Wafer tray assembly and evaporation apparatus

Abstract

The utility model discloses a wafer tray assembly and evaporation equipment. Wafer tray assembly is installed in planet carrier, and it includes planet disc and fixed column. Among them, planet disc is set up with a plurality of first installation hole, and planet carrier is set up with the second installation hole corresponding with first installation hole, fixed column is set up with opposite two thread holes, and the center axis of one thread hole has a preset eccentricity relative to the center axis of another thread hole, and the thread hole includes the thread section, and the lateral wall of thread section is provided with internal thread, and fixed column is also set up with the flow guide hole, and the flow guide hole is arranged at the circumferential side of thread hole and is communicated with thread hole, and along the extension direction of thread hole, and the depth of flow guide hole is equal with the depth of thread section, and two thread holes are bolted with first installation hole and second installation hole respectively. The wafer tray assembly can avoid the phenomenon that the bolt of planet disc and planet carrier is locked, thereby reducing the production gap of wafer evaporation operation, and is favorable to improving the production efficiency of wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer tray assembly and vapor deposition equipment. Background Technology

[0002] During wafer deposition, the planetary disk holds the wafer in its accommodating tank and is mounted on a planetary carrier (umbrella carrier). The carrier rotates the planetary disk to ensure uniform wafer deposition. During the deposition process, the planetary disk and carrier are continuously exposed to a high-temperature vacuum environment, which often leads to jamming of the connecting bolts. This makes it difficult for operators to disassemble the planetary disk, increasing the production gap during wafer deposition and ultimately affecting wafer production efficiency. Utility Model Content

[0003] The main purpose of this invention is to provide a wafer tray assembly and vapor deposition equipment, which aims to reduce the production gap in wafer vapor deposition operations and improve wafer production efficiency.

[0004] To achieve the above objectives, this utility model proposes a wafer tray assembly, mounted on a planetary carrier, comprising: The planetary disk has multiple first mounting holes, and the planet carrier has second mounting holes corresponding to the first mounting holes. A fixed post has two opposing threaded holes, wherein the central axis of one threaded hole has a predetermined eccentricity relative to the central axis of the other threaded hole. The threaded hole includes a threaded section, and the sidewall of the threaded section is surrounded by an internal thread. The fixed post also has a guide hole, which is disposed on the periphery of the threaded hole and communicates with the threaded hole. Along the extension direction of the threaded hole, the depth of the guide hole is equal to the depth of the threaded section. The two threaded holes are respectively bolted to the first mounting hole and the second mounting hole.

[0005] In one embodiment, each of the threaded holes is provided with at least two guide holes arranged in a ring array in the circumferential direction.

[0006] In one embodiment, the tolerance zone of the internal thread is 7H, and the thread angle of the internal thread is 55°.

[0007] In one embodiment, the planetary disk includes a disk body, a transition ring, and a positioning pin. The top surface of the disk body is provided with a plurality of receiving slots and at least two positioning holes. The plurality of receiving slots are arranged in a circular array, and the positioning holes are provided between adjacent receiving slots. The adapter ring includes a ring body, with at least two bayonets and a plurality of first mounting holes spaced apart along the circumference of the ring body. The number of positioning pins is the same as the number of bayonets. One end of the positioning pin is threadedly connected to the positioning hole, and the other end of the positioning pin is engaged with the bayonets.

[0008] In one embodiment, the top surface of the disc body is provided with at least two transition holes. The positioning holes and the transition holes are arranged in a circumferential array along the circumference of the disc body. The ring body is also provided with connecting holes corresponding to the transition holes. The transition holes and the connecting holes are connected by the fixing post bolts.

[0009] In one embodiment, the positioning pin includes a connecting post, a snap-fit ​​post, and a limiting cap connected in sequence. The snap-fit ​​post includes a circular hole and a groove formed on one side of the circular hole. The connecting post is threadedly connected to the positioning hole. The diameter of the circular hole is smaller than the diameter of the limiting cap. The snap-fit ​​post is used to slide into the groove.

[0010] In one embodiment, the top surface of the disc body is provided with a first weight-reducing groove and a second weight-reducing groove, and a plurality of the receiving grooves surround to form a central area. The first weight-reducing groove is opened in the central area, and the second weight-reducing groove is opened between adjacent receiving grooves.

[0011] In one embodiment, the projection of the first weight-reducing groove onto the top surface of the disk is a first projection, which is a centrally symmetrical figure, and the plurality of second weight-reducing grooves are distributed in a ring array along the circumference of the disk.

[0012] In one embodiment, both the planetary disk and the fixing column are made of stainless steel.

[0013] This invention also proposes a vapor deposition apparatus, including a wafer tray assembly as described in any of the above embodiments.

[0014] According to the technical solution of this utility model, a wafer tray assembly is mounted on a planetary carrier, which includes a planetary disk and a fixing post. The planetary disk has multiple first mounting holes, and the planetary carrier has second mounting holes corresponding to the first mounting holes. The fixing post has two opposing threaded holes, wherein the central axis of one threaded hole has a predetermined eccentricity relative to the central axis of the other threaded hole. The threaded hole includes a threaded section, the sidewall of which is surrounded by internal threads. The fixing post also has a guide hole, which is located on the periphery of the threaded hole and communicates with it. Along the extension direction of the threaded hole, the depth of the guide hole is equal to the depth of the threaded section. The two threaded holes are bolted to the first mounting holes and the second mounting hole, respectively.

[0015] This technical solution enables the planetary disk and planetary carrier to be connected via a fixed post and bolts. Because the fixed post has non-coaxial threaded holes, it prevents the bolts from rotating synchronously with both ends of the fixed post during bolt removal, thus avoiding the bolts getting stuck and unable to be removed. By setting a guide hole, the inside of the threaded hole is connected to the outside of the planetary disk, thereby preventing the threaded hole from generating an adsorption force on the bolt in a vacuum environment due to the gas being extracted from the gap between the bolt and the threaded hole, thus preventing the bolt from getting stuck.

[0016] With this arrangement, the technical solution provided by this utility model has at least the following beneficial effects: (1) This solution can ensure that during the disassembly of the bolt and the fixed column, there will be no situation where the bolt cannot be removed due to the synchronous rotation of the bolt and the fixed column, and it can also eliminate the vacuum adsorption effect of the threaded hole on the bolt, thereby avoiding the bolt from getting stuck in the threaded hole, and thus improving the disassembly efficiency of the bolt. (2) The planetary disk and planetary carrier will not get stuck during the separation process, which helps to reduce the production gap of the wafer evaporation operation and thus improve the production efficiency of the wafer. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the planetary disk provided by this utility model; Figure 2 A schematic diagram of a structure of an embodiment of the fixing column provided by this utility model; Figure 3 for Figure 2 A top-view structural diagram; Figure 4 A schematic diagram of another embodiment of the fixing column provided by this utility model; Figure 5 A schematic diagram of the structure of an embodiment of the disk body provided by this utility model; Figure 6 A schematic diagram of the structure of an embodiment of the adapter ring provided by this utility model; Figure 7 A schematic diagram of an embodiment of the positioning pin provided by this utility model.

[0019] Explanation of icon numbers: 1. Planetary disk; 11. Disk body; 111. Receiving groove; 112. Positioning hole; 113. Adapter hole; 12. Adapter ring; 121. First mounting hole; 122. Bayonet; 1221. Round hole; 1222. Slide groove; 123. Connecting hole; 13. Positioning pin; 131. Connecting post; 132. Snap-fit ​​post; 133. Limiting cap; 14. First weight reduction groove; 15. Second weight reduction groove; 16. Central area; 2. Fixed post; 21. Threaded hole; 211. Threaded section; 22. Guide hole.

[0020] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0024] In the wafer deposition process of semiconductor manufacturing, the planetary disk plays a crucial role as a core supporting component. Its structure is designed with multiple annularly distributed receiving slots, each precision-machined into an arc-shaped groove matching the outer diameter of the wafer, ensuring the wafer remains horizontally stable during deposition. This planetary disk is mounted on the rotation axis of a planetary carrier (commonly known in the industry as an umbrella carrier) via a standardized interface. The planetary carrier is driven by a servo motor to rotate at a uniform speed. This design, through the combined rotation and revolution of the planetary disk, ensures that the relative positions of different areas on the wafer surface and the deposition source change periodically, effectively eliminating differences in deposition thickness and ultimately achieving uniform control of the film thickness on the wafer surface, meeting the stringent quality requirements of semiconductor devices.

[0025] During the vacuum evaporation process, the planetary disk and planetary carrier must operate under extreme conditions of high temperature and vacuum. Because the threaded holes maintain a high vacuum for extended periods, air is extracted from the threads, causing the bolts to become stuck. This leads to bolt jamming. When replacing the planetary disk for the next evaporation cycle or performing equipment maintenance, operators cannot apply effective torque to the bolts using conventional disassembly tools. Forced disassembly often results in stripped threads or bolt deformation, preventing proper removal and reducing planetary disk replacement efficiency. This increases the operation gap between wafer evaporation operations, ultimately reducing wafer production efficiency.

[0026] In view of this, one embodiment of this application proposes a wafer tray assembly.

[0027] Please see Figures 1 to 3 In one embodiment of this application, the wafer tray assembly can be mounted on a planetary carrier, which includes a planetary disk 1 and a fixing post 2. The planetary disk 1 has multiple first mounting holes 121, and the planetary carrier has second mounting holes (not shown) corresponding to the first mounting holes 121. The fixing post 2 has two opposing threaded holes 21, wherein the central axis of one threaded hole 21 has a predetermined eccentricity relative to the central axis of the other threaded hole 21. The threaded hole 21 includes a threaded section 211, the sidewall of which is surrounded by an internal thread. The fixing post 2 also has a guide hole 22, which is located around the periphery of the threaded hole 21 and communicates with it. Along the extension direction of the threaded hole 21, the depth of the guide hole 22 can be equal to the depth of the threaded section 211. The two threaded holes 21 are respectively bolted to the first mounting holes 121 and the second mounting hole.

[0028] Specifically, please refer to Figures 2 to 4The two threaded holes 21 are arranged with their central axes parallel. The preset eccentricity refers to the center offset between the two threaded holes 21, specifically the vertical distance e between the central axes of the two threaded holes 21. The value of the preset eccentricity and the width of the guide hole 22 can be determined according to the specifications of the bolts to be installed. For example, in one embodiment of this application, the preset eccentricity is 2.3 mm (i.e., the vertical distance between the central axes of the two threaded holes 21 is 2.3 mm), and the width of the guide hole 22 is 1 mm. The head of the bolt that mates with the threaded hole 21 can be provided with anti-slip grooves to improve the bolt's anti-loosening performance and prevent the bolt from loosening due to vibration.

[0029] When removing the planetary disk 1, because the two threaded holes 21 are not coaxial, the first mounting hole 121 and the second mounting hole can limit the movement of the fixing post 2, preventing the bolt from rotating synchronously with the fixing post 2 during bolt removal. Therefore, this solution improves the bolt removal efficiency and prevents the bolt from getting stuck in the fixing post 2. Simultaneously, the guide hole 22 is correspondingly located on the side of the threaded hole 21, allowing the threaded hole 21 to communicate with the outside atmosphere even when the bolt is installed. After the wafer evaporation process is completed and the planetary disk 1 is removed from the vacuum environment, air can promptly fill the gap between the threaded hole 21 and the bolt through the guide hole 22, restoring the pressure in this gap to one atmosphere. This prevents the bolt from being "adsorbed" into the threaded hole 21, causing it to jam, and further prevents the bolt from getting stuck in the fixing post 2.

[0030] Regarding the attraction of the bolt by the threaded hole 21, it should be noted that if the fixed post 2 only has a pair of threaded holes 21 with different axes, and no guide hole 22 is provided around the threaded hole 21 (as shown in the image), the bolt will not be attracted to the bolt. Figure 4 As shown in the fixed post 2), after the bolt and threaded hole 21 form a threaded fit, due to tolerance effects, a gap will inevitably exist between the external thread of the bolt and the internal thread in the threaded hole 21. Multiple such gaps may exist between the external and internal threads. During the vapor deposition process, after the planetary disk 1 enters the vacuum environment, due to the negative pressure in the vacuum environment, the air in the aforementioned gaps is extracted through the tiny gaps between the external and internal threads. Furthermore, during the vapor deposition process, the planetary disk 1 and the planetary carrier are heated, and the external threads expand due to heat, causing the tiny gaps for gas flow to disappear. This results in multiple gaps forming multiple negative pressure cavities, causing the bolt to be attracted into the threaded hole 21, ultimately leading to bolt jamming. Therefore, based on in-depth research into this phenomenon, this embodiment provides a guide hole 22 communicating with the threaded hole 21 on its periphery to eliminate the attraction of the threaded hole 21 to the bolt after the planetary disk 1 is removed from the vacuum environment.

[0031] The technical solution of this embodiment connects the planetary disk 1 and the planetary carrier via a fixing post 2 and bolts. Because the fixing post 2 has a non-coaxial threaded hole 21, it prevents the bolt from rotating synchronously with both ends of the fixing post 2 during bolt removal, thus avoiding the bolt becoming stuck. Simultaneously, by providing a guide hole 22, the inside of the threaded hole 21 communicates with the outside of the planetary disk 1, preventing the threaded hole 21 from exerting an adsorption force on the bolt in a vacuum environment due to gas extraction from the gap between the bolt and the threaded hole 21, thereby preventing the bolt from becoming stuck. Thus, this solution ensures that during disassembly, the bolt and fixing post 2 will not rotate synchronously, preventing the bolt from becoming stuck, and it also eliminates the vacuum adsorption effect of the threaded hole 21 on the bolt, preventing the bolt from getting stuck. The planetary disk 1 and planetary carrier will not experience bolt jamming during separation, which helps reduce the production gap in the wafer evaporation operation and thus improves wafer production efficiency.

[0032] In another embodiment of this application, each threaded hole 21 is provided with at least two guide holes 22 arranged in a ring array around its circumference. During the wafer evaporation process, the planetary disk 1 and the planetary carrier are continuously in a high-temperature vacuum environment. Due to the thermal expansion effect of the threads in the bolt and the threaded hole 21, metal migration and cold welding may occur between the threaded mating surfaces of the two, causing some of the threads in the bolt to stick to the threads in the threaded hole 21, thereby blocking the gap for gas flow. Even after the environment outside the planetary disk 1 is at normal pressure, external air cannot flow into the entire gap between the bolt and the threaded hole 21 through a single guide hole 22. Therefore, negative pressure may still exist inside the threaded hole 21, causing the bolt to jam. In view of this situation, in this embodiment, at least two guide holes 22 are uniformly arranged along the circumference of the threaded hole 21 so that external air can flow into the gap between the bolt and the threaded hole 21 as much as possible, thereby further reducing the probability of the bolt jamming.

[0033] Furthermore, in another embodiment of this application, to address the issue of bolt threads sticking to the threads in the threaded hole 21, the tolerance zone of the internal thread is set to 7H, and the thread angle of the internal thread is 55°. Thus, compared to the standard tolerance zone of 6H, the tolerance of the internal thread in the threaded segment 211 in this embodiment is increased by 0.1mm, providing sufficient space for the expansion of the internal thread and the bolt. Furthermore, setting the thread angle of the internal thread to 55°, compared to the standard 60° thread angle, increases the clearance of the internal thread, thereby providing further expansion space for the internal thread and the bolt. This significantly reduces the probability of bolts sticking to the threaded hole 21 at high temperatures.

[0034] In another embodiment of this application, please refer to Figures 4 to 6The planetary disk 1 includes a disk body 11, a transition ring 12, and positioning pins 13. The top surface of the disk body 11 has multiple receiving grooves 111 and at least two positioning holes 112. The multiple receiving grooves 111 are arranged in a ring array, and the positioning holes 112 are opened between adjacent receiving grooves 111. The transition ring 12 includes a ring body, and at least two bayonets 122 and multiple first mounting holes 121 are opened at intervals along the circumference of the ring body. The number of positioning pins 13 is the same as the number of bayonets 122. One end of the positioning pin 13 is threaded to the positioning hole 112, and the other end of the positioning pin 13 is engaged with the bayonet 122.

[0035] With the increasing demand for wafer production capacity, a planetary disk 1 needs to hold a larger number of wafers. This situation requires the pre-designed holes in the planetary disk 1 for connection with the planetary carrier to be relocated to the receiving slot 111, making it impossible for the planetary disk 1 to be stably connected to the original planetary carrier. Improving the planetary carrier would require significant design and manufacturing costs. Therefore, this embodiment proposes an adapter ring 12 for connection with the planetary carrier. During installation, a locating pin 13 is installed in the locating hole 112, and the locating pin 13 is aligned with the bayonet 122 in the adapter ring 12, so that the top of the locating pin 13 engages with the bayonet 122, thereby connecting the adapter ring 12 to the disk body 11. After the adapter ring 12 is connected to the disk body 11, the first mounting hole 121 is bolted to one of the threaded holes 21 in the fixing post 2, and the other threaded hole 21 in the fixing post 2 is bolted to the second mounting hole in the planetary disk 1. In this way, the planetary disk 1 is mounted on the planetary carrier. In this embodiment, by providing the adapter hole 113, the planetary carrier can be adapted to different disks 11, thereby enabling one type of planetary carrier to be adapted to multiple types of disks 11.

[0036] Furthermore, in another embodiment of this application, please continue to refer to... Figure 4 and Figure 5 The top surface of the disk body 11 is provided with at least two transition holes 113. The positioning holes 112 and the transition holes 113 are arranged in a circular array along the circumference of the disk body 11. The ring body is also provided with connecting holes 123 corresponding to the transition holes 113. The transition holes 113 and the connecting holes 123 are connected by bolts through fixing posts 2. The transition holes 113 and the connecting holes 123 are connected by fixing posts 2 and bolts. In order to ensure the uniformity of force on the disk body 11, the transition holes 113 and the positioning holes 112 are arranged in a circular array on the disk body 11. The distance between the transition holes 113 and the adjacent positioning holes 112 is the same as the arc length between the adjacent transition holes 113. By setting the transition holes 113 and the connecting holes 123 to be connected by bolts through fixing posts 2, the transition ring 12 can be stably connected to the disk body 11, thereby preventing the disk body 11 from detaching from the transition ring 12 during the rotation of the planetary disk 1.

[0037] In another embodiment of this application, please refer to Figure 6 The positioning pin 13 includes a connecting post 131, a snap-fit ​​post 132, and a limiting cap 133 connected in sequence. The bayonet 122 includes a circular hole 1221 and a sliding groove 1222 formed on one side of the circular hole 1221. The connecting post 131 is threadedly connected to the positioning hole 112. The diameter of the circular hole 1221 is smaller than the diameter of the limiting cap 133. The snap-fit ​​post 132 is used to slide into the sliding groove 1222. A threaded blind hole is formed at the bottom of the connecting post 131. The threaded blind hole is eccentrically set so that when the positioning pin 13 is removed, the bolt and the positioning pin 13 can be prevented from rotating synchronously, thus facilitating the removal of the positioning pin 13 from the positioning hole 112. When installing the adapter ring 12, after the limiting cap 133 extends into the round hole 1221, the adapter ring 12 is rotated so that the locking post 132 can slide into the sliding groove 1222. The sliding groove 1222 and the locking post 132 are in transition fit, thereby allowing the positioning pin 13 to engage with the bayonet 122. This design is simple and helps to improve the efficiency of installing and removing the adapter ring 12.

[0038] Please see Figure 4 In another embodiment of the application, a first weight-reducing groove 14 and a second weight-reducing groove 15 are formed on the top surface of the disc 11. A plurality of receiving grooves 111 surround a central area 16. The first weight-reducing groove 14 is formed in the central area 16, and the second weight-reducing groove 15 is formed between adjacent receiving grooves 111. The area of ​​the first weight-reducing groove 14 occupies at least 60% of the area of ​​the central area 16. By setting the first weight-reducing groove 14 and the second weight-reducing groove 15, the overall weight of the disc 11 can be reduced, which is beneficial to reducing the moment of inertia, thereby improving the stability and reliability of the disc 11 during long-term rotation.

[0039] Furthermore, in another embodiment of the application, the projection of the first weight-reducing groove 14 onto the top surface of the disk 11 is a first projection, which is a centrally symmetrical figure. Multiple second weight-reducing grooves 15 are arranged in a circular array along the circumference of the disk 11. The projection of the first weight-reducing groove 14 is a centrally symmetrical figure, and the circumferential second weight-reducing grooves 15 are arranged in a circular array. This symmetry ensures a uniform mass distribution throughout the disk 11, greatly reducing vibration during high-speed rotation, ensuring smooth operation, and extending component life. Both the first weight-reducing groove 14 and the second weight-reducing groove 15 are non-through grooves, preventing excessive weakening of the rigidity of the disk 11 and preventing film material penetration.

[0040] In another embodiment of this application, both the planetary disk 1 and the fixing post 2 are made of stainless steel. After vapor deposition, acid pickling is required to clean the planetary disk 1, and stainless steel has good corrosion resistance, which can improve the service life of the planetary disk 1 and the fixing post 2.

[0041] This utility model also proposes a vapor deposition equipment, which includes a wafer tray assembly. The specific structure of the wafer tray assembly is as described in the above embodiments. Since this vapor deposition equipment adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0042] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A wafer tray assembly, mounted on a planetary carrier, characterized in that, include: The planetary disk has multiple first mounting holes, and the planet carrier has second mounting holes corresponding to the first mounting holes. A fixed post has two opposing threaded holes, wherein the central axis of one threaded hole has a predetermined eccentricity relative to the central axis of the other threaded hole. The threaded hole includes a threaded section, and the sidewall of the threaded section is surrounded by an internal thread. The fixed post also has a guide hole, which is disposed on the periphery of the threaded hole and communicates with the threaded hole. Along the extension direction of the threaded hole, the depth of the guide hole is equal to the depth of the threaded section. The two threaded holes are respectively bolted to the first mounting hole and the second mounting hole.

2. The wafer tray assembly as claimed in claim 1, characterized in that, Each of the aforementioned threaded holes is provided with at least two guide holes arranged in a ring array in the circumferential direction.

3. The wafer tray assembly as described in claim 1, characterized in that, The tolerance zone of the internal thread is 7H, and the thread angle of the internal thread is 55°.

4. The wafer tray assembly as described in any one of claims 1 to 3, characterized in that, The planetary disk includes a disk body, a transition ring, and a positioning pin. The disk body has one or more receiving slots and at least two positioning holes. The multiple receiving slots are arranged in a circular array, and the positioning holes are opened between adjacent receiving slots. The adapter ring includes a ring body, with at least two bayonets and a plurality of first mounting holes spaced apart along the circumference of the ring body. The number of positioning pins is the same as the number of bayonets. One end of the positioning pin is threadedly connected to the positioning hole, and the other end of the positioning pin is engaged with the bayonets.

5. The wafer tray assembly as described in claim 4, characterized in that, The disc body also has at least two adapter holes on one side. The positioning holes and the adapter holes are arranged in a circular array along the circumference of the disc body. The ring body also has connecting holes corresponding to the adapter holes. The adapter holes and the connecting holes are connected by the fixing post bolts.

6. The wafer tray assembly as claimed in claim 4, characterized in that, The positioning pin includes a connecting post, a snap-fit ​​post, and a limiting cap connected in sequence. The snap-fit ​​post includes a circular hole and a groove formed on one side of the circular hole. The connecting post is threaded to the positioning hole. The diameter of the circular hole is smaller than the diameter of the limiting cap. The snap-fit ​​post is used to slide into the groove.

7. The wafer tray assembly as claimed in claim 4, characterized in that, One side of the disc body is provided with a first weight-reducing groove and a second weight-reducing groove, and a plurality of the receiving grooves are arranged to form a central area. The first weight-reducing groove is opened in the central area, and the second weight-reducing groove is opened between adjacent receiving grooves.

8. The wafer tray assembly as claimed in claim 7, characterized in that, The projection of the first weight-reducing groove onto the top surface of the disk is the first projection, which is a centrally symmetrical figure. The plurality of second weight-reducing grooves are distributed in a ring array along the circumference of the disk.

9. The wafer tray assembly as described in any one of claims 1 to 3, characterized in that, Both the planetary disk and the fixed column are made of stainless steel.

10. A vapor deposition apparatus, characterized in that, Includes the wafer tray assembly as described in any one of claims 1 to 9.

Images