A rotating positioning disc based on wafer disc sputtering

Abstract

The utility model relates to a kind of rotary positioning disc based on wafer disc sputtering, including positioning disc, rotary disc and dismounting component, by pressing dismounting column, dismounting column drives connecting column to move, so that connecting column drives dismounting plate to move to adjusting groove inside, dismounting plate extrudes dismounting spring, dismounting plate drives limit post to move, the relative position of limit post and limit hole is controlled, and then the relative position of positioning plate and positioning seat is controlled, the dismounting between positioning disc and rotary disc is realized, it is convenient to install good to be processed wafer disc on new rotary disc, the overall replacement of rotary disc is realized, without after a group of wafer disc processing is completed, time-consuming and labor-consuming replacement wafer disc, avoid device idle, greatly shorten the equipment downtime, improve work efficiency, ensure positioning accuracy and stability, while it is convenient to overhaul and maintain rotary disc according to use demand.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a rotating positioning disk based on wafer disk sputtering. Background Technology

[0002] In PVD sputtering equipment, the structure used to support and precisely position the wafer disk is called the positioning disk. Its core purpose is to achieve uniformity, consistency and repeatability of thin film deposition on the wafer surface.

[0003] A search revealed a rotating positioning disk based on wafer sputtering, with publication number CN222878063U. The disk includes a positioning component, a rotating component, and a driving component. The positioning component has a through-hole at its center and multiple sets of through-holes radially extending outwards. The driving component passes through the through-hole and is fixed to the rotating component at its front end. The rotating component is positioned parallel to the front end of the positioning component. Multiple sets of radially extending second positioning holes are formed on the outer periphery of the rotating component, ensuring a one-to-one correspondence between the second positioning holes and the first positioning holes on the positioning component during rotation. A buffer is provided at each set of second positioning holes, providing support for the wafer. The entire device enables rapid sputtering of wafers, improving sputtering efficiency and accuracy.

[0004] The device in the disclosed patent is time-consuming and labor-intensive when installing wafer disks, requires the device to be idle, affects the continuity of work, reduces work efficiency, and has low practicality. Utility Model Content

[0005] In response to the technical problems in existing patents, such as the time-consuming and labor-intensive installation of wafer disks, the need for the device to remain idle, the impact on work continuity and efficiency, and the low practicality, this utility model provides a rotating positioning disk based on wafer disk sputtering.

[0006] The technical solution adopted in this utility model is: a rotating positioning disk based on wafer disk sputtering, comprising:

[0007] A positioning disk, wherein a rotary motor is bolted to the bottom of the positioning disk;

[0008] A rotating disk, which is mounted on top of the positioning disk;

[0009] A disassembly and assembly assembly is installed on the top of the positioning disk and the bottom of the rotating disk, and the disassembly and assembly assembly is used to control the relative position between the positioning disk and the rotating disk;

[0010] The assembly / disassembly assembly includes a positioning seat fixedly mounted on the output shaft of the rotary motor, an assembly / disassembly structure installed inside the positioning seat, and a positioning plate fixedly welded to the bottom of the rotary disk.

[0011] Furthermore, the top of the positioning seat is provided with a disassembly groove, and one side of the disassembly groove is provided with an adjustment groove. The disassembly structure includes a disassembly plate fused to the inner wall of the adjustment groove by a disassembly spring, a connecting column and a limiting column fixedly welded to one side of the disassembly plate, a disassembly column fixedly welded to one end of the connecting column, and a disassembly block fixedly welded to the bottom of the positioning plate.

[0012] Furthermore, the disassembly block cooperates with the disassembly groove, and a limiting hole is provided on the disassembly block, which cooperates with the limiting post.

[0013] Furthermore, the positioning disk has a first positioning hole, and the rotating disk has a second positioning hole, with the first positioning hole and the second positioning hole cooperating.

[0014] Furthermore, a positioning ring is installed on the second positioning hole.

[0015] The beneficial effects of this utility model are:

[0016] By pressing the disassembly and assembly column, the column moves the connecting column, which in turn moves the disassembly and assembly plate into the adjusting groove. The disassembly and assembly plate then compresses the disassembly and assembly spring, causing the limiting column to move. This controls the relative position of the limiting column and the limiting hole, thereby controlling the relative position of the positioning plate and the positioning seat. This allows for the disassembly and assembly of the positioning plate and the rotating plate, facilitating the installation of the wafer disk to be processed on the new rotating plate. It also enables the complete replacement of the rotating plate, eliminating the need for time-consuming and laborious wafer disk replacement after a set of wafer disks has been processed. This avoids idle equipment, significantly reduces downtime, improves work efficiency, ensures positioning accuracy and stability, and facilitates maintenance and repair of the rotating plate according to usage requirements. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of the separation of the positioning disk and the rotating disk in this utility model;

[0019] Figure 3 This is a three-dimensional structural diagram of the disassembly and assembly structure and the positioning plate in this utility model.

[0020] The diagram is marked as follows:

[0021] 1. Positioning plate; 2. Rotary motor;

[0022] 3. Rotating disk;

[0023] 4. Assembly / Disassembly Components; 401. Positioning Seat; 402. Assembly / Disassembly Structure; 4021. Assembly / Disassembly Spring; 4022. Assembly / Disassembly Plate; 4023. Connecting Post; 4024. Limiting Post; 4025. Assembly / Disassembly Post; 4026. Assembly / Disassembly Block; 403. Positioning Plate;

[0024] 5. Disassembly / assembly slot; 6. Limiting hole; 7. First positioning hole; 8. Second positioning hole; 9. Positioning ring. Detailed Implementation

[0025] In the description of this utility model, it should be noted that the terms "front", "up", "down", "left", "right", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] The following is in conjunction with the appendix Figure 1-3 The present invention will be further described below.

[0028] To address the problems existing in the background art, this application proposes the following technical solution:

[0029] A rotating positioning disk based on wafer disk sputtering includes: a positioning disk 1, a rotating disk 3, and a disassembly / assembly assembly 4;

[0030] A rotary motor 2 is bolted to the bottom of the positioning plate 1, and a rotating plate 3 is mounted on the top of the positioning plate 1.

[0031] like Figure 1-3 As shown, the disassembly and assembly component 4 is installed on the top of the positioning disk 1 and the bottom of the rotating disk 3. The disassembly and assembly component 4 is used to control the relative position between the positioning disk 1 and the rotating disk 3.

[0032] The assembly / disassembly component 4 includes a positioning seat 401 fixedly mounted on the output shaft of the rotary motor 2, an assembly / disassembly structure 402 installed inside the positioning seat 401, and a positioning plate 403 fixedly welded to the bottom of the rotary disk 3.

[0033] Furthermore, the top of the positioning seat 401 is provided with a disassembly groove 5, and an adjustment groove is provided on one side of the disassembly groove 5. The disassembly structure 402 includes a disassembly plate 4022 fused to the inner wall of the adjustment groove by a disassembly spring 4021, a connecting post 4023 and a limiting post 4024 fixedly welded to one side of the disassembly plate 4022, a disassembly post 4025 fixedly welded to one end of the connecting post 4023, and a disassembly block 4026 fixedly welded to the bottom of the positioning plate 403. The disassembly block 4026 cooperates with the disassembly groove 5, and a limiting hole 6 is provided on the disassembly block 4026, which cooperates with the limiting post 4024.

[0034] Furthermore, the positioning disk 1 has a first positioning hole 7, and the rotating disk 3 has a second positioning hole 8. The first positioning hole 7 and the second positioning hole 8 cooperate with each other. The second positioning hole 8 is equipped with a positioning ring 9. Different types of target materials are connected to the rear end of the first positioning hole 7. The specific process has been described in detail in the comparative document and will not be described in detail here. The positioning disk 1 and the rotating disk 3 achieve precise alignment through the first positioning hole 7 and the second positioning hole 8 to ensure the stability and accuracy of the position during sputtering. In addition, the target material connected to the rear end of the first positioning hole 7 can be flexibly replaced according to actual needs to adapt to the sputtering operation requirements of wafer disks of different specifications.

[0035] The top of the positioning ring 9 has a support groove to prevent the wafer disk from slipping. The inner wall of the support groove is specially treated to increase friction, ensuring that the wafer disk will not easily slip during placement. The positioning ring 9 is made of high-strength material and can withstand greater pressure, ensuring stability during use. In addition, the depth of the support groove is precisely calculated to effectively fix the wafer disk and facilitate quick placement and removal by operators. To further improve safety, the edge of the positioning ring 9 is designed with a smooth transition to avoid damage to the wafer disk during operation. This design not only improves work efficiency but also significantly reduces the risk of damage caused by improper operation.

[0036] Working principle: During use, the wafer disk is sputtered through the target material connected to the rear end of the first positioning hole 7. The specific workflow has been described in detail in the comparative document and will not be described in detail here. After completing the sequential sputtering work, the positioning seat 401 is rotated. The positioning seat 401, through the cooperation of the disassembly and assembly structure 402 and the positioning plate 403, drives the rotating disk 3 to rotate synchronously, thereby realizing the rotation of the wafer disk and moving it to the next sputtering work position. The specific process has been described in detail in the comparative document and will not be described in detail here.

[0037] By pressing the disassembly and assembly column 4025, the disassembly and assembly column 4025 drives the connecting column 4023 to move, causing the connecting column 4023 to drive the disassembly and assembly plate 4022 to move inward to the adjusting groove. The disassembly and assembly plate 4022 squeezes the disassembly and assembly spring 4021, and the disassembly and assembly plate 4022 drives the limiting column 4024 to move, thereby controlling the relative position of the limiting column 4024 and the limiting hole 6, and thus controlling the relative position of the positioning plate 403 and the positioning seat 401. This realizes the disassembly and assembly between the positioning disk 1 and the rotating disk 3, making it convenient to install the wafer disk to be processed on the new rotating disk 3, and realizing the overall replacement of the rotating disk 3. It eliminates the need to replace the wafer disk after a set of wafer disks has been processed, which is time-consuming and laborious. This avoids the device being idle, greatly shortens the equipment downtime, improves work efficiency, ensures positioning accuracy and stability, and facilitates the maintenance and repair of the rotating disk 3 according to usage requirements.

[0038] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0039] Although embodiments of the present invention have been shown and described, the scope of the present invention will be defined by the appended claims and their equivalents for those skilled in the art.

Claims

1. A rotating positioning disk based on wafer disk sputtering, characterized in that, include: Positioning disk (1), a rotary motor (2) is bolted to the bottom of the positioning disk (1); Rotary disk (3), the rotary disk (3) is mounted on top of the positioning disk (1); The disassembly and assembly component (4) is installed on the top of the positioning disk (1) and the bottom of the rotating disk (3). The disassembly and assembly component (4) is used to control the relative position between the positioning disk (1) and the rotating disk (3). The disassembly assembly (4) includes a positioning seat (401) fixedly mounted on the output shaft of the rotary motor (2), a disassembly structure (402) installed inside the positioning seat (401), and a positioning plate (403) fixedly welded to the bottom of the rotary disk (3).

2. The rotating positioning disk based on wafer disk sputtering according to claim 1, characterized in that, The top of the positioning seat (401) is provided with a disassembly groove (5), and an adjustment groove is provided on one side of the disassembly groove (5). The disassembly structure (402) includes a disassembly plate (4022) fused to the inner side wall of the adjustment groove by a disassembly spring (4021), a connecting post (4023) and a limiting post (4024) fixedly welded to one side of the disassembly plate (4022), a disassembly post (4025) fixedly welded to one end of the connecting post (4023), and a disassembly block (4026) fixedly welded to the bottom of the positioning plate (403).

3. A rotating positioning disk based on wafer disk sputtering according to claim 2, characterized in that, The disassembly block (4026) cooperates with the disassembly groove (5), and a limiting hole (6) is provided on the disassembly block (4026), which cooperates with the limiting post (4024).

4. A rotating positioning disk based on wafer disk sputtering according to claim 1, characterized in that, The positioning disk (1) has a first positioning hole (7), and the rotating disk (3) has a second positioning hole (8). The first positioning hole (7) and the second positioning hole (8) cooperate with each other.

5. A rotating positioning disk based on wafer disk sputtering according to claim 4, characterized in that, A positioning ring (9) is installed on the second positioning hole (8).

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