LED light emitting device with light color consistency

Abstract

The utility model relates to LED light emitting device technical field especially, a kind of LED light emitting device with light color consistency, it includes at least one circuit board, circuit board is equipped with light-emitting area, light-emitting area is equipped with multiple light-emitting units, the light-emitting unit includes SMD patch fixed in circuit board and lamp pearl module welded with SMD patch, at least one CSP lamp pearl is equipped in lamp pearl module, the CSP lamp pearl includes LED chip, and the surface of LED chip is wrapped with fluorescent glue;The lamp pearl module includes protective film, and the surface of all fluorescent glue is covered by protective film.The utility model is produced independently outside circuit board by novel structure, circuit board is combined SMD patch and lamp pearl module, the CSP lamp pearl of lamp pearl module, again, screening is welded to circuit board, so that the lamp pearl color temperature on circuit board keeps consistent, and color difference is small.

Description

Technical Field

[0001] This utility model relates to the field of LED light-emitting device technology, and in particular to an LED light-emitting device with uniform light color. Background Technology

[0002] Currently, LED lighting fixtures are gradually developing towards larger sizes and thinner profiles; in the production of traditional LED lighting fixtures' flexible light strips, the LED beads are... (See...) Figure 2 The common production methods are as follows: 1. Die bonding step, where LED chips are pasted onto FPC (Flexible Printed Circuit Board) substrate; at the same time, soldering is performed, using reflow soldering to heat and fuse the chip pads and FPC substrate pads, connecting the chip and substrate circuit paths; 2. Phosphor spraying or phosphor coating; 3. Spraying protective film.

[0003] When LED lights are large in size, during step 2, if adhesive is applied using dispensing, molding, or spraying processes, the large size and long travel distance result in a large gap between the front and rear light-emitting areas. Consequently, the uniformity of the adhesive between the front and rear ends cannot be guaranteed, leading to poor color consistency after application. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing an LED light-emitting device with uniform light color, wherein the color temperature difference between the LED beads in the device is small.

[0005] An LED light-emitting device with uniform light color includes at least one circuit board with a light-emitting area and multiple light-emitting units. Each light-emitting unit includes an SMD chip fixed to the circuit board and an LED module soldered to the SMD chip. The LED module contains at least one CSP LED, which includes an LED chip with a fluorescent adhesive coating on its surface. The LED module includes a protective film covering the surface of all the fluorescent adhesive.

[0006] Furthermore, the lamp module contains at least three CSP lamps spaced apart, preferably nine.

[0007] Furthermore, the circuit board is a single-layer flexible circuit board.

[0008] Furthermore, the length of one side of the circuit board in one direction is greater than 600mm.

[0009] Furthermore, the light-emitting area on the surface of the circuit board is provided with a protective layer.

[0010] Furthermore, the LED light-emitting device includes two or more circuit boards, and the contact surface between adjacent circuit boards is wavy.

[0011] Furthermore, the LED light-emitting device also includes an IC driver board, with the IC driver board and circuit boards located on both sides respectively, and the IC driver board connected to all the circuit boards and the IC driver board.

[0012] Furthermore, the fluorescent adhesive is wrapped on five sides.

[0013] Furthermore, the protective film of the LED module has an inverted U-shaped cross-section.

[0014] The beneficial effects of this utility model are as follows: Through a novel structure, the circuit board is combined with SMD chips and LED modules. The CSP LEDs of the LED modules can be produced independently outside the circuit board and then screened and soldered onto the circuit board, so that the color temperature of the LEDs on the circuit board is consistent and the color difference is small. Attached Figure Description

[0015] Figure 1 This is a simplified schematic diagram of the LED light-emitting device in this embodiment.

[0016] Figure 2 This is a schematic diagram of a process for manufacturing LED beads on flexible LED strips in the prior art.

[0017] Figure 3 This is a schematic diagram of the CSP lamp bead production process in this embodiment.

[0018] Figure 4 This is a schematic diagram of the LED module processing in this embodiment.

[0019] Figure label: 1—Protective film; 2—Fluorescent adhesive; 3—LED chip; 4—Soldering pad; 5—Circuit board; 6—Steel plate; 7—Adapter film; 8—SMD chip; 9—LED bead module; 10—IC driver board; 11—Flexible circuit board; 12—Blue film. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] The present invention will now be described in detail with reference to the accompanying drawings. Figures 1 to 2 As shown.

[0025] Example 1: See Figure 2 A light-emitting device with uniform light color includes at least one circuit board 5. The circuit board 5 has a light-emitting area and a plurality of light-emitting units. The light-emitting unit includes an SMD patch 8 fixed to the circuit board 5 and an LED bead module 9 soldered to the SMD patch 8. The LED bead module 9 contains at least one CSP LED bead.

[0026] Compared to existing technologies, this technical solution solves the problem of significant color differences in light emitted by widely spaced LEDs on large-size circuit boards during production due to processing techniques. In this solution, the CSP LEDs of the LED module 9 are manufactured independently of the circuit board, without direct chip soldering or adhesive application on the circuit board 5. During the production of the LED module 9, preliminary chip packaging is performed on the steel plate 6 (see appendix). Figure 3 To be continued Figure 4Specifically: 1. Apply double-sided adhesive to the steel plate 6 and bond the LED chip 3; 2. Fix a fluorescent film on the chip surface, i.e., spray fluorescent adhesive 2 onto the chip surface. The size of the fluorescent film is greater than or equal to the chip size, and the fluorescent film covers the surface of the LED chip 3; at this point, a CSP lamp bead is formed; 3. Attach an adapter film to the back of the steel plate, peel the CSP lamp bead off the double-sided adhesive, and attach it upside down to the adapter film; 4. Remove the double-sided adhesive from the front of the steel plate, attach a blue film 12, and attach the CSP lamp bead upside down to the blue film 12 again; 5. Place the CSP lamp bead... The beads are peeled off from the blue film 12, and CSP beads are screened. Color difference is assessed, and beads with color differences within a certain range are selected, such as within 1000K (or lower). Two flip-chip processes are performed to remove double-sided adhesive residue from the LED pads. 6. SMD chips 8 are placed on the circuit board (e.g., FPC substrate). A certain number of SMD chips 8 are categorized and combined, with the number of SMD chips corresponding to the number of CSP beads in the LED module. 7. CSP beads 9 are soldered onto the SMD chips 8. During soldering, the LED beads 9 are soldered to the SMD chips 8 by reflow soldering to heat and melt the chip pads, ensuring a one-to-one correspondence between the pads 4 on the LED chip and the solder points on the SMD chips. 8. Multiple CSP beads 9 are grouped into sets, and each set is individually coated with a protective film covering the fluorescent adhesive on the surface of all CSP beads 9.

[0027] Compared to existing technologies, this technical solution involves manufacturing the CSP LEDs separately from the circuit board, then screening for color differences, and finally soldering them to the circuit board and applying a protective film. This ensures consistent color across the LEDs on the circuit board. The protective film can be made of materials such as silicone.

[0028] Secondly, when connecting the circuit board to the LED chips, the SMD surface mount technology (SMD) is used for soldering, so the size of the circuit board is no longer limited, and the size of the circuit board can be made large, such as 700mm*800mm.

[0029] SMD: It is an abbreviation for Surface Mounted Devices.

[0030] As LED lighting fixtures are currently trending towards thinner designs, the circuit board in this embodiment is a single-layer flexible circuit board 11. This allows for a very thin lighting fixture. The thickness of the circuit board 5 + LED beads 9 in this technical solution can be quite small, specifically: an ultra-thin thickness of 0.27 to 0.37 mm is achieved through the combination of FPC (0.07 mm) + CSP (0.15-0.25 mm) + protective film (0.05 mm), which is beneficial for the thinning of lighting fixtures.

[0031] Secondly, LED lighting fixtures are also developing towards larger sizes. In this embodiment, the length of one side of the circuit board in one direction is greater than 600mm.

[0032] Since the LED beads are formed independently outside the circuit board, there is no need to set the LED chip 3 and encapsulate it on the circuit board; therefore, the size of the circuit board can be large, such as a rectangle of 700*800mm or a circle with a diameter of 650mm.

[0033] When setting the LED chips within the LED beads, the LED bead module 9 shall contain at least 3 CSP LED beads 3, preferably 9. Using multiple CSP LED beads 3 can improve the brightness and color selection of the LED bead module 9.

[0034] To protect the circuit board, a protective layer is provided on the light-emitting area of ​​the circuit board surface.

[0035] The protective layer can be sprayed onto the surface of the circuit board to improve its surface insulation and corrosion resistance. The protective layer can be silicone polyimide (PI) or polyester (PET), with a thickness between 0.0125 mm and 0.05 mm. This protective layer forms an insulating protective layer on the surface of the flexible circuit board and can also have openings for soldering and electrical connections.

[0036] To make the LED light-emitting device have a larger area, see Figure 1 In this embodiment, the LED light-emitting device includes two or more circuit boards 5, and the contact surface between adjacent circuit boards 5 is wavy.

[0037] Multiple circuit boards 5 are set up to facilitate splicing into a larger LED light-emitting device; the contact surface is set to a wavy shape, with a relatively larger contact surface, to facilitate splicing and assembly.

[0038] See Figure 1 The IC driver board and the circuit board are located on both sides respectively. The IC driver board is connected to all the circuit boards and the IC driver board. In this embodiment, all the circuit boards 5 are located on the left side, and the IC driver board 10 is located on the right side of the circuit boards 5. The IC driver board 10 is connected to all the circuit boards 5 and the IC driver board 10.

[0039] To facilitate the control of multiple circuit boards 5, in this embodiment, the IC driver board 10 is placed on one side of the LED light-emitting device, and the other side of the circuit board 5 is set with width. The right side of each circuit board 5 is adjacent to the IC driver board 10. The IC driver board 10 is electrically connected to all the circuit boards 5 and controls the LED beads on all the circuit boards 5 to emit light.

[0040] See Figure 4 The fluorescent adhesive 2 of the LED bead 9 is wrapped on five sides.

[0041] The fluorescent adhesive 2 encapsulates the LED chip 3 of the lamp bead 9, and the color temperature of the emitted light can be changed by adjusting the composition of the fluorescent adhesive 2.

[0042] See Figure 4 The protective film 1 of the lamp bead 9 has an inverted U-shaped cross-section.

[0043] When molding the LED bead module 9, perforations are made on the FPC circuit board. There are perforations on all four sides of the LED bead module 9. When spraying the protective film 1, the protective film 1 covers the surface of the fluorescent adhesive 2. Part of the protective film 1 will leak out through the perforations (not shown in the figure). The protective film 1 ultimately forms an inverted U-shape. The curved surfaces on both sides of the protective film 1 have a good slope, improving the light emission angle. In specific processing, the shape of the protective film 1 can be adjusted by adjusting the position of the perforations, so that the protective film 1 has a better light emission surface.

[0044] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. An LED light-emitting device with uniform light color, characterized in that: It includes at least one circuit board, the circuit board has a light-emitting area, the light-emitting area has multiple light-emitting units, the light-emitting unit includes an SMD patch fixed to the circuit board and an LED module soldered to the SMD patch, the LED module has at least one CSP LED, the CSP LED includes an LED chip, the surface of the LED chip is covered with fluorescent adhesive; the LED module includes a protective film, the protective film covers the surface of all fluorescent adhesive.

2. The LED light-emitting device with uniform light color according to claim 1, characterized in that: The circuit board is a single-layer flexible circuit board.

3. The LED light-emitting device with uniform light color according to claim 1, characterized in that: The lamp module contains at least three CSP lamps spaced apart.

4. The LED light-emitting device with uniform light color according to claim 1, characterized in that: The length of one side of the circuit board is greater than 600mm in one direction.

5. The LED light-emitting device with uniform light color according to claim 1, characterized in that: The surface of the light-emitting area of ​​the circuit board is provided with a protective layer.

6. The LED light-emitting device with uniform light color according to claim 1, characterized in that: The LED light-emitting device includes two or more circuit boards, and the contact surface between adjacent circuit boards is wavy.

7. The LED light-emitting device with uniform light color according to claim 6, characterized in that: The LED light-emitting device also includes an IC driver board, with the IC driver board and circuit board located on both sides respectively, and the IC driver board connected to all the circuit boards and the IC driver board.

8. The LED light-emitting device with uniform light color according to claim 1, characterized in that: The protective film of the LED module has an inverted U-shaped cross-section.

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