A turning plate adsorption device for a PCB

Abstract

The utility model relates to printing ink jet technology field, and disclose a kind of plate flipping adsorption device for PCB, including the substrate rotating by motor drive, and substrate is equipped with the chuck assembly for adsorbing PCB, chuck assembly includes the sponge suction cup and vacuum fitting suction nozzle connected with vacuum generation component, and vacuum fitting suction nozzle is set in the both sides of sponge suction cup;Sponge suction cup is installed in the substrate far from motor side by vertical plate, for carrying out vacuum adsorption to PCB main body, and the height of sponge suction cup is adjustable.The utility model is directly integrated in single main machine by the integration design of "substrate+sponge suction cup+vacuum fitting suction nozzle", sponge suction cup carries out large-area adsorption to PCB main body, two sides vacuum fitting suction nozzle reinforce edge, motor drive substrate overturns 180 °, and double-sided switching can be completed, without additional auxiliary machine, single equipment can realize double-sided printing, reduce equipment procurement and maintenance cost.

Description

Technical Field

[0001] This utility model relates to the field of inkjet printing technology, specifically to a flip-type adsorption device for PCB boards. Background Technology

[0002] In high-precision manufacturing scenarios such as double-sided inkjet printing on PCBs (e.g., flexible OLED driver boards, multi-layer communication circuit boards) and the processing of dual-panel micro-PCBs (e.g., automotive electronics micro-PCBs), traditional PCB flip-and-adsorption technology suffers from problems such as reliance on additional auxiliary equipment and unstable adsorption, making it difficult to meet the demands for efficient and low-cost production. Specific shortcomings are as follows: 1. Traditional duplex printing requires the installation of a flipping auxiliary machine between two main units, which is costly and takes up space; 2. In the traditional process, the PCB board needs to be transferred from the first main machine to the second main machine via an auxiliary machine. The fiber debris generated by the friction of the auxiliary machine's conveyor belt may adhere to the surface of the PCB board, which may lead to short circuits in some inkjet lines. During the transfer process, the PCB board is prone to shifting, resulting in large alignment errors for double-sided printed characters and a high failure rate for vias in multi-layer circuit boards. When the flexible PCB board is flipped by the auxiliary machine's grippers, edge wrinkles may appear, making it difficult to meet subsequent soldering requirements. 3. Traditional adsorption devices have fixed suction cup positions and non-adjustable suction force, which leads to problems such as high risk of multi-hole plates falling off, difficulty in double-panel operation, and inability to handle both thick and thin plates.

[0003] As electronic manufacturing moves towards "flexibility, high precision, and low cost," the shortcomings of traditional technologies in terms of cost, precision, and adaptability have become key bottlenecks restricting industry upgrades. There is an urgent need to design an innovative design that can integrate flip-up panels and flexibly attach them to overcome these limitations. Utility Model Content

[0004] To address the technical problems existing in the background art, this utility model proposes a flip-type adsorption device for PCB boards.

[0005] The present invention proposes a flip-board adsorption device for PCB boards, including a base plate driven to rotate by a motor, and a suction cup assembly for adsorbing PCB boards is installed on the base plate. The suction cup assembly includes a sponge suction cup connected to a vacuum generating assembly and a vacuum fitting nozzle, and the vacuum fitting nozzle is disposed on both sides of the sponge suction cup. The sponge suction cup is mounted on the side of the substrate away from the motor via a vertical plate, and is used to vacuum adsorb the PCB board body. The height of the sponge suction cup is adjustable. A support plate is provided on the side of the substrate away from the motor. The upper end and the lower end of the support plate are magnetically connected to the side of the upright plate and the substrate, respectively. There are multiple vacuum fitting nozzles, which are magnetically installed on the upper end of the support plate. An air distributor is installed on the upper surface of the second magnetic support plate. The vacuum fitting nozzle is connected to the vacuum generating component through the air distributor and is used to vacuum adsorb the edge of the PCB board.

[0006] As a further optimization of this utility model, the number of sponge suction cups is at least two and they are spaced apart along the length of the substrate. The support plate includes a first magnetic support plate disposed in the gap between two adjacent sponge suction cups and a second magnetic support plate disposed on the open side of the sponge suction cup. Vertical plates are installed on both sides of the long side of the sponge suction cup. The two sides of the first magnetic support plate and the inner side of the second magnetic support plate are magnetically connected to the lower end face of the adjacent vertical plate, respectively.

[0007] As a further optimization of this utility model, there are multiple air path distributors that are evenly distributed along the length of the first magnetic bearing plate. The multiple vacuum fitting nozzles are divided into multiple groups and correspond one-to-one with the multiple air path distributors, which are used for group control of the vacuum fitting nozzles.

[0008] As a further optimization of this utility model, the end of the upright plate is fixed to the base plate by fasteners, and the connection is stabilized by reinforcing ribs.

[0009] As a further optimization of this utility model, multiple circular holes are provided on the upright plate along its length, through which the pipeline between the air supply distributor and the vacuum fitting nozzle passes.

[0010] As a further optimization of this utility model, the side of the sponge suction cup has multiple bolts evenly distributed along its length direction, and the upright plate has a waist-shaped hole arranged along its height direction. There are multiple waist-shaped holes, each corresponding to a multiple bolt. The ends of the bolts pass through the waist-shaped holes and are locked with nuts.

[0011] As a further optimization of this utility model, it also includes a fixing plate fixedly installed on the equipment frame. A reducer connected to the output end of the motor is installed on one side of the fixing plate, and the output end of the reducer extends to the other side of the fixing plate and is fixed to the base plate.

[0012] As a further optimization of this utility model, a proximity sensor higher than the upper surface of the substrate is installed on the fixed plate, and a sensing block corresponding to the fixed plate is installed on the lower surface of the substrate. When the motor drives the substrate to rotate 180 degrees, the sensing block is opposite to the detection end of the proximity sensor.

[0013] As a further optimization of this utility model, the vacuum generating assembly includes a fixed frame mounted on the equipment frame and a second solenoid valve; The fixed frame is equipped with a first solenoid valve and a vacuum generator. The vacuum generator is connected to the input end of the gas distributor through the first solenoid valve. The output end of the gas distributor is connected in series with multiple vacuum fitting nozzles through pipelines. The output of the second solenoid valve is connected to the input of the sponge suction cup via a pipeline.

[0014] As a further optimization of this utility model, the gas distributor is equipped with a hose connector and a pagoda connector. The output end of the first solenoid valve is connected to the internal gas path of the gas distributor through the hose connector, and the pagoda connector is connected to the input end of the vacuum fitting nozzle.

[0015] The flip-type adsorption device for PCB boards proposed in this utility model has the following beneficial effects: (i) Through the integrated design of “substrate + sponge suction cup + vacuum fitting nozzle”, it can be directly integrated into a single host. The sponge suction cup adsorbs the PCB board body over a large area, and the vacuum fitting nozzles on both sides reinforce the edges. The motor drives the substrate to rotate 180° to complete the double-sided switching. No additional auxiliary equipment is required. A single device can achieve double-sided printing, which reduces the equipment purchase and maintenance costs. At the same time, it avoids fiber debris contamination caused by auxiliary equipment transportation, which helps to improve the character printing qualification rate and reduce the failure rate of via continuity in multi-layer circuit boards. (ii) The height of the sponge suction cup is adjustable by using the waist-shaped hole and bolts, which can be used to adapt to flexible boards and thick hard boards of various thicknesses. At least two sponge suction cups are distributed along the length of the substrate to ensure that the large board is firmly adsorbed. The first / second magnetic support plate is magnetically connected to the upright plate and the substrate. The vacuum fitting nozzle is magnetically installed on the support plate. The position can be adjusted without tools, easily avoiding the heat dissipation holes and mounting holes of the multi-hole PCB board, or adapting to the edge adsorption requirements of double-panel small boards. For example, when processing double-panel boards, the positions of the two sets of nozzles can be adjusted independently to ensure that the two small boards are flipped synchronously without misalignment. The adaptability is greatly improved compared with traditional fixed suction cups. (III) The air path distributor is evenly distributed along the support plate. The vacuum fitting nozzles are connected to the distributor in groups and are independently controlled by the first solenoid valve. The sponge suction cups are controlled separately by the second solenoid valve, forming a dual independent air path of "main body + edge". This design can flexibly open the corresponding suction cup group according to the PCB board specifications: when processing small boards, only the edge suction cup group is opened, reducing energy consumption by %. If a group of suction cups fails, the other groups can still work normally, avoiding overall adsorption failure. The vacuum digital display monitors the negative pressure in real time to ensure stable adsorption force, which is conducive to reducing the board drop rate of porous boards. (iv) The motor and reducer drive the substrate to flip, the proximity sensor and sensing block work together to achieve 180° precise positioning, and the encoder assists in adjusting the angle to ensure that the substrate has a small horizontal error after flipping, thereby improving the double-sided character alignment accuracy. It is especially suitable for high-precision scenarios such as flexible OLED driver boards, avoiding short circuits caused by flipping offset, reducing the edge wrinkling rate of flexible boards, and meeting the requirements of subsequent welding processes.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 A schematic diagram of the structure of an embodiment provided by this utility model; Figure 3 This is a schematic diagram of the gas distributor of this utility model.

[0018] Figure Descriptions: 1. Substrate; 2. Sponge suction cup; 3. Vacuum fitting nozzle; 4. Air distributor; 5. First magnetic support plate; 6. Second magnetic support plate; 7. Vertical plate; 8. Reinforcing rib plate; 9. Vacuum digital display; 10. Motor; 11. Fixing plate; 12. Reducer; 13. Proximity sensor; 14. Fixing frame; 15. First solenoid valve; 16. Vacuum generator; 17. Second solenoid valve; 18. Hose connector; 19. Pagoda connector; 20. Sensing block. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar symbols denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0021] Please see Figures 1-3 A flip-board adsorption device for PCB boards includes a base plate 1 driven to rotate by a motor 10, and a suction cup assembly for adsorbing PCB boards is installed on the base plate 1. The suction cup assembly includes a sponge suction cup 2 connected to a vacuum generating assembly and a vacuum fitting nozzle 3, and the vacuum fitting nozzle 3 is disposed on both sides of the sponge suction cup 2. The sponge suction cup 2 is mounted on the side of the substrate 1 away from the motor 10 via the upright plate 7, and is used to vacuum adsorb the PCB board body. The height of the sponge suction cup 2 is adjustable. A support plate is provided on the side of the substrate 1 away from the motor 10. The upper end and the lower end of the support plate are magnetically connected to the upright plate 7 and the side of the substrate 1, respectively. There are multiple vacuum fitting nozzles 3, which are magnetically installed on the upper end of the support plate. The upper surface of the second magnetic support plate 6 is equipped with an air distributor 4. The vacuum fitting nozzle 3 is connected to the vacuum generating component through the air distributor 4 and is used to vacuum adsorb the edge of the PCB board. like Figure 2 As shown, the vacuum generating assembly includes a mounting bracket 14 and a second solenoid valve 17 mounted on the equipment frame. A first solenoid valve 15 and a vacuum generator 16 are mounted on the mounting bracket 14. The vacuum generator 16 is connected to the input end of the gas distributor 4 through the first solenoid valve 15. The output end of the gas distributor 4 is connected in series with multiple vacuum fitting nozzles 3 through a pipeline. The output end of the second solenoid valve 17 is connected to the input end of the sponge suction cup 2 through a pipeline. The vacuum generator 16 provides negative pressure for the vacuum fitting nozzle 3. The first solenoid valve 15 controls the suction and vacuum breaking of the nozzle, and the second solenoid valve 17 controls the sponge suction cup separately, realizing independent air paths for the two suction cups to avoid mutual interference. The mounting bracket 14 integrates the air path assembly for easy maintenance. The vacuum generating assembly is adapted to a working air pressure of 0.5-0.8MPa to ensure long-term stable operation. Addressing the issues of traditional double-sided printing requiring additional flipping auxiliary equipment, high costs, and easy character contamination, this device optimizes the process through a "dual suction cup synergistic adsorption + integrated flip plate" design. The sponge suction cup 2 provides large-area adsorption to the PCB board, while the vacuum fitting nozzles 3 on both sides reinforce the edges to prevent the board from falling off during flipping. The sponge suction cups are height-adjustable, and the support plate is magnetically connected to the upright plate and substrate. The vacuum fitting nozzles are magnetically installed and their positions can be flexibly adjusted according to the board size, such as avoiding holes in porous PCBs. No tools are required for disassembly and assembly. The air path distributor 4 enables group control of the nozzles, working in conjunction with the vacuum generator to ensure stable adsorption force. A single main unit can complete double-sided printing, reducing equipment costs and improving the character printing pass rate.

[0022] Specifically, such as Figure 1 and Figure 2 As shown, there are at least two sponge suction cups 2, which are spaced apart along the length of the substrate 1. The support plate includes a first magnetic support plate 5 disposed in the gap between two adjacent sponge suction cups 2 and a second magnetic support plate 6 disposed on the open side of the sponge suction cup 2. Vertical plates 7 are installed on both sides of the long side of the sponge suction cup 2. The two sides of the first magnetic support plate 5 and the inner side of the second magnetic support plate 6 are magnetically connected to the lower end face of the adjacent vertical plate 7, respectively. At least two sponge suction cups 2 are distributed along the length of the substrate to ensure that the large board is firmly adsorbed. The first magnetic support plate 5 fills the gaps between the sponge suction cups, and the second magnetic support plate 6 covers the open side, forming a surrounding adsorption layout to avoid the edge of the PCB board being suspended. The support plate is magnetically connected to the upright plate, making disassembly and assembly convenient. The position of the support plate can be adjusted according to the needs of the double-sided small board, so that the vacuum fitting nozzle can accurately adsorb the edges of the two small boards, preventing flipping and misalignment. The adaptability is greatly improved compared with traditional fixed suction cups.

[0023] Specifically, there are multiple air path distributors 4, which are evenly distributed along the length of the first magnetic bearing plate 5. Multiple vacuum fitting nozzles 3 are divided into multiple groups and correspond one-to-one with multiple air path distributors 4, which are used for group control of vacuum fitting nozzles 3. Furthermore, such as Figure 1 As shown, there are two air distributors 4, which are respectively installed at both ends of the first magnetic support plate 5, and control the positive and negative pressure of the suction nozzles near both ends of the first magnetic support plate 5. Multiple vacuum fitting nozzles 3 are arranged in four rows. Each sponge suction cup 2 has a row of vacuum fitting nozzles 3 on both sides of its long side. Each row has at least four vacuum fitting nozzles 3. Multiple vacuum fitting nozzles 3 distributed circumferentially at one end of the sponge suction cup 2 constitute an adsorption unit. Each air path distributor 4 controls two adjacent adsorption units respectively, thereby realizing independent control of nozzle groups. If one group of nozzles malfunctions, the others can still work, preventing overall adsorption failure. The group design is also suitable for dual-plate operation, allowing separate control of the adsorption of two small plates, ensuring synchronous stability during flipping and reducing the risk of overall scrap due to adsorption abnormalities of a single plate.

[0024] Furthermore, such as Figure 3 As shown, the gas distributor 4 is equipped with a hose connector 18 and a pagoda connector 19. The output end of the first solenoid valve 15 is connected to the internal gas path of the gas distributor 4 through the hose connector 18, and the pagoda connector 19 is connected to the input end of the vacuum fitting nozzle 3. The first solenoid valve 15 is a three-way solenoid valve. A vacuum digital display 9 is installed on the side of the sponge suction cup 2. Each gas distributor 4 has two hose connectors 18. One hose connector 18 is connected to the vacuum digital display 9 through a pipeline, and the other hose connector 18 is connected to one of the output terminals of the three-way solenoid valve for gas path control and detection of real-time vacuum negative pressure. The second solenoid valve 17 is a two-way solenoid valve. Its output end is connected to the input end of the two sponge suction cups 2 through a pipeline, and is used to simultaneously control the vacuum adsorption and vacuum breaking of the two sponge suction cups 2. The hose connector 18 enables quick connection between the air distributor and the solenoid valve, while the pagoda connector 19 connects to the suction nozzle for easy assembly and disassembly. The vacuum digital display 9 monitors the negative pressure in real time, allowing operators to promptly detect adsorption anomalies and reduce the risk of plate drop. The second solenoid valve simultaneously controls two sponge suction cups to ensure adsorption synchronization and adapt to the adsorption needs of large plates. The three-way solenoid valve features a dual-output design that combines air path control and negative pressure detection, resulting in high functional integration, reduced number of external components, and fewer potential failure points.

[0025] Specifically, such as Figure 1 As shown, the end of the upright plate 7 is fixed to the base plate 1 by fasteners, and the connection is secured by reinforcing ribs 8. The upright plate 7 is fixed to the base plate with bolts. The reinforcing rib plate 8 adopts a triangular structure to enhance the rigidity of the connection and prevent the upright plate from deforming when flipping. This structure is suitable for high-frequency flipping driven by motor 10, ensuring that the adsorption position accuracy is not deviated after long-term use, and meeting the requirements of high-precision PCB printing.

[0026] Specifically, such as Figure 1 and Figure 2 As shown, the upright plate 7 has multiple round holes arranged along its length to allow the pipeline between the air distributor 4 and the vacuum fitting nozzle 3 to pass through, thus preventing the pipeline from getting tangled or worn when the substrate is flipped.

[0027] Specifically, such as Figure 1 and Figure 2 As shown, the side of the sponge suction cup 2 has multiple bolts evenly distributed along its length direction, and the upright plate 7 has multiple waist-shaped holes arranged along its height direction. The number of waist-shaped holes is multiple and corresponds one-to-one with multiple bolts. The ends of the bolts pass through the waist-shaped holes and are locked by nuts. The waist-shaped hole and bolts allow for height adjustment of the sponge suction cup, adapting to PCBs of different thicknesses. For example, when adsorbing flexible boards, the height can be lowered to prevent wrinkles, while when adsorbing heavy hard boards, the height can be raised to ensure a close fit. Tightening the nut ensures that the height is fixed, preventing the suction cup from shifting when flipped. The adsorption stability is greatly improved compared to traditional fixed suction cups.

[0028] Specifically, such as Figure 1 and Figure 2 As shown, the device also includes a fixing plate 11 fixedly mounted on the equipment frame. A reducer 12 connected to the output end of the motor 10 is mounted on one side of the fixing plate 11. The output end of the reducer 12 extends to the other side of the fixing plate 11 and is fixed to the base plate 1. The fixed plate 11 provides stable support for the device. The motor 10 is a 400W motor with a brake. It is equipped with a reducer 12 to reduce the speed and increase the torque, ensuring that the base plate 1 flips smoothly and avoiding the PCB board from shaking due to impact. The output end of the reducer is fixed to the base plate to further ensure the flipping accuracy and adapt to high-frequency automated operation.

[0029] Furthermore, a proximity sensor 13 is installed on the fixed plate 11, which is higher than the upper end of the substrate 1. A sensing block 20 corresponding to the fixed plate 11 is installed on the lower end of the substrate 1. When the motor 10 drives the substrate 1 to rotate 180 degrees, the sensing block 20 is opposite to the detection end of the proximity sensor 13. The rotation angle is adjusted by the encoder to ensure that the device is horizontal. After rotating to the correct position, the adsorption stops, so that the PCB board falls on the workbench and the next board is picked up, and the cycle continues. The proximity sensor 13 works in conjunction with the sensing block 20 to achieve precise 180° positioning. The encoder assists in adjusting the angle to ensure that the level error of the substrate is small after flipping, avoiding misalignment in double-sided printing, improving character alignment accuracy. After rotating into position, the vacuum is automatically broken and the material is unloaded, realizing an automated cycle of "adsorption-flipping-printing-unloading", which greatly shortens the processing cycle of a single board, requires no manual intervention, and reduces the difficulty of operation.

[0030] It should be noted that when the motor 10 drives the base plate 1 and its accessories to flip, the height needs to be adjusted in conjunction with the lifting module on the equipment frame to facilitate actual automated operation.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A flip-type adsorption device for PCB boards, comprising a base plate (1) driven to rotate by a motor (10), and a suction cup assembly for adsorbing PCB boards mounted on the base plate (1), characterized in that, The suction cup assembly includes a sponge suction cup (2) connected to the vacuum generating assembly and a vacuum fitting nozzle (3), with the vacuum fitting nozzle (3) located on both sides of the sponge suction cup (2); The sponge suction cup (2) is installed on the side of the substrate (1) away from the motor (10) via the upright plate (7) for vacuum adsorption of the PCB board body, and the height of the sponge suction cup (2) is adjustable. A support plate is provided on the side of the substrate (1) away from the motor (10). The upper end and the lower end of the support plate are magnetically connected to the side of the upright plate (7) and the substrate (1), respectively. There are multiple vacuum fitting nozzles (3) and they are magnetically installed on the upper end of the support plate. An air distributor (4) is installed on the upper surface of the second magnetic support plate (6). The vacuum fitting nozzle (3) is connected to the vacuum generating component through the air distributor (4) for vacuum adsorption of the edge of the PCB board.

2. The flip-board adsorption device for PCB boards according to claim 1, characterized in that, The number of sponge suction cups (2) is at least two and they are spaced apart along the length of the substrate (1). The support plate includes a first magnetic support plate (5) disposed in the gap between two adjacent sponge suction cups (2) and a second magnetic support plate (6) disposed on the open side of the sponge suction cup (2). A vertical plate (7) is installed on both sides of the long side of the sponge suction cup (2). The two sides of the first magnetic support plate (5) and the inner side of the second magnetic support plate (6) are magnetically connected to the lower end face of the adjacent vertical plate (7).

3. The flip-board adsorption device for PCB boards according to claim 2, characterized in that, The number of air distributors (4) is multiple and they are evenly distributed along the length of the first magnetic bearing plate (5). The multiple vacuum fitting nozzles (3) are divided into multiple groups and correspond one-to-one with the multiple air distributors (4) for group control of the vacuum fitting nozzles (3).

4. The flip-board adsorption device for PCB boards according to claim 1, characterized in that, The end of the upright plate (7) is fixed to the base plate (1) by fasteners, and the connection is secured by reinforcing ribs (8).

5. The flip-board adsorption device for PCB boards according to claim 1, characterized in that, Multiple round holes are provided on the upright plate (7) along its length, allowing the pipeline between the air distributor (4) and the vacuum fitting nozzle (3) to pass through.

6. The flip-board adsorption device for PCB boards according to claim 1, characterized in that, The side of the sponge suction cup (2) has multiple bolts evenly distributed along its length direction. The upright plate (7) has a waist-shaped hole arranged along its height direction. There are multiple waist-shaped holes, each corresponding to a bolt. The bolt ends pass through the waist-shaped holes and are locked with nuts.

7. The flip-board adsorption device for PCB boards according to claim 1, characterized in that, It also includes a fixed plate (11) fixedly installed on the equipment frame. A speed reducer (12) connected to the output end of the motor (10) is installed on one side of the fixed plate (11). The output end of the speed reducer (12) extends to the other side of the fixed plate (11) and is fixed to the base plate (1).

8. The flip-board adsorption device for PCB boards according to claim 7, characterized in that, A proximity sensor (13) higher than the upper surface of the substrate (1) is installed on the fixed plate (11). A sensing block (20) corresponding to the fixed plate (11) is installed on the lower surface of the substrate (1). When the motor (10) drives the substrate (1) to rotate 180 degrees, the sensing block (20) is opposite to the detection end of the proximity sensor (13).

9. A flip-type adsorption device for PCB boards according to any one of claims 1-8, characterized in that, The vacuum generating assembly includes a mounting bracket (14) mounted on the equipment frame and a second solenoid valve (17). The mounting bracket (14) is equipped with a first solenoid valve (15) and a vacuum generator (16). The vacuum generator (16) is connected to the input end of the gas distributor (4) through the first solenoid valve (15). The output end of the gas distributor (4) is connected in series with multiple vacuum fitting nozzles (3) through pipelines. The output end of the second solenoid valve (17) is connected to the input end of the sponge suction cup (2) through a pipeline.

10. A flip-type adsorption device for PCB boards according to claim 9, characterized in that, The gas distributor (4) is equipped with a hose connector (18) and a pagoda connector (19). The output end of the first solenoid valve (15) is connected to the internal gas path of the gas distributor (4) through the hose connector (18), and the pagoda connector (19) is connected to the input end of the vacuum fitting nozzle (3).

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