Low wire consumption diamond wire tensioning device for wafer cutting

Abstract

The utility model discloses a kind of low line loss diamond wire tensioning devices for wafer cutting, belong to wafer processing equipment field, including support, the top of support is provided with tensioning adjusting assembly, the top of tensioning adjusting assembly is provided with guide assembly, and the front end of tensioning adjusting assembly is provided with diamond wire positioning assembly;Tensioning adjusting assembly includes the bottom frame of fixed mounting in the top of support, the inside fixed connection of bottom frame has slide bar, the right side of slide bar is provided with screw rod, screw rod is rotatably connected with bottom frame, the rear end fixed connection of bottom frame has motor, the transmission end of motor is fixedly connected with screw rod, its technical scheme main point is, through tensioning adjusting assembly, motor drives screw rod to rotate, make screw sleeve move along screw rod, simultaneously slide sleeve synchronous sliding along slide bar, to drive pressing line roller to move, realize the automatic, accurate adjustment of diamond wire tensioning degree, avoid the error of manual adjustment, ensure that tensioning degree meets cutting demand, reduce the diamond wire loss due to improper tensioning degree.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment, and in particular to a low-wire-consumption diamond wire tensioning device for wafer dicing. Background Technology

[0002] Diamond wire cutting is a commonly used process in wafer fabrication. Diamond wire for wafer cutting is a core tool for precisely dividing wafers in semiconductor manufacturing. It uses high-strength piano wire or tungsten wire as the substrate, and diamond micro powder is solidified on the surface through electroplating or resin bonding. It has the characteristics of high hardness and strong tensile strength. It has low loss, thin damage layer and strong stability during cutting, and is a key piece of equipment for improving wafer yield.

[0003] However, during the diamond wire cutting operation, insufficient tension of the diamond wire can cause the diamond wire to vibrate and move around, resulting in deviation of the cutting trajectory, tilting of the wafer cut, and dimensional deviation. It may also increase the risk of wire breakage. On the other hand, excessive tension can easily cause the wire to break due to overload, while deepening the wafer damage layer and affecting chip performance. In addition, the wire will undergo slight deformation due to friction and thermal expansion and contraction during the cutting process.

[0004] To address this, we propose a low-wire-loss diamond wire tensioning device for wafer dicing. Summary of the Invention

[0005] To overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a low-wire-loss diamond wire tensioning device for wafer dicing. Through the tension adjustment component, the motor drives the lead screw to rotate, causing the screw sleeve to move along the lead screw. At the same time, the sliding sleeve slides synchronously along the sliding rod, thereby driving the pressure roller to move, realizing automatic and precise adjustment of the diamond wire tension, avoiding the error of manual adjustment, ensuring that the tension meets the dicing requirements, and reducing diamond wire loss caused by improper tension.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: A low-line-loss diamond wire tensioning device for wafer dicing includes a bracket, a tension adjustment component at the top of the bracket, a guide component at the top of the tension adjustment component, and a diamond wire positioning component at the front end of the tension adjustment component. The tension adjustment component includes a base frame fixedly installed at the top of the bracket, a slide rod fixedly connected inside the base frame, a lead screw on the right side of the slide rod, the lead screw being rotatably connected to the base frame, a motor fixedly connected to the rear end of the base frame, the transmission end of the motor being fixedly connected to the lead screw, a threaded sleeve threaded to the outer wall of the lead screw, a sliding sleeve slidably connected to the outer wall of the slide rod, and a pressure roller rotatably connected between the threaded sleeve and the sliding sleeve. The surface of the pressure roller has an annular notch.

[0007] Furthermore, the guide assembly includes a fixed frame fixedly installed on the top of the bottom frame, an upper frame fixedly connected to the top of the fixed frame, a guide roller rotatably connected inside the upper frame, an annular groove being formed on the surface of the guide roller, and a slot corresponding to the annular groove being formed on the top of the upper frame.

[0008] Furthermore, the diamond wire positioning assembly includes a limiting frame fixedly installed at the front end of the bottom frame, and a limiting rod is fixedly connected inside the limiting frame, the limiting rod being horizontal with the pressure roller.

[0009] Furthermore, the middle part of the limiting rod is detachably connected with multiple limiting rings.

[0010] Furthermore, a groove is provided at the top of the limiting rod.

[0011] Furthermore, the inner ring of the limiting ring is fixed with a protrusion, the protrusion is adapted to the groove, and a screw hole is opened at the bottom end of the protrusion.

[0012] Furthermore, the top end of the limiting ring is provided with a mounting groove, which communicates with the screw hole.

[0013] In summary, this utility model has the following beneficial effects: 1. Through the tension adjustment component, the motor drives the lead screw to rotate, causing the screw sleeve to move along the lead screw. At the same time, the sliding sleeve slides synchronously along the sliding rod, thereby driving the pressure roller to move, realizing automatic and precise adjustment of the diamond wire tension, avoiding the error of manual adjustment, ensuring that the tension meets the cutting requirements, and reducing diamond wire loss caused by improper tension. 2. The annular groove on the surface of the guide roller guides the diamond wire through the guide assembly, preventing the diamond wire from shifting during movement and ensuring cutting accuracy. At the same time, the slot at the top of the upper frame facilitates the installation and maintenance of the diamond wire. 3. The diamond wire positioning component, with its limiting rod and limiting ring working together, positions the diamond wire, preventing it from shaking during cutting and further reducing wire loss. The limiting ring is also detachable and can be installed by fitting protrusions and grooves, allowing for easy adjustment of the number and position of the limiting rings according to the required spacing of the diamond wire, thus improving the versatility of the device. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure in this embodiment; Figure 2 This is a schematic diagram of the overall disassembled structure in this embodiment; Figure 3 This is a schematic diagram of the guide component in this embodiment; Figure 4 This is a schematic diagram of the diamond wire positioning component in this embodiment; Figure 5 This is in this embodiment Figure 4 Enlarged structural diagram at point A in the middle.

[0015] In the diagram, 1 is the bracket; 2 is the tension adjustment assembly; 3 is the guide assembly; 4 is the diamond wire positioning assembly; 201 is the base frame; 202 is the slide rod; 203 is the motor; 204 is the lead screw; 205 is the screw sleeve; 206 is the slide sleeve; 207 is the pressure roller; 301 is the upper frame; 302 is the fixing frame; 303 is the guide roller; 401 is the limiting frame; 402 is the limiting rod; and 403 is the limiting ring. Detailed Implementation

[0016] The present invention will be further described in detail below with reference to the accompanying drawings.

[0017] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0018] Reference Figures 1 to 5 As shown, a low-wire-loss diamond wire tensioning device for wafer dicing according to a preferred embodiment of the present invention includes a bracket 1, a tension adjustment component 2 at the top of the bracket 1, a guide component 3 at the top of the tension adjustment component 2, and a diamond wire positioning component 4 at the front end of the tension adjustment component 2. The tension adjustment component 2 includes a bottom frame 201 fixedly installed at the top of the bracket 1, a slide rod 202 fixedly connected inside the bottom frame 201, a lead screw 204 on the right side of the slide rod 202, the lead screw 204 being rotatably connected to the bottom frame 201, a motor 203 fixedly connected to the rear end of the bottom frame 201, the transmission end of the motor 203 being fixedly connected to the lead screw 204, a threaded sleeve 205 threadedly connected to the outer wall of the lead screw 204, a sliding sleeve 206 slidably connected to the outer wall of the slide rod 202, and a pressure roller 207 rotatably connected between the threaded sleeve 205 and the sliding sleeve 206. The surface of the pressure roller 207 is provided with an annular notch. The motor 203 drives the lead screw 204 to rotate, which in turn moves the screw sleeve 205. This causes the pressure roller 207 to move stably with the cooperation of the slide rod 202 and the slide sleeve 206, thus achieving automatic adjustment of the diamond wire tension. The annular notch is used to place the diamond wire, limit the relative position of the diamond wire, prevent the diamond wire from shifting on the surface of the pressure roller 207, and ensure the adjustment effect. The guide assembly 3 includes a fixed frame 302 fixedly installed on the top of the bottom frame 201. The top of the fixed frame 302 is fixedly connected to the upper frame 301. The upper frame 301 is rotatably connected to the inside of the upper frame 301. The surface of the guide roller 303 is provided with an annular groove. The top of the upper frame 301 is provided with a slot corresponding to the annular groove. The diamond wire is guided by the annular groove on the surface of the guide roller 303, ensuring that the diamond wire moves along a fixed trajectory and avoiding deviation. The groove makes it easy to put the diamond wire into the annular groove, simplifying the installation process. At the same time, the guide roller 303 can rotate, reducing the friction between the diamond wire and the guide roller 303 and reducing diamond wire loss. The diamond wire positioning assembly 4 includes a limiting frame 401 fixedly installed at the front end of the bottom frame 201. A limiting rod 402 is fixedly connected inside the limiting frame 401, and the limiting rod 402 is kept horizontal with the pressure roller 207.

[0019] The diamond wire is initially positioned by the limiting rod 402, which restricts the movement of the diamond wire in the direction perpendicular to the axis of the pressure roller 207, thus ensuring the stability of the diamond wire during the cutting process. The middle part of the limiting rod 402 is detachably connected to multiple limiting rings 403. The number and spacing of the detachable limiting rings 403 can be adjusted according to actual cutting requirements to adapt to the cutting of wafers of different specifications, thereby improving the applicability of the device. At the same time, the limiting rings 403 can further separate and position the diamond wires to prevent interference between multiple diamond wires.

[0020] The top of the limiting rod 402 has a groove. The groove provides a positioning reference for the installation of the limit ring 403, ensuring the accuracy of the installation position of the limit ring 403 on the limit rod 402 and preventing the limit ring 403 from rotating or shifting during use. The inner ring of the limiting ring 403 is fixed with a protrusion, which is adapted to the groove, and a screw hole is opened at the bottom of the protrusion. By matching the protrusion and the groove, the limiting ring 403 and the limiting rod 402 are accurately positioned and connected. The screw hole makes it easy to fix the limiting ring 403 to the limiting rod 402 with bolts, which enhances the firmness of the installation of the limiting ring 403 and prevents the limiting ring 403 from loosening during the cutting operation. The top of the limiting ring 403 is provided with an installation groove, which is connected to the screw hole. The mounting slot provides operating space for the installation and removal of bolts, making it convenient for staff to install, adjust and maintain the limit ring 403, thus improving operational convenience. Specific implementation process: When using this low-wire-loss diamond wire tensioning device for wafer dicing, firstly, according to the specifications of the wafer to be diced and the required spacing of the diamond wire, install an appropriate number of limiting rings 403 by fitting them into the grooves on the limiting rods 402 through the protrusions. Then, fix the limiting rings 403 onto the limiting rods 402 by bolts passing through the mounting slots and screw holes. Next, pass the diamond wire sequentially through the slot at the top of the upper frame 301, the annular groove on the surface of the guide roller 303, and the gap between the limiting rods 402 and the limiting rings 403. Finally, connect both ends of the diamond wire to the corresponding mechanisms of the dicing equipment. During the dicing operation, when it is necessary to adjust the tension of the diamond wire, start the motor 203. The motor 203 drives the lead screw 204 to rotate. The rotation of the lead screw 204 causes the threaded sleeve 205 to move along the axis of the lead screw 204. At the same time, the sliding sleeve 206 slides synchronously on the sliding rod 202, thereby driving the pressure roller 207 to move. When the pressure roller 207 moves, the annular notch on its surface applies pressure to the diamond wire, thereby adjusting the tension of the diamond wire. During the entire cutting process, the guide roller 303 in the guide assembly 3 guides the diamond wire through the annular groove to prevent the diamond wire from deviating. The limiting rod 402 and the limiting ring 403 in the diamond wire positioning assembly 4 cooperate to position the diamond wire, prevent the diamond wire from shaking, effectively reduce the loss of the diamond wire, and ensure the wafer cutting accuracy.

[0021] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A low-wire-loss diamond wire tensioning device for wafer dicing, characterized in that: Includes a bracket (1), the top of the bracket (1) is provided with a tension adjustment component (2), the top of the tension adjustment component (2) is provided with a guide component (3), and the front end of the tension adjustment component (2) is provided with a diamond wire positioning component (4). The tension adjustment assembly (2) includes a base frame (201) fixedly installed on the top of the bracket (1). A slide rod (202) is fixedly connected inside the base frame (201). A lead screw (204) is provided on the right side of the slide rod (202). The lead screw (204) is rotatably connected to the base frame (201). A motor (203) is fixedly connected to the rear end of the base frame (201). The transmission end of the motor (203) is fixedly connected to the lead screw (204). A threaded sleeve (205) is threadedly connected to the outer wall of the lead screw (204). A sliding sleeve (206) is slidably connected to the outer wall of the slide rod (202). A pressure roller (207) is rotatably connected between the threaded sleeve (205) and the sliding sleeve (206). An annular notch is provided on the surface of the pressure roller (207).

2. The low-wire-loss diamond wire tensioning device for wafer dicing according to claim 1, characterized in that: The guide assembly (3) includes a fixed frame (302) fixedly installed on the top of the bottom frame (201). The top of the fixed frame (302) is fixedly connected to the upper frame (301). The upper frame (301) is rotatably connected to the inside of the upper frame (301). The surface of the guide roller (303) is provided with an annular groove. The top of the upper frame (301) is provided with a slot corresponding to the annular groove.

3. The low-wire-loss diamond wire tensioning device for wafer dicing according to claim 1, characterized in that: The diamond wire positioning assembly (4) includes a limiting frame (401) fixedly installed at the front end of the bottom frame (201). A limiting rod (402) is fixedly connected inside the limiting frame (401). The limiting rod (402) is horizontal with the pressure roller (207).

4. The low-wire-loss diamond wire tensioning device for wafer dicing according to claim 3, characterized in that: The middle part of the limiting rod (402) is detachably connected to multiple limiting rings (403).

5. A low-wire-loss diamond wire tensioning device for wafer dicing according to claim 4, characterized in that: The top end of the limiting rod (402) is provided with a groove.

6. A low-wire-loss diamond wire tensioning device for wafer dicing according to claim 4, characterized in that: The inner ring of the limiting ring (403) is fixed with a protrusion, which is adapted to the groove, and a screw hole is opened at the bottom end of the protrusion.

7. A low-wire-loss diamond wire tensioning device for wafer dicing according to claim 6, characterized in that: The top end of the limiting ring (403) is provided with an installation groove, which is connected to the screw hole.

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