A temperature sensor thermistor element packaging device

Abstract

The utility model relates to the technical fields of sensor manufacturing, in particular to a temperature sensor thermosensitive element packaging device, its not only can hold fixing to the pin of thermosensitive element, avoid in the packaging process pin is broken and damaged, and can carry out step -by -step heating to the packaging glue, accelerate the glue solidification, improve the packaging effect, heating mechanism, still including conveying mechanism, multiple sets of clamping mechanism, filling and sealing mechanism and glue supply mechanism, conveying mechanism installs on heating mechanism and drives thermosensitive element to move, multiple sets of clamping mechanism all install on conveying mechanism and carry out the fixed to the pin, filling and sealing mechanism installs on heating mechanism and fills and seals the glue into the shell, and glue supply mechanism installs on heating mechanism and stores the glue.

Description

Technical Field

[0001] This utility model relates to the technical field of sensor manufacturing, and in particular to a packaging device for a temperature sensor thermistor element. Background Technology

[0002] Temperature sensors are widely used in industrial control, home appliances, automotive electronics and other fields, and their core component is thermistor.

[0003] Existing thermistor packaging devices, such as the temperature sensor probe packaging potting structure disclosed in utility model patent application number 202020412042.7, mainly include a probe metal tube body that is closed at one end and open at the other end. The inner end of the probe metal tube body is provided with a thermistor element, and the inner end of the probe metal tube body is filled with a potting medium that surrounds the thermistor element. In use, after the positioning plate is inserted into the tapered tube, glue is injected through the potting hole. The potting can be stopped when the glue just overflows the potting hole of the positioning plate.

[0004] However, existing thermistors require a long drying time after packaging, which affects working efficiency. Moreover, the lack of pin fixation and protection during the packaging process makes them easy to bend and be damaged. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a temperature sensor thermistor packaging device that can not only clamp and fix the pins of the thermistor to prevent the pins from being broken or damaged during the packaging process, but also perform stepped heating of the packaging adhesive to accelerate the curing of the adhesive and improve the packaging effect.

[0006] This utility model discloses a temperature sensor thermistor packaging device, including a heating mechanism; it also includes a conveying mechanism, multiple clamping mechanisms, a potting mechanism, and a glue supply mechanism. The conveying mechanism is mounted on the heating mechanism and drives the thermistor to move. The multiple clamping mechanisms are all mounted on the conveying mechanism and fix the pins. The potting mechanism is mounted on the heating mechanism and pots glue into the housing. The glue supply mechanism is mounted on the heating mechanism and stores the glue. The operator places the housing and the thermistor into the conveying mechanism. The clamping mechanisms fix the pins of the thermistor. The conveying mechanism drives the thermistor to rotate and feed the material. The potting mechanism pots the glue from the glue supply mechanism into the housing, thus encapsulating the thermistor. Then, the conveying mechanism continues to drive the thermistor to rotate, facilitating the heating mechanism to perform stepped heating and accelerate glue solidification. After the conveying mechanism has rotated one revolution, the operator removes the encapsulated thermistor and installs a new housing and thermistor.

[0007] Preferably, the heating mechanism includes a worktable, a controller, a protective cover, and heating plates. The worktable is placed on the ground, the controller is installed on the worktable, the protective cover is installed on the worktable, and multiple heating plates are installed in a ring on the worktable. By setting up the protective cover, external dust is prevented from falling into the heat-sensitive element and affecting the encapsulation effect, while heat loss is reduced. The controller controls multiple heating plates to heat and dry the heat-sensitive element after the glue is filled, thereby improving work efficiency.

[0008] Preferably, the heating temperature of multiple heating plates increases in a stepped manner; the conveying mechanism drives the packaged thermistor to rotate, and the heating temperature of the heating plate increases in a stepped manner, so that the component is heated evenly, avoiding thermal shock and allowing sufficient time for residual air bubbles inside to slowly dissipate.

[0009] Preferably, the conveying mechanism includes a stepper motor, a reducer, a drive shaft, and a turntable. The stepper motor is mounted on the worktable, and the power output end of the stepper motor is connected to the power input end of the reducer. The power output end of the reducer is connected to the power input end of the drive shaft, and the power output end of the drive shaft is connected to the power input end of the turntable. The turntable has multiple sets of positioning slots. The operator removes the packaged thermistor from the positioning slot, and then places the housing and thermistor into the positioning slot of the turntable. The clamping mechanism fixes the pins, and the controller starts the stepper motor. The stepper motor drives the drive shaft and the turntable to rotate one working position each time through the reducer.

[0010] Preferably, the clamping mechanism includes a column, a clamp, a switch button, and two sets of clamping plates. The bottom end of the column is connected to the top end of the turntable. The clamp is mounted on the column, and the switch button is mounted on the clamp. The output end of the clamp is connected to the input end of the two sets of clamping plates. After the operator adjusts the pin position of the thermal element, he presses the switch button. The switch button controls the clamp to drive the two sets of clamping plates to clamp and fix the pin, thus protecting the pin.

[0011] Preferably, the potting mechanism includes a servo motor, a reciprocating screw, a slider, a bracket, a filling head, and a control valve. A sliding groove is provided on the worktable. The servo motor is mounted on the worktable, and its power output end is connected to the power input end of the reciprocating screw. The slider is slidably mounted in the sliding groove of the worktable, and the slider and the reciprocating screw are connected via a threaded drive. The bracket is mounted on the slider, the filling head is mounted on the bracket, and the control valve is mounted on the filling head. The controller starts the servo motor, which drives the reciprocating screw to rotate. The reciprocating screw drives the slider closer to the housing, opening the control valve. The glue supply mechanism then fills the housing with glue through the filling head to encapsulate the thermal element.

[0012] Preferably, the glue supply mechanism includes a glue storage tank, a glue dispensing pipe, a valve, and a glue delivery hose. The glue storage tank is mounted on a protective cover and has an internal cavity. The bottom end of the glue dispensing pipe is connected to the top of the glue storage tank. The valve is mounted on the glue dispensing pipe, and the glue delivery hose is connected between the glue storage tank and the filling head. The operator opens the valve and adds glue into the glue storage tank through the glue dispensing pipe. The glue in the glue storage tank is then delivered to the filling head through the glue delivery hose.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: the operator places the housing and the thermal element into the conveying mechanism, the clamping mechanism fixes the pins of the thermal element, the conveying mechanism drives the thermal element to rotate and feed, the potting mechanism pots the glue in the glue supply mechanism into the housing to encapsulate the thermal element, and then the conveying mechanism continues to drive the thermal element to rotate, so that the heating mechanism can heat it in steps and accelerate the solidification of the glue. After the conveying mechanism has rotated once, the operator removes the encapsulated thermal element and installs a new housing and thermal element. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the isometric structure of this utility model; Figure 2 This is a front view structural diagram of the heating mechanism of this utility model; Figure 3 This is a cross-sectional isometric structural diagram of the conveying mechanism and the glue supply mechanism of this utility model; Figure 4 This is a partially enlarged isometric structural diagram of the clamping mechanism of this utility model; Figure 5 This is a partially enlarged cross-sectional isometric structural schematic diagram of the potting mechanism of this utility model.

[0015] The attached diagram is labeled as follows: 01, Heating mechanism; 11, Workbench; 12, Controller; 13, Protective cover; 14, Heating plate; 02, Conveying mechanism; 21, Stepper motor; 22, Reducer; 23, Drive shaft; 24, Turntable; 03, Clamping mechanism; 31, Column; 32, Clamp; 33, Switch button; 34, Clamping plate; 04, Filling mechanism; 41, Servo motor; 42, Reciprocating screw; 43, Slider; 44, Support; 45, Filling head; 46, Control valve; 05, Glue supply mechanism; 51, Glue storage tank; 52, Glue dispensing hose; 53, Valve; 54, Glue delivery hose. Detailed Implementation

[0016] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. This utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this utility model more thorough and complete.

[0017] Example 1 This utility model discloses a temperature sensor thermistor packaging device, including a heating mechanism 01; it also includes a conveying mechanism 02, multiple clamping mechanisms 03, a potting mechanism 04, and a glue supply mechanism 05. The conveying mechanism 02 is mounted on the heating mechanism 01 and drives the thermistor to move. The multiple clamping mechanisms 03 are all mounted on the conveying mechanism 02 and fix the pins. The potting mechanism 04 is mounted on the heating mechanism 01 and pots glue into the housing. The glue supply mechanism 05 is mounted on the heating mechanism 01 and stores the glue. The heating mechanism 01 includes a worktable 11, a controller 12, a protective cover 13, and a heating plate 14. 1. Placed on the ground, controller 12 is mounted on workbench 11, protective cover 13 is mounted on workbench 11, and multiple heating plates 14 are mounted in a ring on workbench 11; the heating temperature of the multiple heating plates 14 increases in a stepped manner; the conveying mechanism 02 includes a stepper motor 21, a reducer 22, a drive shaft 23, and a turntable 24. The stepper motor 21 is mounted on workbench 11, the power output end of the stepper motor 21 is connected to the power input end of the reducer 22, the power output end of the reducer 22 is connected to the power input end of the drive shaft 23, and the power output end of the drive shaft 23 is connected to the power input end of the turntable 24. The turntable 24 has multiple positioning slots; the clamping mechanism 03 includes a column 31, a clamp 32, a switch button 33, and two sets of clamping plates 34. The bottom end of the column 31 is connected to the top end of the turntable 24. The clamp 32 is mounted on the column 31, and the switch button 33 is mounted on the clamp 32. The output end of the clamp 32 is connected to the input end of the two sets of clamping plates 34. When it is working, firstly, the operator takes the packaged thermistor out of the positioning slot, then places the housing and thermistor in the positioning slot of the turntable 24. The operator adjusts the pin position of the thermistor and presses the switch button 33. The switch button 33 controls the clamping. The device 32 drives two sets of clamping plates 34 to clamp and fix the pins, protecting them. The controller 12 controls the start of the stepper motor 21. The stepper motor 21 drives the transmission shaft 23 and the turntable 24 to rotate one working position each time through the reducer 22. The potting mechanism 04 pots the glue in the glue supply mechanism 05 into the housing to encapsulate the thermal element. Then the turntable 24 continues to drive the thermal element to rotate. The heating plate 14 raises the heating temperature of the thermal element in a stepwise manner, so that the component is heated evenly, avoiding thermal shock and allowing sufficient time for residual air bubbles inside to slowly dissipate. The protective cover 13 is set to prevent external dust from falling into the thermal element and affecting the encapsulation effect.

[0018] Example 2 like Figures 1 to 5As shown, this utility model discloses a temperature sensor thermistor packaging device, based on Embodiment 1. The filling mechanism 04 includes a servo motor 41, a reciprocating screw 42, a slider 43, a bracket 44, a filling head 45, and a control valve 46. A sliding groove is provided on the worktable 11. The servo motor 41 is mounted on the worktable 11, and the power output end of the servo motor 41 is connected to the power input end of the reciprocating screw 42. The slider 43 is slidably mounted in the sliding groove of the worktable 11, and the slider 43 is connected to the reciprocating screw 42 through a threaded transmission. The bracket 44 is mounted on the slider. On the 43, the filling head 45 is mounted on the bracket 44, and the control valve 46 is mounted on the filling head 45; the glue supply mechanism 05 includes a glue storage tank 51, a glue dispensing pipe 52, a valve 53, and a glue delivery hose 54. The glue storage tank 51 is mounted on the protective cover 13, and the inside of the glue storage tank 51 is provided with a cavity. The bottom end of the glue dispensing pipe 52 is connected to the top of the glue storage tank 51. The valve 53 is mounted on the glue dispensing pipe 52, and the glue delivery hose 54 is connected and installed between the glue storage tank 51 and the filling head 45; when it is working, firstly, the operator takes the packaged thermal element out of the positioning slot, then... The housing and thermistor are then placed in the positioning slot of the turntable 24. The operator adjusts the pin position of the thermistor and presses switch button 33. Switch button 33 controls clamp 32 to move two sets of clamping plates 34 to clamp and fix the pins, protecting them. Controller 12 starts stepper motor 21, which, through reducer 22, drives drive shaft 23 and turntable 24 to rotate one working position at a time. Controller 12 then starts servo motor 41, which drives reciprocating screw 42 to rotate. Reciprocating screw 42 moves slider 43 closer to the housing, opening... Open control valve 46, and the operator opens valve 53 to add glue into the storage tank 51 through glue addition tube 52. The glue in the storage tank 51 is then transported to the filling head 45 through glue delivery hose 54. The filling head 45 fills the housing with glue to encapsulate the thermal element. Then, turntable 24 continues to drive the thermal element to rotate, and the heating plate 14 raises the temperature of the thermal element in a stepwise manner to ensure that the component is heated evenly, avoid thermal shock, and allow sufficient time for residual air bubbles inside to slowly dissipate. The protective cover 13 is set to prevent external dust from falling into the thermal element and affecting the encapsulation effect.

[0019] The stepper motor 21, reducer 22, and servo motor 41 of this utility model are commercially available. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual, without requiring any creative work from those skilled in the art.

[0020] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A packaging device for a temperature sensor thermistor element, comprising a heating mechanism (01); characterized in that, It also includes a conveying mechanism (02), multiple clamping mechanisms (03), a potting mechanism (04), and a glue supply mechanism (05). The conveying mechanism (02) is installed on the heating mechanism (01) and drives the thermal element to move. The multiple clamping mechanisms (03) are all installed on the conveying mechanism (02) and fix the pins. The potting mechanism (04) is installed on the heating mechanism (01) and pots the glue into the housing. The glue supply mechanism (05) is installed on the heating mechanism (01) and stores the glue.

2. The temperature sensor thermistor packaging device as described in claim 1, characterized in that, The heating mechanism (01) includes a workbench (11), a controller (12), a protective cover (13) and a heating plate (14). The workbench (11) is placed on the ground, the controller (12) is installed on the workbench (11), the protective cover (13) is installed on the workbench (11), and multiple heating plates (14) are installed in a ring on the workbench (11).

3. The temperature sensor thermistor packaging device as described in claim 2, characterized in that, It also includes multiple heating plates (14) whose heating temperature increases in a stepwise manner.

4. The temperature sensor thermistor packaging device as described in claim 2, characterized in that, The conveying mechanism (02) includes a stepper motor (21), a reducer (22), a drive shaft (23), and a turntable (24). The stepper motor (21) is mounted on the workbench (11). The power output end of the stepper motor (21) is connected to the power input end of the reducer (22). The power output end of the reducer (22) is connected to the power input end of the drive shaft (23). The power output end of the drive shaft (23) is connected to the power input end of the turntable (24). The turntable (24) has multiple sets of positioning slots.

5. The temperature sensor thermistor packaging device as described in claim 4, characterized in that, The clamping mechanism (03) includes a column (31), a clamp (32), a switch button (33), and two sets of clamping plates (34). The bottom end of the column (31) is connected to the top end of the turntable (24). The clamp (32) is mounted on the column (31). The switch button (33) is mounted on the clamp (32). The output end of the clamp (32) is connected to the input end of the two sets of clamping plates (34).

6. The temperature sensor thermistor packaging device as described in claim 2, characterized in that, The filling mechanism (04) includes a servo motor (41), a reciprocating screw (42), a slider (43), a bracket (44), a filling head (45), and a control valve (46). A sliding groove is opened on the worktable (11). The servo motor (41) is installed on the worktable (11). The power output end of the servo motor (41) is connected to the power input end of the reciprocating screw (42). The slider (43) is slidably installed in the sliding groove of the worktable (11). The slider (43) and the reciprocating screw (42) are connected by a threaded transmission. The bracket (44) is installed on the slider (43). The filling head (45) is installed on the bracket (44). The control valve (46) is installed on the filling head (45).

7. The temperature sensor thermistor packaging device as described in claim 6, characterized in that, The glue supply mechanism (05) includes a glue storage tank (51), a glue adding pipe (52), a valve (53), and a glue delivery hose (54). The glue storage tank (51) is installed on the protective cover (13). The inside of the glue storage tank (51) is provided with a cavity. The bottom end of the glue adding pipe (52) is connected to the inside of the top of the glue storage tank (51). The valve (53) is installed on the glue adding pipe (52). The glue delivery hose (54) is connected and installed between the glue storage tank (51) and the filling head (45).

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