A semiconductor integrated power module plastic encapsulation mold equipment

Abstract

The utility model relates to the technical field of semiconductor packaging, disclose a kind of semiconductor integrated power module plastic encapsulation mould equipment, and plastic encapsulation mechanism contains upper die plate, lower die plate, pressboard, stripper plate, positioning column, guide slot and guide column.The core technical scheme is in addition to the stripper plate component, and stripper plate component is by mounting plate, connecting plate, rotating shaft, rotating movable plate and limit plate composition.Mounting plate is fixed in positioning column, connecting plate is fixed in mounting plate, rotating shaft is rotatably connected in connecting plate, rotating movable plate is fixed in rotating shaft and can rotate, and limit plate is fixed below rotating movable plate.Stripper plate both sides are equipped with protruding edge.When plastic encapsulation lower die plate rises, stripper plate edge pushes rotating movable plate to rotate.The utility model is through automatic demoulding and automatic cleaning, and the automation level, efficiency and product yield of semiconductor integrated power module plastic encapsulation production are significantly improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a molding die for semiconductor integrated power modules. Background Technology

[0002] Integrated power modules (IPMs) are a crucial component of power electronics, and their packaging quality directly impacts product performance and reliability. In IPM manufacturing, molding is a critical step, designed to protect the semiconductor chip from moisture, dust, and other environmental factors using polymer materials, while also providing mechanical support and heat dissipation pathways. Currently, semiconductor IPM molding typically employs compression molding technology, where pressure and temperature are applied to the packaging material through upper and lower molds, causing it to flow and solidify.

[0003] However, in existing semiconductor integrated power module molding equipment, the demolding process after molding is often a key bottleneck affecting production efficiency and product yield. Traditional demolding methods rely on mechanical ejection or manual assistance, which have many shortcomings. For example, mechanical ejection mechanisms may cause stress damage, warping, or even cracking of the packaged module edges due to uneven force or excessive demolding force in certain situations, especially for IPM modules with complex structures or large sizes, where this risk of damage is more prominent. Manual demolding, on the other hand, faces problems such as low efficiency, high operational intensity, and the potential introduction of human error or surface contamination, which is incompatible with the requirements of semiconductor manufacturing for automation, high cleanliness, and high yield. When there are residual packaging material debris inside the mold, if these debris are not removed in a timely and effective manner, they will not only contaminate subsequent products but may also affect the normal operation of the demolding mechanism, increasing the risk of jamming or damage during demolding. Therefore, existing technologies still lack an integrated solution that can achieve efficient, automatic, and gentle demolding in the molding process of semiconductor integrated power modules.

[0004] Therefore, this utility model proposes a semiconductor integrated power module molding die equipment to solve the core technical deficiencies of the prior art, such as low demolding efficiency, easy damage, and inconvenience in cleaning debris in related areas after molding. Utility Model Content

[0005] In view of the core problems of existing semiconductor integrated power module molding equipment, such as low demolding efficiency, easy damage to the molded product, and inconvenience in cleaning debris in the relevant areas, this utility model aims to provide a semiconductor integrated power module molding equipment with an improved structure that can effectively solve the above problems.

[0006] This utility model provides a semiconductor integrated power module molding die, including: a housing, a molding mechanism, and control buttons. The molding mechanism includes an upper mold plate and a lower mold plate. The lower mold plate is movable up and down relative to the upper mold plate. A pressure plate is supported on the upper surface of the lower mold plate, and a release mold plate is placed on the upper surface of the pressure plate. The molding mechanism also includes a positioning post, which is fixedly connected inside the housing. A guide groove is formed inside the positioning post. A guide post is fixedly connected to the lower mold plate, and the guide post slides within the guide groove.

[0007] Furthermore, the semiconductor integrated power module molding equipment also includes a demolding assembly. The demolding assembly includes a mounting plate, a connecting plate, a rotating shaft, a rotating movable plate, and a limiting plate. The mounting plate is fixedly connected to both sides of the positioning post, the connecting plate is fixedly connected to the mounting plate, the rotating shaft is rotatably connected to the connecting plate, the rotating movable plate is fixedly connected to the rotating shaft and rotates around the rotating shaft, and the limiting plate is fixedly connected below the rotating movable plate. The demolding template has protruding edges on both sides. When the lower template rises, the protruding edges of the demolding template push the rotating movable plate to rotate. When the lower template separates from the upper template and descends, the lower surface of the protruding edges of the demolding template contacts the upper surface of the rotating movable plate, and the limiting plate restricts the downward rotation of the rotating movable plate, thereby allowing the rotating movable plate to lift the demolding template and separate it from the pressure plate. Through the unique cooperation between the rotating movable plate and the limiting plate in the demolding assembly and the interaction with the protruding edges of the demolding template, automatic and efficient demolding of the semiconductor integrated power module after molding is achieved.

[0008] Preferably, the guide post is cylindrical, the guide groove has an inner cavity shape that matches the guide post, and a fitting gap is left between the guide post and the guide groove to achieve guiding and buffering functions and ensure the precise and stable movement of the lower template.

[0009] Preferably, the protruding edge of the ejector plate has a flange structure extending along its length, which makes the contact between the ejector plate and the rotating movable plate more stable and reliable.

[0010] Preferably, the connecting plate is flat, and the rotating shaft passes through and is rotatably connected to the connecting plate, ensuring the smooth rotation of the rotating shaft and the compactness of the mechanism.

[0011] Preferably, the rotating movable plate has an L-shaped plate structure, and the limiting plate is fixedly connected to the lower part of the short arm of the rotating movable plate to limit the excessive rotation of the rotating movable plate and ensure its supporting position during demolding.

[0012] Preferably, the semiconductor integrated power module molding equipment further includes a cleaning mechanism located outside the housing, which is used to automatically clean the mold area after molding and demolding.

[0013] Preferably, the cleaning mechanism includes a collection box, a collection trough, a fan, a connecting pipe, a mounting box, a motor, a sliding plate, a sliding groove, a sliding block, and a suction nozzle. The collection box is located on the right side of the housing and has a collection trough inside. A fan is located on the right side of the collection box and communicates with the collection trough. A mounting box is located on the rear side of the housing, and a motor is located inside the mounting box. The motor drives the sliding plate to move. A sliding groove is opened at the bottom of the sliding plate, and a sliding block slides inside the sliding groove. The sliding block is connected to a suction nozzle, and the suction nozzle communicates with the collection trough through the connecting pipe, thus constructing a complete automatic vacuuming system.

[0014] Preferably, the fan is a suction fan, which can efficiently create a negative pressure environment inside the collection tank and improve the ability to adsorb debris.

[0015] Preferably, the motor is configured to drive the sliding block to reciprocate linearly along the sliding groove, ensuring that the suction nozzle can cover the entire cleaning area and achieve comprehensive cleaning.

[0016] Preferably, the suction nozzle has a funnel-shaped opening and the connecting tube is a flexible tube. This design helps to expand the adsorption range and ensures the flexibility and connectivity of the suction nozzle during movement.

[0017] Preferably, the control buttons include a molding process start button and a cleaning function start button, which facilitates operators to independently and precisely control the various functions of the equipment.

[0018] This utility model has the following beneficial effects:

[0019] 1. This utility model, by setting up a demolding component, uses the movement of the lower template to drive the rotating movable plate to rotate, and when the lower template descends, the limiting plate restricts the downward rotation of the rotating movable plate, thereby lifting the demolding template and separating it from the pressure plate. This solves the problems of low demolding efficiency and easy product damage in the prior art, and achieves the technical effect of automatic and fast demolding, significantly improving production efficiency and protecting the product.

[0020] 2. This utility model solves the problem of mold deviation and insufficient operational stability in the prior art by setting guide posts on the lower template and sliding them in the guide groove inside the positioning post, with a fitting gap between the guide post and the guide groove. It achieves the technical effect of accurately guiding the movement of the lower template, preventing device deviation, and having a buffering effect, thereby improving the operational stability and sealing accuracy of the equipment.

[0021] 3. This utility model, by setting up a cleaning mechanism, uses a fan to create a negative pressure environment inside the collection tank, and drives a sliding block by a motor to move the suction nozzle back and forth along the sliding groove. The suction nozzle is connected to the collection tank through a connecting pipe, which solves the problem of inconvenient and incomplete cleaning of debris after the plastic sealing is completed in the prior art. It achieves the technical effect of automatically and efficiently collecting debris, realizing automatic cleaning of the plastic sealing device, and improving the cleanliness of the equipment.

[0022] 4. This utility model, by combining a molding mechanism and a cleaning mechanism, solves the comprehensive problems of low automation in the molding and demolding processes of existing molding equipment, as well as low efficiency and difficulty in ensuring cleanliness due to reliance on manual labor for cleaning. It achieves the technical effect of integrating automatic molding, automatic demolding and automatic cleaning, significantly improving the automation level, efficiency and product yield of the semiconductor integrated power module molding production process. Attached Figure Description

[0023] Figure 1 This is a three-dimensional schematic diagram of a semiconductor integrated power module molding die device proposed in this utility model;

[0024] Figure 2 This is a schematic diagram of the housing of a semiconductor integrated power module molding die proposed in this utility model;

[0025] Figure 3 This is a schematic diagram of the upper template of a semiconductor integrated power module molding die device proposed in this utility model;

[0026] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0027] Legend:

[0028] 1. Shell;

[0029] 2. Molding sealing mechanism; 21. Lower template; 22. Pressure plate; 23. Template release mechanism; 24. Guide column; 25. Upper template; 26. Positioning column;

[0030] 27. Demolding assembly; 271. Mounting plate; 272. Connecting plate; 273. Rotating shaft; 274. Rotating movable plate; 275. Limiting plate;

[0031] 28. Guide groove;

[0032] 3. Cleaning mechanism; 301. Collection box; 302. Collection trough; 303. Fan; 304. Connecting pipe; 305. Mounting box; 306. Motor; 307. Sliding plate; 308. Sliding groove; 309. Sliding block; 310. Suction nozzle;

[0033] 4. Control buttons. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Example:

[0036] Please refer to Figures 1 to 4 This utility model provides a semiconductor integrated power module molding equipment, which aims to solve the structural defects in the prior art such as low demolding efficiency after molding of semiconductor integrated power modules, easy damage to products, and inconvenient and incomplete cleaning of debris in the molding area.

[0037] like Figure 1 and Figure 2 As shown, the semiconductor integrated power module molding equipment includes a housing 1, a molding mechanism 2 disposed inside the housing 1, and a cleaning mechanism 3 disposed outside the housing 1. A control button 4 is located on the outer surface of the housing 1. The housing 1 serves as the external frame and protective structure of the entire equipment, providing installation and support for the internal molding mechanism 2 and the external cleaning mechanism 3, while protecting the internal precision components from external environmental influences. The molding mechanism 2 is responsible for molding the semiconductor integrated power module, the cleaning mechanism 3 is used to clean debris generated during molding and demolding, and the control button 4 serves as a human-machine interface for operators to initiate the molding process and cleaning function.

[0038] The molding mechanism 2 includes an upper mold plate 25 and a lower mold plate 21, with the lower mold plate 21 capable of moving up and down relative to the upper mold plate 25. A pressure plate 22 is supported on the upper surface of the lower mold plate 21, and a release mold 23 is placed on the upper surface of the pressure plate 22. The upper mold plate 25 and the lower mold plate 21 are the core components of the molding die, completing the molding of the semiconductor integrated power module through their closing and opening actions. The pressure plate 22, as a supporting component, supports the product to be molded and its mold during the molding process. The release mold 23, placed on the pressure plate 22, directly contacts the product and plays a crucial role in the molding and demolding processes.

[0039] The molding mechanism 2 also includes a positioning post 26, which is fixedly connected inside the housing 1 to provide guidance and support for the movement of the lower mold plate 21. The positioning post 26 has a guide groove 28 inside, which has an internal cavity shape that matches that of the guide post 24, ensuring accurate guidance. A guide post 24 is fixedly connected to the lower mold plate 21. The guide post 24 is cylindrical and slides within the guide groove 28. A clearance is provided between the guide post 24 and the guide groove 28. This fit not only accurately guides the vertical movement of the lower mold plate 21, preventing deviation during molding, but also provides a buffering effect, reducing the impact when the lower mold plate 21 closes with the upper mold plate 25, thereby protecting the mold and product, and improving the operational stability and molding accuracy of the equipment.

[0040] One of the innovations of this invention lies in the demolding assembly 27 incorporated into the molding mechanism 2. The demolding assembly 27 includes a mounting plate 271, a connecting plate 272, a rotating shaft 273, a rotating movable plate 274, and a limiting plate 275. The mounting plate 271 is fixedly connected to the left and right sides of the positioning post 26, providing a stable mounting base for the demolding assembly 27. The connecting plate 272, which is flat and fixedly connected to one of the mounting plates 271, serves as a support structure for the rotating shaft 273. The rotating shaft 273 passes through and is rotatably connected to the connecting plate 272, serving as the rotation center of the rotating movable plate 274. The rotating movable plate 274, which is fixedly connected to the rotating shaft 273 and rotates around it, has an L-shaped plate structure. This special shape facilitates effective contact and action with the demolding template 23. The limiting plate 275 is fixedly connected below the short arm of the rotating movable plate 274, restricting its downward transition rotation and ensuring its supporting function during demolding. The demolding template 23 has protruding edges on its left and right sides. These edges are flange structures that extend along their length and come into contact with the upper surface of the rotating movable plate 274 during demolding, thus achieving automatic demolding.

[0041] To solve the above-mentioned technical problems, the core of the technical solution of this embodiment is that the semiconductor integrated power module molding equipment also includes a demolding component 27, and the demolding component 27 forms a specific structural fit and connection relationship with the aforementioned positioning post 26 and demolding template 23 to achieve automatic demolding.

[0042] Please refer to the following carefully. Figure 3 and Figure 4 The core structure will now be described in detail.

[0043] The demolding assembly 27 includes mounting plates 271, which are fixedly connected to the left and right sides of the positioning post 26, providing a stable support base for the demolding assembly 27. The mounting plates 271 are flat and integrally formed on the side of the positioning post 26. A connecting plate 272 is fixedly connected to the upper surface of one of the mounting plates 271. The connecting plate 272 is flat and serves as a mounting platform for the rotating shaft 273. The rotating shaft 273 passes through and is rotatably connected to the connecting plate 272, ensuring that the rotating shaft 273 can rotate flexibly around its own axis, providing a rotation center for the rotation of the rotating movable plate 274. The rotating movable plate 274 is fixedly connected to the rotating shaft 273 and rotates around the rotating shaft 273. It has an L-shaped plate structure, which allows it to be pushed and rotated by the edge of the demolding template 23 during the molding process and also forms an effective support surface during demolding. The limiting plate 275 is fixedly connected to the lower part of the short arm of the rotating movable plate 274. When the rotating movable plate 274 rotates downward, the limiting plate 275 will abut against the limiting structure set inside the housing 1 below, such as a fixed support block, thereby restricting the downward transition rotation of the rotating movable plate 274 and ensuring its supporting role in the demolding process.

[0044] Meanwhile, the demolding template 23 has protruding edges on both sides, which are flange structures extending along its length. These edges cooperate with the rotating movable plate 274 during the molding and demolding process. In the assembled state, when the lower molding template 21 rises, the protruding edges of the demolding template 23 contact and push the rotating movable plate 274 to rotate around the rotation axis 273. After molding is complete, when the lower template 21 separates from the upper template 25 and descends, the lower surface of the protruding edges of the demolding template 23 contacts the upper surface of the rotating movable plate 274. Due to the presence of the limiting plate 275, the rotating movable plate 274 cannot continue to rotate downwards. At this time, the rotating movable plate 274 forms a stable support point, lifting the demolding template 23, thereby separating the demolding template 23 from the pressure plate 22, achieving automatic and rapid demolding of the semiconductor integrated power module. This automatic demolding structure, utilizing the movement of the lower template and the rotation mechanism, ensures the automation and efficiency of the demolding process, while avoiding damage to the product that may be caused by manual operation, significantly improving production efficiency and product yield.

[0045] To improve the stability and guiding accuracy of the lower template 21's movement, and to provide necessary cushioning, the guide post 24 is cylindrical, and the guide groove 28 has an inner cavity shape that matches the guide post, ensuring that the guide post 24 can slide smoothly within the guide groove 28. A clearance is provided between the guide post 24 and the guide groove 28. This clearance design not only compensates for machining errors and reduces frictional resistance, but more importantly, during the rising or falling of the lower template 21, the air or lubricant within this clearance provides a certain degree of cushioning, preventing rigid impacts, thereby protecting the mold and equipment and extending their service life.

[0046] To ensure effective contact and reliable pushing between the ejector plate 23 and the rotating movable plate 274, the protruding edge of the ejector plate 23 has a flange structure extending along its length. This flange structure provides sufficient contact area and stability, ensuring that the rotating movable plate 274 can be accurately pushed to rotate when the lower platen 21 rises, and that the rotating movable plate 274 can stably support the ejector plate 23 during demolding, avoiding demolding failure or product damage due to unstable contact.

[0047] To ensure a reliable connection and smooth rotation between the rotating shaft 273 and the connecting plate 272, the connecting plate 272 is flat, providing a smooth mounting surface for the rotating shaft 273. The rotating shaft 273 passes through and is rotatably connected to the connecting plate 272. This through-hole structure is achieved through bearings or bushings, ensuring that the rotating shaft 273 can rotate freely and with low friction on the connecting plate 272, providing smooth transmission for the movement of the rotating movable plate 274.

[0048] To achieve effective interaction between the rotating movable plate 274 and the demolding template 23, and to coordinate with the limiting plate 275, the rotating movable plate 274 has an L-shaped plate structure. This L-shaped structure gives it two arms: one arm connects to the rotating shaft 273 and receives the push or support of the demolding template 23, while the other short arm is used to fix the limiting plate 275. The limiting plate 275 is fixedly connected to the lower part of the short arm of the rotating movable plate 274. When the rotating movable plate 274 rotates downward due to gravity or the action of the reset mechanism, the limiting plate 275 abuts against the limiting structure inside the housing 1, such as a fixed support block, thereby limiting the excessive rotation of the rotating movable plate 274, ensuring that it always remains in an effective working position, and preventing it from swinging freely and affecting the accuracy of demolding.

[0049] In addition to the sealing mechanism 2, this utility model also includes a cleaning mechanism 3. The cleaning mechanism 3 is located outside the housing 1 and is used to automatically clean the sealing device after sealing and demolding, thereby improving the overall automation level of the equipment and the cleanliness of the working environment.

[0050] To achieve efficient debris collection and cleaning, the cleaning mechanism 3 includes a collection box 301, a collection trough 302, a fan 303, a connecting pipe 304, a mounting box 305, a motor 306, a sliding plate 307, a sliding groove 308, a sliding block 309, and a suction nozzle 310. The collection box 301 is located on the right side of the housing 1 and serves as a temporary storage container for debris. The collection box 301 contains a collection trough 302 for centralized storage of sucked-in debris. A fan 303 is located on the right side of the collection box 301, communicating with the collection trough 302 to generate airflow for debris suction. A mounting box 305 is located at the rear of the housing 1, and a motor 306 is located inside the mounting box 305. The motor 306 serves as a power source to drive the sliding plate 307 to move. The bottom of the sliding plate 307 is provided with a sliding groove 308, and a sliding block 309 is slidably fitted inside the sliding groove 308. The sliding block 309 is connected to a suction nozzle 310, which serves as the inlet for debris. It is connected to the collection tank 302 through the connecting pipe 304 to form a complete debris suction and conveying path.

[0051] In order to efficiently create a negative pressure environment inside the collection tank 302 to suck up debris, the fan 303 is configured as an exhaust fan. When the exhaust fan is working, it extracts the gas from the collection tank 302, thereby creating a pressure zone lower than the external environment inside the collection tank 302 and through the connecting pipe 304 and the suction nozzle 310, so that external air along with debris is sucked in.

[0052] To ensure thorough cleaning of the sealed area by the nozzle 310, the motor 306 is configured to drive the sliding block 309 in a linear reciprocating motion along the sliding groove 308. This linear reciprocating motion ensures that the nozzle 310 can cover the entire area requiring cleaning, achieving automatic cleaning without any blind spots.

[0053] To improve debris suction efficiency and accommodate nozzle movement, the nozzle 310 has a funnel-shaped opening, which facilitates the collection of debris over a wide area. The connecting tube 304 is a flexible tube, which allows it to bend or extend with the movement of the nozzle 310. This ensures that the connecting tube 304 will not restrict the movement range of the nozzle or cause damage due to rigidity during the reciprocating motion of the nozzle 310, while maintaining good communication with the collection tank 302.

[0054] Control buttons 4 are located on the outer surface of housing 1, providing operators with a convenient operating interface. Control buttons 4 include a molding process start button and a cleaning function start button, allowing operators to activate the molding and cleaning functions separately as needed, achieving precise control of the equipment.

[0055] The implementation principle of this application embodiment is as follows:

[0056] Molding and demolding process:

[0057] After the operator presses the molding process start button on control button 4, the molding process begins. The lower mold plate 21 inside the housing 1 begins to move upward under the drive of a driving device, such as a hydraulic or pneumatic cylinder. Guide posts 24, fixedly connected to the lower mold plate 21, slide within guide grooves 28 formed inside positioning posts 26. The guide posts 24 are cylindrical, and the guide grooves 28 have an inner cavity shape that matches the guide posts. The fit between them allows the guide posts 24 to provide precise guidance within the guide grooves 28, while also providing cushioning to prevent the lower mold plate 21 from deviating during its ascent, ensuring precise contact between the lower mold plate 21 and the upper mold plate 25, thus completing the molding of the semiconductor integrated power module.

[0058] As the lower template 21 rises, the pressure plate 22 on its upper surface and the demolding template 23 placed on the pressure plate 22 also rise accordingly. The demolding template 23 has protruding flanges extending along its length on both sides. These edges contact and push the rotating movable plate 274 in the demolding assembly 27, which is fixedly connected to the mounting plate 271 on both sides of the positioning post 26. The rotating movable plate 274 has an L-shaped plate structure and is fixedly connected to a rotating shaft 273 that passes through and rotatably connects to the connecting plate 272, thus rotating around the rotating shaft 273. When the molding is complete and the lower template 21 is attached to the upper template 25, the rotating movable plate 274 does not contact the demolding template 23 and will return to its initial position by its own weight or a reset mechanism. The limiting plate 275 fixedly connected to its short arm below will abut against a limiting structure inside the housing 1, such as a fixed support block, restricting the downward transition rotation of the rotating movable plate 274.

[0059] When demolding is required, the lower mold plate 21 separates from the upper mold plate 25, and the lower mold plate 21 begins to move downward under the action of the driving device. At this time, the demolding mold plate 23 descends with the pressure plate 22, and the lower part of its protruding edges on both sides contacts the upper surface of the rotating movable plate 274. Since the limiting plate 275 restricts the rotating movable plate 274 from rotating downward, the rotating movable plate 274 acts as a fixed support point, lifting the demolding mold plate 23, causing the demolding mold plate 23 to separate from the pressure plate 22, thereby completing the automatic and rapid demolding of the semiconductor integrated power module. This automatic demolding structure, which utilizes the movement of the lower mold plate and the cooperation of the rotating mechanism, ensures the automation and high efficiency of the demolding process.

[0060] Cleaning process:

[0061] After demolding, the operator presses the cleaning function start button on control button 4. The blower 303, located on the right side of the collection box 301 on the right side of the housing 1, starts. The blower 303 is a suction blower, expelling gas and creating a negative pressure environment inside the collection groove 302 within the collection box 301. Simultaneously, the motor 306 inside the mounting box 305 on the rear side of the housing 1 starts synchronously. The motor 306 drives the sliding block 309 to reciprocate linearly along the sliding groove 308. The sliding block 309 slides within the sliding groove 308 at the bottom of the sliding plate 307, causing the suction nozzle 310, connected to the sliding block 309, to reciprocate above the sealing device. The suction nozzle 310 has a funnel-shaped opening; under the negative pressure environment, it sucks in debris generated during demolding. This debris enters the collection groove 302, which communicates with the blower 303, through the flexible tubular connecting pipe 304. This automatic cleaning mechanism, which combines negative pressure adsorption with a moving suction nozzle, can effectively collect debris generated during the demolding process, achieving automatic cleaning of the sealing device and improving the cleanliness and production efficiency of the equipment.

Claims

1. A semiconductor integrated power module molding die assembly equipment, comprising: A housing (1), a sealing mechanism (2), are disposed inside the housing (1), and a control button (4) is disposed on the outer surface of the housing (1). The sealing mechanism (2) includes an upper template (25) and a lower template (21). The lower template (21) can move up and down relative to the upper template (25). A pressure plate (22) is supported on the upper surface of the lower template (21), and a release template (23) is placed on the upper surface of the pressure plate (22). The sealing mechanism (2) further includes a positioning post (26), which is fixedly connected to the inside of the housing (1). A guide groove (28) is provided inside the positioning post (26). A guide post (24) is fixedly connected to the lower template (21), and the guide post (24) is slidably fitted in the guide groove (28). The molding mechanism (2) is characterized in that it further includes a demolding assembly (27), which includes a mounting plate (271), a connecting plate (272), a rotating shaft (273), a rotating movable plate (274), and a limiting plate (275). The mounting plate (271) is fixedly connected to both sides of the positioning post (26), the connecting plate (272) is fixedly connected to the mounting plate (271), the rotating shaft (273) is rotatably connected to the connecting plate (272), the rotating movable plate (274) is fixedly connected to the rotating shaft (273) and rotates around the rotating shaft (273), and the limiting plate (275) is fixedly connected to the rotating movable plate (275). Below the lower template (21), the demolding template (23) has protruding edges on both sides. When the lower template (21) rises, the protruding edges of the demolding template (23) push the rotating movable plate (274) to rotate. When the lower template (21) separates from the upper template (25) and the lower template (21) descends, the protruding edges of the demolding template (23) contact the upper surface of the rotating movable plate (274). The limiting plate (275) restricts the rotating movable plate (274) from rotating downward, thereby allowing the rotating movable plate (274) to lift the demolding template (23) and separate the demolding template (23) from the pressure plate (22).

2. The semiconductor integrated power module molding equipment according to claim 1, characterized in that, The guide post (24) is cylindrical, and the guide groove (28) has an inner cavity shape that matches the guide post. There is a fitting gap between the guide post (24) and the guide groove (28) to achieve guiding and buffering functions.

3. The semiconductor integrated power module molding equipment according to claim 1, characterized in that, The protruding edge of the template (23) has a flange structure that extends along its length.

4. The semiconductor integrated power module molding equipment according to claim 1, characterized in that, The connecting plate (272) is flat, and the rotating shaft (273) passes through and is rotatably connected to the connecting plate (272).

5. The semiconductor integrated power module molding equipment according to claim 1, characterized in that, The rotating movable plate (274) has an L-shaped plate structure, and the limiting plate (275) is fixedly connected to the lower part of the short arm of the rotating movable plate (274) to limit the excessive rotation of the rotating movable plate (274).

6. The semiconductor integrated power module molding equipment according to claim 1, characterized in that, It also includes a cleaning mechanism (3), which is disposed outside the housing (1).

7. The semiconductor integrated power module molding equipment according to claim 6, characterized in that, The cleaning mechanism (3) includes a collection box (301), a collection trough (302), a fan (303), a connecting pipe (304), a mounting box (305), a motor (306), a sliding plate (307), a sliding groove (308), a sliding block (309), and a suction nozzle (310); The collection box (301) is located on the right side of the housing (1). The collection box (301) has a collection groove (302) inside. A fan (303) is located on the right side of the collection box (301). The fan (303) is connected to the collection groove (302). An installation box (305) is located on the rear side of the housing (1). A motor (306) is located inside the installation box (305). The motor (306) drives the sliding plate (307) to move. A sliding groove (308) is opened at the bottom of the sliding plate (307). A sliding block (309) is slidably fitted inside the sliding groove (308). A suction nozzle (310) is connected to the sliding block (309). The suction nozzle (310) is connected to the collection groove (302) through a connecting pipe (304).

8. The semiconductor integrated power module molding equipment according to claim 7, characterized in that, The fan (303) is configured as an exhaust fan to create a negative pressure environment inside the collection tank (302).

9. The semiconductor integrated power module molding equipment according to claim 7, characterized in that, The motor (306) is configured to drive the sliding block (309) to perform linear reciprocating motion along the sliding groove (308).

10. The semiconductor integrated power module molding equipment according to claim 7, characterized in that, The suction nozzle (310) has a funnel-shaped opening, and the connecting tube (304) is a flexible tube to accommodate the movement of the suction nozzle (310).

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