A hot-pressing mechanism for back adhesive bonding

Abstract

The utility model relates to back adhesive laminating equipment technical field, concretely relates to a hot press mechanism for back adhesive laminating, including upper die and with the lower die of upper die cooperation, still include mounting seat, swing lever, press pipe and synchronous adjusting ring, the lower die outer circumferential side is evenly provided with several groups of mounting seat along the circumference, is provided with swing lever in the mounting seat, the upper die outer circumferential side is evenly provided with several connecting pieces along the circumference, swing lever can enter into the connecting piece, press pipe is correspondingly set on swing lever, synchronous adjusting ring can rotate assembly in upper die, and synchronous adjusting ring can drive several groups of press pipe synchronous rotation to press on the connecting piece. First, swing lever is moved to the connecting piece, then, synchronous adjusting ring is connected on the upper die, so that synchronous adjusting ring can cooperate and press pipe, rotates synchronous adjusting ring can drive press pipe to move in vertical direction, when press pipe presses on the lower die, can make back adhesive even and compactly press on electronic component.

Description

Technical Field

[0001] This utility model relates to the technical field of adhesive bonding equipment, specifically to a hot pressing mechanism for adhesive bonding. Background Technology

[0002] In the field of electronic component manufacturing, effective sealing is a crucial step in ensuring product performance and quality. To achieve a seal between two electronic components, an adhesive backing is typically applied between them. This adhesive not only serves as a fixative but also provides a reliable seal.

[0003] There are many types of adhesive backings, which can be divided into two categories based on the bonding conditions: cold-press adhesives and hot-press adhesives. Cold-press adhesives do not require heating and can be directly applied between two electronic components to complete the bonding. Hot-press adhesives, on the other hand, require heating after bonding, and the adhesive melts and then cures again. Hot-melt adhesives have stronger adhesion than cold-press adhesives.

[0004] Whether using cold-press or hot-press adhesive, a downward pressure must be applied to the electronic components during the bonding process to ensure a stronger bond. Based on this, some adhesive bonding equipment has emerged on the market. This equipment primarily uses cylinders or hydraulic cylinders to apply pressure to the bonding fixture. However, such equipment suffers from complex structures and high manufacturing costs, making it a significant investment for businesses with limited budgets and thus limiting its application.

[0005] Chinese Patent Publication No. CN221647361U discloses a hot pressing fixture for adhesive bonding. By setting up pressing ears, pressing nuts, and rotatable connecting rods, the fixture forms a mechanical pressing mechanism. The locking force of the threaded connection between the pressing nuts and the connecting rods applies a pressing force to the upper mold, replacing the previous pressing method that required cylinders or hydraulic cylinders. This simplifies the fixture structure and reduces manufacturing costs. However, it is difficult to ensure that the force applied to each corner of the upper mold is the same when several pressing nuts are tightened, which can easily lead to uneven force on the upper mold and affect the stability of adhesive bonding. Therefore, this utility model provides a hot pressing mechanism for adhesive bonding. Utility Model Content

[0006] To address the aforementioned issues, a hot-pressing mechanism for adhesive bonding is provided. Through the cooperation of the mounting base and the swing rod, and with the addition of a pressing tube and a synchronous adjusting ring, the pressing tube presses synchronously onto the lower mold, resulting in uniform force during adhesive bonding. This solves the problem that traditional fixtures cannot guarantee that each pressing nut descends at the same height, making it difficult to ensure the stability of adhesive bonding.

[0007] To address the problems of existing technologies, this utility model provides a hot-pressing mechanism for adhesive bonding, including an upper mold and a lower mold that cooperates with the upper mold, as well as mounting seats, swing rods, pressing tubes, and a synchronous adjusting ring. Several sets of mounting seats are evenly arranged circumferentially on the outer periphery of the lower mold, and a swing rod is disposed within each mounting seat. Several connecting pieces are evenly arranged circumferentially on the outer periphery of the upper mold, and the swing rod can enter into the connecting pieces. The pressing tube is correspondingly sleeved on the swing rod. The synchronous adjusting ring is rotatably mounted on the upper mold, and the synchronous adjusting ring can drive several sets of pressing tubes to rotate synchronously to press against the connecting pieces.

[0008] Preferably, the synchronous adjustment ring includes a rotating gear and several sets of driven gears. The rotating gear is rotatably connected to the center of the top of the upper mold. The driven gears are sleeved on the swing rod and mesh with the rotating gear. Rotating the rotating gear can drive the pressing tube to move in the vertical direction.

[0009] Preferably, the top edge of the upper mold extends outward to form a support plate, and the driven gear is mounted on the support plate and rotates.

[0010] Preferably, the mounting base includes a mounting plate, a clamping plate, and a pressing member. The mounting plate is detachably connected to the side wall of the lower mold. The ends of the two sets of clamping plates are respectively hinged to both ends of the mounting plate. The two sets of clamping plates can enclose a spherical restrictive space. The pressing member is disposed on the mounting plate and is arranged radially along the lower mold. The lower end of the swing rod can be restricted to swinging in the spherical restrictive space, and the pressing member can press on the swing rod.

[0011] Preferably, the pressing component includes a pressing spring and a limiting plate. One end of the pressing spring is fixed to the mounting plate and the other end extends radially along the lower mold. One side of the limiting plate is fixed to the pressing spring and the other side can contact the side wall of the swing rod.

[0012] Preferably, the top of the lower mold is provided with a receiving groove for accommodating electronic components, and the top of the lower mold is provided with a groove for accommodating heating tubes. The groove is arranged around the receiving groove, and a through hole is provided in the receiving groove, which can vertically penetrate to the bottom of the lower mold.

[0013] Preferably, the support plate is provided with an arc-shaped limiting block, and the driven gear is restricted to rotating on the arc-shaped limiting block.

[0014] Preferably, a rotating handle is provided at the center of the rotating gear.

[0015] The advantages of this utility model compared to the prior art are:

[0016] First, move the swing rod into the connector to restrict the rotation of the upper mold relative to the lower mold. Then, connect the synchronous adjustment ring to the upper mold so that the synchronous adjustment ring can cooperate with the pressing tube. Rotating the synchronous adjustment ring can drive the pressing tube to move in the vertical direction. When the pressing tube presses onto the connector, the tight fit between the upper and lower molds is completed, so that the adhesive is pressed evenly and firmly onto the electronic components. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a hot pressing mechanism for adhesive backing bonding according to this utility model.

[0018] Figure 2 This is a schematic diagram of the split structure of a hot pressing mechanism for adhesive bonding according to this utility model.

[0019] Figure 3 This is a schematic diagram of the connection structure of the upper mold, lower mold, mounting base and swing rod of a hot pressing mechanism for adhesive bonding according to this utility model.

[0020] Figure 4 This is a cross-sectional structural diagram of a hot pressing mechanism for adhesive bonding according to this utility model.

[0021] Figure 5 This is a schematic diagram of the connection structure between the mounting base and the swing rod of a hot pressing mechanism for adhesive bonding according to this utility model.

[0022] Figure 6 This is a schematic diagram of the lower mold of a hot pressing mechanism for adhesive bonding according to this utility model.

[0023] The components in the diagram are labeled as follows: upper mold 1, bearing plate 10, arc-shaped limiting block 100, lower mold 2, receiving groove 20, groove 21, through hole 22, mounting base 3, mounting plate 30, clamping plate 31, pressing component 32, pressing spring 320, limiting plate 321, swing rod 4, pressing tube 5, synchronous adjusting ring 6, rotating gear 60, rotating handle 600, driven gear 61. Detailed Implementation

[0024] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments.

[0025] like Figures 1-6As shown, this utility model provides a hot pressing mechanism for adhesive bonding, including an upper mold 1 and a lower mold 2 that cooperates with the upper mold 1, and also includes a mounting base 3, a swing rod 4, a pressing tube 5 and a synchronous adjusting ring 6. Several sets of mounting bases 3 are evenly arranged circumferentially on the outer periphery of the lower mold 2, and a swing rod 4 is provided inside the mounting base 3. Several connecting parts are evenly arranged circumferentially on the outer periphery of the upper mold 1, and the swing rod 4 can enter into the connecting parts. The pressing tube 5 is correspondingly sleeved on the swing rod 4. The synchronous adjusting ring 6 can be rotatably assembled on the upper mold 1, and the synchronous adjusting ring 6 can drive several sets of pressing tubes 5 to rotate synchronously to press on the connecting parts.

[0026] In the hot-press mechanism for adhesive bonding, the upper mold 1 and the lower mold 2 cooperate to form the basic structure for hot-press bonding, providing operating space for adhesive bonding of electronic components. Several sets of mounting seats 3, evenly distributed circumferentially on the outer periphery of the lower mold 2, serve to install and position the swing rod 4, ensuring that the swing rod 4 can be stably positioned in the preset position. The swing rod 4 is movably mounted within the mounting seat 3, allowing it to enter the connecting parts evenly distributed on the outer periphery of the upper mold 1. This design establishes a connection between the upper mold 1 and the lower mold 2 through the swing rod 4 and the connecting parts, laying the foundation for subsequent pressing actions.

[0027] The pressing tube 5 is fitted onto the swing rod 4 and can adjust its position as the swing rod 4 moves. Its main function is to apply pressure to the connector during the bonding process, thereby ensuring the bonding effect between the adhesive and the electronic components. The synchronous adjustment ring 6 is rotatably mounted on the upper mold 1. As the core transmission component, it can simultaneously drive several sets of pressing tubes 5 to rotate synchronously, thereby pressing the pressing tubes 5 onto the connector. This achieves the coordinated action of multiple pressing structures, ensuring the uniformity and consistency of pressure application.

[0028] It should be noted that the electronic component is placed in the lower mold 2, and the upper mold 1 is correspondingly set on the lower mold 2. First, the swing rod 4 is moved to the connector, which can restrict the rotation of the upper mold 1 relative to the lower mold 2. Then, the synchronous adjustment ring 6 is connected to the upper mold 1, so that the synchronous adjustment ring 6 can cooperate to connect the pressing tube 5. Rotating the synchronous adjustment ring 6 can drive the pressing tube 5 to move in the vertical direction. When the pressing tube 5 presses on the connector, the tight fit between the upper mold 1 and the lower mold 2 is completed, so that the adhesive is pressed evenly and firmly on the electronic component.

[0029] The synchronous adjustment ring 6 includes a rotating gear 60 and several sets of driven gears 61. The rotating gear 60 is rotatably connected to the center of the top of the upper mold 1. The driven gears 61 are sleeved on the swing rod 4 and mesh with the rotating gear 60. Rotating the rotating gear 60 can drive the pressing tube 5 to move vertically. Preferably, a rotating handle 600 is provided at the center of the rotating gear 60 to facilitate the operator to rotate the rotating gear 60.

[0030] The synchronizing adjustment ring 6 adopts a gear transmission structure design, in which the rotating gear 60, as the driving component, is rotatably connected to the center of the top of the upper mold 1, facilitating rotation by the operator or drive device. Several sets of driven gears 61 are respectively sleeved on the corresponding swing rods 4 and mesh with the rotating gears 60, forming a complete gear transmission system. When the rotating gear 60 rotates, the meshing action between the gears drives all the driven gears 61 to rotate synchronously, thereby driving the pressing tubes 5 sleeved on the swing rods 4 to move vertically. This achieves precise adjustment of the pressure of the pressing tubes 5 on the connector, further ensuring the quality and stability of the adhesive bonding. This gear transmission method has the advantages of high transmission efficiency, smooth movement, and good synchronization, effectively ensuring the consistency of the actions of multiple sets of pressing tubes 5. The upper section of the swing rod 4 is provided with a threaded section, and both the inner and outer walls of the pressing tube 5 are provided with threads. The inner wall of the driven gear 61 is provided with threads. The threaded section of the swing rod 4 can mesh with the threads on the inner wall of the pressing tube 5, and the threads on the outer wall of the pressing tube 5 can mesh with the threads on the inner wall of the driven gear 61.

[0031] Mounting base 3 includes mounting plate 30, clamping plate 31 and pressing member 32. Mounting plate 30 is detachably connected to the side wall of lower mold 2. The ends of two sets of clamping plates 31 are respectively hinged to the two ends of mounting plate 30. The two sets of clamping plates 31 can form a spherical restricted space. Pressing member 32 is set on mounting plate 30 and is arranged radially along lower mold 2. The lower end of swing rod 4 can be restricted to swing in the spherical restricted space. Pressing member 32 can press on swing rod 4.

[0032] The mounting plate 30, serving as the basic load-bearing component of the mounting base 3, is detachably connected to the side wall of the lower mold 2. This design not only facilitates the overall disassembly and maintenance of the mounting base 3 but also allows for flexible adjustment of the installation position according to actual usage requirements, enhancing the adaptability of the mechanism. The ends of the two sets of clamping plates 31 are hinged to both ends of the mounting plate 30, giving the clamping plates 31 a certain degree of rotational freedom. When the two sets of clamping plates 31 rotate relative to each other, they can enclose a spherical confinement space. The spherical structure of this space provides multi-directional swing margin for the lower end of the swing rod 4, ensuring that the swing rod 4 can swing flexibly according to the fitting requirements during operation, meeting the action requirements of different angles.

[0033] The pressing component 32 is fixedly mounted on the mounting plate 30 and arranged radially along the lower mold 2. Its main function is to limit and apply pressure to the swing rod 4. When the swing rod 4 swings within the spherical confinement space, the pressing component 32 can press against the swing rod 4 through its own structural characteristics. On the one hand, it can limit the excessive swing of the swing rod 4 and ensure the stability of its movement range; on the other hand, it can provide appropriate pressure to the swing rod 4 to ensure that the swing rod 4 maintains reliable cooperation with related components during operation, thereby improving the accuracy and stability of the entire hot pressing mechanism in the adhesive bonding process.

[0034] The pressing component 32 includes a pressing spring 320 and a limiting plate 321. One end of the pressing spring 320 is fixed to the mounting plate 30, and the other end extends radially along the lower mold 2. One side of the limiting plate 321 is fixed to the pressing spring 320, and the other side can contact the side wall of the swing rod 4. When the swing rod 4 is rotated into the connecting component, as... Figure 3 The structure of the connector shown allows the swing plate to enter the connector when it swings. When the swing rod 4 enters the connector, the pressing member 32 can press the swing member into the connector, reducing its radial movement along the upper mold 1.

[0035] The lower mold 2 has a receiving groove 20 at its top for accommodating electronic components, and a groove 21 at its top for accommodating a heating tube. The groove 21 surrounds the receiving groove 20, and a through hole 22 is provided in the receiving groove 20, which can vertically extend to the bottom of the lower mold 2. The heating tube is placed in the groove 21 and has a through hole 22 to facilitate connection between the heating tube and a power source.

[0036] A support plate 10 extends outward from the top edge of the upper mold 1, and a driven gear 61 is mounted on the support plate 10 and rotates thereon. An arc-shaped limiting block 100 is provided on the support plate 10, and the driven gear 61 is restricted to rotating on the arc-shaped limiting block 100. Figure 2 and Figure 3 As shown, the support plate 10 is designed to support the rotation of the driven gear 61, and the limiting block facilitates the installation of the driven gear 61. It should be noted that the extended support plate 10 does not interfere with the swing of the swing rod 4, that is, the horizontal height of the top of the swing rod 4 is lower than the height of the bottom of the support plate 10.

[0037] The above embodiments only illustrate one or more implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. A hot pressing mechanism for adhesive bonding, comprising an upper mold (1) and a lower mold (2) cooperating with the upper mold (1), characterized in that, It also includes a mounting base (3), a swing rod (4), a pressing tube (5), and a synchronous adjustment ring (6). Several sets of mounting bases (3) are evenly arranged circumferentially on the outer side of the lower mold (2). A swing rod (4) is provided inside the mounting base (3). Several connecting parts are evenly arranged circumferentially on the outer side of the upper mold (1). The swing rod (4) can enter the connecting parts. The pressing tube (5) is correspondingly sleeved on the swing rod (4). The synchronous adjustment ring (6) can be rotatably assembled on the upper mold (1). The synchronous adjustment ring (6) can drive several sets of pressing tubes (5) to rotate synchronously to press on the connecting parts.

2. The hot pressing mechanism for adhesive backing bonding according to claim 1, characterized in that, The synchronous adjustment ring (6) includes a rotating gear (60) and several sets of driven gears (61). The rotating gear (60) is rotatably connected to the top center of the upper mold (1). The driven gears (61) are sleeved on the swing rod (4). The driven gears (61) mesh with the rotating gear (60). Rotating the rotating gear (60) can drive the pressing tube (5) to move in the vertical direction.

3. The hot pressing mechanism for adhesive bonding according to claim 2, characterized in that, The upper mold (1) extends outward from the top edge to form a support plate (10), and the driven gear (61) is mounted on the support plate (10) and rotates.

4. The hot pressing mechanism for adhesive bonding according to claim 1, characterized in that, The mounting base (3) includes a mounting plate (30), a clamping plate (31), and a pressing member (32). The mounting plate (30) is detachably connected to the side wall of the lower mold (2). The ends of the two sets of clamping plates (31) are respectively hinged to the two ends of the mounting plate (30). The two sets of clamping plates (31) can form a spherical restricted space. The pressing member (32) is disposed on the mounting plate (30). The pressing member (32) is disposed radially along the lower mold (2). The lower end of the swing rod (4) can be restricted to swing in the spherical restricted space. The pressing member (32) can press on the swing rod (4).

5. The hot pressing mechanism for adhesive bonding according to claim 4, characterized in that, The pressing component (32) includes a pressing spring (320) and a limiting plate (321). One end of the pressing spring (320) is fixed on the mounting plate (30) and the other end extends radially along the lower mold (2). One side of the limiting plate (321) is fixed on the pressing spring (320) and the other side can contact the side wall of the swing rod (4).

6. The hot pressing mechanism for adhesive bonding according to claim 1, characterized in that, The lower mold (2) has a receiving groove (20) at the top for accommodating electronic components and a groove (21) at the top for accommodating heating tubes. The groove (21) surrounds the receiving groove (20) and a through hole (22) is provided in the receiving groove (20). The through hole (22) can vertically penetrate to the bottom of the lower mold (2).

7. The hot pressing mechanism for adhesive bonding according to claim 3, characterized in that, The support plate (10) is provided with an arc-shaped limiting block (100), and the driven gear (61) is restricted to rotating on the arc-shaped limiting block (100).

8. The hot pressing mechanism for adhesive bonding according to claim 2, characterized in that, A rotating handle (600) is provided at the center of the rotating gear (60).

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