Wafer thinning machine cooling water spraying device and wafer thinning machine head

Abstract

The utility model provides a kind of wafer thinning machine cooling water water spraying device and wafer thinning machine head, the wafer thinning machine cooling water water spraying device of the utility model, it include: upper cover plate, circular ring structure, the water inlet end of being connected with cooling water supply device is set in upper cover plate middle part;Lower cover plate, disc structure;Cooling water flow circulation cavity is formed between upper cover plate and lower cover plate, cooling water flow circulation cavity is flat annular cavity, cooling water flow circulation cavity inner side is communicated with water inlet end, annular water outlet end is formed in the outside of cooling water flow circulation cavity;Cooling water enters cooling water flow circulation cavity by water inlet end, and is sprayed out in 360 ° continuous water curtain shape by water outlet end. Water curtain shape water spraying can completely cover the entire inner ring working matrix of grinding wheel, avoid local wear of grinding wheel, improve the service life of grinding wheel.

Description

Technical Field

[0001] This utility model relates to the field of wafer thinning machine technology, specifically to a cooling water spray device and a wafer thinning machine head for a wafer thinning machine. Background Technology

[0002] In semiconductor manufacturing processes, wafer thinning is one of the key steps to achieve high performance, low power consumption, and high integration of chips. Especially for third-generation semiconductor materials such as silicon carbide, due to their extremely high hardness and brittleness, more stringent requirements are placed on the precision, stability, and surface integrity of the thinning process.

[0003] During the wafer thinning process, the high-speed rotating grinding wheel grinds against the wafer surface, generating a large amount of grinding heat. If this heat cannot be dissipated in time, it will cause damage to the wafer surface, such as burns, microcracks, and residual stress, severely affecting device performance and yield. Simultaneously, if the grinding debris is not effectively removed, it will scratch the wafer surface or clog the grinding wheel. Therefore, an efficient internal cooling system is an indispensable and crucial component of the wafer thinning machine.

[0004] Currently, the cooling systems commonly used in the industry for thinning machines mostly employ a columnar water jet design for their water spray devices. This means that multiple independent water outlets are set on the spray nozzle. Under high pressure, the coolant is forced through these outlets to form multiple concentrated, high-impact columnar water jets, which are then sprayed onto the working surface of the grinding wheel. The concentrated, high-pressure water jets directly and continuously impact the abrasive on the grinding wheel's working surface in a point-like manner. Excessive localized impact force can accelerate grinding wheel wear. Furthermore, uneven cooling affects machining stability: the discrete water jets cannot form a continuous, uniform cooling coverage, easily creating cooling blind spots on the grinding wheel surface. This can lead to excessively high local temperatures on the grinding wheel, affecting its hardness and grinding performance. Utility Model Content

[0005] In view of the problems existing in the prior art of wafer thinning machines, this application provides a cooling water spray device and a wafer thinning head for a wafer thinning machine, which can solve the problems caused by the columnar water jet design of the spray device in the prior art, which damages the grinding wheel.

[0006] To achieve the above and other related objectives, this utility model provides a cooling water spraying device for a wafer thinning machine, comprising:

[0007] The upper cover plate has a circular structure, and a water inlet end for connecting a cooling water supply device is provided in the middle of the upper cover plate.

[0008] The lower cover plate has a disc-like structure.

[0009] A cooling water flow cavity is formed between the upper cover plate and the lower cover plate. The cooling water flow cavity is a flat annular cavity. The inner side of the cooling water flow cavity is connected to the water inlet end, and the outer side of the cooling water flow cavity forms an annular water outlet end.

[0010] Cooling water enters the cooling water circulation cavity through the inlet end and is sprayed out in a continuous 360° water curtain shape through the outlet end.

[0011] Optionally, the height of the water outlet end outside the cooling water flow cavity is between 0.3 mm and 0.5 mm.

[0012] Optionally, the thickness of the upper cover plate gradually increases from the center to the periphery, and the thickness of the lower cover plate gradually decreases from the center to the periphery.

[0013] Optionally, the annular body of the upper cover plate is provided with a plurality of first threaded holes; the lower cover plate is provided with a second threaded hole at a position corresponding to the first threaded holes; the bolt assembly passes through the first threaded holes and the second threaded holes to realize the connection between the upper cover plate and the lower cover plate.

[0014] Optionally, a connecting structure is provided at the center of the lower cover plate for fixing the cooling water spray device of the wafer thinning machine to the wafer thinning machine.

[0015] Optionally, the upper cover and the lower cover are made of ceramic material.

[0016] This application also provides a wafer thinning head, comprising:

[0017] Cooling water supply system;

[0018] grinding wheel;

[0019] Cooling water spraying device, including the wafer thinning machine cooling water spraying device described in any one of the above, wherein the cooling water spraying device is provided with a flat annular cooling water flow cavity;

[0020] The cooling water spraying device is located inside the grinding wheel, and the cooling water supply device is located above the cooling water spraying device. The water outlet direction of the cooling water flow cavity is towards the inner surface of the grinding wheel, which is used to uniformly spray a cooling water curtain onto the inner surface of the grinding wheel.

[0021] As described above, the wafer thinning machine cooling water spray device and wafer thinning head provided by this utility model have at least the following beneficial technical effects:

[0022] The wafer thinning machine cooling water spray device of this application is equipped with a flat annular cooling water flow cavity. The sprayed cooling water is in the form of a water curtain, changing from the traditional point impact to a dispersed surface pressure. The pressure acting on the grinding wheel working base is drastically reduced, avoiding local wear of the grinding wheel and greatly extending the service life of the grinding wheel. Secondly, the continuous water curtain can completely cover the entire inner ring working base of the grinding wheel without dead angles, avoiding the cooling blind spots in the traditional method and preventing the grinding wheel from degrading due to local overheating. Attached Figure Description

[0023] Figure 1 The image shows a top view of the cooling water spray system of a wafer thinning machine.

[0024] Figure 2 Displayed as Figure 1 The image shows a cross-sectional view of the cooling water spray device of the wafer thinning machine along the AA' direction.

[0025] Figure 3 The display shows a schematic diagram of the wafer thinning head.

[0026] Reference numerals: 10, upper cover plate; 11, water inlet; 20, lower cover plate; 21, cooling water flow chamber; 22, water outlet; 23, connecting structure; 30, cooling water supply device; 40, grinding wheel; 41, cooling water spray device. Detailed Implementation

[0027] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0028] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0029] Example 1

[0030] This embodiment provides a cooling water spray device for a wafer thinning machine, such as... Figure 1 The image shown is a top view of the cooling water spray device of a wafer thinning machine. Figure 2The image shows a cross-sectional view of the cooling water spray device for a wafer thinning machine. The cooling water spray device for a wafer thinning machine provided in this embodiment includes an upper cover plate 10, which has a circular structure. An inlet end 11 connected to a cooling water supply device 30 is located in the middle of the upper cover plate 10. A lower cover plate 20 has a disc structure. A cooling water flow cavity 21 is formed between the upper cover plate 10 and the lower cover plate 20. The cooling water flow cavity 21 is a flat, annular cavity. The inner side of the cooling water flow cavity 21 is connected to the inlet end 11, and an outlet end 22 is formed on the outer side of the cooling water flow cavity 21. Cooling water enters the cooling water flow cavity 21 through the inlet end 11 and is sprayed out in a continuous 360° water curtain shape through the outlet end 22.

[0031] Specifically, such as Figure 1 As shown, the upper cover plate 10 has a circular structure, and its outer diameter can be matched according to the grinding wheel model. Optionally, the diameter of the upper cover plate 10 is between 50mm and 200mm, and further, the diameter of the upper cover plate 10 is between 80mm and 150mm. Optionally, the thickness of the upper cover plate 10 gradually increases from the center to the periphery. Specifically, in this embodiment, the thickness of the upper cover plate 10 increases in a stepped manner from the center to the periphery. The stepped thickening can enhance the structural rigidity, resist deformation caused by water pressure, and guide the water flow when it flows outward in the cavity. Optionally, the thickness of the lower cover plate 20 gradually decreases or decreases in a stepped manner from the center to the periphery. The lower cover plate 20 cooperates with the upper cover plate 10 to form a cooling water flow cavity 21 with a gradually changing height.

[0032] Optionally, to avoid affecting the normal operation and structural safety of the grinding wheel, the overall structure of the cooling water spray device for the wafer thinning machine, including the upper cover plate 10, the cooling water flow cavity 21, and the lower cover plate 20, can be adjusted according to actual conditions. Generally, the overall thickness of the cooling water spray device for the wafer thinning machine is between 3mm and 10mm, and further between 5mm and 8mm. This thickness is used to ensure the mechanical strength and stability of the structure under high-pressure water flow, while also meeting the compactness requirements of integrating the device inside the grinding wheel.

[0033] Optionally, both the upper cover plate 10 and the lower cover plate 20 are made of high-purity, high-wear-resistant ceramic materials, such as alumina ceramics or silicon nitride ceramics. Ceramic materials have excellent corrosion resistance, resisting the erosion of additives in the coolant; simultaneously, their high hardness ensures that the spray nozzles maintain their original precision over a long period under high-pressure water flow and micro-abrasive conditions, and are not easily worn or deformed. Optionally, they can also be made of high-strength stainless steel or engineering plastics with good weight-reduction and self-lubricating properties.

[0034] Optionally, the cooling water flow chamber 21 has a flat, disc-shaped structure. Specifically, due to the special thickness design of the upper cover plate 10 and the lower cover plate 20, the height of the cooling water flow chamber 21 gradually decreases from the center to the periphery, which is beneficial for accelerating and evenly distributing the water flow within the chamber. Specifically, the height of the water outlet 22 located at the outermost part of the cooling water flow chamber 21 is between 0.3mm and 0.5mm. The water outlet 22 allows the cooling water to be sprayed out evenly in a 360° continuous circumferential water curtain pattern with extremely low impact force when leaving the device.

[0035] Optionally, the annular body of the upper cover plate 10 is provided with a plurality of first threaded holes; the lower cover plate 20 is provided with second threaded holes at positions corresponding to the first threaded holes; the bolt assembly passes through the first threaded holes and the second threaded holes to connect the upper cover plate 10 and the lower cover plate 20. Specifically, the number of first threaded holes and second threaded holes is the same. Optionally, the annular body of the upper cover plate 10 is provided with 3-8 first threaded holes.

[0036] Specifically, the bolt assembly includes stud assemblies such as spacer bolts and interval bolts, which contain spacer sleeves, creating a cooling water flow cavity 21 with a certain height distance between the upper cover plate 10 and the lower cover plate 20. Specifically, this embodiment uses a spacer bolt assembly, which includes bolts, spacer sleeves, and nuts. Specifically, the length of the spacer sleeve is precisely machined to match the designed local height of the cooling water flow cavity 21. When the bolt is tightened, the sleeve acts as a mechanical limiter, ensuring that a precisely accurate and uniform gap, i.e., the cooling water flow cavity 21, is formed between the upper and lower cover plates.

[0037] Optionally, a connecting structure 23 is provided at the center of the lower cover plate 20 for fixing the cooling water spray device of the wafer thinning machine to the wafer thinning machine.

[0038] This device transforms the traditional high-pressure water jet spray into a surface-mounted, uniform, low-pressure 360° continuous water curtain by designing a flat, annular cooling water flow chamber 21. This water curtain spray can completely cover the inner working surface of the grinding wheel, providing uniform cooling and lubrication, significantly reducing the local impact force of the cooling water on the grinding wheel abrasive, thereby effectively extending the service life of the grinding wheel, improving the stability of the thinning process, and enhancing the processing quality of the wafer surface.

[0039] Example 2

[0040] This embodiment provides a wafer thinning head, such as Figure 3The diagram shows a schematic of the wafer thinning head. The wafer thinning head includes a cooling water supply device 30, a grinding wheel 40, and a cooling water spraying device 41, which is the cooling water spraying device of the wafer thinning machine in Embodiment 1. The cooling water spraying device 41 is provided with a flat annular cooling water flow cavity. The cooling water spraying device 41 is located inside the grinding wheel 40, and the cooling water supply device 30 is located above the cooling water spraying device. The water outlet direction of the cooling water flow cavity is towards the inner surface of the grinding wheel, which is used to uniformly spray a cooling water curtain onto the inner surface of the grinding wheel.

[0041] Optionally, the cooling water supply device 30 is a high-pressure cooling water pump and piping system, located at the inlet at the center of the upper cover of the cooling water spray device 41. The delivery pipeline of the cooling water supply device 30 is made of flexible Teflon tubing or metal hose. The cooling water working pressure can be adjusted between 0.2MPa and 1.0MPa according to process requirements to meet the cooling needs under different thinning intensities.

[0042] Specifically, the grinding wheel 40 is a ring-shaped diamond grinding wheel with a cylindrical cavity inside for a cooling water spray device 41. The cooling water spray device 41 is embedded and fixed in the cavity, and the water outlet 22 of the cooling water spray device 41 faces the inner wall of the gear of the grinding wheel base.

[0043] The wafer thinning head provided in this embodiment is equipped with a cooling water supply device. High-pressure cooling water enters the flat, annular cooling water circulation cavity of the cooling water spray device 41 through the inlet. The water flow rapidly and evenly diffuses within the narrow cavity, and after accumulating pressure, it is sprayed out in a 360° continuous water curtain shape from the outlet end of the entire circumference. This water curtain directly and evenly impacts the inner surface of the high-speed rotating grinding wheel 40. It completely covers the grinding wheel substrate, removes grinding heat, and reduces grinding wheel deformation and premature abrasive grain shedding caused by thermal stress. It eliminates the concentrated impact force of traditional point-like water jets, and the abrasive wear on the working surface of the grinding wheel changes from localized abnormal point wear to overall uniform wear, thereby improving the service life of the grinding wheel.

[0044] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A cooling water spraying device for a wafer thinning machine, characterized in that, include: The upper cover plate has a circular structure, and a water inlet end for connecting a cooling water supply device is provided in the middle of the upper cover plate. The lower cover plate has a disc-like structure. A cooling water flow cavity is formed between the upper cover plate and the lower cover plate. The cooling water flow cavity is a flat annular cavity. The inner side of the cooling water flow cavity is connected to the water inlet end, and the outer side of the cooling water flow cavity forms an annular water outlet end. Cooling water enters the cooling water circulation cavity through the inlet end and is sprayed out in a continuous 360° water curtain shape through the outlet end.

2. The cooling water spray device for a wafer thinning machine according to claim 1, characterized in that, The height of the outlet end outside the cooling water flow cavity is between 0.3mm and 0.5mm.

3. The cooling water spray device for a wafer thinning machine according to claim 1, characterized in that, The thickness of the upper cover plate gradually increases from the center outwards, while the thickness of the lower cover plate gradually decreases from the center outwards.

4. The cooling water spray device for a wafer thinning machine according to claim 1, characterized in that, The annular body of the upper cover plate is provided with a plurality of first threaded holes; the lower cover plate is provided with a second threaded hole at a position corresponding to the first threaded holes; the bolt assembly passes through the first threaded holes and the second threaded holes to realize the connection between the upper cover plate and the lower cover plate.

5. The cooling water spray device for a wafer thinning machine according to claim 1, characterized in that, A connecting structure is provided at the center of the lower cover plate for fixing the cooling water spray device of the wafer thinning machine to the wafer thinning machine.

6. The cooling water spray device for a wafer thinning machine according to claim 1, characterized in that, The upper cover plate and the lower cover plate are made of ceramic material.

7. A wafer thinning head, characterized in that, include: Cooling water supply system; grinding wheel; A cooling water spraying device, including the wafer thinning machine cooling water spraying device according to any one of claims 1-6, wherein the cooling water spraying device is provided with a flat annular cooling water flow cavity; The cooling water spraying device is located inside the grinding wheel, and the cooling water supply device is located above the cooling water spraying device. The water outlet direction of the cooling water flow cavity is towards the inner surface of the grinding wheel, which is used to uniformly spray a cooling water curtain onto the inner surface of the grinding wheel.

Images