Special gas feedthrough device and semiconductor apparatus

Abstract

A special gas feedthrough device and a semiconductor device, the special gas feedthrough device comprising: a lower feedthrough body, the top of the lower feedthrough body having a first assembly hole; an upper feedthrough body located on the lower feedthrough body, the upper feedthrough body being provided with a through second assembly hole, the second assembly hole being oppositely arranged with the first assembly hole; a connecting component arranged in the second assembly hole and the first assembly hole, used for tightly connecting the lower feedthrough body and the upper feedthrough body; a detector arranged on the upper feedthrough body, when the detector detects that the connecting component is in an unconnected position, the special gas feedthrough device prevents starting a process processing program, which is beneficial to guarantee the stability of the process environment; after the process processing is completed, when the detector detects that the connecting component is still in the connected position, the opening of the cavity cover plate is prohibited, so as to avoid forcibly separating the upper feedthrough body and the lower feedthrough body and causing damage to the semiconductor device, thereby improving the safety and reliability of the semiconductor device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and more particularly to a special gas feedthrough device and semiconductor equipment. Background Technology

[0002] In semiconductor device manufacturing processes, thin film deposition technology is a fundamental step in constructing device structures. By introducing specific process gases, or specialty gases, chemical or physical reactions occur on the substrate surface to form a thin film layer with specific electrical or physical properties. Therefore, precise control of the purity, flow rate, and delivery process of these specialty gases is a decisive factor in ensuring thin film quality and the final device performance.

[0003] To ensure a stable delivery of specialty gases from the gasbox to the process chamber, a specialty gas feedthrough device is typically required. This device serves as a connecting channel, designed to maintain a vacuum environment within the process chamber and prevent external gas intrusion or internal specialty gas leakage. A typical feedthrough device consists of two parts, upper and lower, secured with screws or other fasteners, and uses an O-ring to create a vacuum seal at the interface between the two parts.

[0004] However, there are areas where feedthrough devices need improvement in practical applications. Utility Model Content

[0005] The problem solved by this utility model embodiment is to provide a special gas feedthrough device and semiconductor equipment to improve the safety and reliability of semiconductor equipment.

[0006] To address the aforementioned problems, this utility model provides a special gas feedthrough device for installation on a cavity cover plate. The device includes: a lower feedthrough body with a first mounting hole at its top; an upper feedthrough body located on the lower feedthrough body, having a through second mounting hole opposite to the first mounting hole; a connecting component disposed in the second and first mounting holes for fastening the lower and upper feedthrough bodies together; and a detector disposed on the upper feedthrough body for detecting whether the connecting component is in a connected position.

[0007] Optionally, the feedthrough body is provided with a sensing channel penetrating the opposite sidewall of the feedthrough body, and the sensing channel is connected to the second mounting hole; the detector includes a transmitter and a receiver, and the transmitter and receiver are respectively disposed at both ends of the sensing channel; the special gas feedthrough device further includes: a control system, electrically connected to the detector, for receiving the signal output by the detector; when the connecting component is in the connecting position, the connecting component blocks the signal between the transmitter and the receiver; when the connecting component is disengaged from the connecting position, the signal between the transmitter and the receiver is connected.

[0008] Optionally, the special gas feeder device further includes: an elastic connection mechanism for movably mounting the upper feeder body on the cavity cover plate.

[0009] Optionally, the upper feedthrough body is provided with a stepped hole, and the elastic connection mechanism is disposed in the stepped hole. The elastic connection mechanism includes: a stepped screw, which passes through the stepped hole and is fixedly disposed in the cavity cover plate; and a spring, which is disposed between the head of the stepped screw and the stepped surface of the stepped hole.

[0010] Optionally, the upper feeder body includes a through upper air passage, and the lower feeder body includes a through lower air passage, wherein the upper air passage and the lower air passage are connected to form an air supply channel; the special gas feeder device further includes: an inner sealing element disposed between the upper feeder body and the lower feeder body, and the inner sealing element surrounds the air supply channel; and an outer sealing element disposed between the upper feeder body and the lower feeder body, and the outer sealing element surrounds the inner sealing element.

[0011] Optionally, there are multiple gas delivery channels, and correspondingly, there are multiple inner sealing elements, with the outer sealing element surrounding the multiple inner sealing elements.

[0012] Optionally, the special gas feeding device includes: an intermediate region located between the inner sealing element and the outer sealing element; and an extraction channel communicating with the intermediate region for extracting gas from the intermediate region.

[0013] Optionally, the special gas feeder includes: a processing pipeline connected to the extraction channel; a vacuum pump installed on the processing pipeline; and a scrubbing tower connected to the processing pipeline and located downstream of the vacuum pump; or, the special gas feeder includes: a processing pipeline connected to the extraction channel; a vacuum pump installed on the processing pipeline; and a collector connected to the processing pipeline.

[0014] Optionally, the special gas feeder device further includes: a heating element disposed in the upper feeder body and the lower feeder body for heating the gas supply channel; a temperature sensor disposed in both the upper feeder body and the lower feeder body; and a control system connected to the heating element and the temperature sensor, wherein the control system is used to adjust the heating power of the heating element according to the temperature of the upper feeder body and the lower feeder body detected by the temperature sensor.

[0015] This utility model embodiment also provides a semiconductor device, including: a cavity, including a reaction chamber; a cavity cover plate disposed on the top of the cavity, the cavity cover plate having a chamber opening; and a special gas feeding device disposed on the cavity cover plate, the bottom of the special gas feeding device extending into the reaction chamber.

[0016] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages: The special gas feedthrough device provided in this embodiment includes: a lower feedthrough body with a first mounting hole at its top; an upper feedthrough body located on the lower feedthrough body, with a through second mounting hole disposed opposite to the first mounting hole; a connecting component disposed in the second and first mounting holes for fastening the lower and upper feedthrough bodies together; and a detector disposed on the upper feedthrough body for detecting whether the connecting component is in a connected position. Before processing, the special gas feedthrough device of this embodiment prevents the start of the processing procedure when the detector detects that the connecting component is not connected, thus avoiding process accidents caused by forgetting to install the connecting component. After processing, when the detector detects that the connecting component is still connected, the cavity cover is prohibited from being opened, preventing forced separation of the upper and lower feedthrough bodies and potential damage to the semiconductor equipment, thereby improving the safety and reliability of the semiconductor equipment. Attached Figure Description

[0017] Figure 1 and Figure 2 This is an isometric structural schematic diagram of the special air supply device according to an embodiment of this utility model; Figure 3 This is a schematic diagram of the structure of the feedthrough body in an embodiment of this utility model; Figure 4 This is a top view of the feedthrough body in an embodiment of the present invention; Figure 5 yes Figure 4 Schematic diagram of the cross-sectional structure at the middle EE; Figure 6 This is a schematic diagram of the feedthrough body in an embodiment of the present invention; Figure 7 This is a top view schematic diagram of the special air supply device according to an embodiment of this utility model; Figure 8 yes Figure 7 A schematic diagram of the cross-sectional structure at the FF point; Figure 9 yes Figure 7 Schematic diagram of the cross-sectional structure at point DD; Figure 10 yes Figure 7 Schematic diagram of the cross-sectional structure at point CC; Figure 11 yes Figure 7 Schematic diagram of the cross-sectional structure at point BB; Figure 12 yes Figure 7 A schematic diagram of the cross-sectional structure at point HH; Figure 13 This is a functional block diagram of the control system and detector according to an embodiment of the present invention; Figure 14 This is a functional block diagram of the control system, temperature sensor, and heating unit according to an embodiment of the present invention; Figure 15 This is an exploded structural diagram of the cavity, cavity cover plate, and special gas feed device in the semiconductor structure of this utility model embodiment; Figure 16 This is a schematic diagram of the assembly structure of the cavity, cavity cover plate and special gas feed device in the semiconductor structure of this utility model embodiment. Detailed Implementation

[0018] As the background technology shows, the feedthrough device using screw locking and sealing rings requires improvement in practical applications. First, due to tolerances in the machining or installation of the upper and lower parts of the feedthrough device, these tolerances can accumulate and cause physical interference between the two structural parts when the process cavity is closed. This interference hinders the complete closure of the cavity, thus compromising the necessary vacuum sealing conditions. Second, the O-ring, as a core sealing element, directly affects system safety and process stability. If the O-ring fails due to aging, damage, or improper installation, it can cause leakage of special gases from the cavity to the external environment, leading to safety accidents. Furthermore, oxygen from the external environment may leak back into the high-vacuum process cavity through the failed seal, contaminating the process environment and directly causing a decline in film quality or process failure. In addition, the locking state of this feedthrough device lacks an effective feedback mechanism. When the cavity is opened for maintenance, if the operator does not loosen the locking screws first, the movement of the cavity lifting mechanism will apply excessive tensile force to the feedthrough device, easily causing structural damage. Conversely, if the operator forgets to tighten the locking screw after the cavity is closed, an effective vacuum seal cannot be formed, resulting in vacuum leakage. The system cannot detect such human negligence.

[0019] To address the aforementioned technical problem, the special gas feedthrough device provided in this embodiment of the invention includes: a lower feedthrough body with a first mounting hole at its top; an upper feedthrough body located on the lower feedthrough body, with a through second mounting hole disposed opposite to the first mounting hole; a connecting component disposed in the second and first mounting holes for fastening the lower and upper feedthrough bodies together; and a detector disposed on the upper feedthrough body for detecting whether the connecting component is in a connected position. Before processing, the special gas feedthrough device of this embodiment prevents the start of the processing procedure when the detector detects that the connecting component is in an unconnected position, thus avoiding process accidents caused by forgetting to install the connecting component. After processing, when the detector detects that the connecting component is still in a connected position, the cavity cover is prohibited from being opened, preventing forced separation of the upper and lower feedthrough bodies and potential damage to the semiconductor equipment, thereby improving the safety and reliability of the semiconductor equipment.

[0020] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] refer to Figure 1 and Figure 2 This utility model embodiment provides a special gas feeder device 100, which is disposed on the cavity cover plate 10. The special gas feeder device 100 includes: a lower feeder body 101, the top of which has a first mounting hole 1011 (e.g., ...). Figure 6 (As shown); the upper feedthrough body 102 is located on the lower feedthrough body 101, and the upper feedthrough body 102 is provided with a through second assembly hole 1021 (as shown). Figure 1 As shown), the second mounting hole 1021 is disposed opposite to the first mounting hole 1011; the connecting component 103 (as shown) Figure 11 As shown, the lower feedthrough body 101 and the upper feedthrough body 102 are fastened together in the second assembly hole 1021 and the first assembly hole 1011; the detector 104 is disposed on the upper feedthrough body 102 and is used to detect whether the connecting component 103 is in the connection position.

[0022] The special gas feeder device 100 provided in this embodiment of the utility model includes: a lower feeder body 101, the top of which has a first mounting hole 1011; an upper feeder body 102, located on the lower feeder body 101, the upper feeder body 102 having a through second mounting hole 1021, the second mounting hole 1021 being opposite to the first mounting hole 1011; a connecting component 103, disposed in the second mounting hole 1021 and the first mounting hole 1011, for fastening the lower feeder body 101 and the upper feeder body 102 together; and a detector 104, disposed on the upper feeder body 102, for detecting whether the connecting component 103 connects the upper feeder body 102 and the lower feeder body 101. Before the process is prepared, the special gas feedthrough device 100 of this application embodiment prevents the start of the process process when the detector 104 detects that the connecting part 103 is in an unconnected position, which helps to ensure the stability of the process environment. After the process is completed, when the detector 104 detects that the connecting part 103 is still in the connected position, the cavity cover 10 is prohibited from being opened, so as to avoid forcibly separating the upper feedthrough body 102 and the lower feedthrough body 101 and causing damage to the semiconductor equipment, thereby improving the safety and reliability of the semiconductor equipment.

[0023] like Figure 6 As shown, the lower feedthrough body 101 has a first mounting hole 1011 on its top.

[0024] The lower feeder body 101 provides a structural foundation for the special gas feeder device 100. After the first mounting hole 1011 aligns with the second mounting hole 1021 of the upper feeder body 102, the lower feeder body 101 and the upper feeder body 102 are securely connected together by the connecting component 103, thus providing a structural foundation for the special gas conveying channel.

[0025] As an example, the feedthrough body 101 is made of a metal with good mechanical strength and corrosion resistance, such as a 5-series or 6-series aluminum alloy, such as 5052 aluminum alloy or 6061 aluminum alloy.

[0026] It should be noted that the bottom of the lower feedthrough body 101 is used to extend into the reaction chamber 21 of the semiconductor device (e.g., Figure 16 As shown), the top of the lower feedthrough body 101 is positioned outside the reaction chamber 21, and the top of the lower feedthrough body 101 is used to dock with the upper feedthrough body 102.

[0027] In some embodiments, the first mounting hole 1011 includes a threaded hole at the top of the lower feedthrough body 101. Specifically, the threaded hole includes a T-type thread, which has good self-locking performance and high transmission efficiency, can withstand large axial forces, and improves the reliability of locking.

[0028] like Figure 3 and Figure 4 As shown, the upper feedthrough body 102 is located on the lower feedthrough body 101, and the upper feedthrough body 102 is provided with a through second assembly hole 1021 (e.g., ...). Figure 1 As shown), the second mounting hole 1021 and the first mounting hole 1011 (as shown) Figure 4 (As shown) Relative settings.

[0029] The upper feedthrough body 102 is the movable docking part of the special gas feedthrough device 100. The through second assembly hole 1021 of the upper feedthrough body 102 is used to provide an assembly channel for the connecting component 103. When the second assembly hole 1021 is arranged opposite to the first assembly hole 1011, the connecting component 103 can pass smoothly through the upper feedthrough body 102 and be fastened together with the lower feedthrough body 101, thereby completing the assembly of the feedthrough device.

[0030] As an example, the feedthrough body 102 is made of a metal with good mechanical strength and corrosion resistance, such as a five-series or six-series aluminum alloy, such as 5052 aluminum alloy or 6061 aluminum alloy.

[0031] like Figure 8 As shown, the upper feedthrough body 102 is in the shape of an inverted stacked boss, and the bottom sidewall of the upper feedthrough body 102 and the sidewall of the lower feedthrough body 101 are in the same vertical plane. Specifically, the special gas feedthrough device is disposed in the chamber opening 10a (e.g., Figure 15 As shown, the bottom of the upper feedthrough body 102 and the sidewall of the lower feedthrough body 101 are in contact with the sidewall of the chamber opening 10a; and the horizontal surface of the side of the upper feedthrough body 102 is in contact with the top of the chamber cover.

[0032] It should also be noted that the second mounting hole 1021 is a through hole that passes through the upper feedthrough body 102. The diameter of the second mounting hole 1021 is larger than the outer diameter of the thread of the connecting component 103, so as to ensure that the connecting component 103 can pass through without interference.

[0033] refer to Figure 7 and Figure 10 The upper feedthrough body 102 is mounted on the cavity cover plate 10; the special gas feedthrough device 100 further includes: an elastic connection mechanism 105 (such as... Figure 10 As shown), it is used to movably mount the upper feedthrough body 102 on the cavity cover plate 10.

[0034] The elastic connection mechanism 105 enables a floating connection between the upper feedthrough body 102 and the cavity cover plate 10. Specifically, the elastic connection mechanism 105 allows the upper feedthrough body 102 to have a degree of freedom in the direction perpendicular to the surface of the bottom of the upper feedthrough body 102. During the descent of the upper feedthrough body 102, it can absorb deviations caused by tolerances accumulated during processing or installation, so that there will be no collision or interference between the upper feedthrough body 102 and the lower feedthrough body 101.

[0035] like Figure 5 and Figure 10 As shown, the upper feedthrough body 102 is provided with a stepped hole 1022; the elastic connection mechanism 105 is disposed in the stepped hole 1022.

[0036] The stepped hole 1022 includes two through holes with different inner diameters in the feedthrough body 102. Specifically, in the stepped hole 1022, the top through hole 1022b in the feedthrough body 102 has a larger diameter, forming a countersunk hole, and the bottom of the countersunk hole forms a flat annular step surface; the bottom through hole 1022a in the feedthrough body 102 has a smaller diameter and is coaxially arranged with the top through hole 1022b in the feedthrough body 102, for the bottom of the elastic connecting mechanism 105 to pass through.

[0037] It should be noted that there are multiple stepped holes 1022, which are evenly distributed on the upper feedthrough body 102 to improve the overall floating stability.

[0038] As an example, such as Figure 10 As shown, the elastic connection mechanism 105 includes: a stepped screw 1051, which passes through the stepped hole 1022 and is fixedly disposed in the cavity cover plate 10; and a spring 1052, which is disposed between the head of the stepped screw 1051 and the stepped surface of the stepped hole 1022.

[0039] The stepped screw 1051 in the elastic connection mechanism 105 is used for guidance and limiting, constraining the movement space of the upper feedthrough body 102 within a predetermined area on the cavity cover plate 10. The distance between the head of the stepped screw 1051 and the stepped hole 1022 limits the movement distance between the upper feedthrough body 102 and the cavity cover plate 10. The spring 1052 is used to provide flexible support force to absorb collision impact and compensate for position deviation during the docking process of the upper feedthrough body 102 and the lower feedthrough body 101, thereby realizing a floating connection between the upper feedthrough body 102 and the cavity cover plate 10.

[0040] It should be noted that the head diameter of the stepped screw 1051 is larger than the shank diameter of the stepped screw 1051. The head is used to limit the disengagement of the upper feedthrough body 102 and to provide a reaction force surface for the spring 1052. The shank passes through the bottom through hole 1022 in the upper feedthrough body 102, and the thread of the shank is screwed into the cavity cover plate 10, so that the stepped screw 1051 is fixed relative to the cavity cover plate 10.

[0041] As an example, the distance between the head of the step screw 1051 and the step surface can be changed by altering the depth to which the shank of the step screw 1051 is screwed into the cavity cover plate 10, thereby indirectly limiting the floating dimension of the feedthrough body 102 relative to the cavity cover plate 10.

[0042] As an example, the spring 1052 is a helical compression spring 1052, which generates an elastic force opposite to the compression direction when compressed, and provides force for the floating of the feedthrough body 102.

[0043] Spring 1052 is sleeved on the shank of stepped screw 1051 and placed in the countersunk hole space of stepped hole 1022, with its two ends abutting against the lower surface of the head of stepped screw 1051 and the stepped surface of stepped hole 1022, respectively.

[0044] It should be noted that the top of the cavity cover plate 10 has a threaded hole, and the shank of the stepped screw 1051 passes through the upper feed body 102 and engages with the threaded hole in the cavity cover plate 10.

[0045] In some embodiments, the connecting component 103 is disposed in the second mounting hole 1021 and the first mounting hole 1011 for fastening the lower feedthrough body 101 and the upper feedthrough body 102 together.

[0046] The connecting component 103 is used to provide mechanical fastening force and is disposed in the second mounting hole 1021 and the first mounting hole 1011 to rigidly connect the upper feed passage body 102 and the lower feed passage body 101.

[0047] As an example, the connecting component 103 includes metal screws or bolts, such as hex socket head cap screws, with sufficient fastening strength to ensure the connection force between the upper feedthrough body 102 and the lower feedthrough body 101.

[0048] Specifically, the first mounting hole 1011 is located at the top of the lower feed passage body 101, and the connecting component 103 is inserted from above the upper feed passage body 102, passes through the second mounting hole 1021, and is screwed into the first mounting hole 1011 of the lower feed passage body 101.

[0049] It should be noted that after the elastic connecting mechanism 105 aligns the upper feedthrough body 102 and the lower feedthrough body 101, the connecting component 103 is inserted into the second mounting hole 1021 and screwed into the first mounting hole 1011. As the connecting component 103 (e.g., a screw or bolt) is installed in place, the head of the screw or bolt acts on the upper feedthrough body 102, pulling the upper feedthrough body 102 and the lower feedthrough body 101 closer together through the threaded connection, generating a clamping force. The detector 104 of this embodiment is used to detect whether the connecting component 103 is in a preset connection position.

[0050] In some embodiments, there are multiple connecting parts 103, and the multiple connecting parts 103 are spaced apart to ensure that the clamping force between the upper feedthrough body 102 and the lower feedthrough body 101 is evenly distributed, thereby ensuring the reliability of the seal.

[0051] It should also be noted that the elastic connection mechanism 105 is disposed at the edge of the upper feedthrough body and is located on the periphery of the plurality of connecting components.

[0052] A detector 104 is disposed on the feedthrough body 102 and is used to detect whether the connecting component 103 is in the connection position.

[0053] The detector 104 is used to determine the position of the connecting component 103 in real time without contact, and converts the position information detected by the connecting component 103 into a recognizable electrical signal.

[0054] refer to Figure 7 and Figure 11 The feedthrough body 102 is provided with a sensing channel 106 that penetrates the opposite sidewalls of the feedthrough body 102 (e.g., Figure 11 As shown), and the sensing channel 106 is connected to the second mounting hole 1021; the detector 104 (as shown) Figure 11 (As shown) includes a transmitter 1041 and a receiver 1042, with the transmitter 1041 and receiver 1042 respectively disposed at both ends of the sensing channel 106. When the connecting component 103 is in the connected position, the connecting component 103 blocks the signal between the transmitter 1041 and the receiver 1042; when the connecting component 103 is disengaged from the connected position, the signal between the transmitter 1041 and the receiver 1042 is connected.

[0055] The sensing channel 106 provides a detection path for the detector 104 that extends laterally through the feedthrough body 102. This detection path is spatially connected to the second mounting hole 1021 for mounting the connecting component 103. By setting the transmitter 1041 and receiver 1042 of the detector 104 at both ends of the sensing channel 106, a detection line is formed to detect the physical position of the connecting component 103. The detector 104 detects the physical position of the connecting component 103 and converts the mechanical state of the connecting component 103 into a detectable physical signal, enabling non-contact sensing of whether the connecting component 103 is in a specific position within the second mounting hole 1021.

[0056] As an example, the axis of the sensing channel 106 is perpendicular to the axis of the second mounting hole 1021.

[0057] As an example, when the upper feedthrough body 102 and the lower feedthrough body 101 are in the connected position, the top of the connecting part 103 (e.g., the top of the bolt) is in the sensing channel 106.

[0058] As an example, the detector 104 includes a through-beam fiber optic sensor. The through-beam fiber optic sensor has a transmitter 1041 and a receiver 1042, which are two separate fiber optic probes. The transmitter 1041 probe is used to emit a collimated beam, and the receiver 1042 probe is used to receive the collimated beam.

[0059] As an example, the transmitter 1041 and receiver 1042 of the detector 104 are fixedly mounted on the sidewall of the feedthrough body 102 at the openings at both ends of the sensing channel 106. Specifically, the detector 104 can be locked by fasteners such as threads.

[0060] It should also be noted that when detector 104 is working, the optical axis between transmitter 1041 and receiver 1042 coincides with the central axis of sensing channel 106. This allows the signal beam emitted by transmitter 1041 to be received by receiver 1042 to the greatest extent, improving the sensitivity and reliability of detection.

[0061] Specifically, in the unlocked state, the connecting component 103 is not installed or has been removed from the second mounting hole 1021. At this time, there are no obstructions within the sensing channel 106, and the light beam emitted by the transmitter 1041 can smoothly reach the receiver 1042. When the operator installs the connecting component 103 into the second mounting hole 1021, whether the connecting component 103 is fully tightened or not fully tightened, the physical part of the connecting component 103 will enter and block the sensing channel 106, preventing the light beam from reaching the receiver 1042. Through this direct physical obstruction, the "present" or "absent" state of the connecting component 103 is determined.

[0062] like Figure 13 As shown, the special gas feeder device 100 further includes a control system 200, which is electrically connected to the detector 104 and is used to receive the signal output by the detector 104.

[0063] The control system 200 is a logic unit that connects position monitoring and equipment interlocking functions. The control system 200 is electrically connected to the detector 104. The control system 200 is used to receive and analyze the signals provided by the detector 104, convert the optical path on / off state sensed by the detector 104 into a "in position" or "out position" signal that the control system 200 can recognize, and integrate the position information of the special gas feedthrough device into the automated control process of the semiconductor equipment. In the actual process, it can automatically interlock the process such as the lifting and lowering of the cavity cover plate and the start of the process program based on this status information.

[0064] In some embodiments, the control system 200 includes a programmable logic controller (PLC). In other embodiments, the control system 200 is an integrated module of a semiconductor device master control system, the integrated module including a hardware digital input / output (I / O) interface and a software logic control program.

[0065] It should be noted that the output port of the control system 200 is used for electrical connection with the actuator of the semiconductor device. The actuator includes, but is not limited to: a servo motor for controlling the lifting and lowering of the cavity cover, a system command module for starting or pausing the process flow, etc.

[0066] As an example, the control system 200 can read the input signal of the detector 104 by continuous polling or by interruption. The logic program running the control system 200 interprets the signal according to preset settings: for example, when a signal representing "optical path open" is received, the control system 200 sets the status flag of the feedthrough device to "DISCONNECTED"; when the control system 200 receives a signal representing "optical path blocked", the control system 200 sets the status flag of the feedthrough device to "CONNECTED".

[0067] Furthermore, when the semiconductor device receives a process start command, the control system 200 first checks the status of the feedthrough device. Only when the status between the upper feedthrough body 102 and the lower feedthrough body 101 is "CONNECTED" is the process start command authorized; otherwise, the control system 200 will prevent process start and trigger an alarm. Similarly, before performing the "open cavity cover" action, the status between the upper feedthrough body 102 and the lower feedthrough body 101 is checked to see if it is "DISCONNECTED," thus forming a closed-loop, automated operation protection and interlock mechanism.

[0068] refer to Figure 7and Figure 9 The feedthrough body 102 includes a through upper air passage 1091 (e.g., Figure 9 As shown), the lower feedthrough body 101 includes a through lower air passage 1092 (as shown). Figure 9 As shown), and the upper air passage 1091 and the lower air passage 1092 are connected when the upper feed passage body 102 and the lower feed passage body 101 are connected to form an air delivery channel 109 (as shown). Figure 9 (As shown).

[0069] The upper gas duct 1091 of the upper feedthrough body 102 and the lower gas duct 1092 of the lower feedthrough body 101 together constitute the transport path for the special process gas. When the upper feedthrough body 102 and the lower feedthrough body 101 are connected, the upper gas duct 1091 and the lower gas duct 1092 are aligned and connected, introducing gas from the external gas supply system (Gas Box) into the reaction chamber 21 inside the equipment (e.g., Figure 16 As shown in the figure, it provides reactive materials for processes such as semiconductor thin film deposition.

[0070] As an example, both the upper air duct 1091 and the lower air duct 1092 are treated with processes such as electropolishing, resulting in smooth inner surfaces. This reduces the adsorption and residue of gas molecules on the pipe wall, as well as the generation of particles during the process, thereby ensuring gas purity and the cleanliness of the process environment.

[0071] In some embodiments, such as Figure 9 As shown, the special gas feeder device 100 further includes: an inner sealing element 107 disposed between the upper feeder body 102 and the lower feeder body 101, and the inner sealing element 107 surrounds the gas delivery channel 109; and an outer sealing element 108 disposed between the upper feeder body 102 and the lower feeder body 101, and the outer sealing element 108 surrounds the inner sealing element 107.

[0072] The inner seal 107 and the outer seal 108 work together to seal the gas passage 109. The inner seal 107 provides an independent primary seal for the gas delivery passage 109, preventing leakage of process gas and also preventing external gas from entering the gas delivery passage 109. The outer seal 108 serves as a second line of defense, further isolating all inner seals 107 from the external atmospheric environment, ensuring the safety of personnel and equipment operation.

[0073] As an example, the inner seal 107 includes an O-ring, and the material of the inner seal 107 includes perfluororubber (FFKM), which has good corrosion resistance and sealing performance.

[0074] As an example, the outer seal 108 includes an O-ring, and the material of the outer seal 108 includes perfluororubber (FFKM), which has good corrosion resistance and sealing properties.

[0075] It should be noted that there are multiple gas delivery channels 109. Multiple gas delivery channels 109 are integrated in the special gas feeder device 100, which enables the special gas feeder device 100 to provide multiple delivery channels to the process chamber 20 at the same time, which is beneficial to improving the gas delivery efficiency.

[0076] As an example, one end of the gas supply channel 109 is connected to a gas source cabinet to provide special gas. The other end of the gas supply channel 109 is connected to a showerhead in the reaction chamber 21 to provide process gas during the process.

[0077] In some embodiments, such as Figure 9 As shown, there are multiple gas delivery channels 109, multiple inner sealing elements 107, and an outer sealing element 108 surrounding multiple inner sealing elements 107.

[0078] In some embodiments, the bottom of the feedthrough body 102 is provided with an annular first groove 112 (e.g., Figure 3 (as shown) and the annular second groove 113 (as shown) Figure 3 As shown), the first groove 112 is arranged around the upper air passage 1091, the second groove 113 is arranged around a plurality of the first grooves 112, the inner sealing element 107 is arranged in the first groove 112, and the outer sealing element 108 is arranged in the second groove 113.

[0079] The first groove 112 and the second groove 113 provide installation positions for the inner seal 107 and the outer seal 108, respectively, which can prevent the seals from shifting during installation and compression. Moreover, the first groove 112 and the second groove 113 respectively limit the compression amount of the inner seal 107 and the outer seal 108.

[0080] When the upper feedthrough body 102 and the lower feedthrough body 101 are fastened by the connecting member 103, the inner seal 107 and the outer seal 108 are compressed, thereby forming an effective vacuum seal between the upper feedthrough body 102 and the lower feedthrough body 101.

[0081] As an example, the first groove 112 is annular, and the second groove 113 is rectangular.

[0082] refer to Figure 7 and Figure 9 The special gas feeder device 100 includes: an intermediate region 114 (such as...) Figure 9As shown), located between the inner sealing element 107 and the outer sealing element 108; the air extraction channel 115 (as shown) Figure 3 , 12 As shown), it is connected to the intermediate region 114 and is used to extract the gas from the intermediate region 114.

[0083] A connecting extraction channel 115 is provided in the intermediate region 114, which is located between the inner seal 107 and the outer seal 108, to form an extraction area. In actual process operations, when the inner seal 107 surrounding the gas delivery channel 109 fails, the special gas leaking from the gas delivery channel 109 can be confined within the intermediate region 114 and discharged through the extraction channel 115, preventing leakage of the special gas into the external atmosphere and improving the operational safety of the semiconductor equipment. When the outer seal 108 fails, gas infiltrating from the external environment is confined within the intermediate region 114 and extracted, preventing atmospheric components from contaminating the gas delivery channel 109 and ensuring the normal operation of the process.

[0084] It should be noted that, as Figure 9 As shown, ideally, the upper feedthrough body 102 and the lower feedthrough body 101 are completely and tightly fitted together. Due to the existence of machining and assembly tolerances, there is a small space between the upper feedthrough body 102 and the lower feedthrough body 101, so that the inner sealing element 107 and the outer sealing element 108 form the middle area 114.

[0085] Specifically, the intermediate region 114 is located between the upper feedthrough body 102 and the lower feedthrough body 101. The inner boundary of the intermediate region 114 is defined by the inner layer seal 107, and the outer boundary of the intermediate region 114 is defined by the outer layer seal 108.

[0086] As an example, the air extraction channel 115 is disposed on the side wall of the upper feeder body 102 or the side wall of the lower feeder body 101, or disposed on the top of the upper feeder body 102. One end of the air extraction channel 115 is located in the middle region 114, and the other end of the air extraction channel 115 is located outside the special gas feeder device 100.

[0087] When the special gas supply device 100 is operating, the inner seal 107, the outer seal 108, and the intermediate region 114 work together. When the inner seal 107 leaks, the special gas enters the intermediate region 114. The special gas in the intermediate region 114 is drawn away by the pressure difference provided by the extraction channel 115, and will not break through the outer seal 108 to diffuse to the outside of the special gas supply device 100. When the outer seal 108 leaks, the outside air will be drawn away through the intermediate region 114, and will not cross the inner seal 107 to enter the gas supply channel 109.

[0088] In some embodiments, the special gas feeder 100 includes: a processing pipeline (not shown) connected to the extraction channel 115; a vacuum pump (not shown) disposed on the processing pipeline; and a scrubbing tower (not shown) connected to the processing pipeline and located downstream of the vacuum pump.

[0089] The vacuum pump evacuates the intermediate region 114 between the inner seal 107 and the outer seal 108, actively sucking away leaked special gases. The sucked-away special gases enter a washing tower downstream of the vacuum pump for chemical neutralization treatment, converting corrosive or toxic special gases into harmless or less harmful substances, which is beneficial to safe production.

[0090] As an example, the vacuum pump is a dry vacuum pump, and the scrubber is a standard waste gas treatment device in semiconductor plants, which contains a scrubbing liquid that can chemically react with specific gases (e.g., an alkaline solution can be used for acidic gases), neutralizing harmful gases through gas-liquid contact.

[0091] In other embodiments, the special gas feeder 100 includes: a processing pipeline (not shown in the figure) connected to the gas extraction channel; a vacuum pump (not shown in the figure) disposed on the processing pipeline; and a collector (not shown in the figure) connected to the processing pipeline.

[0092] By evacuating the intermediate region 114 between the inner seal 107 and the outer seal 108 using a vacuum pump, leaked special gases can be actively captured and extracted. When the extracted gas passes through the collector, it is trapped by the adsorption or reaction material in the collector, solidifying the harmful gases. The leaked special gases can be safely disposed of by replacing the collector at fixed maintenance intervals.

[0093] like Figure 14 As shown, the special gas supply device 100 further includes: a heating element 110 (such as...) Figure 8 As shown, the heating element 110 is disposed in the upper feedthrough body 102 and the lower feedthrough body 101 for heating the gas delivery channel 109; a temperature sensor 111 is disposed in the upper feedthrough body 102 and the lower feedthrough body 101; a control system 200 is connected to the heating element 110 and the temperature sensor 111, and the control system 200 is used to adjust the heating power of the heating element 110 according to the temperature of the upper feedthrough body 102 and the lower feedthrough body 101 detected by the temperature sensor 111.

[0094] A closed-loop temperature control system 200 is formed by installing heating elements 110 and temperature sensors 111 in the upper feeder body 102 and the lower feeder body 101. The temperature sensor 111 monitors the temperature of the upper feeder body 102 and the lower feeder body 101 in real time. The control system 200 adjusts the power of the heating elements 110 based on the feedback signal from the temperature sensor 111, maintaining the temperature of the gas delivery channel 109 above a preset target value. This effectively prevents the special gas from condensing or solidifying due to temperature drop as it flows through the special gas feeder device, thus avoiding pipeline blockage or particulate matter generation, and improving the smoothness of gas delivery and the cleanliness of the process environment.

[0095] In some embodiments, there are multiple heating elements 110. On a horizontal plane, the heating elements 110 are arranged between adjacent gas delivery channels 109, so that the heating elements 110 can heat multiple gas delivery channels 109 simultaneously.

[0096] In some embodiments, the number of heating elements 110 is multiple, and in the vertical direction, the heating elements 110 are disposed at the top of the upper feedthrough body 102 and the bottom of the lower feedthrough body 101. This ensures temperature uniformity throughout the entire gas delivery channel 109 along its length, compensates for potential heat dissipation differences at both ends of the feedthrough device, and thus more effectively prevents gas condensation at any point in the channel.

[0097] Specifically, both the upper feedthrough body 102 and the lower feedthrough body 101 have multiple through heating holes 1102 (e.g., Figure 3 As shown), the heating hole 1102 of the upper feedthrough main body 102 is aligned with the heating hole 1102 of the lower feedthrough main body 101, and the heating element 110 is disposed in the heating hole 1102.

[0098] As an example, the heating element 110 at the top of the upper feed passage body 102 and the heating element 110 at the bottom of the lower feed passage body 101 are in the same vertical direction and are used to heat the upper air passage 1091 and the lower air passage 1092 in the same vertical direction.

[0099] As an example, the heating element 110 includes a resistance heating rod.

[0100] As an example, the temperature sensor 111 includes a K-type thermocouple or an R-type thermocouple.

[0101] It should be noted that the lead 1101 of the heating element 110 (such as...) Figure 1 (as shown) and the signal line 1111 of the temperature sensor 111 (as shown) Figure 1As shown, the lead wire 1101 of the heating element 110 is led out from the feedthrough body and connected to the external power supply unit, and the signal line 1111 of the temperature sensor 111 is connected to the control system 200.

[0102] The control system 200 receives the real-time temperature signal from the temperature sensor 111 and compares the real-time temperature signal with the set target temperature. When the actual temperature is lower than the set target temperature value, the control system 200 increases the heating power of the heating element 110; when the actual temperature is higher than the set target temperature value, it decreases the heating power of the heating element 110. Therefore, through this negative feedback regulation, the temperature of the special gas supply device 100 is stabilized near the target temperature value.

[0103] refer to Figure 15 and Figure 16 This application also provides a semiconductor device, including: a cavity 20, the cavity 20 including a reaction chamber 21; a cavity cover 10 disposed on the top of the cavity 20, the cavity cover 10 having a chamber opening 10a; and a special gas feeder 100 disposed on the cavity cover 10, the bottom of the special gas feeder extending into the reaction chamber 21.

[0104] In this embodiment of the semiconductor device, a special gas feeder 100 is installed in the cavity opening of the cavity cover plate 10. The detector 104 of the special gas feeder 100 monitors the position of the connecting component 103 in real time, so that the control system 200 of the semiconductor device can automatically manage and constrain operations such as the lifting and lowering of the cavity cover plate 10 and the start and stop of the process according to the actual position of the feeder, so as to prevent equipment damage due to human negligence or misoperation.

[0105] The cavity 20 provides a closed or semi-closed space that can effectively isolate the external environment and protect the wafer from external contamination, and provides a reaction chamber 21 for vapor deposition or plasma etching processes.

[0106] In some embodiments, the cavity 20 is equipped with a gas flow, pressure control and temperature control system 200 to precisely control the internal environment of the cavity 20, such as air pressure, gas composition and temperature.

[0107] The cavity cover 10 is used to seal the top of the cavity 20 and also to provide an installation interface for other equipment components.

[0108] Furthermore, the control system 200 is used to implement the following interlocking functions: when the detector 104 detects that the connecting component 103 is not in the connected position, it prevents the start of the semiconductor process; and when the detector 104 detects that the connecting component 103 is in the connected position, it prevents the opening of the cavity cover 10.

[0109] Specifically, before executing the process start command, the control system 200 first queries the signal from the detector 104. If the signal from the detector 104 indicates that the connecting component 103 is not in the connected position, the control system 200 will interrupt the process flow and issue an alarm to the operation interface, prompting the operator to check and complete the connection of the feedthrough device. Conversely, upon receiving a command to open the cavity cover 10, the control system 200 will first check the locking status. If the signal from the detector 104 indicates that the connecting component 103 is still in the connected position, the control system 200 will prohibit the operation of the lifting mechanism of the cavity cover 10, thus preventing forced opening of the cover while the special gas feedthrough device is still connected and protecting the special gas feedthrough device 100 from mechanical damage.

[0110] In some embodiments, the semiconductor device is a chemical vapor deposition (CVD) device, an atomic layer deposition (ALD) device, or a plasma etching (Etch) device. The special gas feeder 100 is used to deliver one or more precursor gases, reaction gases, or cleaning gases into the reaction chamber 21.

[0111] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A special gas supply device, characterized in that, The special gas supply device, which is used to be installed on the cavity cover plate, includes: The bottom feedthrough body has a first mounting hole at its top; An upper feedthrough body is located on the lower feedthrough body. The upper feedthrough body is provided with a through second assembly hole, which is positioned opposite to the first assembly hole. A connecting component is disposed in the second mounting hole and the first mounting hole for fastening the lower feed passage body and the upper feed passage body together. A detector is disposed on the feedthrough body and is used to detect whether the connecting component is in the connected position.

2. The special gas feeder device as described in claim 1, characterized in that, The upper feedthrough body is provided with a sensing channel that penetrates the opposite sidewall of the upper feedthrough body, and the sensing channel is connected to the second assembly hole; The detector includes a transmitter and a receiver, and the transmitter and receiver are respectively located at both ends of the sensing channel; The special gas feeder device further includes: a control system, electrically connected to the detector, for receiving signals output by the detector; When the connecting component is in the connected position, the connecting component blocks the signal between the transmitting end and the receiving end; when the connecting component is removed from the connected position, the signal between the transmitting end and the receiving end is connected.

3. The special gas feeder device as described in claim 1, characterized in that, The special gas feeder device further includes: an elastic connection mechanism for movably mounting the upper feeder body on the cavity cover plate.

4. The special gas feeder device as described in claim 3, characterized in that, The upper feedthrough body is provided with a stepped hole, and the elastic connection mechanism is disposed in the stepped hole. The elastic connection mechanism includes: A stepped screw passes through the stepped hole and is fixedly installed in the cavity cover plate; A spring is disposed between the head of the stepped screw and the stepped surface of the stepped hole.

5. The special gas feeder device as described in claim 1, characterized in that, The upper feed passage body includes a through upper air passage, and the lower feed passage body includes a through lower air passage, and the upper air passage and the lower air passage are connected to form an air delivery channel. The special gas feeder device further includes: an inner sealing element disposed between the upper feeder body and the lower feeder body, and the inner sealing element surrounds the gas delivery channel; An outer sealing element is disposed between the upper feedthrough body and the lower feedthrough body, and the outer sealing element surrounds the inner sealing element.

6. The special gas feeder device as described in claim 5, characterized in that, There are multiple gas delivery channels, and correspondingly, there are multiple inner sealing elements, with the outer sealing element surrounding the multiple inner sealing elements.

7. The special gas feeder device as described in claim 5, characterized in that, The special gas supply device includes: The intermediate region is located between the inner seal and the outer seal; An extraction channel, connected to the intermediate region, is used to extract gas from the intermediate region.

8. The special gas feeder device as described in claim 7, characterized in that, The special gas supply device includes: A processing pipeline is connected to the extraction channel; a vacuum pump is installed on the processing pipeline; a scrubbing tower is connected to the processing pipeline and is located downstream of the vacuum pump. or, The special gas feeder device includes: a processing pipeline connected to the extraction channel; a vacuum pump installed on the processing pipeline; and a collector connected to the processing pipeline.

9. The special gas feeder device as described in claim 5, characterized in that, The special gas supply device also includes: Heating elements are disposed in the upper feed passage body and the lower feed passage body for heating the gas delivery passage; Temperature sensors are provided in both the upper feedthrough body and the lower feedthrough body; A control system is connected to the heating element and the temperature sensor. The control system is used to adjust the heating power of the heating element according to the temperature of the upper feedthrough body and the lower feedthrough body detected by the temperature sensor.

10. A semiconductor device, characterized in that, include: Cavities, including reaction chambers; A cavity cover plate is disposed on the top of the cavity, and the cavity cover plate has a cavity opening; The special gas feeding device as described in any one of claims 1 to 9 is disposed on the cavity cover plate, and the bottom of the special gas feeding device extends into the reaction chamber.

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