A semiconductor sputtering table with double-layer reverse magnetic circuit structure

Abstract

The utility model relates to a kind of semiconductor sputtering table with double-layer reverse magnetic circuit structure, including processing table;Circulation component, circulation component is installed on processing table, circulation component is used to drive workpiece to move, circulation component includes slide rail, servo motor, driving shaft, driven shaft and conveyer belt, slide rail is fixedly installed on the side wall of processing table, servo motor is fixedly installed on slide rail, driving shaft is fixedly connected with the output shaft of servo motor, conveyer belt is sleeved on the outside of driving shaft and driven shaft, driving shaft, driven shaft and conveyer belt are rotatably installed in slide rail interior, through the use of circulation component and turnover component, multiple workpieces can be processed simultaneously without interruption and automatically turned over, solve the problem of low efficiency caused by back and forth replacement of different workpieces and manual turning, which is conducive to fully improving the processing efficiency, and is conducive to improving the convenience of device use, easy to use.

Description

Technical Field

[0001] This utility model relates to the field of sputtering stage technology, and in particular to a semiconductor sputtering stage with a double-layer reverse magnetic circuit structure. Background Technology

[0002] Semiconductor sputtering stations are core equipment used for semiconductor material preparation. They belong to the physical vapor deposition process. Semiconductor sputtering stations use magnetron sputtering technology to confine secondary electrons with a magnetic field to form a high-density plasma, achieving high-speed sputtering deposition of target atoms. They can deposit metal and oxide thin films on the wafer surface. Semiconductor sputtering stations have a wide range of applications and can be used in the research and development and production of semiconductor products for integrated circuits and vacuum electronic devices. In order to improve the processing effect, semiconductor sputtering stations with a double-layer reverse magnetic circuit structure are required.

[0003] A search revealed Chinese Patent CN220812602U, which discloses a wafer sputtering apparatus and semiconductor stage, comprising: a chamber body; a base disposed within the chamber body, on which a wafer is placed; a target material disposed within the chamber body; and a magnetic field adjustment assembly disposed on one side of the target material. The magnetic field adjustment assembly includes at least one electromagnet and an adjustment structure, the adjustment structure driving the electromagnet to rotate horizontally and / or move vertically. This wafer sputtering apparatus and semiconductor stage disclosed in this invention can improve target material utilization.

[0004] The above technical solution can only process a single workpiece individually, and cannot process multiple workpieces simultaneously and continuously or automatically flip them. This easily leads to low efficiency due to the need to change different workpieces back and forth and manual flipping, which is not conducive to fully improving processing efficiency or the ease of use of the device. Utility Model Content

[0005] In view of the above-mentioned technical solutions, which can only process a single workpiece individually and cannot process multiple workpieces simultaneously and continuously or automatically flip them, resulting in low efficiency due to the need to change different workpieces back and forth and manual flipping, this invention provides a semiconductor sputtering stage with a double-layer reverse magnetic circuit structure.

[0006] The technical solution adopted in this utility model is: a semiconductor sputtering stage with a double-layer reverse magnetic circuit structure, comprising:

[0007] Processing table;

[0008] A circulation assembly is mounted on the machining table and is used to move the workpiece. The circulation assembly includes a slide rail, a servo motor, a drive shaft, a driven shaft, and a conveyor belt. The slide rail is fixedly mounted on the side wall of the machining table, the servo motor is fixedly mounted on the slide rail, the drive shaft is fixedly connected to the output shaft of the servo motor, the conveyor belt is sleeved on the outside of the drive shaft and the driven shaft, the drive shaft, the driven shaft, and the conveyor belt are rotatably mounted inside the slide rail, a fixing ring is fixedly mounted on the outside of the conveyor belt, a push rod passes through the fixing ring, and anti-friction cloth is bonded to the side wall of the push rod.

[0009] Furthermore, a flipping component is installed on one side of the processing table, which is used to flip the workpiece.

[0010] Furthermore, the flipping assembly includes a bracket, a self-locking motor, a linear cylinder, a first clamping plate, and a second clamping plate. The self-locking motor is fixedly mounted on the side wall of the bracket. The fixed end of the linear cylinder rotatably passes through the inside of the bracket. The fixed end of the linear cylinder is fixedly connected to the output shaft of the self-locking motor. The first clamping plate is fixedly connected to the fixed end of the linear cylinder, and the second clamping plate is fixedly connected to the telescopic end of the linear cylinder.

[0011] Furthermore, the processing table is symmetrically equipped with base plates.

[0012] Furthermore, the processing table is externally fitted with a housing, the circulation component, the flipping component and the base plate are located inside the housing, and the slide rail, the servo motor and the bracket are fixedly installed inside the housing.

[0013] Furthermore, a top plate is fixedly installed on the inner top surface of the outer casing.

[0014] Furthermore, the side wall of the outer casing is provided with a conveying port.

[0015] The beneficial effects of this utility model are:

[0016] This invention, through the setting of a circulation component and a flipping component, can achieve the effect of simultaneous and uninterrupted processing of multiple workpieces and automatic flipping, solving the problem of low efficiency caused by repeatedly changing different workpieces and manual flipping. It is beneficial to significantly improve processing efficiency and enhance the ease of use of the device. Attached Figure Description

[0017] Figure 1 This is a cross-sectional structural schematic diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the disassembled structure of the recirculating component of this utility model;

[0019] Figure 3 This is a rear view structural diagram of the flip-up component of this utility model;

[0020] Figure 4 This is a front view structural diagram of this utility model.

[0021] The following are marked in the diagram: 1. Processing table; 2. Circulation assembly; 201. Slide rail; 202. Servo motor; 203. Drive shaft; 204. Driven shaft; 205. Conveyor belt; 206. Fixing ring; 207. Push rod; 208. Anti-friction cloth; 3. Tilting assembly; 301. Bracket; 302. Self-locking motor; 303. Linear cylinder; 304. Clamping plate one; 305. Clamping plate two; 4. Base plate; 5. Outer shell; 6. Top plate; 7. Conveying port. Detailed Implementation

[0022] In the description of this utility model, it should be noted that the terms "front", "up", "down", "left", "right", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The following is in conjunction with the appendix Figure 1-4 The present invention will be further described below.

[0025] To address the problems existing in the background art, this application proposes the following technical solution: a semiconductor sputtering stage with a double-layer reverse magnetic circuit structure.

[0026] The specific technical solution includes a processing table 1 and a circulation component 2;

[0027] like Figure 1-2 and Figure 4As shown, the circulation assembly 2 is mounted on the processing table 1. The circulation assembly 2 is used to move the workpiece. The circulation assembly 2 includes a slide rail 201, a servo motor 202, a drive shaft 203, a driven shaft 204, and a conveyor belt 205. The slide rail 201 can fix the servo motor 202, and also supports the drive shaft 203, driven shaft 204, and conveyor belt 205. The servo motor 202 can drive the drive shaft 203 to rotate. The drive shaft 203 and driven shaft 204 can support the conveyor belt 205. The conveyor belt 205 can drive the fixed ring 206 to rotate. The slide rail 201 is fixedly mounted on the side wall of the processing table 1. 202 is fixedly mounted on slide rail 201. The drive shaft 203 is fixedly connected to the output shaft of servo motor 202. The conveyor belt 205 is sleeved on the outside of drive shaft 203 and driven shaft 204. Drive shaft 203, driven shaft 204 and conveyor belt 205 are rotatably mounted inside slide rail 201. A fixing ring 206 is fixedly mounted on the outside of conveyor belt 205. The fixing ring 206 can support push rod 207. Push rod 207 is inserted inside fixing ring 206. After push rod 207 is driven, it can push the workpiece to be processed. Anti-friction cloth 208 is bonded to the side wall of push rod 207. Anti-friction cloth 208 can be placed under the workpiece to prevent the workpiece to be processed from being rubbed.

[0028] The circulation assembly 2 includes two slide rails 201, two servo motors 202, two drive shafts 203, two driven shafts 204, and two conveyor belts 205. Two symmetrical slide rails 201 are positioned on either side of the processing table 1. The two conveyor belts 205 rotate in opposite directions. Each slide rail 201 is equipped with one servo motor 202, one drive shaft 203, one driven shaft 204, and one conveyor belt 205. Multiple fixing rings 206 are fixedly installed on each conveyor belt 205. A push rod 207 passes through each fixing ring 206, and an anti-friction cloth 208 is fixedly installed on each push rod 207. The conveyor belt 2... The length of 05 and the number of fixing rings 206 are set as needed. Multiple push rods 207 are arranged around the outside of the processing table 1. The length of the processing table 1 is much greater than the length between four adjacent push rods 207, allowing multiple push rods 207 and anti-friction cloth 208 to be simultaneously located above the processing table 1. When the push rod 207 rotates to the top surface of the processing table 1, the anti-friction cloth 208 on the push rod 207 is pulled onto the processing table 1 and laid flat on the processing table 1. The workpiece to be processed is placed on the anti-friction cloth 208 laid flat on the processing table 1. The servo motor 202 is started to drive the drive shaft 203 to rotate. Shaft 203 can drive the conveyor belt 205 to rotate, the conveyor belt 205 can drive the fixed ring 206 to rotate inside the slide rail 201, and the fixed ring 206 can drive the push rod 207 to rotate around the outside of the processing table 1. When the push rod 207 rotates from below the processing table 1 to below the processing table 1, the push rod 207 is in an upward state. Due to the weight of the anti-friction cloth 208, the upward push rod 207 can drive the anti-friction cloth 208 to slide upward along the end of the processing table 1, so that the anti-friction cloth 208 can be laid flat on the processing table 1. The fixed ring 206 can drive the push rod 207 above the processing table 1. The push rod 207 can move and drive the anti-friction cloth 208 to slide on the processing table 1. Then, multiple parts to be processed can be placed on the anti-friction cloth 208 laid flat on the processing table 1 in sequence. Multiple parts to be processed can be transported, reducing the inefficiency caused by changing parts one by one. Since the conveyor belts 205 on both sides rotate in opposite directions, the parts to be processed are first placed on the anti-friction cloth 208 on one side of the conveyor belt 205. After one side is processed, it is flipped and put into the anti-friction cloth 208 on the other side of the conveyor belt 205, and then driven to perform processing on different sides.

[0029] like Figure 1 and Figure 3As shown, a flipping assembly 3 is installed on one side of the processing table 1. The flipping assembly 3 is used to flip the workpiece. The flipping assembly 3 includes a bracket 301, a self-locking motor 302, a linear cylinder 303, a clamping plate 304, and a clamping plate 305. The bracket 301 can support and fix the self-locking motor 302. The self-locking motor 302 can drive the linear cylinder 303 to rotate. The linear cylinder 303 can adjust the distance between the clamping plate 304 and the clamping plate 305. The clamping plate 304 and the clamping plate 305 can flip the workpiece on the side that has just been processed. The self-locking motor 302 is fixedly installed on the side wall of the bracket 301. The fixed end of the linear cylinder 303 rotates through the inside of the bracket 301. The fixed end of the linear cylinder 303 is fixedly connected to the output shaft of the self-locking motor 302. The clamping plate 304 is fixedly connected to the fixed end of the linear cylinder 303. The clamping plate 305 is fixedly connected to the telescopic end of the linear cylinder 303.

[0030] according to Figure 1 As shown, the rotation of the right-side conveyor belt 205 can drive the right-side push rod 207 to move on the processing table 1 via the fixed ring 206. The right-side push rod 207 can drive the right-side anti-friction cloth 208 to move between the bottom plate 4 and the top plate 6. After the bottom plate 4 and the top plate 6 are started, high-speed sputtering deposition of target atoms can be performed on the exposed surface of the workpiece, which can deposit a metal or oxide film on the surface of the workpiece. The workpiece is driven to continue moving towards the support 301. When the workpiece moves to the right side of the clamping plate 304 and the push rod 207 that drags the anti-friction cloth 208 and the workpiece moves to a height lower than the top surface of the processing table 1, the self-locking motor 302 drives the linear cylinder 303 to rotate clockwise. The linear cylinder 303 drives the clamping plate 304 and the clamping plate 305 to rotate clockwise. The central axis of the clamping plate 304 coincides with the central axis of the self-locking motor 302, so the height of the clamping plate 304 and the water level are... With the flat position unchanged, clamp 1 304 is located on the left side of the workpiece, and clamp 2 305 is rotated to the right side of the workpiece. By starting the linear cylinder 303, clamp 2 305 is moved, which pushes the workpiece closer to clamp 1 304. Clamp 1 304 and clamp 2 305 can clamp the workpiece. By starting the self-locking motor 302, the linear cylinder 303 is rotated counterclockwise. The linear cylinder 303 can drive the workpiece to rotate counterclockwise around the central axis of the self-locking motor 302 through clamp 1 304 and clamp 2 305, which can flip the workpiece 180 degrees. At this time, the workpiece can be rotated onto the anti-friction cloth 208 on the left side. At this time, the processed side of the workpiece is facing down, and the unprocessed side is facing up. According to the above steps, the rotation of the left conveyor belt 205 can drive the workpiece on the left side to move between the bottom plate 4 and the top plate 6, which can process the other side of the workpiece.

[0031] like Figure 1As shown, a base plate 4 is symmetrically mounted on the processing table 1. The base plate 4 can be used simultaneously with the top plate 6 to perform high-speed sputtering deposition of target atoms on the workpiece. It can deposit a metal or oxide film on the surface of the workpiece. There are two base plates 4 and two top plates 6. The top plate 6 is located directly above the base plate 4. The two top plates 6 and the two base plates 4 are separated by an internal baffle of the outer shell 5 to prevent the top plate 6 on one side and the base plate 4 on the other side from interfering with each other.

[0032] like Figure 1 and Figure 4 As shown, the processing table 1 is externally fixedly fitted with a housing 5, which can protect the processing environment and help improve the processing accuracy. The circulation component 2, the flipping component 3 and the base plate 4 are located inside the housing 5. The slide rail 201, the servo motor 202 and the bracket 301 are fixedly installed inside the housing 5.

[0033] like Figure 1 As shown, a top plate 6 is fixedly installed on the inner top surface of the outer shell 5. The top plate 6 can be used simultaneously with the bottom plate 4 to perform double-layer reverse magnetic circuit processing.

[0034] like Figure 4 As shown, the side wall of the outer casing 5 is provided with a conveying port 7, which facilitates the conveying of the workpiece to be processed and the processed workpiece.

[0035] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0036] Although embodiments of the present invention have been shown and described, the scope of the present invention will be defined by the appended claims and their equivalents for those skilled in the art.

Claims

1. A semiconductor sputtering stage with a double-layer reverse magnetic circuit structure, characterized in that, include: Processing table (1); A circulation component (2) is mounted on the processing table (1) and is used to move the workpiece. The circulation component (2) includes a slide rail (201), a servo motor (202), a drive shaft (203), a driven shaft (204), and a conveyor belt (205). The slide rail (201) is fixedly mounted on the side wall of the processing table (1), and the servo motor (202) is fixedly mounted on the slide rail (201). The drive shaft (203) is connected to the servo motor. The output shaft of the machine (202) is fixedly connected. The conveyor belt (205) is sleeved on the outside of the drive shaft (203) and the driven shaft (204). The drive shaft (203), the driven shaft (204) and the conveyor belt (205) are rotatably mounted inside the slide rail (201). A fixing ring (206) is fixedly mounted on the outside of the conveyor belt (205). A push rod (207) is inserted inside the fixing ring (206). Anti-friction cloth (208) is bonded to the side wall of the push rod (207).

2. The semiconductor sputtering stage with a double-layer reverse magnetic circuit structure according to claim 1, characterized in that, A flipping component (3) is installed on one side of the processing table (1), and the flipping component (3) is used to flip the workpiece.

3. A semiconductor sputtering stage with a double-layer reverse magnetic circuit structure according to claim 2, characterized in that, The flipping assembly (3) includes a bracket (301), a self-locking motor (302), a linear cylinder (303), a clamping plate one (304), and a clamping plate two (305). The self-locking motor (302) is fixedly mounted on the side wall of the bracket (301). The fixed end of the linear cylinder (303) is rotatably inserted inside the bracket (301). The fixed end of the linear cylinder (303) is fixedly connected to the output shaft of the self-locking motor (302). The clamping plate one (304) is fixedly connected to the fixed end of the linear cylinder (303). The clamping plate two (305) is fixedly connected to the telescopic end of the linear cylinder (303).

4. A semiconductor sputtering stage with a double-layer reverse magnetic circuit structure according to claim 3, characterized in that, The processing table (1) is symmetrically equipped with a base plate (4).

5. A semiconductor sputtering stage with a double-layer reverse magnetic circuit structure according to claim 4, characterized in that, The processing table (1) is fixedly fitted with a shell (5). The circulation component (2), the flipping component (3) and the base plate (4) are located inside the shell (5). The slide rail (201), the servo motor (202) and the bracket (301) are fixedly installed inside the shell (5).

6. A semiconductor sputtering stage with a double-layer reverse magnetic circuit structure according to claim 5, characterized in that, A top plate (6) is fixedly installed on the inner top surface of the outer shell (5).

7. A semiconductor sputtering stage with a double-layer reverse magnetic circuit structure according to claim 6, characterized in that, The outer casing (5) has a conveying port (7) on its side wall.

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