A LED module convenient for multiple integration

Abstract

The utility model discloses a kind of LED module convenient to multiple integration, it is related to LED lighting field, including substrate, the substrate bottom end is equipped with multiple slot and fixed groove, metal heat sink is inserted in the slot, the metal heat sink outside is fixed with protective block, the protective block one side is fixed with connecting plate, the connecting plate one side is connected with multiple fixed seat, multiple fixed seat is all provided with LED crystal grain, by the design of conducting metal layer, insulating heat insulation layer in substrate, alloy plate, the current required by LED crystal grain is transferred by conducting metal layer, most of the heat generated by LED crystal grain is directly transferred to alloy plate by heat conduction column, while metal heat sink can absorb heat, to avoid heat gathering around LED crystal grain. Through the multiple heat dissipation structure of "heat conduction column+metal heat sink+alloy plate", combined with the isolation of insulating heat insulation layer, realize heat, electric efficient separation.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting, and in particular to an LED module that is easy to integrate multiple LEDs. Background Technology

[0002] With the rapid development of LED technology, its application in lighting, display, automotive electronics and other fields is becoming increasingly widespread. In order to meet the requirements of high brightness and high power, the integration of multiple LED chips has become the mainstream trend in the industry.

[0003] Traditional LED modules mostly use single-layer substrates or simple composite substrates. The heat generated by the LED chips is mainly dissipated naturally through the substrate surface or relies on a single heat-conducting structure. Due to the dense arrangement of multiple LED chips, heat easily accumulates inside the module, causing the LED chip operating temperature to rise, which not only leads to significant light decay.

[0004] Therefore, it is necessary to propose a solution to the above problems by integrating multiple LED modules. Utility Model Content

[0005] The purpose of this invention is to provide an LED module that facilitates the integration of multiple LED chips, in order to solve the problem that when multiple LED chips are densely arranged, heat tends to accumulate inside the module, causing the operating temperature of the LED chips to rise, which not only leads to obvious light decay.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an LED module that facilitates the integration of multiple LED chips, comprising a substrate, wherein a plurality of slots and fixing grooves are provided at the bottom end of the substrate, a metal heat-absorbing plate is inserted into the slot, a protective block is fixed to the outside of the metal heat-absorbing plate, a connecting plate is fixed to one side of the protective block, and a plurality of fixing seats are connected to one side of the connecting plate, and LED chips are provided on the plurality of fixing seats.

[0007] Each of the LED chips has a heat-conducting pillar at its bottom, and the heat-conducting pillar is located inside the corresponding fixing groove.

[0008] According to the claim, an LED module that facilitates the integration of multiple LEDs is characterized in that: the substrate comprises a conductive metal layer, an insulating and heat-insulating layer, and an alloy plate distributed sequentially from top to bottom, and the bottom end of the LED chip is electrically connected to the conductive metal layer.

[0009] Preferably, the heat-conducting column passes through the conductive metal layer and the insulating heat-insulating layer and then contacts the upper surface of the alloy plate, and the bottom end of the metal heat-absorbing plate passes through the conductive metal layer and the insulating heat-insulating layer and then contacts the upper surface of the alloy plate.

[0010] Preferably, the top of the conductive metal layer is covered with a corrosion-resistant protective layer.

[0011] Preferably, the connecting plate and the fixing base are detachably connected, and the fixing base has multiple equally spaced sockets on the side near the connecting plate, and the connecting plate is inserted into the corresponding socket.

[0012] Preferably, the conductive metal layer, the insulating and heat-insulating layer, and the alloy plate have the same length and width.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] 1. Due to the design of the conductive metal layer, insulating and heat-insulating layer, and alloy plate in the substrate, the current required by the LED chip is transferred through the conductive metal layer, while most of the heat generated by the LED chip is directly transferred to the alloy plate through the heat-conducting pillar. At the same time, the metal heat-absorbing plate can absorb the heat, thereby preventing heat from accumulating near the LED chip. Through the multi-layer heat dissipation structure of "heat-conducting pillar + metal heat-absorbing plate + alloy plate", combined with the isolation effect of the insulating and heat-insulating layer, efficient separation of heat and electricity is achieved. At the same time, the metal heat-absorbing plate can also separate and protect the LED chips that are distributed in parallel.

[0015] 2. Furthermore, since the LED chips are mounted on the mounting base, which is connected to the metal heat-absorbing plate, simultaneous installation and removal are possible during installation. The LED chips are integrated into the mounting base, which is connected to the metal heat-absorbing plate via a connecting plate. This allows for the simultaneous assembly of multiple LED chips at once. Compared to traditional single-chip installation, during disassembly and maintenance, only the connecting plate needs to be pulled out to remove the mounting base and LED chips, eliminating the need to disassemble the entire substrate, significantly reducing maintenance costs and time. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the LED module that facilitates the integration of multiple LEDs according to this utility model.

[0017] Figure 2 This is a schematic diagram of the structure of the fixing groove of this utility model.

[0018] Figure 3 This utility model Figure 1 Enlarged diagram of point A in the middle.

[0019] Figure 4 This is a schematic diagram of the structure of the heat-conducting column and the conductive metal layer of this utility model.

[0020] In the diagram: 1. Substrate; 2. Mounting base; 3. LED chip; 4. Connecting plate; 5. Protective block; 6. Metal heat-absorbing plate; 7. Mounting groove; 8. Alloy plate; 9. Heat-conducting column; 10. Conductive metal layer; 11. Insulating and heat-insulating layer. Detailed Implementation

[0021] This utility model provides, for example Figures 1-4 The diagram illustrates a multi-LED module for easy integration, comprising a substrate 1. The substrate 1 has multiple slots and mounting grooves 7 at its bottom. A metal heat-absorbing plate 6 is inserted into each slot. A protective block 5, made of flame-retardant ABS material, is integrally formed and fixed to the outside of the metal heat-absorbing plate 6. This protective block not only protects the metal heat-absorbing plate 6 from external impacts but also prevents current interference between adjacent components. A connecting plate 4 is fixed to one side of the protective block 5. Multiple mounting seats 2 are detachably connected to one side of the connecting plate 4. Each mounting seat 2 has an LED chip 3 mounted on it. Insertion of the connecting plate 4 allows for quick positioning and fixation, facilitating future maintenance and replacement. Each mounting seat 2 is secured with thermally conductive adhesive to hold the LED chip 3.

[0022] Each of the multiple LED chips 3 has a heat-conducting pillar 9 at its bottom, which is located inside the corresponding fixing groove 7. The heat-conducting pillar 9 is made of copper-tungsten alloy.

[0023] The substrate 1 comprises, from top to bottom, a conductive metal layer 10, an insulating and heat-insulating layer 11, and an alloy plate 8. The bottom end of the LED chip 3 is electrically connected to the conductive metal layer 10. The conductive metal layer 10, the insulating and heat-insulating layer 11, and the alloy plate 8 have the same length and width. The three-layer structure has completely identical length and width dimensions, ensuring structural stability and assembly compatibility. The insulating and heat-insulating layer 11 is made of high-temperature resistant epoxy resin, which can effectively isolate the current between the conductive metal layer 10 and the alloy plate 8, while reducing reverse heat transfer. In addition, the top of the conductive metal layer 10 is covered with a 5-10μm thick anti-corrosion protective layer using a nickel-gold plating process, which can resist the corrosion of moisture and corrosive gases, extending the module's service life.

[0024] The heat-conducting column 9 passes through the conductive metal layer 10 and the insulating heat insulation layer 11 and then contacts the upper surface of the alloy plate 8. The bottom end of the metal heat-absorbing plate 6 passes through the conductive metal layer 10 and the insulating heat insulation layer 11 and then contacts the upper surface of the alloy plate 8.

[0025] The top of the conductive metal layer 10 is covered with a corrosion-resistant protective layer.

[0026] The connecting plate 4 and the fixing base 2 are detachably connected. The fixing base 2 has multiple equally spaced sockets on the side near the connecting plate 4, and the connecting plate 4 is inserted into the corresponding socket.

[0027] When the LED module is working, the external current is transferred to each LED chip 3 through the conductive metal layer 10, which powers the LED chip 3 to emit light. At the same time, the heat generated by the LED chip 3 during the light emission process is partly transferred directly to the alloy plate 8 through the heat conduction column 9 at the bottom, and partly absorbed by the metal heat absorption plate 6 and then transferred to the alloy plate 8. The alloy plate 8 then quickly diffuses the heat to the external environment.

[0028] During this process, the insulating and heat-insulating layer 11, on the one hand, prevents the current from flowing from the conductive metal layer 10 to the alloy plate 8, ensuring electrical safety, and on the other hand, reduces the reverse transfer of heat from the alloy plate 8 to the conductive metal layer 10, avoiding the influence of temperature on current transmission.

[0029] Due to the design of the conductive metal layer 10, insulating and heat-insulating layer 11, and alloy plate 8 in the substrate 1, the current required by the LED chip 3 is transferred through the conductive metal layer 10, while most of the heat generated by the LED chip 3 is directly transferred to the alloy plate 8 through the heat-conducting pillar 9. At the same time, the metal heat-absorbing plate 6 can absorb the heat, thereby preventing heat from accumulating near the LED chip 3. Through the multiple heat dissipation structure of "heat-conducting pillar 9 + metal heat-absorbing plate 6 + alloy plate 8", combined with the isolation effect of the insulating and heat-insulating layer 11, efficient separation of heat and electricity is achieved. At the same time, the metal heat-absorbing plate 6 can also separate and protect the LED chips 3 that are arranged in parallel.

[0030] Meanwhile, since the LED chip 3 is mounted on the mounting base 2, and the mounting base 2 is connected to the metal heat-absorbing plate 6, simultaneous installation and removal can be performed at the same time. The LED chip 3 is integrated on the mounting base 2, and the mounting base 2 is connected to the metal heat-absorbing plate 6 through the connecting plate 4. During installation, multiple LED chips 3 can be assembled simultaneously at one time. Compared with the traditional single-chip installation method, during disassembly and maintenance, only the connecting plate 4 needs to be pulled out to remove the mounting base 2 and the LED chip 3, without disassembling the entire substrate 1, which greatly reduces maintenance costs and time.

Claims

1. A multi-LED module that is easy to integrate, comprising a substrate (1), characterized in that: The substrate (1) has multiple slots and fixing grooves (7) at its bottom end. A metal heat-absorbing plate (6) is inserted into the slot. A protective block (5) is fixed to the outside of the metal heat-absorbing plate (6). A connecting plate (4) is fixed to one side of the protective block (5). Multiple fixing seats (2) are detachably connected to one side of the connecting plate (4). LED chips (3) are provided on each of the multiple fixing seats (2). Each of the LED chips (3) has a heat-conducting column (9) at its bottom end, and the heat-conducting column (9) is located inside the corresponding fixing groove (7).

2. The LED module for easy integration of multiple LEDs according to claim 1, characterized in that: The substrate (1) includes a conductive metal layer (10), an insulating and heat-insulating layer (11), and an alloy plate (8) distributed from top to bottom. The bottom end of the LED chip (3) is electrically connected to the conductive metal layer (10).

3. The LED module that facilitates the integration of multiple LEDs according to claim 2, characterized in that: The heat-conducting column (9) passes through the conductive metal layer (10) and the insulating heat insulation layer (11) and then contacts the upper surface of the alloy plate (8). The bottom end of the metal heat-absorbing plate (6) passes through the conductive metal layer (10) and the insulating heat insulation layer (11) and then contacts the upper surface of the alloy plate (8).

4. The LED module that facilitates the integration of multiple LEDs according to claim 2, characterized in that: The top of the conductive metal layer (10) is covered with a corrosion-resistant protective layer.

5. The LED module for easy integration of multiple LEDs according to claim 1, characterized in that: The connecting plate (4) and the fixing seat (2) are detachably connected. The fixing seat (2) has multiple equally spaced sockets on the side near the connecting plate (4). The connecting plate (4) is inserted into the corresponding socket.

6. The LED module that facilitates the integration of multiple LEDs according to claim 2, characterized in that: The conductive metal layer (10), the insulating and heat-insulating layer (11), and the alloy plate (8) have the same length and width.

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