Film pasting device for microfluidic chip

Abstract

The present disclosure relates to a film pasting device for a microfluidic chip, which can improve the efficiency of bonding a sealing film to a pipeline layer, comprising a control system and a machine table, the top surface of the machine table is provided with a rotating mechanism, a turntable, a plurality of product limiting blocks are uniformly and circumferentially arranged on the top surface of the turntable, a film feeding mechanism, the film feeding mechanism comprises a take-up and release assembly and a peeling assembly, the take-up and release assembly is used to feed release paper comprising a plurality of sealing films to the peeling assembly along a first direction, the peeling assembly comprises a bearing table and is provided with a separation channel through which the sealing film passes, a film pasting station, the film pasting station comprises a suction mechanism, the suction mechanism is used to adsorb the sealing film at the peeling assembly and place the sealing film on the pipeline layer on the product limiting block rotating to the film pasting station, and a film pressing station, the film pressing station comprises a lifting driving mechanism and a pressing head located above the turntable, the pressing head is in transmission connection with the lifting driving mechanism, and the pressing head is lifted relative to the product limiting block under the driving of the lifting driving mechanism, so that the sealing film is bonded to the pipeline layer.

Description

Technical Field

[0001] This disclosure relates to the field of biochemical analysis equipment, and more particularly to a film-applying device for microfluidic chips. Background Technology

[0002] Microfluidics is a system that uses microchannels to process or manipulate tiny fluids. It enables a range of microfabrications and micromanipulations that are difficult to achieve using conventional methods. Currently, microfluidic chips are widely used in technologies such as digital PCR and gene sequencing.

[0003] The relevant technology can be found in Chinese Patent Publication CN113278509B. The chip device of the relevant technology includes a sample layer 3 at the top, a gasket 2 below the sample layer 3, a tubing layer 101 below the gasket 2, and a sealing film 104 at the bottom. The sealing film 104 is adhered to the bottom of the tubing layer 101 to achieve a seal. The assembled sample layer 3, gasket 2, tubing layer 101, and sealing film 104 constitute a completely sealed whole, and the virus in the sample will not leak out.

[0004] In related technologies, when attaching the sealing film 104 to the underside of the tubing layer 101, the film must first be peeled off and placed on the tubing layer 101, and then pressed together using a press on a fixture. This method is inefficient and unsuitable for mass production. Furthermore, the aforementioned microfluidic chip is intended for application in the in vitro diagnostic reagent industry, which has high requirements for the cleanliness of production sites and strict limitations on the maximum number of workers per unit area, thus making it impossible to arrange a large number of workers for assembly. Utility Model Content

[0005] Therefore, it is necessary to propose a microfluidic chip film application device to address the problem of low efficiency in applying sealing films to microfluidic chip devices.

[0006] According to one aspect of this disclosure, a film-applying device for a microfluidic chip, the microfluidic chip including a channel layer and a sealing film attached to one side of the channel layer, wherein the film-applying device is used to apply the sealing film to the channel layer, the film-applying device includes a control system and a machine base, the machine base having: a rotating mechanism including a rotating shaft; a turntable coaxially connected to the rotating shaft of the rotating mechanism and capable of rotating around its own central axis under the drive of the rotating mechanism, the top surface of the turntable having a plurality of product limiting blocks evenly spaced circumferentially, the product limiting blocks being used to support the channel layer; and a film feeding mechanism, the film feeding mechanism including a take-up and release component and a peeling component, the take-up and release component being used to feed release paper including a plurality of sealing films toward the peeling component in a first direction, the peeling component including a support platform, the support platform having a phase in the first direction. At the left and right ends of the support platform, a conveying channel is provided for the release paper to pass through, and a separation channel is provided on the platform surface for the sealing film to pass through. When the release assembly causes the release paper to move along with the sealing film, the sealing film separates from the release paper at the left end of the support platform and enters the separation channel and the conveying channel respectively. A film-applying station includes an adsorption mechanism for adsorbing the sealing film from the peeling assembly and placing it on the pipeline layer on the product limiting block rotated to the film-applying station. A film-pressing station includes a lifting drive mechanism and a pressing head located above the turntable. The pressing head is connected to the lifting drive mechanism and moves up and down relative to the product limiting block under the drive of the lifting drive mechanism to adhere the sealing film to the pipeline layer.

[0007] In some embodiments, the support platform has blocks on both sides in the second direction, forming the separation channel between the two blocks. The second direction is perpendicular to the first direction and parallel to the platform.

[0008] In some embodiments, each of the stops has a chamfer on its inner side in the second direction, the chamfer being at the entrance of the separation channel.

[0009] In some embodiments, the adsorption mechanism and the support stage are spaced apart in a first direction.

[0010] In some embodiments, the carrier platform is further provided with a reversing channel, which is used to change the transmission of the release paper extending from the conveying channel to a third direction, which is opposite to the first direction.

[0011] In some embodiments, the film application device further includes a tensioning assembly for tensioning the release paper extending from the reversing channel; the tensioning assembly includes a first tensioning roller and a second tensioning roller, which are arranged sequentially in the first direction, and the first tensioning roller and the second tensioning roller together define a conveying path for guiding the release paper extending from the reversing channel forward, wherein the release paper extending from the reversing channel passes around the first tensioning roller and the second tensioning roller successively.

[0012] In some embodiments, the pressure head is equipped with an electric heating component.

[0013] In some embodiments, a vertical plate is also fixed on the table surface of the machine, and the take-up and release assembly, the tensioning assembly, the peeling assembly and the adsorption mechanism are all disposed on the vertical plate.

[0014] In some embodiments, the laminating device further includes a hopper for storing the release paper comprising a plurality of sealing films.

[0015] In some embodiments, the hopper is fixed to the upright plate.

[0016] The microfluidic chip bonding device disclosed herein utilizes a take-up and release assembly to transport release paper with a bonded sealing film, causing the sealing film to separate from the release paper at a peeling assembly. Then, through the operation of the bonding station and the pressing station, the sealing film is bonded to the tubing layer. This method enables automated or semi-automated bonding, improving bonding efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a film-applying device used for microfluidic chips.

[0018] Figure 2 This is a schematic diagram of another angle of the film application equipment used for microfluidic chips, which hides the machine base, turntable, and display screen.

[0019] Figure 3 This is another structural diagram of a film-applying device for microfluidic chips, which hides equipment such as the machine base, turntable, and display screen.

[0020] Figure 4 This is another structural diagram of a film-applying device for microfluidic chips, further concealing part of the carrier stage to show the path of the release paper.

[0021] Figure label:

[0022] 100. Film application equipment; 10. Machine base; 110. Table surface; 20. Rotating mechanism; 210. Rotating shaft; 30. Turntable; 310. Product limiting block; 40. Film feeding mechanism; 410. Take-up and unload assembly; 411. Motor; 412. Conveyor roller; 413. First guide frame; 414. Second guide frame; 415. Guide roller; 420. Peeling assembly; 421. Support platform; 4211. Left end; 4212. Right end; 4213. Separator Channel; 4214, Conveying aisle; 4215, Reversing channel; 422, Stop block; 430, Tensioning assembly; 431, First tensioning roller; 432, Second tensioning roller; 50, Film application station; 510, Adsorption mechanism; 511, Lifting drive assembly; 512, Adsorption head; 60, Film pressing station; 610, Lifting drive mechanism; 620, Pressing head; 70, Material box; 80, Vertical plate; 90, Display screen; 200, Release paper; 300, Sealing film. Detailed Implementation

[0023] To make the above-described objects, features, and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this disclosure. However, this disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this disclosure. Therefore, this disclosure is not limited to the specific embodiments disclosed below.

[0024] In the description of this disclosure, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0025] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] One aspect of this disclosure provides a film-applying device for microfluidic chips. As is known in the background art, a microfluidic chip includes a channel layer and a sealing film attached to one side of the channel layer. The film-applying device of this disclosure is used to apply the sealing film to the channel layer, thereby enabling semi-automatic or fully automated film application.

[0027] The following describes an embodiment of the film-applying device 100 for microfluidic chips disclosed herein, with reference to the accompanying drawings.

[0028] like Figures 1 to 4 As shown, the film application equipment 100 includes a control system (not shown) and a machine base 10. The control system can be installed inside the machine base 10 or in any other suitable location. The table surface 110 of the machine base 10 is equipped with a rotating mechanism 20, a turntable 30, a film feeding mechanism 40, a film application station 50, and a film pressing station 60.

[0029] The configuration of the rotating mechanism 20 is not limited, and it has a rotating shaft 210. The turntable 30 is coaxially connected to the rotating shaft 210 of the rotating mechanism 20 and can rotate around its own central axis under the drive of the rotating mechanism 20. The top surface of the turntable 30 is provided with a plurality of product limiting blocks 310 evenly spaced along the circumference. The product limiting blocks 310 are used to support the pipeline layer. When the turntable 30 rotates, it can drive the pipeline layer to rotate to the film-applying station 50 or the film-pressing station 60.

[0030] A central hole is provided on the turntable 30. The central hole is coaxially and fixedly connected to the top end of the rotating shaft 210. The central axis of the turntable 30 is perpendicular to the table surface 110. The turntable 30 rotates in a plane parallel to the table surface 110. The product limiting block 310 is used to place the piping layer. Figure 1 As shown, multiple product limiting blocks 310 are evenly distributed on the top surface of the turntable 30 along the circumference of the turntable 30, which can realize the film application operation of multiple pipeline layers.

[0031] It is easy to understand that when the conduit layer is placed on the product limiting block 310, the side of the product limiting block 310 to be covered with film faces upwards. In this disclosure, automated equipment such as a robotic arm can be used to place the conduit layer on the product limiting block 310, or it can be placed manually by an operator.

[0032] The film feeding mechanism 40 is used to feed the sealing film 300 toward the turntable 30, so that the sealing film 300 can be placed on the pipeline layer at the film application station 50. The film feeding mechanism 40 includes a take-up assembly 410 and a peeling assembly 420. The take-up assembly 410 is used to feed the release paper 200 containing multiple sealing films 300 and to collect the release paper 200. The peeling assembly 420 is disposed between the take-up assembly 410 and the turntable 30 for separating the sealing film 300 from the release paper 200.

[0033] refer to Figure 2A plurality of sealing films 300 are provided on the release paper 200. The sealing films 300 are spaced apart along the length of the release paper 200. Only one sealing film 300 is shown schematically in the figure. The sealing films 300 are designed to be easily separable from the release paper 200. The take-up assembly 410 is used to convey the release paper 200 including the plurality of sealing films 300 towards the peeling assembly 420 in a first direction X.

[0034] The peeling assembly 420 includes a support platform 421. The support platform 421 has a left end 4211 and a right end 4212 opposite each other in a first direction X. A separation channel 4213 for the sealing film 300 to pass through is provided on the top surface of the support platform 421, and a conveying passage 4214 for the release paper 200 to pass through is provided in the support platform 421. When the take-up and release assembly 410 causes the release paper 200 to move along with the sealing film 300, the sealing film 300 and the release paper 200 separate at the left end 4211 of the support platform 421 and respectively enter the separation channel 4213 and the conveying passage 4214.

[0035] The film application station 50 is used to place the sealing film 300 onto the tubing layer on the product limiting block 310. The film application station 50 includes an adsorption mechanism 510. The adsorption mechanism 510 is used to adsorb the sealing film 300 at the peeling assembly 420 and place it onto the tubing layer on the product limiting block 310 rotated to the film application station 50.

[0036] like Figure 1 As shown, the adsorption mechanism 510 includes several adsorption heads 512 and a lifting drive assembly 511 for driving the adsorption heads 512 to rise and fall. The adsorption heads 512 are located above the turntable 30. Thus, when the turntable 30 rotates, the product limiting block 310 can drive the tubing layer on it to rotate below the adsorption heads 512. The type of lifting drive assembly is not limited. Optionally, the lifting drive assembly 511 includes a cylinder.

[0037] The pressing station 60 is used to press the sealing film 300 placed on the pipeline layer, so that the sealing film 300 adheres to the pipeline layer. The pressing station 60 includes a lifting drive mechanism 610 and a pressing head 620 located above the turntable 30, the pressing head 620 being driven by the lifting drive mechanism 610. The pressing head 620 is driven to move up and down relative to the product limiting block 310 under the drive of the lifting drive mechanism 610, so that the sealing film 300 can adhere to the pipeline layer. Similar to the lifting drive assembly, the specific type of the lifting drive mechanism 610 is not limited.

[0038] The microfluidic chip bonding apparatus 100 disclosed herein utilizes a take-up / release assembly 410 to transport a release liner 200 with a sealing film 300 bonded to it, causing the sealing film 300 to separate from the release liner 200 at a peeling assembly 420. Then, through the operation of the bonding station 50 and the pressing station 60, the sealing film 300 is bonded to the conduit layer. This method enables automated or semi-automated bonding, improving bonding efficiency.

[0039] Furthermore, in this disclosure, the sealing film 300 and the release paper 200 can be separated at the peeling assembly 420 by the movement of the release paper 200, and the peeling assembly 420 does not need to apply any active action to the sealing film 300 or the release paper 200, thereby simplifying the structural design of the peeling assembly 420.

[0040] In some embodiments, baffles 422 are respectively provided on both sides of the top surface of the support platform 421 in the second direction Y, and a separation channel 4213 is formed between the two baffles 422. The second direction Y is perpendicular to the first direction X and parallel to the platform surface 110. In this way, the separation channel 4213 is located above the top surface of the support platform 421 and can be formed by a pair of baffles 422, which is simple in structure.

[0041] Furthermore, each stop 422 has a chamfer on its inner side in the second direction Y, with the chamfer at the entrance of the separation channel 4213. The chamfer is used to guide the sealing membrane 300 into the separation channel 4213, preventing the sealing membrane 300 from getting stuck. The inner side of the stop 422 refers to the side of the stop 422 that forms the separation channel 4213. The inner sides of two stops 422 face each other.

[0042] In some embodiments, the adsorption mechanism 510 and the support platform 421 are spaced apart in the first direction X. Specifically, the adsorption head 512 of the adsorption mechanism 510 is located in front of the support platform 421. During the separation of the sealing film 300 from the release paper 200, the sealing film 300 also gradually moves forward along the first direction X. Therefore, when the adsorption head 512 of the adsorption mechanism 510 is positioned in front of the support platform 421, the adsorption head 512 can adsorb the sealing film 300 when the sealing film 300 partially extends out of the support platform 421. This design can reduce the design length of the support platform 421.

[0043] In some embodiments, the carrier platform 421 is further provided with a reversing channel 4215, which is used to change the release paper 200 extending from the conveying channel 4214 to be conveyed along a third direction Z, which is opposite to the first direction X.

[0044] Specifically, refer to Figure 3The reversing channel 4215 is located below the conveying channel 4214. When the release paper 200 is conveyed along the conveying channel 4214 and extends out of the right end 4212 of the support platform 421, the release paper 200 turns around from the first direction X and enters the reversing channel 4215, finally extending out from the left end 4211 of the support platform 421. With this design, the release paper 200 will not continue to move towards the turntable 30, but will turn around and move in the opposite direction, thus facilitating the collection of the release paper 200.

[0045] In some embodiments, the film application device 100 further includes a tensioning assembly 430 for tensioning the release paper 200 extending from the reversing channel 4215. The tensioning assembly 430 includes a first tensioning roller 431 and a second tensioning roller 432, which are sequentially arranged in a first direction X. The first tensioning roller 431 and the second tensioning roller 432 together define the conveying path guiding the release paper 200 extending from the reversing channel 4215 forward, wherein the release paper 200 extending from the reversing channel 4215 successively passes around the first tensioning roller 431 and the second tensioning roller 432.

[0046] like Figure 4 As shown, the release paper 200 extending from the reversing channel 4215 passes around one side of the first tensioning roller 431 and the second tensioning roller 432, thus being tensioned by the first tensioning roller 431 and the second tensioning roller 432. Furthermore, the direction of movement of the release paper 200 when it leaves the second tensioning roller 432 is still along the third direction Z. By tensioning the release paper 200, it is prevented from falling off or becoming tangled during transport.

[0047] In this disclosure, the manner in which the take-up and untake-down assembly 410 conveys the release paper 200, which includes multiple sealing films 300, is not limited. The conveying path can be set up using the method of the roll-to-roll process in the prior art.

[0048] refer to Figure 2 Optionally, the take-up and take-down assembly 410 includes a plurality of conveyor rollers 412 driven by a motor 411. The conveyor rollers 412 are distributed on the upper and lower sides of the release paper 200 in the height direction of the machine base 10.

[0049] Optionally, the take-up and release assembly 410 includes a first guide frame 413 and a second guide frame 414. The first guide frame is used to guide the release paper 200, which includes a plurality of sealing films 300, forward. The second guide frame 414 is used to guide the release paper 200, which has exited the second tension roller 432, forward.

[0050] Furthermore, a guide roller 415 is provided between the first guide frame 413 and the second guide frame 414. The top of the guide roller 415 is used to guide the release paper 200, which includes multiple sealing films 300, forward, and the bottom of the guide roller 415 is used to guide the release paper 200 that has left the second tensioning roller 432 forward.

[0051] In some embodiments, the laminating apparatus 100 further includes a hopper 70. The hopper 70 is used to store release paper 200 comprising a plurality of sealing films 300. The release paper 200 is drawn out from the hopper 70 and moved under the guidance of the take-up and release assembly 410.

[0052] In some embodiments, the pressure head 620 is equipped with an electric heating component (not shown). The electric heating component is used to heat the sealing film 300 when the pressure head 620 presses against it, so that the sealing film 300 can be firmly bonded to the pipeline layer. Exemplarily, the electric heating component specifically includes a resistance wire disposed inside the pressure head 620. When the resistance wire heats up, the bottom surface of the pressure head 620 is heated, and then the heat is transferred to the sealing film 300 through the pressure head 620, so that the adhesive material on the sealing film 300 is moderately softened, and then can be firmly bonded to the pipeline layer.

[0053] In some embodiments, a vertical plate 80 is also fixed on the table 110 of the machine platform 10, and the take-up and release assembly 410, tensioning assembly 430, peeling assembly 420 and adsorption mechanism 510 are all disposed on the vertical plate 80. Furthermore, the material box 70 is also fixed to the vertical plate 80.

[0054] The take-up and release assembly 410, tensioning assembly 430, peeling assembly 420, adsorption mechanism 510, and material bin 70 are all supported on the same supporting element, namely the upright plate 80, which simplifies design and installation. Specifically, the take-up and release assembly 410, tensioning assembly 430, peeling assembly 420, and adsorption mechanism 510 can be pre-integrated onto the upright plate 80, then the upright plate 80 is fixed onto the table 110, and finally the material bin 70 is installed. This process simplifies the assembly process and reduces the difficulty of assembling the film-applying equipment 100.

[0055] In some embodiments, a display screen 90 is also provided on the tabletop 110, and the display screen 90 is communicatively connected to the control system. The display screen 90 is used to display various work information.

[0056] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0057] In this disclosure, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0058] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this disclosure are for illustrative purposes only and do not represent the only possible implementation.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above embodiments merely illustrate several implementation methods of this disclosure, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A film-applying device for a microfluidic chip, the microfluidic chip comprising a channel layer and a sealing film attached to one side of the channel layer, wherein the film-applying device is used to attach the sealing film to the channel layer, characterized in that, The film application equipment includes a control system and a machine base, and the machine base has the following on its table surface: A rotating mechanism, including a rotating shaft; The turntable is coaxially connected to the rotation axis of the rotating mechanism and can rotate around its own central axis under the drive of the rotating mechanism. The top surface of the turntable is provided with a plurality of product limiting blocks evenly spaced along the circumference. The product limiting blocks are used to support the pipeline layer. A film feeding mechanism includes a take-up and release assembly and a peeling assembly. The take-up and release assembly is used to feed release paper including multiple sealing films toward the peeling assembly along a first direction. The peeling assembly includes a support platform with opposing left and right ends in the first direction. The support platform is provided with a conveying passage for the release paper to pass through, and the platform surface of the support platform is provided with a separation channel for the sealing films to pass through. When the take-up and release assembly causes the release paper to move along with the sealing films, the sealing films separate from the release paper at the left end of the support platform and enter the separation channel and the conveying passage respectively. A film-applying station, comprising an adsorption mechanism for adsorbing the sealing film from the peel-off assembly and placing it on the tubing layer on the product positioning block rotated to the film-applying station; and The film pressing station includes a lifting drive mechanism and a pressing head located above the turntable. The pressing head is connected to the lifting drive mechanism and is driven by the lifting drive mechanism to move up and down relative to the product limiting block so that the sealing film is bonded to the pipeline layer.

2. The film-applying device for microfluidic chips according to claim 1, characterized in that, The support platform has blocks on both sides in the second direction, forming a separation channel between the two blocks. The second direction is perpendicular to the first direction and parallel to the platform.

3. The film-applying device for microfluidic chips according to claim 2, characterized in that, Each of the blocks has a chamfer on its inner side in the second direction, and the chamfer is at the entrance of the separation channel.

4. The film-applying device for microfluidic chips according to claim 1, characterized in that, The adsorption mechanism and the support platform are spaced apart in a first direction.

5. The film-applying device for microfluidic chips according to claim 1, characterized in that, The carrier platform is also provided with a reversing channel, which is used to change the transmission of the release paper extending from the conveying channel to a third direction, which is opposite to the first direction.

6. The film-applying device for microfluidic chips according to claim 5, characterized in that, The film application device further includes a tensioning assembly for tensioning the release paper extending from the reversing channel. The tensioning assembly includes a first tensioning roller and a second tensioning roller, which are arranged sequentially in the first direction. The first tensioning roller and the second tensioning roller together define a conveying path that guides the release paper extending from the reversing channel forward, wherein the release paper extending from the reversing channel passes around the first tensioning roller and the second tensioning roller in succession.

7. The film-applying device for microfluidic chips according to claim 1, characterized in that, The pressure head is equipped with an electric heating component.

8. The film-applying device for microfluidic chips according to claim 6, characterized in that, A vertical plate is also fixed on the table surface of the machine, and the take-up and release component, the tensioning component, the peeling component and the adsorption mechanism are all disposed on the vertical plate.

9. The film-applying device for microfluidic chips according to claim 8, characterized in that, The film-applying equipment also includes a material bin for storing the release paper containing multiple sealing films.

10. The film-applying device for microfluidic chips according to claim 9, characterized in that, The material box is fixed to the upright plate.

Images