A flexible composite film for probe card cleaning

Abstract

The utility model discloses a kind of flexible composite film for probe card cleaning, belong to probe card needle cleaning technical field, including flexible substrate and cleaning layer;It is by being set as flexible substrate to substrate, so that composite film has excellent flexibility, so that product can be closely attached to the complex shape of probe card and high-density probe array when using, realize dead angle cleaning, significantly improve cleaning coverage and consistency, and make composite film have cuttable, To meet the cleaning needs of different models of probe card, improve the applicability of product;Through the adhesion adsorption of cleaning layer, capture planktonic particle;Through inorganic particle in cleaning layer, provide grinding function for probe, effectively remove stubborn contaminants on probe, through the microstructure of macroscopic roughness on the surface of cleaning layer, enhance the relative sliding friction effect between probe and film, improve the contact area of probe and film, facilitate directional discharge of abrasive debris, effectively improve the cleaning effect of probe.

Description

Technical Field

[0001] This utility model belongs to the field of probe card cleaning technology, specifically relating to a flexible composite film for probe card cleaning. Background Technology

[0002] In the manufacturing and testing of semiconductor devices, probe cards are key components connecting test equipment to the chips under test on the wafer. The cleanliness of their probe tips directly affects the accuracy and yield of the tests. During repeated contact with wafer pads, probes easily attract metal debris, organic residues, and particulate contaminants, leading to increased contact resistance, abnormal signal transmission, and even chip damage.

[0003] Currently, probe card cleaning mainly employs dry or wet processes. Dry cleaning commonly uses cleaning pads for wiping, and existing cleaning pads are mostly based on wafers, metal plates, or rigid plastic substrates, coated with a cleaning layer that has adsorption or abrasive functions. However, such substrates have significant drawbacks: 1) Rigid substrates are difficult to adapt to the complex three-dimensional structure of probe cards, especially high-density, fine-pitch probe arrays, easily creating contact blind spots during cleaning; 2) Wafer or metal plate substrates are costly, complex to process, and have limited dimensions, making it difficult to customize them according to the shape of the probe card; 3) Rigid plastic substrates are prone to scratches or deformation during repeated use, affecting cleaning consistency.

[0004] In addition, the existing manufacturing processes for cleaning sheets mostly rely on photolithography or etching techniques in semiconductor-grade clean environments, which impose strict limitations on size and shape, making it impossible to flexibly produce small-sized or irregularly shaped structures. This results in high production costs and long production cycles, making it difficult to meet the diverse cleaning needs of probe cards. Utility Model Content

[0005] In view of one or more of the above-mentioned defects or improvement needs of the prior art, this utility model provides a flexible composite film for probe card cleaning, which has good flexibility, processability and excellent cleaning performance, and is particularly suitable for efficient and uniform cleaning of probe cards with complex structures.

[0006] To achieve the above objectives, this utility model provides a flexible composite film for probe card cleaning, which includes a flexible substrate and a cleaning layer; The cleaning layer adheres to the flexible substrate and includes a polymer matrix with strong adhesion and inorganic particles, wherein the inorganic particles are dispersed in the polymer matrix; the side of the cleaning layer opposite to the flexible substrate is provided with periodic or non-periodic microstructures, forming macroscopic roughness on the surface of the cleaning layer.

[0007] As a further improvement of this utility model, the microstructure is in the form of multi-scale corrugated or grooved shapes.

[0008] As a further improvement of this utility model, the particle size of the inorganic particles is 3~10μm, and the macroscopic roughness Ra1 of the cleaning layer is 5~15μm.

[0009] As a further improvement of this utility model, the inorganic particles have a particle size of 0.5~1μm and form a micro-roughness on the surface of the cleaning layer. The micro-roughness Ra2 of the cleaning layer is 1~1.5μm, and the macro-roughness Ra3 of the cleaning layer is 2~7μm.

[0010] As a further improvement of this utility model, the cleaning layer includes a first cleaning layer and a second cleaning layer; the first cleaning layer is adhered to the flexible substrate and includes a first polymer matrix and first inorganic particles, the first inorganic particles are dispersed in the first polymer matrix, and the particle size of the first inorganic particles is 3~10μm; the first cleaning layer has a periodic or non-periodic first microstructure on the side opposite to the flexible substrate. The second cleaning layer adheres to the side of the first cleaning layer away from the flexible substrate and includes a second polymer matrix and second inorganic particles; the second inorganic particles are dispersed in the second polymer matrix and have a particle size of 0.5~1μm, forming a micro-roughness on the surface of the second cleaning layer; the side of the second cleaning layer away from the first cleaning layer is provided with a periodic or non-periodic second microstructure.

[0011] As a further improvement of this utility model, the macroscopic roughness Ra4 formed by the first microstructure is 5~15μm; the macroscopic roughness Ra5 formed by the second microstructure is 2~7μm; and the microscopic roughness Ra6 formed by the second inorganic particles on the surface of the second cleaning layer is 1~1.5μm. And / or, the thickness of the first cleaning layer is 5~15μm, and the thickness of the second cleaning layer is 2~3μm.

[0012] As a further improvement of this utility model, the flexible substrate is made of polyimide; and / or, the thickness of the flexible substrate is 10-100 μm; and / or, the flexible composite film can be cut into small sizes or irregular shapes with a side length ≤ 5 mm.

[0013] As a further improvement of this utility model, it also includes an adhesive layer, which is disposed on the side of the flexible substrate away from the cleaning layer, for bonding the flexible composite film.

[0014] As a further improvement of this utility model, a release film layer is also included, which is disposed on the side of the adhesive layer away from the flexible substrate and is used for isolation and protection of the adhesive layer.

[0015] As a further improvement of this utility model, a protective layer is also included, which is disposed on the side of the cleaning layer away from the flexible substrate, for the isolation and protection of the cleaning layer.

[0016] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0017] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include: (1) The flexible composite film for probe card cleaning of this utility model has excellent flexibility by setting the substrate as a flexible substrate, so that the composite film can closely fit the complex shape and high-density probe array of the probe card when the product is used, so as to achieve cleaning without dead corners, significantly improve the cleaning coverage and consistency. At the same time, the composite film has the ability to be cut to meet the cleaning needs of different types of probe cards in practical applications, improve the applicability of the product, facilitate the mass production of the product, and greatly reduce the manufacturing cost. Through the adhesion and adsorption of the cleaning layer, the floating particles are captured. At the same time, by setting inorganic particles in the cleaning layer, the inorganic particles are used to provide a grinding function for the probe to effectively remove stubborn contaminants on the probe. By setting microstructures with macro-roughness on the surface of the cleaning layer, the relative sliding friction effect between the probe and the film is enhanced. While increasing the overall contact area between the probe and the film, it is easy to directionally discharge the grinding debris, effectively improving the cleaning effect on the probe.

[0018] (2) The flexible composite film for probe cleaning card of this utility model has an adhesive layer on the side of the flexible substrate away from the cleaning layer so that the flexible composite film can be bonded to the cleaning carrier through the adhesive layer during actual use, so as to avoid the composite film from slipping during the cleaning process; at the same time, the adhesive layer and the cleaning layer are isolated and protected by the bottom release film layer and the protective layer to prevent the flexible composite film from being contaminated before use.

[0019] (3) The flexible composite film for probe cleaning of the present invention has a simple structure and is easy to produce. It meets the needs of mass production of cleaning products and personalized cleaning needs of different shapes and sizes, solves the technical bottleneck of poor adaptability and limited mass production of existing rigid cleaning products, and has broad market prospects and promotion value. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a flexible composite film used for probe card clearing in one embodiment of this utility model; Figure 2 This is a schematic diagram of the structure of a flexible composite film used for probe card clearing in another embodiment of this utility model; Figure 3 This is a schematic diagram of the structure of a flexible composite film used for probe card clearing in another embodiment of this utility model; In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1, flexible substrate; 2, cleaning layer; 201, first cleaning layer; 202, second cleaning layer; 3, adhesive layer; 4, release film layer; 5, protective layer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0023] In the description of this utility model, it should be understood that, unless otherwise explicitly specified and limited, the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] Example: Please see Figures 1-3 In a preferred embodiment of the present invention, the flexible composite film for probe card cleaning includes a flexible substrate 1 and a cleaning layer 2; wherein, the cleaning layer 2 is disposed on the flexible substrate 1 so as to support the cleaning layer 2 through the flexible substrate 1 and to clean the probe card through the cleaning layer.

[0028] Specifically, in the preferred embodiment, the flexible substrate 1 is made of polyimide (PI), which has excellent heat resistance, mechanical strength, and flexibility. This gives the composite film excellent flexibility, allowing it to closely conform to the complex shape and high-density probe array of the probe card during cleaning, achieving thorough cleaning and significantly improving cleaning coverage and consistency. At the same time, the flexible composite film can be cut to flexibly prepare small-sized, irregularly shaped cleaning materials, improving the product applicability of the composite film and meeting the personalized cleaning needs of different probe card models. This overcomes the shortcomings of traditional rigid cleaning materials such as wafers or metal plates in probe card cleaning applications, which have fixed shapes and are not easy to produce small-sized products.

[0029] Preferably, the thickness of the flexible substrate 1 is 10–100 μm.

[0030] Furthermore, in the preferred embodiment, the cleaning layer 2 is coated on the flexible substrate 1 and includes a polymer matrix with strong adhesion and inorganic particles. The inorganic particles are uniformly dispersed in the polymer matrix so that the polymer matrix can adhere and capture contaminants on the probe, and the inorganic particles can micro-grind the probe to remove stubborn contaminants. At the same time, it can also effectively restore the original sharpness and conductivity of the probe, solve the local passivation phenomenon caused by wear during long-term use, and extend the service life of the probe card.

[0031] Meanwhile, a periodically or non-periodically distributed microstructure is provided on the side of the cleaning layer 2 away from the flexible substrate 1, and preferably the microstructure is a multi-scale corrugated or grooved structure, so as to form macroscopic roughness on the surface of the cleaning layer 2, enhance the relative sliding friction effect between the probe and the film, increase the overall contact area between the probe and the film, reduce the wear of the probe, and also help to directionally discharge the grinding debris and prevent secondary pollution.

[0032] Preferably, the polymer matrix is ​​epoxy resin, polyurethane, silicone rubber, polyimide, etc., so that the cleaning layer 2 can maintain good performance in high and low temperature environments. The strong adhesion of the polymer matrix can capture contaminants ground off the probe, preventing them from re-adhering to the probe and contaminating the inside of the machine, thus avoiding secondary contamination. At the same time, the polymer matrix not only gives the film good flexibility and adhesion, but also effectively buffers the impact force during the probe grinding process, reducing film wear and detachment, and extending service life.

[0033] Preferably, the inorganic particles can be made of any one or more of silicon dioxide, alumina, silicon carbide, silicon carbide and diamond, so that when the probe is inserted into the thin film material, the inorganic particles generate friction with the probe surface to grind the probe, remove most of the contaminants on the probe, and enhance the mechanical strength, thermal stability and support capacity of the cleaning layer 2.

[0034] Preferably, the inorganic particles have a particle size of 3~10μm and a Vickers hardness of ≥800HV, so as to generate a moderate frictional force on the probe surface, effectively removing contaminants without damaging the probe.

[0035] Preferably, the macroscopic roughness Ra1 formed by the microstructure is 5~15μm, and the specific setting is selected according to the arrangement density of different probe arrays and the cleaning path requirements.

[0036] Furthermore, in another preferred embodiment of this utility model, such as Figure 2As shown, the inorganic particles have a particle size of 0.5~1μm and a Vickers hardness of not less than 800HV. These inorganic particles are used to form a micro-roughness of Ra2 of 1~1.5μm on the surface of the cleaning layer 2. This micro-roughness can create localized stress concentration areas when the probe contacts the film, thereby achieving effective stripping and removal of nano- to submicron-sized contaminants. Furthermore, the sphericity of the inorganic particles is preferably ≥0.85 to reduce the risk of scratching the probe tip and improve surface compatibility during the grinding process.

[0037] Meanwhile, by utilizing microstructures to form a macroscopic roughness of Ra3 of 2~7μm on the surface of cleaning layer 2, the grinding debris of cleaning layer 2 can be directionally discharged.

[0038] Furthermore, in another preferred embodiment of this utility model, such as Figure 3 As shown, the cleaning layer 2 includes a first cleaning layer 201 and a second cleaning layer 202; wherein, the first cleaning layer 201 is adhered to the flexible substrate 1 and includes a first polymer matrix and first inorganic particles, the first inorganic particles are uniformly dispersed in the first polymer matrix, and the particle size of the first inorganic particles is 3~10μm; at the same time, the first cleaning layer 201 has a first microstructure with periodic or non-periodic multi-scale corrugated or grooved features on the side away from the flexible substrate 1, and a macroscopic roughness of Ra4 of 5~15μm is formed on the surface of the first cleaning layer 201.

[0039] Correspondingly, the second cleaning layer 202 adheres to the side of the first cleaning layer 201 away from the flexible substrate 1, and includes a second polymer matrix and second inorganic particles; wherein, the second inorganic particles are dispersed in the second polymer matrix, and the particle size of the second inorganic particles is 0.5~1μm, forming a micro-roughness Ra6 of 1~1.5μm on the surface of the second cleaning layer 202; at the same time, the side of the second cleaning layer 202 away from the first cleaning layer 201 is provided with a second microstructure with periodic or non-periodic multi-scale corrugated or grooved features, forming a macro-roughness Ra5 of 2~7μm on the surface of the second cleaning layer 202, so as to utilize the synergistic effect of multiple different roughnesses to achieve efficient removal of contaminants of different scales, significantly improving cleaning efficiency and adaptability.

[0040] Preferably, the thickness of the first cleaning layer 201 is 5~15μm, and the thickness of the second cleaning layer 202 is 2~3μm.

[0041] Furthermore, in a preferred embodiment of the present invention, an adhesive layer 3 is provided on the side of the flexible substrate 1 away from the cleaning layer 2 for bonding the flexible composite film. In actual use, the flexible composite film is bonded to the cleaning fixture through the adhesive layer 3, so as to avoid displacement of the composite film during the probe cleaning process.

[0042] More preferably, a release film layer 4 is provided on the side of the adhesive layer 3 facing away from the flexible substrate 1 for isolation and protection of the adhesive layer 3, and the release film layer 4 can be peeled off during card removal.

[0043] Furthermore, in a preferred embodiment of the present invention, a protective layer 5 is provided on the surface of the cleaning layer 2 facing away from the flexible substrate 1, so as to isolate and protect the cleaning layer 2 through the protective layer 5, to prevent the cleaning layer 2 from being contaminated when not in use, and the protective layer 5 can be peeled off when in use.

[0044] Understandably, in practical applications, the composite film can be cut according to the size of the probe card model. Then, the cut composite film can be attached to the cleaning fixture or held directly in hand to gently press and wipe the probe tip of the probe card. The micro-abrasive action of the inorganic particles and the adhesion of the polymer matrix can be used to remove contaminants from the tip.

[0045] The flexible composite film for probe cleaning of this utility model has a simple structure and is easy to produce. It meets the needs of mass production of cleaning products and personalized cleaning needs of different shapes and sizes, and solves the technical bottleneck of poor adaptability and limited mass production of existing rigid cleaning products. It has broad market prospects and promotion value.

[0046] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flexible composite film for probe card clearing, characterized in that, Includes a flexible substrate and a cleaning layer; The cleaning layer adheres to the flexible substrate and includes a polymer matrix with strong adhesion and inorganic particles, wherein the inorganic particles are dispersed in the polymer matrix; the side of the cleaning layer opposite to the flexible substrate is provided with periodic or non-periodic microstructures, wherein the microstructures are multi-scale corrugated or grooved, forming macroscopic roughness on the surface of the cleaning layer. The cleaning layer includes a first cleaning layer and a second cleaning layer; the first cleaning layer is adhered to the flexible substrate and includes a first polymer matrix and first inorganic particles, the first inorganic particles being dispersed in the first polymer matrix, and the particle size of the first inorganic particles being 3~10μm; a periodic or non-periodic first microstructure is provided on the side of the first cleaning layer opposite to the flexible substrate; the second cleaning layer is adhered to the side of the first cleaning layer opposite to the flexible substrate and includes a second polymer matrix and second inorganic particles; the second inorganic particles are dispersed in the second polymer matrix, the particle size of the second inorganic particles being 0.5~1μm, forming a micro-roughness on the surface of the second cleaning layer; a periodic or non-periodic second microstructure is provided on the side of the second cleaning layer opposite to the first cleaning layer.

2. The flexible composite film for probe card clearing according to claim 1, characterized in that, The macroscopic roughness Ra4 formed by the first microstructure is 5~15μm; the macroscopic roughness Ra5 formed by the second microstructure is 2~7μm; the microscopic roughness Ra6 formed by the second inorganic particles on the surface of the second cleaning layer is 1~1.5μm. And / or, the thickness of the first cleaning layer is 5~15μm, and the thickness of the second cleaning layer is 2~3μm.

3. The flexible composite film for probe card clearing according to claim 1, characterized in that, The flexible substrate is made of polyimide; and / or the thickness of the flexible substrate is 10 to 100 μm; and / or the flexible composite film can be cut into small sizes or irregular shapes with a side length ≤ 5 mm.

4. The flexible composite film for probe card clearing according to any one of claims 1 to 3, characterized in that, It also includes an adhesive layer disposed on the side of the flexible substrate opposite to the cleaning layer, for bonding the flexible composite film.

5. The flexible composite film for probe card clearing according to claim 4, characterized in that, It also includes a release film layer, which is disposed on the side of the adhesive layer away from the flexible substrate, and is used for isolation and protection of the adhesive layer.

6. The flexible composite film for probe card clearing according to claim 4, characterized in that, It also includes a protective layer disposed on the side of the cleaning layer away from the flexible substrate, for the isolation and protection of the cleaning layer.

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