Backlight module with improved heat dissipation effect of lamp plate and vehicle-mounted display device

Abstract

The utility model provides a kind of backlight module for improving the heat dissipation effect of lamp panel, including die casting, multiple heat-conducting silica gel and lamp panel, the die casting is equipped with accommodating cavity and multiple avoidance grooves, each the avoidance groove is communicated with the accommodating cavity, each the heat-conducting silica gel is respectively arranged in each the avoidance groove, the lamp panel is arranged in the accommodating cavity, the lamp panel includes multiple drive chips, each the drive chip is respectively with each the heat-conducting silica gel interference fit. The utility model's backlight module for improving the heat dissipation effect of lamp panel can improve the heat dissipation effect of lamp panel, improve the quality of product.

Description

Technical Field

[0001] This utility model relates to the field of display screen technology, and in particular to a backlight module and vehicle display device that improves the heat dissipation effect of the lamp board. Background Technology

[0002] Currently, automobiles have become an indispensable means of transportation in people's lives. In addition to having stringent requirements for in-vehicle driving safety and experience, users also have increasingly higher demands for interior display screens. Users pursue larger screens and more vivid and higher color gamut in-vehicle display effects. Therefore, manufacturers have begun to introduce Mini LED automotive backlights to improve color gamut and brightness. The Local Dimming lamp board structure can achieve an ultra-high color gamut value experience. The Local Dimming lamp board is composed of multiple LED chips that emit blue light, which is then converted into white light through a QD film to obtain an ultra-high color gamut. The normal operation of LED chips requires the driver chip (driver IC) for control. However, the driver IC is not only fragile, but also prone to generating heat during operation.

[0003] A conventional backlight consists of a lower frame and a lamp board. The lower frame has a recessed slot, and the lamp board is connected inside the lower frame. The driver IC is installed in the recessed slot of the closed lower frame. However, the heat dissipation effect of the sealed space is poor, and the driver IC has difficulty dissipating heat during operation. It is prone to short circuits due to poor heat dissipation. In addition, the driver IC is also prone to damage during operation, resulting in poor light display of the lamp board. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a backlight module that improves the heat dissipation effect of the lamp board. This backlight module can solve the problems existing in the prior art, improve the heat dissipation effect of the lamp board, and improve the quality of the product.

[0005] This utility model provides a backlight module that improves the heat dissipation effect of the lamp board, including a die-cast part, multiple thermally conductive silicone pads and a lamp board. The die-cast part is provided with a receiving cavity and multiple clearance grooves. Each clearance groove is connected to the receiving cavity. Each thermally conductive silicone pad is respectively disposed in each clearance groove. The lamp board is disposed in the receiving cavity. The lamp board includes multiple driving chips. Each driving chip is interference-fitted with each thermally conductive silicone pad.

[0006] In one embodiment, the thickness of the thermally conductive silicone is 1.0 mm to 1.5 mm.

[0007] In one embodiment, the thermally conductive silicone is flexible and includes an adhesive layer and a thermally conductive layer that are fixedly connected. The adhesive layer is disposed on the side of the thermally conductive layer away from the lamp panel and is used to fix the thermally conductive layer in the clearance groove.

[0008] In one embodiment, the die-cast part includes a base plate and a side frame fixedly connected, and the receiving cavity is formed between the base plate and the side frame. The base plate includes an inner surface and an outer surface disposed opposite to each other. The inner surface is disposed in the receiving cavity, and the clearance groove is formed by recessing from the inner surface toward the outer surface.

[0009] In one embodiment, the depth of the clearance groove is 1.5mm to 2.0mm.

[0010] In one embodiment, the length of the thermally conductive silicone is greater than the length of the driver chip, and the width of the thermally conductive silicone is greater than the width of the driver chip.

[0011] In one embodiment, the backlight module for improving the heat dissipation effect of the lamp board further includes a thermally conductive adhesive layer. The thermally conductive adhesive layer is connected between the base plate of the die-cast part and the lamp board. The thermally conductive adhesive layer is provided with a plurality of through holes, each of which is respectively provided with a corresponding clearance groove, and each of the driving chips is provided through the through holes.

[0012] In one embodiment, the backlight module for improving the heat dissipation effect of the lamp board further includes an optical film. The optical film includes a diffuser plate, a quantum film, a diffuser film, a lower brightness enhancement film, an upper brightness enhancement film, and a brightness enhancement film. The diffuser plate is disposed on the lamp board, the quantum film is disposed on the diffuser plate, the diffuser film is disposed on the quantum film, the lower brightness enhancement film is disposed on the diffuser film, the upper brightness enhancement film is disposed on the lower brightness enhancement film, and the brightness enhancement film is disposed on the upper brightness enhancement film.

[0013] In one embodiment, the backlight module for improving the heat dissipation effect of the lamp board further includes a middle frame, which is connected to the die-cast part and is used to support the display screen.

[0014] This utility model provides an in-vehicle display device, including the aforementioned backlight module that improves the heat dissipation effect of the lamp panel.

[0015] The backlight module of this utility model has heat-dissipating silicone placed in the relief groove of the die-cast part. When the lamp board is installed in the die-cast part, the driver chip of the lamp board is correspondingly set with the heat-dissipating silicone. The driver chip and the thermally conductive silicone are interference fit, so that the driver chip transfers heat to the die-cast part for heat dissipation through the thermally conductive silicone, which improves the heat dissipation effect of the driver chip, reduces the problem of the lamp board being damaged by excessive temperature when the backlight module lights up the screen in a high-temperature environment, avoids the phenomenon of poor display image caused by the backlight module, and improves the quality of the product. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the disassembled structure of the backlight module of this utility model.

[0018] Figure 2 This is a top view of the die-cast part of this utility model.

[0019] Figure 3 This is a partial cross-sectional view of the lamp panel of this utility model.

[0020] Figure 4 This is a side view of the thermal silicone of this utility model.

[0021] Reference numerals: 101; 102; 103; 11; 111; 112; 12; 12; 12; 121; 122; 13; 13; 131; 132; 14; 15; 151; 152; 153; 154; 155; 156; 16; 17; 18; 19. Detailed Implementation

[0022] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0023] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0024] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0026] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0027] like Figures 1 to 4 As shown, the backlight module for improving the heat dissipation of the lamp board includes a die-cast part 11, multiple thermally conductive silicone 12, and a lamp board 13. The die-cast part 11 is provided with a receiving cavity 101 and multiple clearance grooves 102. Each clearance groove 102 is connected to the receiving cavity 101. Each thermally conductive silicone 12 is respectively disposed in each clearance groove 102. The lamp board 13 is disposed in the receiving cavity 101. The lamp board 13 includes multiple driver chips 132 (driver ICs). Each driver chip 132 is interference-fitted with each thermally conductive silicone 12.

[0028] The backlight module of this utility model has heat-dissipating silicone in the relief groove 102 of the die-cast part 11. When the lamp board 13 is installed in the die-cast part 11, the driver chip 132 of the lamp board 13 is correspondingly set with the heat-dissipating silicone. The driver chip 132 and the thermally conductive silicone 12 are interference fit, so that the driver chip 132 transfers heat to the die-cast part 11 through the thermally conductive silicone 12 for heat dissipation, thereby improving the heat dissipation effect of the driver chip 132, reducing the problem of the lamp board 13 being damaged by excessive temperature when the screen is lit in a high-temperature environment, avoiding the phenomenon of poor display image caused by the backlight module, and improving the quality of the product.

[0029] like Figure 1 and Figure 2As shown, the die-cast part 11 includes a base plate 111 and a side frame 112 fixedly connected. A receiving cavity 101 is formed between the base plate 111 and the side frame 112. The base plate 111 includes an inner surface and an outer surface that are oppositely disposed. The inner surface is disposed within the receiving cavity 101. A relief groove 102 is formed by recesses from the inner surface towards the outer surface. The number of relief grooves 102 is preferably 6, 8, or 10, etc., and can be set according to the number of driver chips 132 on the lamp board 13. The relief grooves 102 are preferably rectangular or square, etc. It is understood that the base plate 111 and the side frame 112 are an integral structure, formed by die casting. The driver chip 132 and the Mini LED lights are not arranged in a one-to-one correspondence; one driver chip 132 can drive multiple Mini LED lights.

[0030] like Figure 3 As shown, the thermally conductive silicone 12 is flexible and includes an adhesive layer 121 and a thermally conductive layer 122 that are fixedly connected. The adhesive layer 121 is located on the side of the thermally conductive layer 122 away from the lamp board 13. The adhesive layer 121 is used to fix the thermally conductive layer 122 in the clearance groove 102. The clearance groove 102 is filled with thermally conductive silicone 12. When the driver chip 132 is interference-fitted with the thermally conductive silicone 12, the thermally conductive silicone 12 provides better heat dissipation performance for the driver chip 132. The die-cast part 11 has a large area and dissipates heat quickly. The combination of thermally conductive silicone 12 and die-cast part 11 can improve the heat dissipation effect of the driver chip 132. Therefore, it can avoid the phenomenon that the driver chip 132 is damaged due to the excessive temperature of the lamp board 13. The adhesive layer 121 is adhesive, the substrate of the thermally conductive layer 122 is preferably vulcanized silicone rubber, and the thermally conductive material in the thermally conductive layer 122 is preferably a metal oxide (alumina or zinc oxide, etc.), a nitride (aluminum nitride or boron nitride, etc.) or a carbon material (graphene / carbon nanotubes or diamond powder, etc.).

[0031] like Figure 1 and Figure 4As shown, the light board 13 includes a PCB board 131, multiple Mini LED lights, and multiple driver chips 132. Each Mini LED light is electrically connected to the PCB board 131, and each driver chip 132 is electrically connected to the PCB board 131. Each Mini LED light is also electrically connected to its respective driver chip 132. The driver chip 132 is used to control the Mini LED lights to turn on or off. The driver chip 132 is connected to the side of the PCB board 131 near the base plate 111. The driver chip 132 protrudes from the surface of the PCB board 131 towards the base plate 111. The thickness of the driver chip 132 is 0.6mm~0.8mm, preferably 0.6mm, 0.7mm, or 0.8mm. The depth of the clearance groove 102 is 1.5mm~2.0mm, preferably 1.5mm, 1.8mm, or 2.0mm. The thickness of the thermally conductive silicone 12 is 1.0mm~1.5mm, preferably... The thickness of the thermally conductive silicone 12 can be 1.0mm, 1.3mm, or 1.5mm. Because the thermally conductive silicone 12 is flexible, after the lamp board 13 is installed with the die-cast part 11, the driver chip 132 and the thermally conductive silicone 12 are interference-fitted, and the thickness of the interference fit is 0.1mm to 0.3mm. For example, when the thickness of the driver chip 132 is 0.7mm, the driver chip 132 and the thermally conductive silicone 12 have an interference of 0.2mm. In addition, the flexible characteristics of the thermally conductive silicone 12 can provide a buffer for the driver chip 132 and prevent the driver chip 132 from being damaged during operation.

[0032] Preferably, the length of the thermally conductive silicone 12 is greater than the length of the driver chip 132, and the width of the thermally conductive silicone 12 is greater than the width of the driver chip 132, ensuring that the size of the thermally conductive silicone 12 is greater than the size of the driver chip 132, so as to provide better heat dissipation performance.

[0033] Preferably, the backlight module for improving the heat dissipation of the lamp board further includes a thermally conductive adhesive layer 14. The thermally conductive adhesive layer 14 is connected between the base plate 111 of the die-cast part 11 and the lamp board 13. The thermally conductive adhesive layer 14 has multiple through holes 103, each of which corresponds to a relief groove 102. Each driver chip 132 passes through the through hole 103. The thermally conductive adhesive layer 14 is preferably a double-sided adhesive with thermal conductivity. The thermally conductive adhesive layer 14 is used to fix the lamp board 13 to the base plate 111 of the die-cast part 11. The shape of the through hole 103 matches the shape of the driver chip 132, so that the driver chip 132 can pass through the through hole 103 and cooperate with the thermally conductive silicone 12.

[0034] Preferably, the backlight module for improving the heat dissipation effect of the lamp panel further includes an optical film 15. The optical film 15 includes a diffuser plate 151, a quantum film 152, a diffuser film 153, a lower brightness enhancement film 154, an upper brightness enhancement film 155, and a brightness enhancement film (DBEF) 156. The diffuser plate 151 is disposed on the lamp panel 13, the quantum film 152 is disposed on the diffuser plate 151, the diffuser film 153 is disposed on the quantum film 152, the lower brightness enhancement film 154 is disposed on the diffuser film 153, the upper brightness enhancement film 155 is disposed on the lower brightness enhancement film 154, and the brightness enhancement film 156 is disposed on the upper brightness enhancement film 155. In this embodiment, the films of the optical film 15 can be connected to each other by double-sided adhesive.

[0035] Preferably, the backlight module for improving the heat dissipation effect of the lamp board further includes a middle frame 16, a foam adhesive layer 17, and a light-shielding adhesive layer 18. The middle frame 16 is connected to the die-cast part 11 and is used to support the display screen. The foam adhesive layer 17 is disposed between the display screen and the middle frame 16 and is used to buffer and fix the display screen. The light-shielding adhesive layer 18 is disposed between the middle frame 16 and the brightness enhancement film 156 and can reduce the phenomenon of bright edges appearing in the display area of ​​the backlight module.

[0036] This utility model also relates to an in-vehicle display device, including the aforementioned backlight module for improving the heat dissipation effect of the lamp panel. The in-vehicle display device in this embodiment may be, for example, a high-end in-vehicle instrument panel, an in-vehicle central control display, or an integrated display screen for the in-vehicle driver's cab, but is not limited thereto.

[0037] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. A backlight module for improving the heat dissipation effect of the lamp panel, characterized in that, The device includes a die-cast part (11), multiple thermally conductive silicone rubbers (12), and a lamp plate (13). The die-cast part (11) is provided with a receiving cavity (101) and multiple clearance grooves (102). Each clearance groove (102) is connected to the receiving cavity (101). Each thermally conductive silicone rubber (12) is respectively disposed in each clearance groove (102). The lamp plate (13) is disposed in the receiving cavity (101). The lamp plate (13) includes multiple driving chips (132). Each driving chip (132) is interference-fitted with each thermally conductive silicone rubber (12).

2. The backlight module for improving heat dissipation of the lamp board as described in claim 1, characterized in that, The thickness of the thermally conductive silicone (12) is 1.0mm~1.5mm.

3. The backlight module for improving heat dissipation of the lamp board as described in claim 1, characterized in that, The thermally conductive silicone (12) is flexible and includes a fixedly connected adhesive layer (121) and a thermally conductive layer (122). The adhesive layer (121) is located on the side of the thermally conductive layer (122) away from the lamp plate (13) and is used to fix the thermally conductive layer (122) in the relief groove (102).

4. The backlight module for improving heat dissipation of the lamp panel as described in claim 1, characterized in that, The die-cast part (11) includes a base plate (111) and a side frame (112) fixedly connected. The accommodating cavity (101) is formed between the base plate (111) and the side frame (112). The base plate (111) includes an inner surface and an outer surface that are disposed opposite to each other. The inner surface is disposed in the accommodating cavity (101). The relief groove (102) is formed by recessing from the inner surface toward the outer surface.

5. The backlight module for improving heat dissipation of the lamp board as described in claim 4, characterized in that, The depth of the clearance groove (102) is 1.5mm~2.0mm.

6. The backlight module for improving heat dissipation of the lamp board as described in claim 1, characterized in that, The length of the thermally conductive silicone (12) is greater than the length of the driving chip (132), and the width of the thermally conductive silicone (12) is greater than the width of the driving chip (132).

7. The backlight module for improving heat dissipation of the lamp panel as described in any one of claims 1 to 6, characterized in that, The backlight module for improving the heat dissipation effect of the lamp board also includes a thermally conductive adhesive layer (14). The thermally conductive adhesive layer (14) is connected between the base plate (111) of the die-cast part (11) and the lamp board (13). The thermally conductive adhesive layer (14) is provided with a plurality of vias (103). Each via (103) is respectively provided with a corresponding clearance groove (102). Each driving chip (132) is provided through the via (103).

8. The backlight module for improving heat dissipation of the lamp board as described in claim 7, characterized in that, The backlight module for improving the heat dissipation effect of the lamp board also includes an optical film (15). The optical film (15) includes a diffuser plate (151), a quantum film (152), a diffuser film (153), a lower brightness enhancement film (154), an upper brightness enhancement film (155), and a brightness enhancement film (156). The diffuser plate (151) is disposed on the lamp board (13), the quantum film (152) is disposed on the diffuser plate (151), the diffuser film (153) is disposed on the quantum film (152), the lower brightness enhancement film (154) is disposed on the diffuser film (153), the upper brightness enhancement film (155) is disposed on the lower brightness enhancement film (154), and the brightness enhancement film (156) is disposed on the upper brightness enhancement film (155).

9. The backlight module for improving heat dissipation of the lamp board as described in claim 7, characterized in that, The backlight module for improving the heat dissipation effect of the lamp board also includes a middle frame (16), which is connected to the die-cast part (11) and is used to support the display screen.

10. A vehicle-mounted display device, characterized in that, The backlight module that improves the heat dissipation effect of the lamp panel as described in any one of claims 1-9.

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