Novel semiconductor special gas heating device and semiconductor process system

Abstract

The utility model relates to a novel semiconductor special gas heating device and semiconductor technology system, novel semiconductor special gas heating device includes main unit, liquid storage unit, microwave heating unit, heat exchange unit, temperature detection unit, inductive alarm unit and control unit. Its advantage lies in, using microwave heating unit to the liquid storage unit carries out microwave heating, high security, can effectively eliminate resistance overheat and fire hazard, thermal efficiency is obviously superior to resistance heating mode, and energy consumption is lower, realizes heat storage and temperature control through heat exchange unit, and temperature is uniform and stable, utilizes inductive alarm unit and carries out inductive alarm, effectively prevents leakage and radiation, utilizes temperature monitoring unit and carries out temperature feedback mechanism, realizes accurate temperature control, and overall operation is efficient and reliable.

Description

Technical Field

[0001] This utility model relates to the field of special gas cabinet technology, and in particular to a novel semiconductor special gas heating device and semiconductor process system. Background Technology

[0002] Specialty gas holders are core storage devices in electronic specialty gas pipeline systems, specifically designed for supplying gases with corrosive, toxic, or other hazardous properties in emerging industries such as semiconductors, LEDs, and integrated circuits. These gases typically require specific temperatures to maintain optimal performance and stability. In practical use, the gas within the storage device flows continuously, and the user requires a stable supply of gas pressure and flow rate. However, the natural evaporation rate of the liquid often cannot meet actual demands, causing the liquid to cool down due to significant evaporation, and simultaneously reducing the internal gas pressure of the storage device. To address this situation, external heating is required to heat the storage device to ensure a stable and reliable gas supply.

[0003] The current mainstream heating method uses resistance wire, which has the following drawbacks: First, resistance wire is difficult to heat evenly, leading to excessively high local temperatures and posing safety hazards, potentially causing accidents. Second, resistance wire is prone to oxidation at high temperatures, increasing resistance and affecting heating performance and lifespan. Furthermore, wrapping the resistance wire with a heating blanket can cause repeated deformation or even breakage during disassembly and replacement of the gas storage device. This method also suffers from low thermal efficiency and is uneconomical in energy use. Additionally, heating rubber heating blankets with resistance wire releases noticeable odors and toxic gases, adversely affecting the working environment and personnel health.

[0004] Currently, no effective solutions have been proposed for the various problems existing in related technologies, such as low heating efficiency, significant safety hazards, environmental and health risks, and poor structural reliability. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a novel semiconductor special gas heating device and semiconductor process system, thereby solving various problems such as low heating efficiency, significant safety hazards, environmental and health risks, and poor structural reliability in related technologies.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: In a first aspect, a novel semiconductor special gas heating device is provided, comprising: The main unit is used to house the gas storage device to be heated; A liquid storage unit, which is disposed inside the main body unit, is used to store liquid; A microwave heating unit is connected to the liquid storage unit and is used to microwave heat the liquid in the liquid storage unit; A heat exchange unit, which is connected to the liquid storage unit, is used to surround the gas storage device, circulate liquid with the liquid storage unit, and heat the gas storage device. A temperature detection unit is provided in the liquid storage unit, the heat exchange unit, and the gas storage device, and is used to detect the temperature information of the liquid storage unit, the temperature information of the heat exchange unit, and the temperature information of the gas storage device. An alarm sensing unit is disposed on the main unit and is used to sense whether the main unit is turned on, to trigger an alarm when the main unit is turned on, and to trigger an alarm when an abnormal situation occurs. The control unit is communicatively connected to the microwave heating unit, the temperature detection unit, and the alarm sensing unit, and is used to control the microwave heating unit according to the temperature detection unit and the alarm sensing unit.

[0007] In some embodiments, the main body unit includes: The main component includes, inside which are arranged, the liquid storage unit, the microwave heating unit, the heat exchange unit, and the sensing alarm unit; A door element, which is movably connected to the main body element, is used to seal or open the main body element.

[0008] In some embodiments, the main body unit further includes: An observation window element is disposed on the door element to allow the user to observe the interior of the main body element.

[0009] In some embodiments, the liquid storage unit includes: The first liquid storage element is disposed inside the main body unit and communicates with the heat exchange unit and is connected to the microwave heating unit, and is used to store liquid and circulate liquid with the heat exchange unit; The first liquid outlet element is connected to the first liquid storage element and the heat exchange unit respectively, and is used to allow high-temperature liquid to flow from the first liquid storage element into the heat exchange unit; A power delivery element is disposed on the first liquid outlet element and is used to provide power for liquid delivery.

[0010] In some embodiments, the heat exchange unit includes: The second liquid storage element is connected to the liquid storage unit and is used to surround the gas storage device, circulate liquid with the liquid storage unit, and heat the gas storage device. The second liquid outlet element is connected to the second liquid storage element and the liquid storage unit, respectively, and is used to allow cryogenic liquid to flow from the second liquid storage element into the liquid storage unit.

[0011] In some embodiments, the temperature detection unit includes: A first temperature sensing element is disposed in the liquid storage unit and is communicatively connected to the control unit for detecting the temperature information of the liquid storage unit. A second temperature sensing element is disposed in the heat exchange unit and is communicatively connected to the control unit for detecting the temperature information of the heat exchange unit. A third temperature sensing element is disposed in the gas storage device and is communicatively connected to the control unit for detecting the temperature information of the gas storage device.

[0012] In some embodiments, the sensing alarm unit includes: A sensing element is disposed in the main body unit and is communicatively connected to the control unit, used to sense whether the main body unit is turned on; An alarm element is disposed in the main unit and is communicatively connected to the control unit.

[0013] In some of these embodiments, it also includes: The first fixing unit is disposed inside the main body unit and is used to fix the gas storage device; In some of these embodiments, it also includes: The second fixing unit is connected to the heat exchange unit and is used to fix the heat exchange unit to the gas storage device.

[0014] In some embodiments, the second fixing unit includes: A first fixing element abuts against the heat exchange unit; At least one first connecting element is disposed on the side of the first fixing element away from the heat exchange unit; at least one second fixing element is disposed at one end of the second fixing element and connected to the first fixing element; At least one second connecting element is disposed on the side of the second fixing element near the heat exchange unit and is removably connected to the first connecting element, for connecting the second fixing element to the first fixing element to fix the heat exchange unit to the gas storage device.

[0015] Secondly, a semiconductor process system is provided, comprising: The novel semiconductor special gas heating device and semiconductor process system described in the first aspect.

[0016] The present invention adopts the above technical solution and has the following technical effects compared with the prior art: This invention utilizes a microwave heating unit to microwave heat the liquid storage unit, which is highly safe and effectively eliminates the risk of overheating and fire from resistance heating. Its thermal efficiency is significantly better than that of resistance heating, and its energy consumption is lower. The heat exchange unit achieves heat storage and temperature control, resulting in uniform and stable temperature. The induction alarm unit provides induction alarms to effectively prevent leakage and radiation. The temperature monitoring unit provides a temperature feedback mechanism to achieve precise temperature control, making the overall operation highly efficient and reliable. Attached Figure Description

[0017] Figure 1 This is a flowchart of a novel semiconductor special gas heating device according to an embodiment of the present utility model; Figure 2 This is a schematic diagram (a) of a novel semiconductor special gas heating device according to an embodiment of the present utility model; Figure 3 This is a schematic diagram (II) of a novel semiconductor special gas heating device according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of a novel liquid storage unit and heat exchange unit according to an embodiment of the present utility model; Figure 5 This is a schematic diagram of the microwave heating unit and the second fixing unit according to an embodiment of the present utility model.

[0018] The reference numerals in the attached figures are: 100. Main body unit; 110. Main body component; 120. Door component; 130. Observation window component; 200, Liquid storage unit; 210, First liquid storage element; 211, Side body; 212, Cover; 220, First liquid outlet element; 230, Power transmission element; 300. Microwave heating unit; 400. Heat exchange unit; 410. Second liquid storage element; 420. Second liquid outlet element; 500. Temperature detection unit; 510. First temperature detection element; 520. Second temperature detection element; 530. Third temperature detection element; 600. Sensor alarm unit; 610. Sensor element; 620. Alarm element; 700, Control Unit; 800. First fixed unit; 900, Second Fixed Unit; A. New type of semiconductor special gas heating device; B. Gas storage device. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.

[0020] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0021] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0022] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that includes a series of steps or units (elements) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or apparatus. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms “multiple” / “several” used in this application refer to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can indicate: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0023] Example 1 This embodiment relates to a novel semiconductor special gas heating device of the present invention.

[0024] An illustrative embodiment of this utility model, such as Figures 1-5As shown, a novel semiconductor special gas heating device A includes a main body unit 100, a liquid storage unit 200, a microwave heating unit 300, a heat exchange unit 400, a temperature detection unit 500, a sensor alarm unit 600, and a control unit 700. The main unit 100 houses the gas storage device to be heated; the liquid storage unit 200 is located inside the main unit 100 and stores liquid; the microwave heating unit 300 is connected to the liquid storage unit 200 and microwaves the liquid in the liquid storage unit 200; the heat exchange unit 400 is connected to the liquid storage unit 200 and surrounds the gas storage device, circulates liquid with the liquid storage unit 200, and heats the gas storage device; the temperature detection unit 500 is located in the liquid storage unit 200, the heat exchange unit 400, and the gas storage device, and detects the temperature information of the liquid storage unit 200, the heat exchange unit 400, and the gas storage device; the induction alarm unit 600 is located in the main unit 100 and detects whether the main unit 100 is turned on, alarms when the main unit 100 is turned on, and alarms when an abnormal situation occurs. The control unit 700 is communicatively connected to the microwave heating unit 300, the temperature detection unit 500, and the alarm sensing unit 600, and is used to control the microwave heating unit 300 according to the temperature detection unit 500 and the alarm sensing unit 600.

[0025] In this invention, the gas storage device is generally a special gas cylinder.

[0026] In this invention, the microwave heating unit 300 includes, but is not limited to, a magnetron, which is used to efficiently convert and emit ultra-high frequency electromagnetic microwaves.

[0027] In this invention, the control unit 700 is a circuit board that integrates a microprocessor, such as an MCU or a PLC.

[0028] like Figure 3 As shown, the main unit 100 includes a main component 110 and a door component 120. The main component 110 is internally provided with a liquid storage unit 200, a microwave heating unit 300, a heat exchange unit 400, and a sensor alarm unit 600; the door component 120 is movably connected to the main component 110 and is used to seal or open the main component 110.

[0029] In this utility model, the main component 110 is manufactured using sheet metal technology, and the internal settings of the main component 110 must be set according to certain safety standards. For example, the material must be stainless steel or other metals, and the edges of the main component 110 must use microwave suppression springs to ensure that there is no gap leakage when the door is closed.

[0030] The movable connection between the door element 120 and the main body element 110 is a hinge.

[0031] The edges of door element 120 must use microwave-suppressed reeds to ensure that there is absolutely no gap leakage when the door is closed.

[0032] Furthermore, the main unit 100 also includes an observation window element 130. The observation window element 130 is disposed on the door element 120 and is used to allow the user to observe the internal situation of the main unit 110.

[0033] The observation window element 130 is made of metal mesh glass, which can effectively achieve electromagnetic shielding and allow operators to inspect and observe.

[0034] like Figure 3 As shown, the liquid storage unit 200 includes a first liquid storage element 210, a first liquid outlet element 220, and a power transmission element 230. The first liquid storage element 210 is disposed inside the main body unit 100 and communicates with the heat exchange unit 400 and the microwave heating unit 300, for storing liquid and circulating it with the heat exchange unit 400. The first liquid outlet element 220 communicates with both the first liquid storage element 210 and the heat exchange unit 400, for supplying high-temperature liquid from the first liquid storage element 210 into the heat exchange unit 400. The power transmission element 230 is disposed on the first liquid outlet element 220 and provides power for liquid transport.

[0035] Specifically, the first liquid storage element 210 is disposed inside the main body element 110.

[0036] In some embodiments, the first liquid storage element 210 includes a side body 211 and a cover 212. The side body 211 is disposed on the side of the first liquid storage element 210; the cover 212 is disposed on the upper surface of the side body 211 and is provided with a first liquid dispensing element 220.

[0037] In this invention, the first liquid storage element 210 is made of polyethylene terephthalate.

[0038] The first liquid outlet element 220 is sealed to the cover 212 of the first liquid storage element 210.

[0039] In this invention, the first liquid outlet element 220 includes, but is not limited to, a pipe.

[0040] In this invention, the ports of the first liquid outlet element 220 and the first liquid storage element 210 are fixedly connected.

[0041] In this invention, the distance between the end of the first liquid outlet element 220 and the bottom of the first liquid storage element 210 is lower than the minimum liquid level required by the first liquid storage element 210.

[0042] In this invention, the power transmission element 230 is a hot water pump that responds to system commands in real time to start, stop, speed, or flow rate adjustment, thereby achieving continuous circulation of hot water within the heat exchange unit 400 and maintaining a more stable temperature.

[0043] Furthermore, the liquid storage unit 200 also includes a first liquid level detection element. The first liquid level detection element is disposed inside the first liquid storage element 210 and connected to the control unit 700, and is used to detect the water level of the first liquid storage element 210.

[0044] In some of these embodiments, the first liquid level detection element includes, but is not limited to, a capacitive liquid level sensor.

[0045] like Figure 3 As shown, the heat exchange unit 400 includes a second liquid storage element 410 and a second liquid outlet element 420. The second liquid storage element 410 is connected to the liquid storage unit 200 and is used to surround the gas storage device, circulate liquid with the liquid storage unit 200, and heat the gas storage device. The second liquid outlet element 420 is connected to both the second liquid storage element 410 and the liquid storage unit 200 and is used to allow cryogenic liquid to flow from the second liquid storage element 410 into the liquid storage unit 200.

[0046] Specifically, the second liquid storage element 410 is connected to the first liquid outlet element 220; the second liquid outlet element 420 is connected to the first liquid storage element 210.

[0047] In this invention, the second liquid storage element 410 is made of fluoroplastic film, which has excellent chemical inertness and high temperature resistance, up to 260°C. An additional braided layer is added to the outside to increase the wear resistance of the material and to provide good flexibility, allowing it to be bent and bound to the gas storage device B for continuous heating.

[0048] In this invention, the ports of the second liquid outlet element 420 and the second liquid storage element 410 are fixedly connected.

[0049] In this invention, the second liquid outlet element 420 includes, but is not limited to, a pipe.

[0050] In this invention, the second liquid outlet element 420 is made of a non-metallic heat-resistant material.

[0051] like Figure 4As shown, the temperature detection unit 500 includes a first temperature detection element 510, a second temperature detection element 520, and a third temperature detection element 530. The first temperature detection element 510 is disposed in the liquid storage unit 200 and is communicatively connected to the control unit 700, used to detect the temperature information of the liquid storage unit 200; the second temperature detection element 520 is disposed in the heat exchange unit 400 and is communicatively connected to the control unit 700, used to detect the temperature information of the heat exchange unit 400; the third temperature detection element 530 is disposed in the gas storage device and is communicatively connected to the control unit 700, used to detect the temperature information of the gas storage device.

[0052] In some of these embodiments, the first temperature sensing element 510, the second temperature sensing element 520, and the third temperature sensing element 530 are microwave-specific temperature sensing elements.

[0053] In this invention, the first temperature sensing element 510 is positioned below the lowest water level of the first liquid storage element 210.

[0054] In this invention, the number of first temperature sensing elements 510 is greater than or equal to one. If the number of first temperature sensing elements 510 is one, the first temperature sensing elements 510 are distributed at the intersection of the midpoint line of the lowest water level line of the first liquid storage element 210 and the midpoint line of the length of the first liquid storage element 210; if the number of first temperature sensing elements 510 is greater than two, one first temperature sensing element 510 is located at the junction of the second liquid outlet element 420 and the first liquid storage element 210, and the remaining first temperature sensing elements 510 are evenly and symmetrically distributed on multiple surfaces of the first liquid storage element 210, with each surface located at the intersection of the midpoint line of the lowest water level line of the first liquid storage element 210 and the midpoint line of the length of the first liquid storage element 210.

[0055] In this invention, the second temperature sensing element 520 is disposed on the side of the heat exchange unit 400 facing the gas storage device.

[0056] In this invention, there is one or more second temperature sensing elements 520. If there is one second temperature sensing element 520, it is distributed at the center of the heat exchange unit 400; if there are more than two second temperature sensing elements 520, one second temperature sensing element 520 is located at the center of the heat exchange unit 400, and the remaining second temperature sensing elements 520 are evenly distributed on the inner surface of the heat exchange unit 400.

[0057] The third temperature sensing element 530 is located at the gas storage device surrounding the heat exchange unit 400.

[0058] In this invention, there is one or more third temperature sensing elements 530. If there is one third temperature sensing element 530, it is disposed around the second temperature sensing element 520; if there are more than two third temperature sensing elements 530, one second temperature sensing element 520 is disposed around the second temperature sensing element 520, and the remaining third temperature sensing elements 530 are evenly distributed on the outer surface of the gas storage device.

[0059] like Figure 3 As shown, the sensing alarm unit 600 includes a sensing element 610 and an alarm element 620. The sensing element 610 is disposed in the main unit 100 and is communicatively connected to the control unit 700, and is used to sense whether the main unit 100 is turned on; the alarm element 620 is disposed in the main unit 100 and is communicatively connected to the control unit 700, and is used to sound an alarm when the main unit 100 is turned on and when an abnormal situation occurs.

[0060] Specifically, the sensing element 610 is located on the door element 120 and is used to sense whether the door element 120 is opened; the alarm element 620 is located on the main body element 110.

[0061] In this invention, the sensing element 610 includes, but is not limited to, a built-in magnetic induction switch. It senses the opening and closing state of the door. When the door is closed, a magnetic induction signal is input to the control unit 700 in the induction alarm unit 600, indicating that microwave heating is required before the relevant devices can be activated. If the door is not properly closed, the magnetic induction signal input system can disconnect the microwave heating unit 300 and trigger an alarm.

[0062] In this invention, the alarm element 620 includes, but is not limited to, audible and / or visual alarm elements, which can alert staff to handle abnormal states set in the alarm system.

[0063] Figure 5 As shown, the semiconductor special gas heating device A also includes a first fixing unit 800, which is disposed inside the main body unit 100 and is used to fix the gas storage device B.

[0064] Further, the second fixing unit 900 includes a first fixing element, at least one first connecting element, at least one second fixing element, and at least one second connecting element. The first fixing element abuts against the heat exchange unit 400; the first connecting element is disposed on the side of the first fixing element away from the heat exchange unit 400; one end of the second fixing element is connected to the first fixing element; the second connecting element is disposed on the side of the second fixing element near the heat exchange unit 400 and is removably connected to the first connecting element, for connecting the second fixing element to the first fixing element to fix the second liquid storage element 410 to the gas storage device.

[0065] Specifically, the first fixing element abuts against the second liquid storage element 410; the first connecting element is disposed on the side of the first fixing element away from the second liquid storage element 410; and the second connecting element is disposed on the side of the second fixing element close to the second liquid storage element 410.

[0066] In this invention, the length of the first fixing element is not greater than the length of the second liquid storage element 410, and the width of the first fixing element is not greater than the width of the second liquid storage element 410.

[0067] In some of these embodiments, the first fixing element includes, but is not limited to, a strap.

[0068] In this invention, one end of the first connecting element is fixedly connected to or detachably connected to the first fixing element, including but not limited to adhesive or snap-fit ​​connection.

[0069] In this invention, the width of the first connecting element is not greater than the width of the first fixing element.

[0070] In some embodiments, there are multiple first connecting elements. The multiple first connecting elements are spaced apart along the width direction of the first fixing element.

[0071] In some of these embodiments, the first connecting element includes, but is not limited to, a Velcro strap.

[0072] In this invention, the second fixing element is detachably connected to the first fixing element, including but not limited to existing snap-fit ​​connections, Velcro connections, hook-and-loop connections, hook connections, magnetic connections, and quick clamps / lever buckles.

[0073] In this invention, the width of the second fixing element is equal to the width of the first fixing element.

[0074] In this invention, the second fixing element includes, but is not limited to, a strap.

[0075] In this invention, one end of the second connecting element is fixedly connected to or detachably connected to the second fixing element, including but not limited to adhesive or Velcro connection.

[0076] In this invention, the width of the second connecting element is not greater than the width of the second fixing element.

[0077] In some embodiments, there are multiple second connecting elements. These multiple second connecting elements are spaced apart along the width direction of the second fixing element.

[0078] In this invention, the number of second connecting elements is equal to the number of first connecting elements.

[0079] In some embodiments, the second connecting element includes, but is not limited to, a Velcro hook-and-loop fastener.

[0080] The method of using this utility model is as follows: Initial operation of the equipment: When the gas storage device B needs to be heated, the second liquid storage element 410 is tied to the corresponding position of the gas storage device B through the second fixing unit 900. The required parameters are adjusted and the door element 120 is closed. The sensing element 610 transmits safety information to the control unit 700. The microwave heating unit 300 starts to operate and heats the liquid inside the first liquid storage element 210. The first temperature detection element 510 detects its temperature in real time. After heating is completed, the power delivery element 230 operates and draws hot water from the first liquid outlet element 220 into the second liquid storage element 410 to heat the gas storage device B. Temperature detection elements are installed inside the second liquid storage element 410 and on the gas storage device B to detect the heating status in real time and transmit it to the control unit 700 for judgment. The second liquid outlet element 420 drains water at a certain flow rate to ensure a continuous supply of hot water in the second liquid storage element 410 and a stable heating temperature.

[0081] During equipment operation: Temperature detection units 500 are installed inside the second liquid storage element 410, the gas storage device B, and the first liquid storage element 210. All three have set temperature thresholds, and the following conditions apply: 1. The temperature of the gas storage device B is low, the temperature of the second liquid storage element 410 is high, and the temperature inside the first liquid storage element 210 is normal. At this time, the equipment will delay the alarm without triggering the alarm element 620, and start timing. When this state lasts longer than a certain critical time point, the temperature inside the first liquid storage element 210 will be heated without triggering its highest temperature. 2. When the temperature of the gas storage device B is low and the temperature of the second liquid storage element 410 is low, the microwave heating unit 300 will start under safe conditions. 3. When the gas storage device B and the second liquid storage element 410 approach the threshold temperature, and the first temperature detection element 510 in the first liquid storage element 210 reaches the lowest temperature first, the microwave heating unit 300 is activated, and the water in the first liquid storage element 210 is heated; after being heated to a certain temperature, the microwave heating unit 300 is turned off, and the cycle repeats.

[0082] The advantages of this invention are as follows: it uses a microwave heating unit to microwave heat the liquid storage unit, which is highly safe and can effectively eliminate the risk of overheating and fire. The thermal efficiency is significantly better than that of resistance heating and the energy consumption is lower. It achieves heat storage and temperature control through a heat exchange unit, resulting in uniform and stable temperature. It uses an induction alarm unit for induction alarm, which effectively prevents leakage and radiation. It uses a temperature monitoring unit for temperature feedback mechanism, which achieves precise temperature control. Overall, the operation is highly efficient and reliable.

[0083] Example 2 This embodiment is a modified embodiment of Embodiment 1. The difference between this embodiment and Embodiment 1 is that the structure of the liquid storage unit 200 is different.

[0084] In this embodiment, the liquid storage unit 200 further includes a third liquid storage element and a third liquid outlet element. The top end of the third liquid storage element is connected to the second liquid outlet element 420 and is used to store and microwave heat the low-temperature liquid flowing out of the second liquid storage element 410. The third liquid outlet element is disposed on the side end of the third liquid storage element and is used to allow high-temperature liquid to flow from the third liquid storage element into the first liquid storage element 210.

[0085] The third liquid storage element is basically the same as the first liquid storage element 210 in the embodiment, and will not be described again here.

[0086] In some of these embodiments, the third liquid outlet element is sealed to the first liquid storage element 210 and the third liquid storage element.

[0087] In this invention, the third liquid outlet element includes, but is not limited to, a pipe.

[0088] In this invention, the ports of the third liquid outlet element and the first liquid storage element 210, as well as the port of the third liquid storage element, are fixedly connected.

[0089] In this invention, both ends of the third liquid outlet element are located below the minimum liquid level required by the first liquid storage element 210 and the third liquid storage element.

[0090] Furthermore, the liquid storage unit 200 also includes a valve element. The valve element is located at one end of the third liquid outlet element near the third liquid storage element and is communicatively connected to the control unit 700, used to open or close the third liquid outlet element under the action of the control unit 700.

[0091] Furthermore, the liquid storage unit 200 also includes a second liquid level detection element. This second liquid level detection element is disposed inside the third liquid storage element and connected to the control unit 700, and is used to detect the water level of the third liquid storage element.

[0092] In this invention, the water level threshold of the third liquid storage element is different from the water level threshold of the first liquid storage element 210.

[0093] In some embodiments, the second liquid level detection element includes, but is not limited to, a capacitive liquid level sensor. The advantage of this invention is that, in extremely cold environments, heated water flows through three channels, transferring heat to the gas storage device for further heating. During this process, the water temperature can easily drop rapidly. If it were directly fed into the first liquid storage element, it could lead to uneven temperature distribution and insufficient heating time, preventing the hot water in the heat exchange unit from reaching a suitable temperature to continuously heat the gas storage device. Therefore, a third liquid storage element is added, which can continuously heat the dissipated portion during water circulation, ensuring that the water temperature pumped into the heat exchange unit remains stable. As the water level in the first liquid storage element decreases, the hot water in the third liquid storage element can be replenished in time, maintaining the overall water temperature at a high level and thus providing a continuous and stable supply of sufficient heat to the gas storage device.

[0094] Example 3 A semiconductor process system includes a novel semiconductor special gas heating device A as described in any of Examples 1-2.

[0095] The usage method of this embodiment is basically the same as that of Embodiments 1 to 2, and will not be repeated here.

[0096] The technical effects of this embodiment are basically the same as those of Embodiments 1 and 2, and will not be repeated here.

[0097] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel semiconductor special gas heating device, characterized in that, include: The main unit is used to house the gas storage device to be heated; A liquid storage unit, which is disposed inside the main body unit, is used to store liquid; A microwave heating unit is connected to the liquid storage unit and is used to microwave heat the liquid in the liquid storage unit; A heat exchange unit, which is connected to the liquid storage unit, is used to surround the gas storage device, circulate liquid with the liquid storage unit, and heat the gas storage device. A temperature detection unit is provided in the liquid storage unit, the heat exchange unit, and the gas storage device, and is used to detect the temperature information of the liquid storage unit, the temperature information of the heat exchange unit, and the temperature information of the gas storage device. An alarm sensing unit is disposed on the main unit and is used to sense whether the main unit is turned on, to trigger an alarm when the main unit is turned on, and to trigger an alarm when an abnormal situation occurs. The control unit is communicatively connected to the microwave heating unit, the temperature detection unit, and the alarm sensing unit, and is used to control the microwave heating unit according to the temperature detection unit and the alarm sensing unit.

2. The novel semiconductor special gas heating device according to claim 1, characterized in that, The main body unit includes: The main component includes, inside which are arranged, the liquid storage unit, the microwave heating unit, the heat exchange unit, and the sensing alarm unit; A door element, which is movably connected to the main body element, is used to seal or open the main body element.

3. The novel semiconductor special gas heating device according to claim 2, characterized in that, The main body unit also includes: An observation window element is disposed on the door element to allow the user to observe the interior of the main body element.

4. The novel semiconductor special gas heating device according to claim 1, characterized in that, The liquid storage unit includes: The first liquid storage element is disposed inside the main body unit and communicates with the heat exchange unit and is connected to the microwave heating unit, and is used to store liquid and circulate liquid with the heat exchange unit; The first liquid outlet element is connected to the first liquid storage element and the heat exchange unit respectively, and is used to allow high-temperature liquid to flow from the first liquid storage element into the heat exchange unit; A power delivery element is disposed on the first liquid outlet element and is used to provide power for liquid delivery.

5. The novel semiconductor special gas heating device according to claim 1, characterized in that, The heat exchange unit includes: The second liquid storage element is connected to the liquid storage unit and is used to surround the gas storage device, circulate liquid with the liquid storage unit, and heat the gas storage device. The second liquid outlet element is connected to the second liquid storage element and the liquid storage unit, respectively, and is used to allow cryogenic liquid to flow from the second liquid storage element into the liquid storage unit.

6. The novel semiconductor special gas heating device according to claim 1, characterized in that, The temperature detection unit includes: A first temperature sensing element is disposed in the liquid storage unit and is communicatively connected to the control unit for detecting the temperature information of the liquid storage unit. A second temperature sensing element is disposed in the heat exchange unit and is communicatively connected to the control unit for detecting the temperature information of the heat exchange unit. A third temperature sensing element is disposed in the gas storage device and is communicatively connected to the control unit for detecting the temperature information of the gas storage device.

7. The novel semiconductor special gas heating device according to claim 1, characterized in that, The sensing alarm unit includes: A sensing element is disposed in the main body unit and is communicatively connected to the control unit, used to sense whether the main body unit is turned on; An alarm element is disposed in the main unit and is communicatively connected to the control unit.

8. The novel semiconductor special gas heating device according to any one of claims 1 to 7, characterized in that, Also includes: The first fixing unit is disposed inside the main body unit and is used to fix the gas storage device; and / or The second fixing unit is connected to the heat exchange unit and is used to fix the heat exchange unit to the gas storage device.

9. The novel semiconductor special gas heating device according to claim 8, characterized in that, The second fixing unit includes: A first fixing element abuts against the heat exchange unit; At least one first connecting element is disposed on the side of the first fixing element away from the heat exchange unit; at least one second fixing element is disposed at one end of the second fixing element and connected to the first fixing element; At least one second connecting element is disposed on the side of the second fixing element near the heat exchange unit and is removably connected to the first connecting element, for connecting the second fixing element to the first fixing element to fix the heat exchange unit to the gas storage device.

10. A semiconductor process system, characterized in that, include: The novel semiconductor special gas heating device as described in any one of claims 1 to 9.

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