A thin film deposition apparatus

Abstract

The utility model discloses a kind of film deposition jigs, it is related to wafer film deposition equipment technical field, including substrate, the upper surface of substrate is equipped with baffle, placement table, arc spring and traction mechanism;Baffle and arc spring are respectively arranged in the opposite sides of placement table;Arc spring is horizontally curved and arranged in the periphery of placement table, and the two ends of arc spring are arc-shaped and extend towards placement table;Traction mechanism is connected with first traction end and second traction end;First traction end is arranged in the first end of arc spring;Second traction end is arranged in the second end of arc spring;Traction mechanism changes the arc size of arc spring by traction first traction end and second traction end.The utility model provides a kind of film deposition jig by changing the arc size of arc spring in horizontal direction to adapt to multiple sizes of wafer, without sinking into groove can be completed fixed, to avoid scratch wafer when using tweezers.

Description

Technical Field

[0001] This utility model relates to the field of wafer thin film deposition equipment technology, and in particular to a thin film deposition fixture. Background Technology

[0002] Thin film deposition equipment is used to deposit one or more thin films on a substrate surface, and is widely used in semiconductors, optoelectronics, flat panel displays, and other fields. Its working principles are mainly divided into physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD). PVD technology vaporizes the material source surface through a physical process and deposits it on the substrate surface using low-pressure gas or plasma. CVD technology deposits a solid film on the substrate surface through a chemical reaction involving gas mixing. Atomic layer deposition (ALD) is a vacuum deposition process that forms a thin film on the substrate surface layer by layer in the form of single atomic layers.

[0003] Chinese utility model patent application No. 202322522300.3 discloses a wafer thin film deposition fixture and wafer thin film deposition equipment. This patent uses a support groove with an opening size varying with depth to accommodate wafers of different sizes. However, since the wafer is placed inside the groove, tweezers are required for both insertion and removal. In practice, the tip of the tweezers typically needs to be tilted and inserted into the gap between the wafer and the inner wall of the support groove, then one side of the wafer is lifted and gripped for removal. However, the tweezers are highly susceptible to scratching the deposited thin film on the wafer surface during this tilting process, leading to a decrease in yield. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a thin film deposition fixture that can adapt to wafers of various sizes by changing the curvature of the arc-shaped spring in the horizontal direction, and can fix the wafer without sinking it into the groove, thereby avoiding scratching the wafer when using tweezers.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: This utility model provides a thin film deposition fixture, including a substrate, a baffle, a placement stage, an arc-shaped spring, and a traction mechanism mounted on the upper surface of the substrate; the baffle and the arc-shaped spring are respectively disposed on opposite sides of the placement stage; the arc-shaped spring is horizontally bent and arranged around the periphery of the placement stage, with both ends of the arc-shaped spring extending toward the placement stage in an arc shape; the traction mechanism is connected to a first traction end and a second traction end; the first traction end is disposed at the first end of the arc-shaped spring; the second traction end is disposed at the second end of the arc-shaped spring; the traction mechanism changes the arc size of the arc-shaped spring by traction of the first traction end and the second traction end.

[0006] The thin film deposition fixture provided by this utility model preferably includes a traction mechanism comprising a traction column, a first traction belt, and a second traction belt. In the height direction, the center of the traction column, the center point of the arc-shaped spring, and the center point of the placement stage are located on the same straight line. Along the straight line, a plurality of fixing holes are also provided on the upper surface of the substrate. The plurality of fixing holes are all located on the outer arc side of the arc-shaped spring. The traction column is inserted into one of the plurality of fixing holes. One end of the first traction belt is connected to the peripheral side of the traction column, and the other end is connected to the first traction end. One end of the second traction belt is connected to the peripheral side of the traction column, and the other end is connected to the second traction end.

[0007] The thin film deposition fixture provided by this utility model preferably has a limiting groove formed on the upper surface of the substrate, which fits against the inner wall edge of the fixing hole; a limiting block is provided on the peripheral side of the traction column; when the traction column is inserted into the fixing hole, the limiting block is embedded in the limiting groove.

[0008] The thin film deposition fixture provided by this utility model preferably has a support column in the middle of the arc-shaped spring sheet, and the arc-shaped spring sheet is mounted on the upper surface of the substrate through the support column.

[0009] The thin film deposition fixture provided by this utility model preferably has a baffle with a plate-like structure; an elastic layer is provided on the side of the baffle facing the placement stage.

[0010] The above technical solution has the following advantages or beneficial effects: This utility model provides a thin film deposition fixture, relating to the field of wafer thin film deposition equipment technology. It includes a substrate, a baffle, a placement stage, an arc-shaped spring, and a traction mechanism mounted on the upper surface of the substrate. The baffle and the arc-shaped spring are respectively disposed on opposite sides of the placement stage. The arc-shaped spring is horizontally bent and arranged around the periphery of the placement stage, with both ends extending arc-shaped towards the placement stage. The traction mechanism is connected to a first traction end and a second traction end. The first traction end is disposed at the first end of the arc-shaped spring; the second traction end is disposed at the second end of the arc-shaped spring. The traction mechanism changes the curvature of the arc-shaped spring by traction of the first and second traction ends. This utility model provides a thin film deposition fixture that adapts to wafers of various sizes by changing the curvature of the arc-shaped spring in the horizontal direction, achieving fixation without sinking the wafer into the groove, thus avoiding scratching the wafer when using tweezers. Attached Figure Description

[0011] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0012] Figure 1 This is a front view of a thin film deposition fixture provided in Embodiment 1 of this utility model; Figure 1Includes: 1. base plate; 11. fixing hole; 12. limiting groove; 2. baffle; 3. placement platform; 4. arc-shaped spring sheet; 41. first traction end; 42. second traction end; 43. support column; 5. traction column; 51. first traction belt; 52. second traction belt; 53. limiting block. Detailed Implementation

[0013] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0014] Example 1: Existing fixtures employ a recessed groove structure to hold the wafer in place, and by varying the groove width with depth, wafers of different sizes can be fitted into grooves of different depths, allowing a single fixture to accommodate multiple wafer sizes. However, during wafer handling, tweezers are required to be tilted and inserted into the gap between the wafer and the inner wall of the groove to pry the wafer up and remove it. This process is highly susceptible to damaging the coating deposited on the wafer surface with the sharp tips of the tweezers.

[0015] like Figure 1 As shown: To enable the fixture to accommodate wafers of various sizes without requiring the wafers to be placed in a slot, this utility model provides a thin film deposition fixture, including a substrate 1, a baffle 2, a placement stage 3, an arc-shaped spring 4, and a traction mechanism mounted on the upper surface of the substrate 1; the baffle 2 and the arc-shaped spring 4 are respectively disposed on opposite sides of the placement stage 3; the arc-shaped spring 4 is horizontally curved and arranged around the periphery of the placement stage 3, with both ends of the arc-shaped spring 4 extending arc-shaped toward the placement stage 3; the traction mechanism is connected to a first traction end 41 and a second traction end 42; the first traction end 41 is disposed at the first end of the arc-shaped spring 4; the second traction end 42 is disposed at the second end of the arc-shaped spring 4; the traction mechanism changes the arc size of the arc-shaped spring 4 by traction of the first traction end 41 and the second traction end 42.

[0016] When using the thin film deposition fixture provided by this invention, the wafer is first placed on the placement stage 3, with the side of the wafer closest to the baffle 2 firmly against the baffle 2, and the other side of the wafer facing the arc-shaped spring 4. Then, the curvature of the arc-shaped spring 4 is adjusted using a traction mechanism to fit the wafer. If the curvature of the adjusted arc-shaped spring 4 matches the wafer, the arc-shaped spring 4 will completely adhere to the side of the wafer. If it does not match completely, both ends of the arc-shaped spring 4 can still adhere to the wafer, and the baffle 2 can still fix the wafer in place. Furthermore, when the arc-shaped spring 4 is not under traction, it should be at its minimum curvature. Through the traction action of the traction mechanism, both ends of the arc-shaped spring 4 continuously expand, and its curvature continuously increases until it matches the wafer size.

[0017] This invention provides a thin-film deposition fixture that uses a deformable, expandable arc-shaped spring 4 and a baffle 2 to act on the sidewalls of the wafer, thereby fixing the wafer. Since it eliminates the need to submerge the wafer in the groove, placement and removal are more convenient, and it avoids scratching the wafer with clamping tools such as tweezers.

[0018] As a specific implementation of the traction mechanism, in a preferred embodiment, the traction mechanism includes a traction column 5, a first traction belt 51, and a second traction belt 52. In the height direction, the center of the traction column 5, the center point of the arc-shaped spring 4, and the center point of the placement platform 3 are located on the same straight line. Along the straight line, a plurality of fixing holes 11 are also provided on the upper surface of the substrate 1. The plurality of fixing holes 11 are all provided on the outer arc side of the arc-shaped spring 4. The traction column 5 is inserted into one of the plurality of fixing holes 11. One end of the first traction belt 51 is connected to the peripheral side of the traction column 5, and the other end is connected to the first traction end 41. One end of the second traction belt 52 is connected to the peripheral side of the traction column 5, and the other end is connected to the second traction end 42.

[0019] One end of the first traction belt 51 and one end of the second traction belt 52 are fixedly connected to the traction post 5, and the other ends of both are respectively connected to the first traction end 41 and the second traction end 42 at both ends of the arc-shaped spring piece 4. In use, the arc-shaped spring piece 4 is pulled open by the traction post 5 so that its curvature matches the outer dimensions of the wafer. Then, the traction post 5 is inserted into the corresponding fixing hole 11 to fix it. It should be noted that the thin film deposition fixture provided by this invention is designed to adapt to several types of wafers with a fixed shape and quantity. Therefore, it is necessary to calculate the corresponding curvature value of the arc-shaped spring piece 4 for adapting to different wafers and set the setting position of each fixing hole 11. It cannot adapt to wafers of arbitrary sizes.

[0020] Normally, the two traction bands should be mirror-connected to the traction post 5. If there is a deviation in the size of the traction post 5 inserted into the fixing hole 11, the two traction bands will not be able to symmetrically pull the two ends of the arc-shaped spring piece 4, resulting in the arc of the arc-shaped spring piece 4 not corresponding to the wafer size. To avoid the above situation, in a preferred embodiment, a limiting groove 12 is formed on the upper surface of the substrate 1, and the limiting groove 12 fits against the inner wall edge of the fixing hole 11; a limiting block 53 is provided on the peripheral side of the traction post 5; when the traction post 5 is inserted into the fixing hole 11, the limiting block 53 is embedded in the limiting groove 12. After setting the limiting groove 12, the traction post 5 can be inserted into the fixing hole 11 according to the limiting angle, which can ensure that after the traction post 5 is fixed, the two traction bands symmetrically pull the arc-shaped spring piece 4.

[0021] As a specific connection scheme between the arc-shaped spring 4 and the substrate 1, in a preferred embodiment, a support post 43 is provided in the middle of the arc-shaped spring 4, and the arc-shaped spring 4 is mounted on the upper surface of the substrate 1 through the support post 43.

[0022] In a preferred embodiment, the baffle 2 has a plate-like structure; an elastic layer is provided on the side of the baffle 2 facing the placement stage 3. The placement stage 3 is placed directly on the upper surface of the substrate 1, and its position is adjusted according to the engagement distance between the baffle 2 and the arc-shaped spring piece 4. When the two ends of the arc-shaped spring piece 4 clamp the wafer, a pushing force is applied to the wafer in the direction of the baffle 2, causing the wafer to press firmly against the baffle 2, thereby fixing the wafer. The elastic layer of the baffle 2 corresponds to the wafer, which can prevent damage from impact when the wafer is clamped. At the same time, the elastic layer can deform under the clamping force, making the wafer more stable.

[0023] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application filed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not claimed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

[0024] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A thin film deposition fixture, characterized in that, The system includes a substrate, a baffle, a placement platform, an arc-shaped spring sheet, and a traction mechanism mounted on the upper surface of the substrate; the baffle and the arc-shaped spring sheet are respectively disposed on opposite sides of the placement platform; the arc-shaped spring sheet is horizontally curved and arranged around the periphery of the placement platform, with both ends of the arc-shaped spring sheet extending toward the placement platform in an arc shape; The traction mechanism is connected to a first traction end and a second traction end; the first traction end is disposed at the first end of the arc-shaped spring piece; the second traction end is disposed at the second end of the arc-shaped spring piece; the traction mechanism changes the arc size of the arc-shaped spring piece by traction of the first traction end and the second traction end.

2. The thin film deposition fixture according to claim 1, characterized in that, The traction mechanism includes a traction column, a first traction belt, and a second traction belt. In the height direction, the center of the traction column, the center point of the arc-shaped spring piece, and the center point of the placement platform are located on the same straight line. Along the straight line, a plurality of fixing holes are also provided on the upper surface of the substrate. The plurality of fixing holes are all located on the outer arc side of the arc-shaped spring piece. The traction column is inserted into one of the plurality of fixing holes. One end of the first traction belt is connected to the peripheral side of the traction column, and the other end is connected to the first traction end. One end of the second traction belt is connected to the peripheral side of the traction column, and the other end is connected to the second traction end.

3. The thin film deposition fixture according to claim 2, characterized in that, A limiting groove is formed on the upper surface of the substrate, and the limiting groove fits against the inner wall edge of the fixing hole; a limiting block is provided on the peripheral side of the traction column; when the traction column is inserted into the fixing hole, the limiting block is embedded in the limiting groove.

4. The thin film deposition fixture according to claim 1, characterized in that, A support column is provided in the middle of the arc-shaped spring piece, and the arc-shaped spring piece is mounted on the upper surface of the substrate through the support column.

5. The thin film deposition fixture according to claim 1, characterized in that, The baffle is a plate-shaped structure; an elastic layer is provided on the side of the baffle facing the placement platform.

Images