A cmp dedicated integrated polishing barrel

Abstract

The utility model relates to the technical field of polishing barrel, concretely to a CMP special integrated polishing barrel, including installation platform and polishing barrel, be provided with sand pump on the installation platform, be connected through main connecting pipeline between polishing barrel and sand pump, the inner wall of polishing barrel is provided with cooling water interlayer, the both sides outer surface of polishing barrel is connected with water inlet and water outlet respectively. This kind of CMP special integrated polishing barrel, through being equipped with temperature sensor, concentration sensor and liquid level sensor in the inside polishing barrel, realizes the real -time detection to the inside polishing liquid state of polishing barrel, keeps the polishing efficiency of polishing liquid to product and the production stability of product, in addition, the cooling water interlayer is set up in the side wall of polishing barrel, can not only realize the adjustment to the inside temperature of polishing barrel.

Description

Technical Field

[0001] This utility model relates to the field of polishing barrel technology, specifically to an integrated polishing barrel for CMP. Background Technology

[0002] CMP polishing slurry tanks are standardized containers designed for storing, transporting, and quantitatively supplying polishing slurry required for CMP processes in semiconductor manufacturing. Currently, CMP polishing equipment slurry tanks are relatively simple and lack monitoring of the polishing slurry's condition. When sedimentation occurs in the polishing slurry, its concentration decreases, which may reduce the polishing efficiency and product quality. Furthermore, the polishing slurry is under continuous pressure during polishing, and its temperature rises during circulation. Due to the volatility of liquids, the polishing slurry gradually decreases during use. If not replenished in time, insufficient flow in the tank can lead to a situation similar to dry grinding, damaging the product.

[0003] To address the aforementioned issues, we have made improvements by proposing a CMP-specific integrated polishing barrel. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0005] This utility model provides a CMP-specific integrated polishing barrel, including an installation platform and a polishing barrel. A sand pump is installed on the installation platform, and the polishing barrel and the sand pump are connected by a main connecting pipe.

[0006] The inner wall of the polishing barrel is provided with a cooling water jacket, and the outer surfaces on both sides of the polishing barrel are respectively connected to a water inlet and a water outlet.

[0007] The bottom of the polishing barrel is provided with a funnel-shaped guide plate, and the interior of the polishing barrel is equipped with an extension head and a stirring paddle.

[0008] Temperature and concentration sensors are installed on the outside of the polishing barrel.

[0009] As a preferred embodiment of this utility model, a sand pump mounting base is installed on the mounting platform by bolts, and the sand pump is connected to the sand pump mounting base by a flange.

[0010] As a preferred embodiment of this utility model, the mounting platform is equipped with several support frames by bolts, and the polishing barrel is mounted on the top of the support frames.

[0011] As a preferred embodiment of this utility model, the two ends of the main connecting pipe are respectively connected to the liquid outlet of the polishing barrel and the liquid inlet of the sand pump, the side wall of the polishing barrel is equipped with a drain port, and the bottom of the polishing barrel is provided with a discharge port.

[0012] In a preferred embodiment of this invention, the cooling water jacket is connected to the inlet and outlet, and the cooling water jacket is separated from the internal space of the polishing tank.

[0013] As a preferred embodiment of this utility model, a lid is provided on the top of the polishing barrel, a stirring motor is installed on the lid, the output shaft of the stirring motor is coaxially and fixedly connected to the stirring paddle, a liquid level sensor is installed on the lid, the extension head is located at the bottom of the liquid level sensor, and the extension head extends downward to the bottom of the polishing barrel.

[0014] As a preferred embodiment of this utility model, a sensor interface is provided on the side wall of the polishing barrel, and the sensing heads of the temperature sensor and the concentration sensor penetrate inward through the side wall of the polishing barrel.

[0015] As a preferred embodiment of this utility model, the bottom of the installation platform is equipped with omnidirectional casters.

[0016] The beneficial effects of this utility model are as follows: This CMP-specific integrated polishing tank, by equipping the polishing tank with temperature sensors, concentration sensors, and liquid level sensors, enables real-time detection of the polishing fluid state inside the polishing tank, maintaining the polishing efficiency of the polishing fluid on the product and ensuring stable product production. In addition, the cooling water jacket opened on the side wall of the polishing tank not only allows for the regulation of the internal temperature of the polishing tank but also avoids contact between the cooling water and the polishing fluid, preventing changes in the polishing fluid during the production process. This device is an external sand pump, which reduces the weight to be handled during the cleaning process without affecting the function of the device, thereby improving cleaning efficiency. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the overall front structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the overall rear structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the internal structure of the polishing barrel of this utility model;

[0021] Figure 4 This is a schematic diagram of the cross-sectional structure of the polishing barrel of this utility model;

[0022] In the diagram: 1. Mounting platform; 2. Polishing bucket; 3. Bucket lid; 4. Sand pump; 5. Agitator motor; 6. Temperature sensor; 7. Support frame; 8. Main connecting pipe; 9. Concentration sensor; 10. Universal casters; 11. Cooling water jacket; 12. Guide plate; 13. Sensor interface; 14. Water inlet; 15. Water outlet; 16. Sewage outlet; 17. Material outlet; 18. Liquid level sensor; 19. Extension head; 20. Agitator; 21. Sand pump mounting base. Detailed Implementation

[0023] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0024] Example: Figure 1-4 As shown, a CMP-specific integrated polishing barrel includes an installation platform 1 and a polishing barrel 2. A sand pump 4 is installed on the installation platform 1, and the polishing barrel 2 and the sand pump 4 are connected by a main connecting pipe 8.

[0025] The inner wall of the polishing barrel 2 is provided with a cooling water jacket 11, and the outer surfaces on both sides of the polishing barrel 2 are respectively connected to a water inlet 14 and a water outlet 15.

[0026] The bottom of the polishing barrel 2 is provided with a funnel-shaped guide plate 12, and the interior of the polishing barrel 2 is equipped with an extension head 19 and a stirring paddle 20.

[0027] A temperature sensor 6 and a concentration sensor 9 are installed on the outside of the polishing bucket 2.

[0028] A sand pump mounting base 21 is bolted onto the mounting platform 1, and the sand pump 4 is connected to the sand pump mounting base 21 via a flange.

[0029] Several support frames 7 are bolted to the mounting platform 1, and the polishing bucket 2 is mounted on top of the support frames 7.

[0030] The two ends of the main connecting pipe 8 are connected to the liquid outlet of the polishing tank 2 and the liquid inlet of the sand pump 4, respectively. The side wall of the polishing tank 2 is equipped with a drain port 16, and the bottom of the polishing tank 2 is equipped with a discharge port 17.

[0031] The cooling water jacket 11 is connected to the inlet 14 and the outlet 15. The cooling water jacket 11 is separated from the internal space of the polishing tank 2. The cooling water jacket 11 is opened on the side wall of the polishing tank 2, which can not only adjust the internal temperature of the polishing tank 2, but also avoid the contact between the cooling water and the polishing liquid, and prevent the polishing liquid from changing during the production process.

[0032] A lid 3 is installed on the top of the polishing tank 2. A stirring motor 5 is installed on the lid 3. The output shaft of the stirring motor 5 is coaxially and fixedly connected to the stirring paddle 20. A liquid level sensor 18 is installed on the lid 3. An extension head 19 is located at the bottom of the liquid level sensor 18 and extends downward to the bottom of the polishing tank 2. By equipping the polishing tank 2 with a temperature sensor 6, a concentration sensor 9, and a liquid level sensor 18, the state of the polishing liquid inside the polishing tank 2 can be detected in real time, so as to maintain the polishing efficiency of the polishing liquid on the product and the production stability of the product.

[0033] A sensor interface 13 is provided on the side wall of the polishing barrel 2, and the sensing heads of the temperature sensor 6 and the concentration sensor 9 penetrate inward through the side wall of the polishing barrel 2.

[0034] The bottom of the mounting platform 1 is equipped with swivel casters 10.

[0035] Working principle: In use, the polishing liquid is poured into the polishing tank 2 until it is about 80%-90% full. The stirring motor 5 is turned on, and the polishing liquid inside the polishing tank 2 is fully stirred by the stirring paddle 20 to ensure the uniformity of the liquid. The polishing liquid in the tank is pumped to the CMP polishing equipment by the sand pump 4. The signals of all sensors are connected to the equipment PLC. When the concentration and height of the liquid in the tank are higher or lower than the set value, or when the temperature of the cooling water in the jacket is higher or lower than the set value, the equipment will sound an alarm signal to notify the staff to deal with it in time.

[0036] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A CMP-specific integrated polishing barrel, comprising a mounting platform (1) and a polishing barrel (2), characterized in that: A sand pump (4) is installed on the installation platform (1), and the polishing barrel (2) and the sand pump (4) are connected by a main connecting pipe (8); The inner wall of the polishing barrel (2) is provided with a cooling water jacket (11), and the outer surfaces on both sides of the polishing barrel (2) are respectively connected to a water inlet (14) and a water outlet (15). The bottom of the polishing barrel (2) is provided with a funnel-shaped guide plate (12), and the inside of the polishing barrel (2) is equipped with an extension head (19) and a stirring paddle (20). A temperature sensor (6) and a concentration sensor (9) are installed on the outside of the polishing barrel (2).

2. The CMP-specific integrated polishing bucket according to claim 1, characterized in that, A sand pump mounting base (21) is bolted onto the mounting platform (1), and the sand pump (4) is connected to the sand pump mounting base (21) via a flange.

3. The CMP-specific integrated polishing bucket according to claim 1, characterized in that, Several support frames (7) are bolted onto the installation platform (1), and the polishing barrel (2) is installed on the top of the support frames (7).

4. The CMP-specific integrated polishing bucket according to claim 1, characterized in that, The two ends of the main connecting pipe (8) are respectively connected to the liquid outlet of the polishing barrel (2) and the liquid inlet of the sand pump (4). The side wall of the polishing barrel (2) is equipped with a drain port (16), and the bottom of the polishing barrel (2) is provided with a discharge port (17).

5. The CMP-specific integrated polishing bucket according to claim 1, characterized in that, The cooling water jacket (11) is connected to the inlet (14) and the outlet (15), and the cooling water jacket (11) is separated from the internal space of the polishing barrel (2).

6. The CMP-specific integrated polishing bucket according to claim 1, characterized in that, The top of the polishing barrel (2) is provided with a barrel cover (3), and a stirring motor (5) is installed on the barrel cover (3). The output shaft of the stirring motor (5) is coaxially and fixedly connected to the stirring paddle (20). A liquid level sensor (18) is installed on the barrel cover (3). The extension head (19) is located at the bottom of the liquid level sensor (18) and extends downward to the bottom of the polishing barrel (2).

7. The CMP-specific integrated polishing bucket according to claim 1, characterized in that, The polishing barrel (2) has a sensor interface (13) on its side wall, and the sensing heads of the temperature sensor (6) and the concentration sensor (9) penetrate the side wall of the polishing barrel (2) inward.

8. The CMP-specific integrated polishing bucket according to claim 1, characterized in that, The bottom of the installation platform (1) is equipped with omnidirectional casters (10).

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