inserted into the positioning groove on the back of the pallet to position the pallet. At the same time, the top flattening component is also inserted into the bottom of the placement groove of the pallet to lift the tilted or bent semiconductor material, improve the flatness of the laser processing surface of the semiconductor material, and thus improve the processing quality of the semiconductor material. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of one embodiment of the support device of this application;

[0033] Figure 2 for Figure 1 A partial structural diagram of the central support device;

[0034] Figure 3 This is a schematic diagram of the structure of an embodiment of the driver component of this application.

[0035] Explanation of icon numbers:

[0036] 1. Drive assembly; 11. Mounting base; 12. Driver; 13. Adapter; 14. Connecting base; 2. Lifting component; 21. Weight reduction hole; 22. Mounting slot; 23. First through hole; 3. Top flat component; 4. Positioning component; 41. Positioning section; 42. Limiting section; 5. Adjusting plate; 6. Buffer assembly; 61. Fixed base; 62. Fixed plate; 621. Second through hole; 63. Elastic component; 7. Sensor.

[0037] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0040] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0041] It should be understood that the term "and / or" as used in this application specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0043] This application provides a support device and a laser processing equipment to solve the technical problem of uneven surface during laser processing of semiconductor materials.

[0044] In the embodiments of this application, such as Figure 1 As shown, the lifting device includes a drive assembly 1, a lifting member 2, a top leveling member 3, and a positioning member 4. The lifting member 2 is located at the output end of the drive assembly 1, and the drive assembly 1 is used to drive the lifting member 2 to rise and fall. The top leveling member 3 is located on the top surface of the lifting member 2, and at least two positioning members 4 are provided, each located on the top surface of the lifting member 2.

[0045] The tray contains multiple placement slots, each capable of holding semiconductor materials. A support device is used to level the laser processing surface of the semiconductor materials within the placement slots, ensuring that the laser processing surface meets the requirements of laser processing.

[0046] Positioning component 4 is used to position the pallet. When the pallet is transported to the laser processing station and stopped, the drive assembly 1 drives the lifting component 2 to rise, so that the positioning component 4 is inserted into the positioning hole at the bottom of the pallet to position the pallet. The lifting component 2 can be a plate-like structure.

[0047] The top-flattening component 3 can be a protrusion used to flatten the laser-processed surface of the semiconductor material. After the positioning component 4 positions the tray, the top-flattening component 3 will also be inserted into the bottom of the placement groove to lift the tilted or bent semiconductor material in the placement groove, so that the entire laser-processed surface of the semiconductor material in the placement groove meets the requirements of laser processing.

[0048] In this embodiment, the drive component 1 is used to drive the lifting component 2 to rise and fall. After the tray is transported to the laser processing position and stopped, the drive component 1 drives the lifting component 2 to rise. During the rising process of the lifting component 2, the positioning component 4 is inserted into the positioning groove on the back of the tray to position the tray. At the same time, the top flattening component 3 is also inserted into the bottom of the tray's placement groove to lift the tilted or bent semiconductor material, improve the flatness of the laser processing surface of the semiconductor material, and thus improve the processing quality of the semiconductor material.

[0049] In one embodiment, such as Figure 1 As shown, the lifting component 2 is provided with a weight-reducing hole 21 to reduce the weight of the lifting component 2.

[0050] In one embodiment, such as Figure 1 As shown, the support device also includes an adjusting plate 5 and a shim. The top surface of the lifting member 2 is provided with a mounting groove 22, and the adjusting plate 5 is detachably disposed in the mounting groove 22. The shim is disposed between the adjusting plate 5 and the bottom wall of the mounting groove 22.

[0051] The mounting slot 22 is used to accommodate the adjustment plate 5 to prevent it from interfering with the positioning member 4's positioning of the tray and the leveling member 3's leveling of the semiconductor materials. Since the adjustment plate 5 is detachably mounted within the mounting slot 22, a corresponding number of shims can be placed between the adjustment plate 5 and the bottom wall of the mounting slot 22 to adjust the adjustment plate 5 to the appropriate height, depending on actual needs. By adjusting the height of the adjustment plate 5 relative to the top surface of the support member 2, the length of the leveling member 3 extending into the tray's placement slot is adjusted, thereby improving the compatibility of the support device.

[0052] In one embodiment, such as Figure 1As shown, multiple adjustment plates 5 are provided, spaced apart at the top edge of the lifting member 2. This avoids interference of the adjustment plates 5 with the placement position of the top flat member 3 and also improves the stability of the adjustment plates 5 against the back of the pallet, thus preventing the lifting member 2 from tilting. This ensures that all top flat members 3 extend into the pallet's placement slot to the same length, making the extension length of the top flat member 3 into the placement slot controllable.

[0053] In one embodiment, such as Figure 1 and Figure 2 As shown, the support device also includes a buffer assembly 6, which is disposed on the support member 2, and a positioning member 4 is disposed on the buffer assembly 6. The buffer assembly 6 can elastically extend and retract in the vertical direction to adjust the height of the positioning member 4.

[0054] After the positioning element 4 extends into the positioning hole on the back of the pallet, if the positioning element 4 reaches the bottom of the positioning hole, the pallet will compress the buffer assembly 6 through the positioning element 4. After the drive assembly 1 moves the lifting element 2 away from the pallet, the buffer assembly 6 will move the positioning element 4 back to its original position. Therefore, the positioning element 4 can be fully inserted into the positioning hole on the back of the pallet, improving the stability of pallet positioning and also improving the compatibility of the positioning element 4 in positioning the pallet.

[0055] In one embodiment, such as Figure 1 and Figure 2 As shown, the support member 2 is provided with a first through hole 23 extending in the vertical direction, the buffer assembly 6 is provided on the back of the support member 2, and the positioning member 4 can be movably passed through the first through hole 23. This can prevent the buffer assembly 6 from pressing against the tray, so as to avoid the buffer assembly 6 interfering with the flattening member 3 flattening the semiconductor material in the tray placement slot.

[0056] In one embodiment, such as Figure 1 and Figure 2 As shown, the buffer assembly 6 includes a fixed base 61, a fixed plate 62, and an elastic member 63. The fixed base 61 is disposed on the back of the supporting member 2. The fixed plate 62 is disposed on the fixed base 61, and a second through hole 621 extending vertically is provided on the fixed plate 62. The positioning member 4 includes a positioning section 41 and a limiting section 42. The limiting section 42 is disposed on the positioning section 41. The diameter of the positioning section 41, the diameter of the first through hole 23, and the diameter of the second through hole 621 are all smaller than the diameter of the limiting section 42. One end of the positioning section 41 passes through the first through hole 23, and the other end of the positioning section 41 passes through the second through hole 621. The elastic member 63 is disposed between the limiting section 42 and the fixed plate 62.

[0057] Since the diameters of the positioning segment 41, the first through hole 23, and the second through hole 621 are all smaller than the diameter of the limiting segment 42, the maximum height of the positioning segment 41 extending beyond the top surface of the support member 2 after one end of the positioning segment 41 passes through the first through hole 23 remains fixed. This prevents the positioning segment 41 from extending too far beyond the top surface of the support member 2 and interfering with the insertion of the top flat member 3 into the tray's placement slot. Similarly, after the other end of the positioning segment 41 passes through the second through hole 621, the positioning segment 41 will not fall out of the second through hole 621 due to its own weight. This effectively confines the positioning segment 41 between the fixing plate 62 and the back of the support member 2.

[0058] The elastic element 63 is disposed between the limiting section 42 and the fixing plate 62. When the positioning section 41 positions the pallet, the pallet will press down the positioning section 41, causing the positioning section 41 to drive the limiting section 42 to move downward, thereby compressing the elastic element 63 through the limiting section 42. After the drive assembly 1 drives the lifting member 2 away from the pallet, the elastic element 63 will lift the limiting section 42 again, resetting the positioning section 41 through the limiting section 42.

[0059] In one embodiment, such as Figure 2 As shown, the positioning segment 41 and the limiting segment 42 are integrated.

[0060] In one embodiment, such as Figure 1 and Figure 2 As shown, the support device also includes a sensor 7, which is disposed on the buffer assembly 6 and is used to detect the bottom of the positioning member 4 when the buffer assembly 6 is elastically compressed.

[0061] When the positioning element 4 positions the tray, the tray will press down on the positioning element 4, causing it to compress the buffer assembly 6. After the height of the positioning element 4 is reduced by the tray, the sensor 7 can detect the reduced positioning element 4. This indicates that the positioning element 4 has positioned the tray, and the leveling element 3 has leveled the semiconductor material in the tray's placement slot, allowing for the next step of the operation. When the sensor 7 no longer detects the reduced positioning element 4, it indicates that the drive assembly 1 has moved the lifting element 2 away from the tray, and the buffer assembly 6 has reset the positioning element 4.

[0062] In one embodiment, such as Figure 1 and Figure 2 As shown, sensor 7 is mounted on base 61 and located directly below mounting plate 62. When positioning segment 41 is pressed down by the tray, the bottom of positioning segment 41 passes through the detection area of ​​sensor 7.

[0063] In one embodiment, such as Figure 1 and Figure 3As shown, the drive assembly 1 includes a mounting base 11, a driver 12, an adapter 13, and a connecting base 14. The driver 12 is mounted on the mounting base 11. The adapter 13 is located at the output end of the driver 12, and the driver 12 is used to drive the adapter 13 to move up and down. The connecting base 14 is located on the adapter 13, and the lifting member 2 is located on the connecting base 14.

[0064] Mounting base 11 is used to fix it to an external conveying device so that when the conveying device transports the pallet to directly above the lifting member 2, the driver 12 can drive the adapter 13 to rise and fall, and then drive the connecting seat 14 to rise and fall through the adapter 13, and then drive the lifting member 2 to rise and fall through the connecting seat 14. This allows the positioning member 4 on the lifting member 2 to position the pallet, and the flattening member 3 to flatten the semiconductor material in the placement slot of the pallet.

[0065] By setting up the adapter 13 and the connecting seat 14 to transmit the power of the drive 12 to the lifting member 2, the flexibility of the mounting position of the mounting base 11 can be improved, thereby improving the applicability of the lifting device.

[0066] In one embodiment, such as Figure 1 and Figure 3 As shown, the adapter 13 is disposed below the mounting base 11, and the connecting base 14 is spaced apart from the mounting base 11 in a direction perpendicular to the vertical direction. The mounting base 11 can be disposed on the outside of the conveying device, and the adapter 13 and connecting base 14 can be used to move from the bottom of the conveying device to the inside of the conveying device, so that the lifting member 2 can be raised and lowered on the inside of the conveying device to flatten the semiconductor material in the placement slot of the tray.

[0067] After the mounting base 11 is fixed to the outside of the conveying device, one side guide rail of the conveying device is located between the connecting seat 14 and the mounting base 11. When the driver 12 drives the adapter 13 to rise and fall, the adapter 13 can move closer to or further away from the mounting base 11, thereby transmitting the power of the driver 12 to the lifting member 2 through the adapter 13 and the connecting seat 14. The mounting base 11 is fixed to the outside of the guide rail of the conveying device.

[0068] Furthermore, this application also provides a laser processing device, which includes a support device. The specific structure of the support device is as described in the above embodiments. Since the laser processing device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments.

[0069] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A load-bearing device, characterized in that, The load-bearing device includes: Driver components; A lifting component is disposed at the output end of the drive assembly, and the drive assembly is used to drive the lifting component to rise and fall. A top flat member, wherein the top flat member is disposed on the top surface of the supporting member; The positioning element is provided in at least two parts, and the positioning element is disposed on the top surface of the lifting element.

2. The support device as described in claim 1, characterized in that, The support device also includes: The adjustment plate has a mounting groove on the top surface of the supporting member, and the adjustment plate is detachably installed in the mounting groove. A gasket is disposed between the adjustment plate and the bottom wall of the mounting groove.

3. The support device as described in claim 2, characterized in that, Multiple adjustment plates are provided, and the multiple adjustment plates are spaced apart at the top edge of the support member.

4. The support device as described in claim 1, characterized in that, The support device also includes: A buffer assembly is provided on the supporting member, and a positioning member is provided on the buffer assembly. The buffer assembly can elastically extend and retract in the vertical direction to adjust the height of the positioning member.

5. The support device as described in claim 4, characterized in that, The lifting member has a first through hole extending in a vertical direction, the buffer assembly is disposed on the back of the lifting member, and the positioning member can movably pass through the first through hole.

6. The support device as described in claim 5, characterized in that, The buffer component includes: A fixing seat is disposed on the back of the lifting member; A fixing plate is disposed on the fixing base, and a second through hole extending in a vertical direction is provided on the fixing plate; the positioning member includes a positioning section and a limiting section, the limiting section is disposed on the positioning section, and the diameters of the positioning section, the first through hole, and the second through hole are all smaller than the diameter of the limiting section, one end of the positioning section passes through the first through hole, and the other end of the positioning section passes through the second through hole; An elastic element is disposed between the limiting segment and the fixing plate.

7. The support device as described in claim 4, characterized in that, The support device also includes: A sensor is disposed on the buffer assembly and is used to detect the bottom of the positioning element when the buffer assembly is elastically compressed.

8. The support device as described in claim 1, characterized in that, The driving component includes: Mounting base; A driver, the driver being disposed in the mounting base; An adapter is disposed at the output end of the driver, and the driver is used to drive the adapter to move up and down; A connecting seat is provided on the adapter, and the lifting member is provided on the connecting seat.

9. The support device as described in claim 8, characterized in that, The adapter is located below the mounting base, and the connecting base and the mounting base are spaced apart in a direction perpendicular to the vertical direction.

10. A laser processing device, characterized in that, The laser processing equipment includes a support device as described in any one of claims 1 to 9.

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