A vacuum chamber door applied to a semiconductor sputtering platform
Patent Information
- Application Number
- CN202522117231.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-10-23
- Estimated Expiration
- 2035-09-30
AI Technical Summary
[0007]本实用新型的目的在于提供一种应用于半导体溅射台的真空腔门，通过设置通孔、第一透明板以及第二透明板，便于在设备外侧，通过第一透明板与第二透明板和通孔观察真空腔体内各加工单元内半导体的加工状态，省去了打开真空腔门查看加工进度和是否存在问题所耗费的时间和精力；门本体的第一面、第二面分别密封连接第一透明板、第二透明板，且使第一透明板同时覆盖多个通孔，减少门本体与第一透明板间的连接面积，保证设置有通孔的真空腔门与一体成型的真空腔门具有同等的密封效果；门本体上设置多个通孔，每一通孔分别与真空腔体内一加工单元相对，便于观察每一加工单元的工作情况及可从各个角度观察真空腔体内工作情况，且多个通孔的中部及相邻通孔间保留有支撑部，保证门本体的强度；这样可以解决现有半导体溅射台真空腔门存在的密封性能不佳、操作效率低、观察效果差、使用寿命短等问题，解决了现有的问题
1、本实用新型通过在门本体上设置多个通孔，使每一通孔分别与真空腔体内第一加工单元相对，利用第一透明板与第二透明板覆盖通孔，从而在设备外侧可通过第一透明板与第二透明板和通孔观察真空腔体内各加工单元内半导体的加工状态，省去了打开真空腔门查看加工进度和是否存在问题所耗费的时间和精力。
Smart Images
Figure CN224884163U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a vacuum cavity door for use in semiconductor sputtering stations. Background Technology
[0002] A semiconductor sputtering stage is a key piece of equipment used in semiconductor manufacturing and materials science. It is mainly used to deposit thin film materials on substrates (such as silicon wafers, glass sheets, etc.) using sputtering technology. In the semiconductor sputtering process, the vacuum chamber door is a key component for maintaining the vacuum environment of the sputtering stage, and its performance has a direct impact on the stability of the sputtering process and the quality of the products.
[0003] In terms of sealing performance, commonly used single-seal structures are prone to wear and tear on the seals due to frequent opening and closing over a long period, resulting in reduced sealing performance of the vacuum chamber and making it difficult to maintain a stable high vacuum environment. This not only adversely affects the sputtering process but also requires frequent replacement of seals, increasing production costs and extending equipment downtime, thus reducing production efficiency.
[0004] In terms of ease of operation, traditional vacuum chamber doors mostly use manual drive or complex mechanical drive methods, which makes the opening and closing process of the chamber door time-consuming and lacks ease of operation, making it difficult to meet the requirements of efficient production in semiconductor manufacturing.
[0005] Regarding ease of observation, the existing vacuum chamber door's observation window design has some shortcomings. Some observation windows have poor light transmittance, making it impossible to clearly and in real-time observe the sputtering process inside the chamber; while other observation windows have good light transmittance, their strength is insufficient, making them easily damaged in a vacuum environment and prone to accumulating dirt, affecting the observation results and requiring frequent cleaning.
[0006] From the perspective of service life, because the vacuum chamber door is in a long-term environment of alternating high and low pressure, temperature changes and possible corrosive gas, the door body and its components are prone to corrosion and wear, resulting in a short overall service life and increased maintenance and replacement costs. Utility Model Content
[0007] The purpose of this invention is to provide a vacuum chamber door for a semiconductor sputtering stage. By incorporating through holes, a first transparent plate, and a second transparent plate, it facilitates observation of the semiconductor processing status within each processing unit of the vacuum chamber from the outside of the equipment, eliminating the time and effort required to open the vacuum chamber door to check the processing progress and for any problems. The first and second sides of the door body are respectively sealed to the first and second transparent plates, and the first transparent plate simultaneously covers multiple through holes, reducing the connection area between the door body and the first transparent plate. This ensures that the vacuum chamber door with through holes has the same sealing effect as a one-piece vacuum chamber door. The door body has multiple through holes, each corresponding to a processing unit within the vacuum chamber, facilitating observation of the operation of each processing unit and allowing observation of the operation within the vacuum chamber from various angles. Support portions are retained in the middle of the multiple through holes and between adjacent through holes to ensure the strength of the door body. This solves the problems of poor sealing performance, low operating efficiency, poor observation effect, and short service life of existing semiconductor sputtering stage vacuum chamber doors, thus resolving these issues.
[0008] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model is a vacuum chamber door for a semiconductor sputtering stage, including a door body, which is divided into a first side and a second side. A connecting frame is provided at the top of both the first side and the second side. A main body is provided inside the connecting frame. An arc plate is provided on the outer wall of the main body. A through hole is provided inside the main body. A first transparent plate is installed inside the first side and a second transparent plate is installed inside the second side. By adopting the above technical solution—with through holes located inside the main body and arranged in a linear array, each through hole corresponds to a first processing unit within the vacuum chamber—and using a first and second transparent plate to cover the through holes, the processing status of the semiconductors within each processing unit inside the vacuum chamber can be observed from the outside of the equipment through the first transparent plate and the through holes. This eliminates the time and effort required to open the vacuum chamber door to check the processing progress and for any problems.
[0009] Preferably, the main body has a groove inside, the groove is located around the through hole, and a sealing ring is installed inside the groove.
[0010] Preferably, a first connecting part is provided inside the connecting frame, the first connecting part is disposed between two through holes, and a second connecting part is provided outside the second transparent plate; By adopting the above technical solution: by sealing and connecting the first transparent plate and the second transparent plate on the first and second sides of the door body respectively, and by having the first transparent plate cover multiple through holes simultaneously, the connection area between the door body and the first transparent plate is reduced, ensuring that the vacuum chamber door with through holes has the same sealing effect as the integrally formed vacuum chamber door. The door body includes a connecting frame, a main body, and an arc plate that matches the inner wall of the vacuum chamber opening, further ensuring the sealing performance of the entire vacuum chamber when closed. The first transparent plate and the second transparent plate are made of acrylic sheets, which are easy to clean and maintain, and have good light transmittance, making them convenient for observation.
[0011] Preferably, screws are installed inside the second transparent panel, and the second transparent panel is connected to the door body by the screws.
[0012] Preferably, both the first transparent plate and the second transparent plate are annular in shape, and both are made of acrylic sheet.
[0013] Preferably, a drive device is installed on the outside of the door body. The drive device includes a cylinder and a shaft. The cylinder is installed on the outside of the door body, and the shaft is located at the center of the door body and is connected to the cylinder.
[0014] This utility model has the following beneficial effects: 1. This utility model provides multiple through holes on the door body, with each through hole corresponding to a first processing unit inside the vacuum chamber. The through holes are covered by a first transparent plate and a second transparent plate, allowing the processing status of semiconductors in each processing unit inside the vacuum chamber to be observed from the outside of the equipment through the first transparent plate, the second transparent plate, and the through holes. This eliminates the time and effort required to open the vacuum chamber door to check the processing progress and for any problems.
[0015] 2. This utility model reduces the connection area between the door body and the first transparent plate by sealing and connecting the first transparent plate and the second transparent plate on the first and second sides of the door body respectively, and by making the first transparent plate cover multiple through holes at the same time, thus ensuring that the vacuum cavity door with through holes has the same sealing effect as the one-piece molded vacuum cavity door.
[0016] 3. The door body of this utility model has multiple through holes arranged in a ring. Each through hole is opposite to a processing unit in the vacuum chamber, which makes it easy to observe the working status of each processing unit and to observe the working status in the vacuum chamber from various angles. In addition, the middle of the multiple through holes and the spaces between adjacent through holes are reserved with support parts to ensure the strength of the door body.
[0017] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a front structural diagram of the present invention.
[0020] The attached diagram lists the components represented by each number as follows: 1. Door body; 11. First side; 12. Second side; 13. Connecting frame; 14. Main body; 15. Arc plate; 2. Through hole; 3. Drive device; 31. Cylinder; 32. Shaft; 4. First transparent plate; 5. Second transparent plate; 6. Groove; 7. Sealing ring; 8. First connecting part; 9. Second connecting part; 10. Screw. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figure 1-2 This invention relates to a vacuum chamber door for a semiconductor sputtering stage, comprising a door body 1, which is divided into a first surface 11 and a second surface 12. Both the first surface 11 and the second surface 12 have a connecting frame 13 at their top. A main body 14 is housed inside the connecting frame 13, and an arc plate 15 is provided on the outer wall of the main body 14. Through holes 2 are provided inside the main body 14. A first transparent plate 4 is installed inside the first surface 11, and a second transparent plate 5 is installed inside the second surface 12. The through holes 2 are located inside the main body 14 and are arranged in a linear array, so that each through hole 2 corresponds to a processing unit within the vacuum chamber. The through holes 2 are covered by the first transparent plate 4 and the second transparent plate 5, allowing observation of the semiconductor processing status within each processing unit inside the vacuum chamber from the outside of the equipment through the first transparent plate 4 and the through holes 2. This eliminates the time and effort required to open the vacuum chamber door to check the processing progress and for any problems.
[0023] The main body 14 has a groove 6 inside, which is located around the through hole 2, and a sealing ring 7 is installed inside the groove 6.
[0024] The connecting frame 13 has a first connecting part 8 inside, which is located between two through holes 2. The second transparent plate 5 has a second connecting part 9 outside. By sealing the first transparent plate 4 and the second transparent plate 5 on the first surface 11 and the second surface 12 of the door body 1 respectively, and making the first transparent plate 4 cover multiple through holes 2 at the same time, the connection area between the door body 1 and the first transparent plate 4 is reduced, ensuring that the vacuum chamber door with through holes 2 has the same sealing effect as the integrally formed vacuum chamber door. The door body 1 includes the connecting frame 13, the main body 14 and the arc plate 15 that cooperates with the inner wall of the vacuum chamber opening, further ensuring the sealing performance of the entire vacuum chamber when closed. The first transparent plate 4 and the second transparent plate 5 are made of acrylic sheets, which are easy to clean and maintain, and have good light transmittance, making them easy to observe.
[0025] The second transparent panel 5 has screws 10 installed inside it, and the second transparent panel 5 is connected to the door body 1 by the screws 10.
[0026] Both the first transparent plate 4 and the second transparent plate 5 are circular in shape, and both are made of acrylic sheets.
[0027] A drive device 3 is installed on the outside of the door body 1. The drive device 3 includes a cylinder 31 and a shaft 32. The cylinder 31 is installed on the outside of the door body 1, and the shaft 32 is located at the center of the door body 1. The shaft 32 is connected to the cylinder 31.
[0028] A specific application of this embodiment is as follows: By setting multiple through holes 2 on the door body 1, each through hole 2 is opposite to a first processing unit inside the vacuum chamber. The through holes 2 are covered by a first transparent plate 4 and a second transparent plate 5. Thus, the processing status of semiconductors in each processing unit inside the vacuum chamber can be observed from the outside of the equipment through the first transparent plate 4, the second transparent plate 5 and the through holes 2, saving the time and effort spent opening the vacuum chamber door to check the processing progress and whether there are any problems. By sealing the first transparent plate 4 and the second transparent plate 5 on the first surface 11 and the second surface 12 of the door body 1 respectively, and making the first transparent plate 4 cover multiple through holes 2 at the same time, the connection area between the door body 1 and the first transparent plate 4 is reduced, ensuring that the vacuum chamber door with through holes 2 has the same sealing effect as the integrally formed vacuum chamber door. Moreover, the door body 1 is provided with multiple through holes 2, each through hole 2 is opposite to a processing unit inside the vacuum chamber, which facilitates the observation of the working status of each processing unit and allows the observation of the working status inside the vacuum chamber from various angles. In addition, the middle part of the multiple through holes 2 and the space between adjacent through holes 2 are reserved to ensure the strength of the door body 1.
[0029] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0030] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A vacuum cavity door for use in a semiconductor sputtering stage, comprising a door body (1), characterized in that: The door body (1) is divided into a first side (11) and a second side (12). A connecting frame (13) is provided on the top of both the first side (11) and the second side (12). A main body (14) is provided inside the connecting frame (13). An arc plate (15) is provided on the outer wall of the main body (14). A through hole (2) is provided inside the main body (14). A first transparent plate (4) is installed inside the first side (11), and a second transparent plate (5) is installed inside the second side (12).
2. The vacuum chamber door for a semiconductor sputtering stage according to claim 1, characterized in that, The main body (14) has a groove (6) inside, the groove (6) is located around the through hole (2), and a sealing ring (7) is installed inside the groove (6).
3. The vacuum chamber door for a semiconductor sputtering stage according to claim 1, characterized in that, The connecting frame (13) has a first connecting part (8) inside, which is located between two through holes (2), and the second transparent plate (5) has a second connecting part (9) outside.
4. A vacuum chamber door for a semiconductor sputtering stage according to claim 1, characterized in that, The second transparent panel (5) is fitted with screws (10), and the second transparent panel (5) is connected to the door body (1) by screws (10).
5. A vacuum cavity door for a semiconductor sputtering stage according to claim 1, characterized in that, The first transparent plate (4) and the second transparent plate (5) are both circular in shape, and the first transparent plate (4) and the second transparent plate (5) are both made of acrylic sheet.
6. A vacuum cavity door for a semiconductor sputtering stage according to claim 1, characterized in that, A drive device (3) is installed on the outside of the door body (1). The drive device (3) includes a cylinder (31) and a shaft (32). The cylinder (31) is installed on the outside of the door body (1), and the shaft (32) is located at the center of the door body (1). The shaft (32) is connected to the cylinder (31).