Wafer inspection device

CN224886645UActive Publication Date: 2026-10-23NINGBO LIMON ROBOT CO LTD
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Patent Information

Application Number
CN202521688319.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-08
Publication Date
2026-10-23
Estimated Expiration
2035-08-08

AI Technical Summary

Technical Problem

[0002]现有技术上,晶圆设备的检测都是将检测设备安装于晶圆设备的正上方,保证精度的情况下进行检测,由于检测设备的重量较大,在长时间的纵向活动后会存在掉落风险,因此,下方的晶圆设备存在被砸伤的风险

Benefits of technology

[0017]本实用新型由于采用了上述技术,使之与现有技术相比具有的积极效果是:

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer detection device, include: base and be located on the support of base, install damping mechanism on the support, install detection mechanism on the damping mechanism, install wafer equipment on the base, detection mechanism is located the right above of wafer equipment for to wafer equipment carries out detection. The utility model sets up damping mechanism between detection mechanism and support, can prevent the risk of falling from the support of detection mechanism, ensures the safety of wafer equipment and detection mechanism.
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Description

Technical Field

[0001] This utility model relates to the technical field of wafers, and in particular to a wafer inspection device. Background Technology

[0002] In current technology, wafer inspection equipment is installed directly above the wafer to ensure accuracy. However, due to the weight of the inspection equipment, there is a risk of it falling after prolonged vertical movement, which could damage the wafer below. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a wafer inspection device, in which a shock-absorbing mechanism is provided between the inspection mechanism and the support, which can prevent the risk of the inspection mechanism falling off the support and ensure the safety of the wafer equipment and the inspection mechanism.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] A wafer inspection device includes: a base and a support mounted on the base, a shock-absorbing mechanism mounted on the support, a detection mechanism mounted on the shock-absorbing mechanism, a wafer device mounted on the base, and the detection mechanism located directly above the wafer device for inspecting the wafer device.

[0006] In the aforementioned wafer inspection device, the vibration damping mechanism includes:

[0007] A slide rail, which is longitudinally mounted on the bracket;

[0008] A skateboard, which is longitudinally slidable on the slide rail, and the detection mechanism is mounted on the skateboard;

[0009] One or more elastic components are longitudinally arranged between the slide rail and the slide plate.

[0010] In the aforementioned wafer inspection device, the top and bottom of the slide rail are provided with limiting plates, and the elastic component is disposed between the two limiting plates.

[0011] In the aforementioned wafer inspection device, each of the elastic components includes an elastic element and a clamping sleeve. The upper and lower ends of the elastic element are respectively fixedly connected to the two limiting plates, and the clamping sleeve is fixedly installed in the middle of the elastic element. The clamping sleeve is fixedly connected to the sliding plate through a fixing block.

[0012] In the aforementioned wafer inspection device, the fixing block is fixedly connected to the clamping sleeve, and the fixing block is fixedly connected to the slide plate by fasteners.

[0013] In the aforementioned wafer inspection device, the upper and lower ends of the elastic element are respectively fixedly connected to the two limiting plates by fasteners.

[0014] In the aforementioned wafer inspection device, a first linear module and a second linear module are provided on the base. The first linear module is arranged along a first horizontal direction, and the second linear module is arranged along a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The first linear module and the second linear module are connected in a driving connection, and the second linear module is connected in a driving connection to the wafer equipment.

[0015] In the aforementioned wafer inspection device, a mounting base is driven and connected to the second linear module, and the wafer equipment is mounted on the mounting base.

[0016] In the aforementioned wafer inspection device, a drive component is mounted on the support, and the drive component is connected to the slide plate to drive the slide plate up and down.

[0017] Because this utility model employs the aforementioned technology, it has the following positive effects compared to existing technologies:

[0018] (1) The present invention provides a shock-absorbing mechanism between the testing mechanism and the support, which can prevent the risk of the testing mechanism falling off the support and ensure the safety of the wafer equipment and the testing mechanism. Attached Figure Description

[0019] Figure 1 This is a front view of the overall structure of a wafer inspection device according to this utility model.

[0020] Figure 2 This utility model relates to a wafer inspection device. Figure 1 Enlarged view of a portion of the image.

[0021] Figure 3 This is a top view of the overall structure of a wafer inspection device according to this utility model.

[0022] Figure 4 This is a schematic diagram of the overall structure of a wafer inspection device according to this utility model.

[0023] Figure 5 This utility model relates to a wafer inspection device. Figure 4 Enlarged view of a portion of the image.

[0024] In the attached diagram: 1. Base; 2. Bracket; 3. Shock absorption mechanism; 4. Detection mechanism; 5. Wafer equipment; 11. First linear module; 12. Second linear module; 13. Mounting base; 31. Slide rail; 32. Slide plate; 33. Elastic component; 34. Limiting plate; 35. Elastic element; 36. Clamping sleeve; 37. Fixing block; 38. Fastener. Detailed Implementation

[0025] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] In the description of this utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", "front", "back", "horizontal", and "vertical" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] It should be noted that the terms "horizontal" and "vertical" in this utility model are used to describe approximate positional relationships, and not strictly "horizontal plane" or "vertical plane".

[0028] It should be noted that, unless otherwise specified, this utility model can be used at the angle shown in the accompanying drawings or at other angles.

[0029] Please see Figures 1 to 5 As shown, a preferred embodiment of a wafer inspection device is provided, including: a base 1 and a support 2 disposed on the base 1. A shock-absorbing mechanism 3 is installed on the support 2, and a detection mechanism 4 is installed on the shock-absorbing mechanism 3. A wafer device 5 is installed on the base 1, and the detection mechanism 4 is located directly above the wafer device 5 for inspecting the wafer device 5.

[0030] Furthermore, as a preferred embodiment, the shock absorption mechanism 3 includes: a slide rail 31 and a slide plate 32. The slide rail 31 is longitudinally mounted on the bracket 2, and the slide plate 32 is longitudinally slidably mounted on the slide rail 31. The detection mechanism 4 is mounted on the slide plate 32.

[0031] One or more elastic components 33 are longitudinally provided between the slide rail 31 and the slide plate 32.

[0032] Furthermore, as a preferred embodiment, the slide rail 31 is provided with limiting plates 34 at both the top and bottom, and the elastic component 33 is disposed between the two limiting plates 34.

[0033] Furthermore, in a preferred embodiment, each elastic component 33 includes an elastic element 35 and a clamping sleeve 36. The upper and lower ends of the elastic element 35 are respectively fixedly connected to two limiting plates 34. The clamping sleeve 36 is fixedly installed in the middle of the elastic element 35 and is fixedly connected to the slide plate 32 through a fixing block 37.

[0034] Furthermore, as a preferred embodiment, the fixing block 37 is fixedly connected to the clamping sleeve 36, and the fixing block 37 is fixedly connected to the slide plate 32 by fasteners.

[0035] Furthermore, as a preferred embodiment, the upper and lower ends of the elastic member 35 are fixedly connected to the two limiting plates 34 by fasteners 38, respectively.

[0036] Fasteners can be bolts.

[0037] The elastic element 35 is a spring.

[0038] When the skateboard 32 of this utility model moves up and down, the elastic element 35 is compressed. When the detection mechanism 4 is at risk of falling, the elastic element 35 and the fastener cooperate to fix it on the limiting plate 34, which can hold the detection mechanism 4.

[0039] Preferably, the detection mechanism 4 is a camera.

[0040] This invention provides a shock-absorbing mechanism 3 between the testing mechanism 4 and the support 2, which can prevent the risk of the testing mechanism 4 falling off the support 2 and ensure the safety of the wafer equipment 5 and the testing mechanism 4.

[0041] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention.

[0042] Based on the above, this utility model also has the following embodiments:

[0043] In a further embodiment of the present invention, a first linear module 11 and a second linear module 12 are provided on the base 1. The first linear module 11 is arranged along a first horizontal direction, and the second linear module 12 is arranged along a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The first linear module 11 and the second linear module 12 are connected by a drive, and the second linear module 12 is connected by a drive to the wafer device 5.

[0044] Preferably, the first linear module 11 and the second linear module 12 are driven by a motor, cylinder, or air source. They are used to adjust the specific position of the wafer equipment 5. The wafer equipment 5 in this invention can be other wafer-related equipment, etc.

[0045] In a further embodiment of this utility model, a mounting base 13 is connected to the second linear module 12, and the wafer device 5 is mounted on the mounting base 13.

[0046] In a further embodiment of this utility model, a driving component (not shown in the figure) is installed on the bracket 2. The driving component is connected to the slide plate 32 for transmission, so that the slide plate 32 can move up and down. The driving component is located between the slide plate 32 and the bracket 2.

[0047] The above description is merely a preferred embodiment of this utility model and does not limit the implementation methods and protection scope of this utility model. Those skilled in the art should be able to understand that...

[0048] All equivalent substitutions and obvious substitutions made based on the description and illustrations of this utility model.

[0049] All solutions obtained by changing the present invention should be included within the protection scope of this utility model.

Claims

1. A wafer inspection device, characterized in that, include: A base and a bracket mounted on the base, a shock-absorbing mechanism mounted on the bracket, a detection mechanism mounted on the shock-absorbing mechanism, a wafer device mounted on the base, and the detection mechanism located directly above the wafer device for detecting the wafer device; The shock absorption mechanism includes: A slide rail, which is longitudinally mounted on the bracket; A skateboard, which is longitudinally slidable on the slide rail, and the detection mechanism is mounted on the skateboard; One or more elastic components are longitudinally arranged between the slide rail and the slide plate.

2. The wafer inspection apparatus according to claim 1, characterized in that, The slide rail is provided with limiting plates at both the top and bottom, and the elastic component is located between the two limiting plates.

3. The wafer inspection apparatus according to claim 2, characterized in that, Each of the elastic components includes an elastic element and a clamping sleeve. The upper and lower ends of the elastic element are respectively fixedly connected to the two limiting plates. The clamping sleeve is fixedly installed in the middle of the elastic element and is fixedly connected to the slide plate through a fixing block.

4. The wafer inspection apparatus according to claim 3, characterized in that, The fixing block is fixedly connected to the clamping sleeve, and the fixing block is fixedly connected to the slide plate by fasteners.

5. The wafer inspection apparatus according to claim 3, characterized in that, The upper and lower ends of the elastic element are respectively fixedly connected to the two limiting plates by fasteners.

6. The wafer inspection apparatus according to claim 1, characterized in that, The base is provided with a first linear module and a second linear module. The first linear module is arranged along a first horizontal direction, and the second linear module is arranged along a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The first linear module and the second linear module are connected in a driving connection, and the second linear module is connected in a driving connection with the wafer equipment.

7. The wafer inspection apparatus according to claim 6, characterized in that, The second linear module is connected to a mounting base, and the wafer equipment is mounted on the mounting base.

8. The wafer inspection apparatus according to claim 1, characterized in that, A drive unit is mounted on the bracket, and the drive unit is connected to the skateboard to enable the skateboard to move up and down.