A hot-pressing die for a copper busbar liquid cooling tank

Abstract

The application relates to the technical field of insulation layer coating technology, and relates to a hot-pressing die for a copper bar liquid cooling tank, which comprises the following: a bottom surface of an upper die is provided with a plurality of pressing strips at intervals along a first direction, the pressing strips are used for pressing an insulation layer into a liquid cooling tank of a copper bar; a top surface of a lower die is provided with two limiting strips at intervals along a second direction, the limiting strips are provided with a plurality of grooves at intervals along the first direction, the plurality of grooves correspond to the plurality of pressing strips one by one; an assembly area is formed between the two limiting strips, the assembly area is used for placing the copper bar, a plurality of limiting columns are arranged at the assembly area of the lower die, the limiting columns are used for penetrating the copper bar and an insulation layer arranged on a top surface of the copper bar in sequence; the pressing strips enter the grooves and press the insulation layer into the liquid cooling tank and the grooves at the same time. Since the edges of the insulation layer are clamped by the pressing strips and the limiting strips at the grooves, relative movement between the edges of the positioning holes and the limiting columns is eliminated, insulation failure and appearance defects caused by tearing are avoided.

Description

Technical Field

[0001] This application relates to the field of insulation layer coating technology, and in particular to a hot pressing mold for a copper drain liquid cooling tank. Background Technology

[0002] To meet the requirements for heat dissipation and insulation, in related technologies, a hot-pressed insulating layer is required in the liquid cooling tank area on the surface of the copper busbar, so that the insulating layer and the copper busbar are hot-pressed together.

[0003] In the hot pressing process, the copper busbar is placed in the lower mold, and the insulating layer is laid on top of the copper busbar. The lower mold has limiting posts that pass through the copper busbar and the insulating layer in sequence to achieve positioning. At the same time, the size of the insulating layer must be larger than the outline of the copper busbar to ensure complete coverage and meet the creepage distance requirements.

[0004] However, in the above positioning method, the part of the insulation layer that extends beyond the edge of the copper busbar is in a suspended state. When pressed down, this area deforms, and the limiting post is a fixed rigid structure, which causes stress concentration at the edge of the positioning hole of the insulation layer due to jamming. During the hot pressing process, the insulation layer is very easy to tear, affecting the insulation reliability and electrical safety of the product. Utility Model Content

[0005] In view of this, this application provides a hot pressing mold for a copper busbar liquid cooling tank to solve the problem of insulation layer tearing during hot pressing.

[0006] This application provides a hot pressing mold for a copper drain cooling tank, comprising: The upper mold has multiple pressure strips spaced apart on its bottom surface along a first direction. The pressure strips are used to press the insulating layer into the liquid cooling tank of the copper busbar. The lower mold has two limiting strips spaced apart along the second direction on its top surface. The limiting strips have multiple grooves spaced apart along the first direction, which allow the pressure strips to enter and press a portion of the insulating layer against the limiting strips. Each of the multiple grooves corresponds to a single pressure strip. An assembly area is formed between the two limiting strips. The assembly area is used to place the copper busbar. The lower mold is provided with a plurality of limiting posts at the assembly area. The limiting posts are used to pass through the copper busbar and the insulating layer provided on the upper surface of the copper busbar in sequence. When the mold is closed, the pressure strip enters the groove and simultaneously presses the insulating layer into the liquid cooling tank and the groove.

[0007] In one possible implementation, the cross-sectional shape of the pressure strip is adapted to the cross-sectional shape of the groove, and when the mold is closed, the insulating layer is sandwiched between the pressing surface of the pressure strip and the inner wall surface of the groove, and is pressed by the pressure strip and the inner wall surface of the groove.

[0008] In one possible implementation, the limiting strip is adjustablely connected to the lower mold so that the two limiting strips move closer to or further apart from each other along the second direction.

[0009] In one possible implementation, the lower mold is provided with a first sliding engagement portion, and the limiting strip is provided with a second sliding engagement portion, wherein the first sliding engagement portion and the second sliding engagement portion are adapted to allow the limiting strip to slide and adjust relative to the lower mold.

[0010] In one possible implementation, the top surface of the lower mold is provided with a groove that extends along the second direction; The limiting strip has a slider on the side facing the lower mold, and the slider is slidably connected to the groove.

[0011] In one possible implementation, an abutment is detachably provided in the groove, the abutment being disposed on the side of the limiting strip opposite to the assembly area and used to abut against the slider; The abutment is provided with an assembly end, and the assembly end extends out of the groove.

[0012] In one possible implementation, the upper mold has a plurality of limiting holes, which are spaced apart between two adjacent pressure strips; The plurality of limiting posts are provided in a one-to-one correspondence with the plurality of limiting holes.

[0013] In one possible implementation, the limiting post includes a first post segment and a second post segment arranged coaxially, wherein the diameter of the first post segment is larger than the diameter of the second post segment, so that the limiting post is in the shape of a stepped shaft. The end of the first column segment furthest from the second column segment is disposed on the lower mold, and the end of the first column segment closest to the second column segment is provided with a rounded chamfer.

[0014] One possible implementation also includes: Multiple pressure-bearing blocks are disposed on the top surface of the upper mold, and the multiple pressure-bearing blocks are spaced apart along the circumference of the lower mold; The thickness of the pressure block is greater than the thickness of the limiting strip. When the mold is closed, the pressure block is used to abut against the bottom surface of the upper mold.

[0015] In one possible implementation, it further includes: at least one pad disposed in the assembly area, the pad being used to fill the recessed area of ​​the copper busbar facing the lower mold, and the thickness of the pad being less than the thickness of the limiting strip.

[0016] Implementing the embodiments of this application has the following beneficial effects: In the hot pressing mold of the copper busbar liquid cooling tank in this embodiment, multiple pressure strips are set in the upper mold, and two grooved limiting strips are provided on the top surface of the lower mold. An assembly area for placing the copper busbar is formed between the two limiting strips. The pressure strips and grooves correspond one-to-one. When the mold is closed, the pressure strips enter the grooves and press the insulating layer into the liquid cooling tank and the grooves at the same time.

[0017] During mold closing, the pressure strip presses the insulation layer into the liquid cooling tank, while the portion of the insulation layer extending beyond the copper busbar edge is simultaneously pressed and fixed within the groove. Because the edge of the insulation layer is held in place by the pressure strip and the limiting strip at the groove, it is no longer suspended and will not bend downwards during hot pressing. The relative movement between the edge of the positioning hole and the limiting post is eliminated, and stress concentration is naturally eliminated. The problem of insulation paper tearing is solved at its root, avoiding insulation failure and appearance defects caused by tearing, thereby improving the insulation reliability and production yield of the product. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the upper mold structure of this utility model is shown; Figure 2 A schematic diagram of the lower mold structure of this utility model is shown; Figure 3 This utility model illustrates Figure 2 A magnified view of a portion of the image; Figure 4 A schematic diagram of the limiting strip of this utility model is shown; Figure 5 The diagram shows the assembly of the abutment and the groove of this utility model.

[0020] Figure label: a. First direction; b. Second direction; 10. Upper mold; 11. Pressure strip; 12. Limiting hole; 20. Lower mold; 21. Limiting strip; 211. Groove; 212. Second sliding fit; 2121. Slider; 22. Assembly area; 23. Limiting post; 231. First column segment; 232. Second column segment; 24. First sliding fit; 241. Slide groove; 30. Abutment part; 31. Assembly end; 40. Pressure block; 50. Pad block. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] To meet the requirements for heat dissipation and insulation, in related technologies, a hot-pressed insulating layer is required in the liquid cooling tank area on the surface of the copper busbar, so that the insulating layer and the copper busbar are hot-pressed together.

[0023] In the hot pressing process, the copper busbar is placed in the lower mold, and the insulating layer is laid on top of the copper busbar. The lower mold has limiting posts that pass through the copper busbar and the insulating layer in sequence to achieve positioning. At the same time, the size of the insulating layer must be larger than the outline of the copper busbar to ensure complete coverage and meet the creepage distance requirements.

[0024] However, in the above positioning method, the portion of the insulation layer extending beyond the edge of the copper busbar lacks rigid support and is suspended. During hot pressing, this suspended area bends and deforms downwards, while the limiting post penetrating the insulation layer is a fixed rigid structure, remaining stationary. This causes the edge of the positioning hole in the insulation layer to be stuck by the limiting post, preventing it from moving downwards synchronously with the material. This results in severe stress concentration at the hole edge, and the high temperature of the hot pressing process reduces the material strength, making it highly susceptible to tearing of the insulation layer from the positioning hole, thereby affecting the insulation reliability and electrical safety of the product.

[0025] See Figures 1 to 5 As shown, for this purpose, this utility model embodiment provides a hot pressing mold for a copper busbar liquid cooling tank, including: an upper mold 10 and a lower mold 20; The bottom surface of the upper mold 10 is provided with a plurality of pressure strips 11 at intervals along the first direction a. The pressure strips 11 are used to press the insulating layer into the liquid cooling tank of the copper busbar. The top surface of the lower mold 20 is provided with two limiting strips 21 at intervals along the second direction b. The limiting strips 21 are provided with multiple grooves 211 at intervals along the first direction a, which allow the pressure strips 11 to enter and press part of the insulating layer into the limiting strips 21. The multiple grooves 211 correspond one-to-one with the multiple pressure strips 11. An assembly area 22 is formed between the two limiting strips 21. The assembly area 22 is used to place the copper busbar. The lower mold 20 is provided with multiple limiting posts 23 in the assembly area 22. The limiting posts 23 are used to pass through the copper busbar and the insulating layer provided on the upper surface of the copper busbar in sequence. When the mold is closed, the pressure strip 11 enters the groove 211 and simultaneously presses the insulating layer into the liquid cooling tank and the groove 211.

[0026] Understandably, the upper mold 10 is the upper part of the mold, which is installed on the movable plate of the hot press. When the upper mold 10 is closed, it drives the pressure strip 11 to move downward and applies high temperature and high pressure to the copper busbar and the insulation layer.

[0027] The pressure strip 11 is a long, raised structure fixedly installed on the bottom surface of the upper mold 10. It can be fixed by detachable connection with bolts or integrally formed with the upper mold 10, and rises and falls synchronously with the upper mold 10. The pressure strip 11 acts directly on the insulating layer, pressing the insulating layer into the liquid cooling tank of the copper busbar so that it adheres to the tank wall. At the same time, it presses the part of the insulating layer extending beyond the edge of the copper busbar into the groove 211 of the limiting strip 21 for fixation.

[0028] The upper mold 10 is positioned directly above the lower mold 20 and is opposite to the lower mold 20. Multiple pressure strips 11 are arranged at intervals along the first direction a. In this embodiment, the first direction a can be the width direction of the copper busbar. The distribution position of each pressure strip 11 on the bottom surface of the upper mold 10 corresponds one-to-one with the setting position of each liquid cooling tank on the surface of the copper busbar. Multiple pressure strips 11 extend along the second direction b. The second direction b can be the length direction of the copper busbar. The length of the pressure strip 11 is not less than the length of the liquid cooling tank to ensure that the pressure strip 11 can completely press the insulating layer into the entire liquid cooling tank.

[0029] The lower mold 20 is the lower half of the mold. It is fixedly installed on the hot press workbench to support the copper busbar and provide bottom support force. It is used to cooperate with the upper mold 10 to complete the mold closing and pressing.

[0030] The limiting strip 21 is a long strip-shaped protrusion fixedly set on the top surface of the lower mold 20. The two limiting strips 21 are arranged at intervals along the second direction b (the length direction of the copper busbar), and the limiting strips 21 extend along the first direction a (the width direction of the copper busbar). The two limiting strips 21 together form the assembly area 22, which is used to initially limit the copper busbar and prevent the copper busbar from moving along the second direction b.

[0031] Each limiting strip 21 has multiple grooves 211 spaced apart along the first direction a (copper busbar width direction). The number of grooves 211 is the same as the number of pressure strips 11 of the upper mold 10. The position of each groove 211 corresponds one-to-one with each pressure strip 11 in the first direction a. That is, the two ends of each pressure strip 11 correspond to the grooves 211 on the two limiting strips 21 respectively. When the mold is closed, the two ends of the pressure strip 11 extending out of the copper busbar enter the corresponding grooves 211 respectively.

[0032] During mold closing, both ends of the pressure strip 11 enter the corresponding grooves 211 of the side limiting strips 21. The depth direction of the grooves 211 is vertically downward, consistent with the movement direction of the pressure strip 11.

[0033] Among them, the two limiting strips 21 have a gap of 0.1-0.3mm between their inner sidewalls and the sidewalls of the copper busbar, which facilitates the assembly of the copper busbar. As the copper busbar expands due to heat, the reserved gap can also serve as an expansion joint between the copper busbar and the limiting strips 21.

[0034] Multiple limiting posts 23 are used to limit the copper busbars placed in the assembly area 22. The multiple limiting posts 23 are distributed in the assembly area 22. The positions of the limiting posts 23 correspond one-to-one with the positions of the limiting holes 12 on the copper busbars. The limiting posts 23 extend vertically, with their lower ends fixed to the lower mold 20 and their upper ends extending upwards. The height of the limiting posts 23 is greater than the thickness of the copper busbars so that they can still extend and penetrate the limiting holes 12 of the insulation layer after the insulation layer is placed on the upper surface of the copper busbars. By passing through the limiting holes 12 of the copper busbars and the limiting holes 12 of the insulation layer in sequence, the limiting posts 23 achieve precise positioning of the copper busbars and the insulation layer, ensuring that there is no relative displacement between the copper busbars and the lower mold 20, and between the insulation layer and the copper busbars during the hot pressing process. It also ensures the alignment accuracy between the pressure strip 11 and the liquid cooling tank.

[0035] The liquid cooling tank is a recessed channel set on the upper surface of the copper busbar, used to assemble the liquid cooling device. The cooling medium inside the liquid cooling device circulates to remove the heat generated by the copper busbar during operation, thereby achieving a heat dissipation effect.

[0036] In this embodiment, multiple liquid cooling tanks are arranged at intervals along the first direction a (width direction of the copper busbar), and each liquid cooling tank extends along the second direction b (length direction of the copper busbar). The arrangement and extension direction of each liquid cooling tank correspond one-to-one with the arrangement and extension direction of each pressure strip 11, and the length of the pressure strip 11 is greater than the length of the liquid cooling tank. When the mold is closed, both ends of the pressure strip 11 extend along the length direction of the copper busbar into the grooves 211 of the limiting strips 21 on both sides of the copper busbar.

[0037] Mold closing refers to the process where the upper mold 10 continuously moves closer to the lower mold 20 under the action of the hot press until they are closed together. At this time, the pressure strip 11 of the upper mold 10 enters the groove 211 of the limiting strip 21 of the lower mold 20, achieving a state where the upper mold 10 and the lower mold 20 are completely closed.

[0038] In the mold-closed state, the copper busbar is located in the assembly area 22 between the two limiting strips 21. The liquid cooling groove on the copper busbar and the groove 211 on the limiting strip 21 are aligned in the second direction b (the length direction of the copper busbar), and the two ends of the liquid cooling groove are respectively opposite to the corresponding grooves 211 on the two limiting strips 21, with all three located on the same straight line. Each pressure strip 11 is simultaneously pressed into its corresponding liquid cooling groove and the grooves 211 on both sides.

[0039] During the process, the upper mold 10 continues to descend and approach the lower mold 20. The pressure strip 11 on the bottom surface of the upper mold 10 pre-contacts the insulating layer on the upper surface of the copper busbar. As the upper mold 10 continues to press down, the insulating layer is gradually pressed into the liquid cooling tank. At the same time, the part extending along the length direction from the edge of the copper busbar is also pressed into the grooves 211 of the limiting strips 21 on both sides of the copper busbar. This allows the insulating layer to be simultaneously adhered to the tank wall of the liquid cooling tank and the groove wall of the groove 211. The insulating layer on the outer edge of the copper busbar is pressed and fixed in the groove 211 and is no longer in a suspended state. This fundamentally solves the problem of the insulating layer bending and deforming downward during hot pressing, ensuring that the insulating layer remains flat and evenly stressed during hot pressing. The edge of the positioning hole and the limiting post 23 no longer experience jamming and stress concentration due to relative movement. The problem of insulation layer tearing is effectively solved, resulting in a significant improvement in the insulation reliability and yield of the product.

[0040] The insulating layer can be insulating paper, such as aramid paper or kraft paper; or it can be an insulating film, such as polyester film (PET), polyimide film (PI), or polytetrafluoroethylene film (PTFE).

[0041] In the hot pressing mold of the copper busbar liquid cooling tank in this embodiment, multiple pressure strips 11 are provided on the upper mold 10, and two limiting strips 21 with grooves 211 are provided on the top surface of the lower mold 20. An assembly area 22 for placing the copper busbar is formed between the two limiting strips 21. The pressure strips 11 and the grooves 211 correspond one-to-one. When the mold is closed, the pressure strips 11 enter the grooves 211 and press the insulating layer into the liquid cooling tank and the grooves 211 at the same time.

[0042] During mold closing, the pressure strip 11 presses the insulating layer into the liquid cooling tank, while the portion of the insulating layer extending beyond the copper busbar edge is simultaneously pressed and fixed within the groove 211. Since the edge of the insulating layer is held in place by the pressure strip 11 and the limiting strip 21 at the groove 211, it is no longer suspended and will not bend downwards during hot pressing. The relative movement between the edge of the positioning hole and the limiting post 23 is eliminated, and stress concentration naturally disappears. The problem of insulation paper tearing is solved at its root, avoiding insulation failure and appearance defects caused by tearing, thereby improving the insulation reliability and production yield of the product.

[0043] In some embodiments, the cross-sectional shape of the pressure strip 11 is adapted to the cross-sectional shape of the groove 211. When the mold is closed, the insulating layer is sandwiched between the pressing surface of the pressure strip 11 and the inner wall surface of the groove 211, and is pressed by the pressure strip 11 and the inner wall surface of the groove 211.

[0044] Understandably, the cross-sectional shape of the pressure strip 11 can be any of a rectangle, trapezoid, or arc, and the cross-sectional shape of the groove 211 can be a rectangle, trapezoid, or arc accordingly. The cross-sectional dimension of the pressure strip 11 is slightly smaller than that of the groove 211, so that the pressure strip 11 can smoothly enter the groove 211 and form a uniform pressing gap. By adapting the cross-sectional shape of the pressure strip 11 to the groove 211, the portion of the insulating layer extending beyond the copper busbar (the edge of the insulating layer) is evenly clamped and fixed during mold closing, preventing the insulating layer from being suspended and deformed. After the pressure strip 11 enters the groove 211, the insulating layer is clamped between the pressing surface of the pressure strip 11 and the inner wall surface of the groove 211. Both surfaces work together to apply a clamping force, ensuring that the insulating layer is evenly stressed and firmly adheres to the wall of the liquid cooling tank.

[0045] In some embodiments, the limiting strip 21 is adjustablely connected to the lower mold 20 so that the two limiting strips 21 move closer to or further away from each other along the second direction b.

[0046] Understandably, the limiting strip 21 and the lower mold 20 are adjustable. This adjustable connection structure allows the limiting strip 21 to be adjusted along the second direction b (the length direction of the copper busbar) on the lower mold 20. This allows the spacing between the two limiting strips 21 to be adjusted according to the actual length of the copper busbar, enabling the two limiting strips 21 to move closer or further apart along the second direction b, thus accommodating copper busbar products of different lengths. Simultaneously, after adjustment, the limiting strip 21 can be fixed to the lower mold 20 via a locking structure, ensuring positioning accuracy and stability during the pressing process.

[0047] The adjustable connection structure may include multiple positioning holes spaced apart on the top surface of the lower mold 20 along the second direction b, and positioning holes on the limiting strip 21, which are installed and fixed by screws.

[0048] The adjustable connection structure may also include an oblong mounting hole extending along the second direction b on the top surface of the lower mold 20, and a corresponding through hole on the limiting strip 21. After the bolt passes through the through hole and the oblong hole, the limiting strip 21 is locked onto the lower mold 20. When the bolt is loosened, the limiting strip 21 can slide and adjust along the oblong hole in the second direction b, and is fixed after being locked.

[0049] The adjustable connection structure can also be a sliding fit structure, allowing the limit bar 21 to slide relative to the lower mold 20 for flexible adjustment.

[0050] In some embodiments, the lower mold 20 is provided with a first sliding engagement portion 24, and the limiting strip 21 is provided with a second sliding engagement portion 212. The first sliding engagement portion 24 and the second sliding engagement portion 212 are adapted to each other so that the limiting strip 21 can slide and adjust relative to the lower mold 20.

[0051] Understandably, the first sliding engagement part 24 and the second sliding engagement part 212 are interlocked and can slide relative to each other, thereby allowing the limit strip 21 to move relative to the lower mold 20 along the second direction b, so as to adjust the distance between the two limit strips 21.

[0052] The first sliding engagement part 24 can be a guide rail structure. A linear guide rail extending along the second direction b is fixedly provided on the top surface of the lower mold 20, serving as the first sliding engagement part 24. Correspondingly, a slider 2121 that mates with the guide rail is fixedly provided at the bottom of the limiting strip 21, serving as the second sliding engagement part 212. The limiting strip 21 slides on the guide rail via the slider 2121 to achieve position adjustment.

[0053] The first sliding fit part 24 can be a groove 241 structure, and correspondingly, the second sliding fit part 212 can be a slider 2121 structure.

[0054] The first sliding fit part 24 and the second sliding fit part 212 have a guiding function during the sliding adjustment process, so that the limiting strip 21 only moves along the second direction b. This ensures that the limiting strip 21 remains parallel to the second direction b during the adjustment process. After adjustment, the groove 211 and the pressure strip 11 can still maintain accurate correspondence, avoiding a decrease in pressing accuracy due to the skewness of the limiting strip 21. At the same time, the operation is simple and the positioning is reliable, further improving the mold's adaptability to copper busbars of different widths and the stability of the production process.

[0055] In some embodiments, the top surface of the lower mold 20 is provided with a groove 241, which extends along the second direction b; the limiting strip 21 is provided with a slider 2121 on the side facing the lower mold 20, and the slider 2121 is slidably connected to the groove 241.

[0056] Understandably, the first sliding fit part 24 is a groove 241 structure, with a T-shaped groove or dovetail groove extending along the second direction b on the top surface of the lower mold 20. Correspondingly, the second sliding fit part 212 is a slider 2121 set at the bottom of the limiting strip 21 and matching the shape of the groove 241. The specific structure can be a T-shaped block or a dovetail block.

[0057] The slider 2121 is embedded in the groove 241 and slides along the groove 241. At the same time, the groove 241, which is in the form of a T-slot or dovetail groove, limits the limiting strip 21 in the vertical direction to prevent the limiting strip 21 from detaching from the lower mold 20.

[0058] In some embodiments, abutment 30 is detachably provided in the slide groove 241. Abutment 30 is disposed on the side of the limiting strip 21 away from the assembly area 22 and is used to abut against the slider 2121. The abutment 30 is provided with an assembly end 31, which extends out of the slide groove 241 to facilitate hand-held replacement.

[0059] Understandably, the abutment 30 is a block-shaped component set inside the slide groove 241. The abutment 30 is detachably set on the side of the limiting strip 21 away from the assembly area 22 to abut against the second sliding mating part 212 (slider 2121) at the bottom of the limiting strip 21, thereby fixing the limiting strip 21 against the slide groove 241 and preventing the limiting strip 21 from sliding and shifting along the slide groove 241 due to vibration or force during the hot pressing process.

[0060] In this process, after placing the copper busbar in the assembly area 22, the limiting strip 21 is slidably adjusted according to the size of the copper busbar so that the limiting strip 21 and the copper busbar have a preset gap. Then, the abutment 30 is embedded in the slide groove 241 and pressed against the side of the slider 2121 away from the assembly area 22. The abutment 30 itself has a certain thickness to occupy and fill the remaining space in the slide groove 241, so that the slider 2121 cannot move away from the assembly area 22, thereby fixing the limiting strip 21 in the current position.

[0061] The assembly end 31 is integrally formed with the abutment part 30, and extends into a groove 241, which is convenient for operators to hold and grasp for assembly or replacement.

[0062] In some embodiments, the upper mold 10 has a plurality of limiting holes 12, which are spaced apart between two adjacent pressure strips 11; Multiple limiting posts 23 are set one-to-one with multiple limiting holes 12.

[0063] Understandably, the limiting hole 12 is a through hole or blind hole opened in the upper mold 10. The position of the limiting hole 12 corresponds one-to-one with the limiting post 23 of the lower mold 20. Multiple limiting holes 12 are distributed at intervals on the upper mold 10 and arranged in the area between two adjacent pressure strips 11.

[0064] During the mold closing process, when the upper mold 10 descends to near the lower mold 20, the limiting post 23, which penetrates the copper busbar and the insulating layer and extends upward, gradually enters the corresponding limiting hole 12 of the upper mold 10. The limiting hole 12 provides clearance space for the limiting post 23, preventing the limiting post 23 from rigidly colliding with the upper mold 10. At the same time, the cooperation between the limiting post 23 and the limiting hole 12 can play an auxiliary guiding role in the mold closing position of the upper mold 10 in the later stage of mold closing, further ensuring the mold closing accuracy.

[0065] In some embodiments, the limiting post 23 includes a first post segment 231 and a second post segment 232 coaxially arranged, wherein the diameter of the first post segment 231 is larger than the diameter of the second post segment 232, so that the limiting post 23 is in the shape of a stepped shaft. The end of the first column segment 231 away from the second column segment 232 is set on the lower mold 20, and the end of the first column segment 231 near the second column segment 232 is provided with a rounded chamfer.

[0066] Understandably, the end of the first column segment 231 furthest from the second column segment 232 (i.e., the lower end) is fixedly mounted on the top surface of the lower mold 20; the end of the first column segment 231 closest to the second column segment 232 (i.e., the upper end) is smoothly connected to the second column segment 232 through a rounded chamfer. The second column segment 232 is located above the first column segment 231, extending upward in a vertical direction, and the axis of the limiting column 23 is vertical, consistent with the opening and closing movement direction of the upper mold 10.

[0067] The diameter of the first column segment 231 is adapted to the diameter of the positioning hole on the copper busbar, and is used to penetrate the copper busbar and limit its movement. The diameter of the second column segment 232 is adapted to the diameter of the positioning hole on the insulating layer, and is used to penetrate the insulating layer and limit its movement.

[0068] The transition joint between the first column segment 231 and the second column segment 232 is provided with a rounded chamfer. When the insulation layer is pressed down by the pressure strip 11, the rounded chamfer structure can prevent the insulation layer from being scratched or damaged by the edge of the positioning hole. At the same time, the rounded chamfer plays a guiding role in the process of the insulation layer being inserted. Even if there is a slight misalignment between the positioning hole of the insulation layer and the limiting post 23, the insulation layer can be guided to pass through smoothly through the rounded surface, reducing the risk of the insulation layer being scratched or torn.

[0069] In some embodiments, the system further includes: a plurality of pressure blocks 40 disposed on the top surface of the lower mold 20, and the plurality of pressure blocks 40 are spaced apart along the circumference of the lower mold 20; the thickness of the pressure blocks 40 is greater than the thickness of the limiting strip 21, and the pressure blocks 40 are used to abut against the bottom surface of the upper mold 10 when the mold is closed.

[0070] Understandably, the pressure block 40 is a block-shaped protrusion structure set on the top surface of the lower mold 20. Multiple pressure blocks 40 are distributed at intervals along the circumference of the lower mold 20, and the thickness of the pressure block 40 is greater than the thickness of the limiting strip 21. In the mold-closed state, the top surface of the pressure block 40 abuts against the bottom surface of the upper mold 10. The downward stroke of the upper mold 10 is limited by the abutment between the pressure block 40 and the upper mold 10.

[0071] Multiple pressure blocks 40 can be evenly distributed along the four corners or four sides of the lower mold 20. The pressure blocks 40 are located outside the assembly area 22 and do not contact the copper busbar and the insulating layer. When the mold is closed, the upper mold 10 moves downward. The top surface of the pressure block 40 abuts against the bottom surface of the upper mold 10 before the limiting strip 21. The protrusion height of the pressure block 40 precisely controls the downward limit position of the upper mold 10, preventing the upper mold 10 from pressing down too much and causing the pressure strip 11 to damage the surface of the copper busbar, damage the edge of the liquid cooling tank or the bottom structure of the groove 211, thus playing a mechanical limiting role. The clamping height is limited to a fixed value by the pressure block 40, ensuring that the pressing depth of the pressure strip 11 is consistent during each hot pressing, thereby ensuring that the pressing thickness of the insulation layer is uniform and improving product consistency. In addition, multiple pressure blocks 40 are evenly distributed around the lower mold 20. When the mold is closed, each pressure block 40 abuts against the upper mold 10 at the same time, so that the reaction force on the upper mold 10 is evenly distributed, avoiding the upper mold 10 from tilting or deforming due to excessive local force.

[0072] In some embodiments, it further includes: at least one pad 50, the pad 50 being disposed in the assembly area 22, the pad 50 being used to fill the recessed area of ​​the copper busbar facing the lower mold 20, and the thickness of the pad 50 being less than the thickness of the limiting strip 21.

[0073] Understandably, the pad 50 is a block-shaped component set in the assembly area 22 to fill the recessed area of ​​the copper busbar facing the lower mold 20 (i.e., the recessed structure at the bottom of the copper busbar, such as process groove, back pit, weight reduction groove, etc.), to fill the suspended area caused by the recess on the bottom surface of the copper busbar, so that the copper busbar can obtain uniform bottom support during hot pressing. In addition, the thickness of the pad 50 is less than the thickness of the limiting strip 21 to ensure that the upper mold 10 contacts the limiting strip 21 when the mold is closed.

[0074] During mold closing, the pad 50 is embedded in the recessed area of ​​the bottom surface of the copper busbar. The upper surface of the pad 50 contacts the bottom surface of the copper busbar, thereby filling the recessed area of ​​the copper busbar and providing the copper busbar with a flat bottom support to prevent local deformation.

[0075] It should be noted that, in the embodiments of this application, for ease of description, the first direction a and the second direction b refer to the width direction and length direction of the copper busbar, respectively, and are not limiting. What can be limited is that the first direction a and the second direction b are two intersecting directions within the same horizontal plane.

[0076] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0077] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0078] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0079] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A hot pressing mold for a copper busbar liquid cooling tank, characterized in that, include: The upper mold has multiple pressure strips spaced apart on its bottom surface along a first direction. The pressure strips are used to press the insulating layer into the liquid cooling tank of the copper busbar. The lower mold has two limiting strips spaced apart along the second direction on its top surface. The limiting strips have multiple grooves spaced apart along the first direction, which allow the pressure strips to enter and press a portion of the insulating layer against the limiting strips. Each of the multiple grooves corresponds to a single pressure strip. An assembly area is formed between the two limiting strips. The assembly area is used to place the copper busbar. The lower mold is provided with a plurality of limiting posts at the assembly area. The limiting posts are used to pass through the copper busbar and the insulating layer provided on the upper surface of the copper busbar in sequence. When the mold is closed, the pressure strip enters the groove and simultaneously presses the insulating layer into the liquid cooling tank and the groove.

2. The hot pressing mold for the copper busbar liquid cooling tank according to claim 1, characterized in that, The cross-sectional shape of the pressure strip is adapted to the cross-sectional shape of the groove. When the mold is closed, the insulating layer is sandwiched between the pressing surface of the pressure strip and the inner wall surface of the groove, and is pressed by the pressure strip and the inner wall surface of the groove.

3. The hot pressing mold for the copper busbar liquid cooling tank according to claim 1, characterized in that, The limiting strip is adjustablely connected to the lower mold so that the two limiting strips move closer to or further away from each other along the second direction.

4. The hot pressing mold for the copper busbar liquid cooling tank according to claim 3, characterized in that, The lower mold is provided with a first sliding engagement portion, and the limiting strip is provided with a second sliding engagement portion. The first sliding engagement portion and the second sliding engagement portion are adapted to each other so that the limiting strip can slide and adjust relative to the lower mold.

5. The hot pressing mold for the copper busbar liquid cooling tank according to claim 4, characterized in that, The top surface of the lower mold is provided with a sliding groove, which extends along the second direction; The limiting strip has a slider on the side facing the lower mold, and the slider is slidably connected to the groove.

6. The hot pressing mold for the copper busbar liquid cooling tank according to claim 5, characterized in that, The slide groove is detachably provided with an abutment, which is located on the side of the limiting strip away from the assembly area and is used to abut the slider. The abutment is provided with an assembly end, and the assembly end extends out of the groove.

7. The hot pressing mold for the copper busbar liquid cooling tank according to claim 1, characterized in that, The upper mold has multiple limiting holes, which are spaced apart between two adjacent pressure strips. The plurality of limiting posts are provided in a one-to-one correspondence with the plurality of limiting holes.

8. The hot pressing mold for the copper busbar liquid cooling tank according to any one of claims 1 to 7, characterized in that, The limiting post includes a first column segment and a second column segment arranged coaxially. The diameter of the first column segment is larger than the diameter of the second column segment, so that the limiting post is in the shape of a stepped shaft. The end of the first column segment furthest from the second column segment is disposed on the lower mold, and the end of the first column segment closest to the second column segment is provided with a rounded chamfer.

9. The hot pressing mold for the copper busbar liquid cooling tank according to claim 8, characterized in that, Also includes: Multiple pressure-bearing blocks are disposed on the top surface of the lower mold, and the multiple pressure-bearing blocks are spaced apart along the circumference of the lower mold; The thickness of the pressure block is greater than the thickness of the limiting strip. When the mold is closed, the pressure block is used to abut against the bottom surface of the upper mold.

10. The hot pressing mold for the copper busbar liquid cooling tank according to claim 9, characterized in that, Also includes: At least one pad is disposed in the assembly area to fill the recessed area of ​​the copper busbar facing the lower mold, and the thickness of the pad is less than the thickness of the limiting strip.

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