A hot water tank cooling and discharging system and a semiconductor production line

CN224887416UActive Publication Date: 2026-10-23JIANGSU QIWEI SEMICON EQUIP CO LTD +1
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Patent Information

Application Number
CN202522202108.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-17
Publication Date
2026-10-23
Estimated Expiration
2035-10-17

AI Technical Summary

Technical Problem

[0003]但采用循环式冷却水的方式会存在以下问题,冷却时间会受限与排放速度,通常需要在130s内冷却热水(在热水槽20L-60℃,冷却槽30L-23℃时得出),而通过冷却槽通入循环冷却水的方式排放时间会在9min左右(在冷却槽20L-60℃,冷却循环水20℃,流量为16LPM时得出),在碰到需要在短时间内排放多槽热水时,对降温时间要求更高,因此当需要增加降温效果时,需要更加循环管的长度或尺寸,所以对空间的要求大,尤其面对热水槽出现连续排放多次的情况,对冷却槽的容积要求更大,但是受限于场地要求,湿法清洗设备在朝着小型化方向不断发展,因此无法满足客户的使用需求

Benefits of technology

[0028]本实用新型提供的热水槽降温排放系统,使用时,将热水槽和冷却槽均安装于清洗容器之内,也就是说,清洗容器能够对产生的中和水进行承接,以避免中和水的迸溅污染,还设有供水管,供水管用于向冷却槽内输送冷却水,也就是说,热水槽内的排入冷却槽,通过冷却水进入冷却槽实现冷水和热水的中和,实现对热水的降温,提升了对热水的降温效率,进而有利于降低冷却排水装置的整体尺寸,满足客户的使用需求。

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Abstract

The utility model discloses a hot water tank cooling and discharging system and semiconductor production line relates to the technical field of semiconductor manufacturing, the above -mentioned hot water tank cooling and discharging system includes washing container, hot water tank, cooling tank and water supply pipe, and washing container communicates with sewage pipeline, and hot water tank is located inside washing container, and cooling tank is located inside washing container, and hot water tank communicates with cooling tank, and water supply pipe communicates with cooling tank, and the neutralization of cold water and hot water is realized through cooling water into cooling tank, realizes the cooling of hot water, improves the cooling efficiency of hot water, and then is favorable to reducing the overall size of cooling and draining device, satisfies the use demand of customer.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, to a hot water tank cooling and drainage system. Furthermore, this utility model also relates to a semiconductor production line including the aforementioned hot water tank cooling and drainage system. Background Technology

[0002] In semiconductor wet cleaning, high-temperature solutions are often used to clean impurities on the wafer surface. To prevent cross-contamination of the solutions, hot water (50~75℃) is usually used to rinse and remove the solutions after the high-temperature solution cleaning process. However, the hot water is subject to temperature requirements of the plant's drainage pipes. Therefore, the hot water is usually cooled down (≤45℃) before being discharged into the plant's drainage pipes. In this case, the usual practice is to first discharge the hot water into a cooling tank for cooling. The cooling tank is filled with circulating cooling water, and the water is discharged into the plant's drainage pipes after it has cooled down to the target temperature.

[0003] However, using a circulating cooling water system presents several challenges. Cooling time is limited by the discharge rate, typically requiring cooling the hot water within 130 seconds (based on a hot water tank temperature of 20L-60℃ and a cooling tank temperature of 30L-23℃). Discharge via circulating cooling water through the cooling tank takes approximately 9 minutes (based on a cooling tank temperature of 20L-60℃, circulating cooling water temperature of 20℃, and a flow rate of 16 LPM). When multiple tanks of hot water need to be discharged in a short time, the cooling time requirement is even higher. Therefore, to enhance the cooling effect, the length or size of the circulation pipe needs to be increased, resulting in greater space requirements. This is especially true when multiple discharges from the hot water tank occur consecutively, requiring a larger cooling tank volume. However, due to site constraints, wet cleaning equipment is increasingly being miniaturized, making it impossible to meet customer needs.

[0004] In conclusion, how to improve the drainage and cooling efficiency of hot water tanks is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a hot water tank cooling and discharge system that rapidly cools the hot water discharged from the hot water tank, thereby improving the hot water cooling efficiency. This also helps to reduce the overall size of the cooling tank, meeting the need for equipment miniaturization.

[0006] Another objective of this invention is to provide a semiconductor production line that includes the aforementioned hot water tank cooling and discharge system.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A hot water tank cooling and drainage system includes:

[0009] A cleaning container, wherein the cleaning container is connected to a sewage pipe;

[0010] A hot water tank, located inside a cleaning container;

[0011] A cooling tank is located inside the cleaning container, and the hot water tank is connected to the cooling tank.

[0012] A water supply pipe, which is connected to the cooling tank.

[0013] Furthermore, in this invention, the cooling tank is located below the hot water tank.

[0014] Furthermore, the cross-sectional area of ​​the cooling tank is larger than that of the hot water tank, so that the projected area of ​​the hot water tank at the bottom of the cooling tank is completely within the projected area of ​​the cooling tank at the bottom of the cooling tank.

[0015] Furthermore, this utility model also includes:

[0016] A valve assembly, comprising a first valve, wherein a drain outlet is provided at the bottom of the hot water tank, the first valve being installed in the hot water tank and used to control the opening and closing of the drain outlet.

[0017] Furthermore, this utility model also includes:

[0018] The detection component includes a first temperature sensor, which is installed in a cooling tank and electrically connected to the controller.

[0019] Furthermore, the bottom of the cleaning container is equipped with a drain pipe, and a branch pipe is provided on the water supply pipe, which is connected to the drain pipe.

[0020] Furthermore, the valve assembly further includes:

[0021] The second valve is installed on the branch pipe.

[0022] The third valve is installed on the water supply pipe.

[0023] Furthermore, the detection component of this invention also includes:

[0024] The second temperature sensor is installed on the drain pipe and is electrically connected to the controller.

[0025] Furthermore, the detection component of this invention also includes:

[0026] A level gauge is installed in a cooling tank and is electrically connected to a controller.

[0027] A semiconductor production line includes the hot water tank cooling and discharge system described in any of the above claims.

[0028] The hot water tank cooling and drainage system provided by this utility model involves installing both the hot water tank and the cooling tank inside a cleaning container. This means the cleaning container can collect the generated neutralized water to prevent splashing and contamination. A water supply pipe is also provided to deliver cooling water to the cooling tank. In other words, the water from the hot water tank is discharged into the cooling tank, and the cooling water entering the cooling tank neutralizes the hot and cold water, thus cooling the hot water and improving its cooling efficiency. This, in turn, helps to reduce the overall size of the cooling drainage device and meets customer needs.

[0029] The semiconductor production line provided by this utility model includes the above-mentioned hot water tank cooling and discharge system, and has the above-mentioned beneficial effects. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0031] Figure 1 This is a structural diagram illustrating a specific implementation of the system provided by this utility model.

[0032] Figure 1 In the accompanying drawings, the reference numerals include:

[0033] 1. Cleaning container; 2. Hot water tank; 3. Cooling tank; 4. Water supply pipe; 5. First valve; 6. First temperature sensor; 7. Drain pipe; 8. Branch pipe; 9. Second valve; 10. Second temperature sensor; 11. Level gauge; 12. Third valve. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] The core of this invention is to provide a hot water tank cooling and discharge system that rapidly cools the hot water discharged from the tank, improving the cooling efficiency. This also helps to reduce the overall size of the cooling tank, meeting the need for equipment miniaturization.

[0036] Another core aspect of this invention is to provide a semiconductor production line that includes the aforementioned hot water tank cooling and discharge system.

[0037] Please refer to Figure 1 A hot water tank cooling and discharge system includes a cleaning container 1, a hot water tank 2, a cooling tank 3, and a water supply pipe 4. The cleaning container 1 is connected to a sewage pipe, the hot water tank 2 is located inside the cleaning container 1, the cooling tank 3 is located inside the cleaning container 1, the hot water tank 2 is connected to the cooling tank 3, and the water supply pipe 4 is connected to the cooling tank 3.

[0038] It should be noted that, in this embodiment of the present invention, the cleaning container 1 is a cleaning chamber with a closed or open state. The closure can be achieved by a cover plate or other structure, which can prevent the cleaning liquid from splashing.

[0039] In addition, in this embodiment of the utility model, the sewage pipe refers to the sewage collection pipe of the factory and production line, through which the neutralized water containing cleaning agents is centrally treated.

[0040] In addition, in this embodiment of the present invention, the hot water tank 2 is used for cleaning wafers, and the hot water tank 2 is fixed to the cleaning container 1 by welding or other means.

[0041] Optionally, in some embodiments, the cleaning container 1 is provided with a bracket inside, the bracket is installed inside the cleaning container 1 and is used to support the hot water tank 2, the hot water tank 2 can be fixed to the bracket by welding or bolts.

[0042] In the above embodiments, the cooling tank 3 can be fixed to the bracket by welding or bolts.

[0043] Optionally, in some embodiments, the bottom of the hot water tank 2 is provided with a pipe, and the pipe is connected to the cold water tank to realize the discharge of hot water.

[0044] In use, both the hot water tank 2 and the cooling tank 3 are installed inside the cleaning container 1. This means that the cleaning container 1 can receive the generated neutralized water to avoid splashing and contamination. It is also equipped with a water supply pipe 4, which is used to supply cooling water to the cooling tank 3. In other words, the water discharged from the hot water tank 2 enters the cooling tank 3, and the cold water and hot water are neutralized through the cooling water entering the cooling tank 3, thereby cooling the hot water and improving the cooling efficiency of the hot water. This also helps to reduce the overall size of the cooling drainage device and meet the user's needs.

[0045] Please refer to Figure 1In some embodiments, the cooling tank 3 is located below the hot water tank 2. In this configuration, at least one drain hole can be opened at the bottom of the hot water tank 2. Hot water can directly enter the cooling tank 3 through the drain hole under the action of gravity, thereby achieving the neutralization of cold water and hot water, reducing the need for additional power drainage, and helping to reduce costs.

[0046] In the above embodiments, the opening and closing of the drain hole can be controlled by installing a valve at the drain hole to meet the cleaning requirements.

[0047] Please refer to Figure 1 In some embodiments, the cross-sectional area of ​​the cooling tank 3 is larger than that of the hot water tank 2, so that the projected area of ​​the hot water tank 2 at the bottom of the cooling tank 3 is completely within the projected area of ​​the cooling tank 3 at the bottom of the cooling tank 3. That is, the cooling tank 3 is larger than the hot water tank 2, so the cooling tank 3 can completely receive the hot water discharged from the hot water tank 2.

[0048] In the above embodiment, the hot water tank 2 is provided with several overflow ports, so that when there is a lot of hot water in the hot water tank 2, it can be quickly discharged through the overflow ports and completely enter the cooling tank 3 after being quickly discharged, which is beneficial to improving the effect of neutralizing the amount of hot water in a short time.

[0049] Optionally, in some embodiments, the cooling tank 3 discharges cooling water by overflow, which can further improve the neutralization effect of hot and cold water.

[0050] Optionally, in some embodiments, the cooling tank 3 is provided with a plurality of overflow ports, through which cooling water is discharged. At the same time, the overflow ports adopt a diffusion structure, which can increase the dispersion effect when the cooling water is discharged, increase the contact area between the neutralized water and the air when it is discharged, thereby helping to further reduce the temperature of the neutralized water and reduce the waste of cooling water.

[0051] Optionally, in some embodiments, a fan is installed inside the cleaning container 1, and the hot water flowing out of the hot water tank 2 is cooled by blowing the fan, thereby reducing the temperature of the hot water entering the cooling tank 3, which helps to reduce the use of cooling water.

[0052] Optionally, in some embodiments, a cooling water recovery device is provided. The recovery device specifically includes a collection tank. A portion of the neutralized water after being neutralized in the cooling tank 3 is output to the collection tank through a pipe and naturally cooled in the collection tank. After reaching the target temperature, it is rinsed and used as cooling tank 3.

[0053] In the above embodiments, there are several collection tanks, and each collection tank is set independently. Therefore, the cooling water can be reused to a great extent through the circulation of several collection tanks, which greatly reduces the cost.

[0054] In the above embodiment, a cooling component is provided in the collection tank. The cooling component is a circulation pipe. By circulating water in the circulation pipe, the neutralized water concentrated in the collection tank can be cooled down quickly, thereby further improving the reuse efficiency of the cooling water.

[0055] Please refer to Figure 1 In some embodiments, a valve assembly is also included, which includes a first valve 5. The bottom of the hot water tank 2 is provided with a drain outlet. The first valve 5 is installed on the hot water tank 2 and is used to control the opening and closing of the drain outlet. That is, the hot water in the hot water tank 2 is controlled to be discharged through the first valve 5.

[0056] Please refer to Figure 1 In some embodiments, a detection component and a controller are also included. The detection component includes a first temperature sensor 6, which is installed in the cooling tank 3 and electrically connected to the controller. That is, the temperature of the neutralized water in the cooling tank 3 is detected by setting the first temperature sensor 6, and the temperature is fed back to the controller. The controller controls the working state of the water pump in the water supply pipe 4. Specifically, when the water temperature in the cooling tank 3 rises, the water pump increases the flow rate to quickly reduce the temperature of the water flow in the cooling tank 3.

[0057] In some embodiments, the first valve 5 is a solenoid valve and is electrically connected to the controller to control the amount of hot water entering the cooling tank 3 from the hot water tank 2.

[0058] Please refer to Figure 1 In some embodiments, a drain pipe 7 is installed at the bottom of the cleaning container 1, and a branch pipe 8 is provided on the water supply pipe 4. The branch pipe 8 is connected to the drain pipe 7. That is, by adding the branch pipe 8, a portion of the cooling water in the water supply pipe 4 flows directly into the drain pipe 7, thereby cooling the neutralized water entering the drain pipe 7. This can prevent the hot water tank 2 from being discharged in a short time and thus failing to cool completely. In this way, the overheated water entering the sewage pipe can be further cooled to maintain the required temperature for the water entering the sewage pipe.

[0059] Please refer to Figure 1 In some embodiments, the valve assembly further includes a second valve 9, which is installed on the branch pipe 8. The opening and closing of the branch pipe 8 is controlled by the second valve 9. The second valve 9 may be a solenoid valve and is electrically connected to the controller. Therefore, when a large amount of hot water is discharged from the hot water tank 2 for a short time, the controller controls the second valve 9 to open.

[0060] Please refer to Figure 1 In some embodiments, the valve assembly further includes a third valve 12, which is used to control the opening and closing of the water supply pipe 4, thereby controlling the amount of cooling water entering the pipe.

[0061] Please refer to Figure 1 In some embodiments, the detection component further includes a second temperature sensor 10, which is installed on the drain pipe 7 and electrically connected to the controller. The second temperature sensor 10 detects the temperature of the warm water entering the drain pipe 7. When the temperature exceeds the preset temperature, the controller controls the second valve 9 to open, so that a portion of the cooling water in the water supply pipe 4 flows directly into the drain pipe 7, thereby cooling the neutralized water entering the drain pipe 7.

[0062] Please refer to Figure 1 In some embodiments, the detection component also includes a level gauge 11, which is installed in the cooling tank 3 and electrically connected to the controller. The level gauge 11 is used to detect the amount of water in the cooling tank 3. When less water is discharged from the hot water tank 2, the level in the cooling tank 3 will drop, and less cooling water is needed for neutralization. Therefore, the level gauge 11 transmits the level signal to the controller, and the controller controls the water supply efficiency of the water pump according to the signal.

[0063] A semiconductor production line includes the aforementioned hot water tank cooling and discharge system.

[0064] In other words, the key point of this utility model is that the cleaning container 1 can receive the generated neutralized water to avoid splashing and contamination. It is also equipped with a water supply pipe 4, which is used to deliver cooling water into the cooling tank 3. That is, the water discharged from the hot water tank 2 enters the cooling tank 3, and the cold water and hot water are neutralized by entering the cooling tank 3, thereby cooling the hot water and improving the cooling efficiency of the hot water. This helps to reduce the overall size of the cooling drainage device and meet the needs of customers.

[0065] In addition to the hot water tank cooling and discharge system disclosed in the above embodiments, this utility model also provides a semiconductor production line including the above-mentioned hot water tank cooling and discharge system. For the structure of other parts of the semiconductor production line, please refer to the prior art, which will not be described in detail here.

[0066] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0067] The above provides a detailed description of a hot water tank cooling and discharge system and a semiconductor production line provided by this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A hot water tank cooling and drainage system, characterized in that, include: A cleaning container (1) is connected to a sewage pipe; Hot water tank (2), the hot water tank (2) is located inside the cleaning container (1); Cooling tank (3), the cooling tank (3) is located inside the cleaning container (1), and the hot water tank (2) is connected to the cooling tank (3); Water supply pipe (4) is connected to cooling tank (3).

2. The hot water tank cooling and discharge system according to claim 1, characterized in that, The cooling tank (3) is located below the hot water tank (2).

3. The hot water tank cooling and discharge system according to claim 2, characterized in that, The cross-sectional area of ​​the cooling tank (3) is larger than that of the hot water tank (2) so that the projected area of ​​the hot water tank (2) at the bottom of the cooling tank (3) is completely within the projected area of ​​the cooling tank (3) at the bottom of the cooling tank (3).

4. The hot water tank cooling and discharge system according to claim 3, characterized in that, Also includes: The valve assembly includes a first valve (5), and the bottom of the hot water tank (2) is provided with a drain outlet. The first valve (5) is installed on the hot water tank (2) and is used to control the opening and closing of the drain outlet.

5. The hot water tank cooling and discharge system according to claim 4, characterized in that, Also includes: The detection component includes a first temperature sensor (6), which is installed in a cooling tank (3) and electrically connected to the controller.

6. The hot water tank cooling and discharge system according to claim 5, characterized in that, The bottom of the cleaning container (1) is equipped with a drain pipe (7), and the water supply pipe (4) is provided with a branch pipe (8), which is connected to the drain pipe (7).

7. The hot water tank cooling and discharge system according to claim 6, characterized in that, The valve assembly also includes: The second valve (9) is installed on the branch pipe (8); The third valve (12) is installed on the water supply pipe (4).

8. The hot water tank cooling and discharge system according to claim 7, characterized in that, The detection component also includes: The second temperature sensor (10) is installed on the drain pipe (7) and is electrically connected to the controller.

9. The hot water tank cooling and discharge system according to any one of claims 5-8, characterized in that, The detection component also includes: A level gauge (11) is installed in a cooling tank (3) and is electrically connected to a controller.

10. A semiconductor production line, characterized in that, Includes the hot water tank cooling and discharge system as described in any one of claims 1-9.