Probe station wafer chucking station cooling device

Abstract

The utility model relates to wafer detection technical field especially probe station wafer piece bearing platform cooling equipment, the upper end of chassis is provided with cooling runner, the side of cooling runner is provided with water inlet, the other side of cooling runner is provided with water outlet, the upper end of chassis is provided with recess, the recess is connected with connecting ring, the upper end fixed connection of connecting ring has the heat spreader, and the heat spreader is matched with the chassis, and the bottom fixed connection of heat spreader has vacuum cavity column, and vacuum cavity column is located in cooling runner. The utility model discloses that the cooling liquid is flowed in the cooling runner through the import, and the cooling liquid is contacted with several vacuum cavity columns in the flowing process, and the vacuum cavity column spreads the punctate cold source into a uniform surface cold source, and the cooling liquid flows to the cooling of several vacuum cavity columns, and the cooling liquid can absorb and take away these local concentrated heat in time and evenly, thereby cooling the heat spreader, and improving the overall heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and in particular to a probe station wafer carrier cooling device. Background Technology

[0002] The probe station wafer carrier cooling equipment is a high-precision temperature control system used to accurately control the temperature of wafer testing. It rapidly and stably cools and maintains the wafer at the required low temperature environment to ensure the accuracy of parameter testing of semiconductor devices under specific low-temperature conditions.

[0003] In the process of using a cooling device to control the temperature of the probe station wafer carrier, the cooling medium is generally used to cool the carrier. Due to the power consumption differences of different devices on the wafer, the surface of the carrier is prone to local overheating, forming significant hot spots. When the cooling medium flows through the pre-set microchannels inside the carrier, the coolant cannot absorb and carry away these locally concentrated heats in a timely and uniform manner, making it difficult to effectively dissipate the heat in the high-temperature areas, thus seriously reducing the overall heat dissipation efficiency. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies where the coolant cannot absorb and remove locally concentrated heat in a timely and uniform manner, making it difficult to effectively dissipate heat in high-temperature areas and thus severely reducing overall heat dissipation efficiency. Therefore, this invention proposes a probe station wafer carrier cooling device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Design a probe station wafer carrier cooling device, including a chassis, a cooling channel at the upper end of the chassis, a water inlet on one side of the cooling channel, a water outlet on the other side of the cooling channel, a groove at the upper end of the chassis, a connecting ring connected to the groove, a heat spreader plate fixedly connected to the upper end of the connecting ring, the heat spreader plate cooperating with the chassis, and a vacuum chamber column fixedly connected to the bottom end of the heat spreader plate, the vacuum chamber column being located inside the cooling channel.

[0007] Preferably, a number of fins are connected at equal intervals along the axial direction in the cooling channel.

[0008] Preferably, the connecting ring and the heat spreader are an integral structure.

[0009] Preferably, the vacuum chamber columns are provided in a plurality of columns and are evenly distributed along the axis of the heat spreader.

[0010] Preferably, a sealing mechanism is connected to the outer side of the heat spreader. The sealing mechanism includes a ring frame, which is fixedly connected to the outer side of the heat spreader. A mounting groove is provided at the bottom end of the ring frame, and a movable ring is slidably connected in the mounting groove. A spring is fixedly connected to the upper end of the movable ring, and one end of the spring is fixedly connected to the mounting groove.

[0011] Preferably, a sealing ring is fixedly connected to the bottom end of the movable ring, and the sealing ring is a corrosion-resistant sealing ring.

[0012] Preferably, the chassis has a cavity, the cavity has several through holes, and the upper part of the cavity is fixedly connected to a heat dissipation tooth.

[0013] Preferably, the heat dissipation teeth are stainless steel heat dissipation teeth.

[0014] The present invention provides a probe station wafer carrier cooling device, which has the following advantages:

[0015] The coolant flows through the cooling channels and comes into contact with several vacuum chamber columns. The vacuum chamber columns rapidly diffuse the point-like cold source into a uniform surface-like cold source. The coolant cools the vacuum chamber columns during its flow. The coolant can absorb and carry away the locally concentrated heat in a timely and uniform manner, thereby cooling the heat spreader and improving the overall heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 This invention provides a schematic diagram of the structure of a probe station wafer carrier cooling device. Figure 1 ;

[0017] Figure 2 This invention provides a schematic diagram of the structure of a probe station wafer carrier cooling device. Figure 2 ;

[0018] Figure 3 This is a cross-sectional structural schematic diagram of a probe station wafer carrier cooling device proposed in this utility model;

[0019] Figure 4 for Figure 3 A magnified view of the structure at point A above;

[0020] Figure 5 This is a schematic diagram of the connection between the chassis and the groove in a probe station wafer carrier cooling device proposed in this utility model.

[0021] In the diagram: 1. Chassis; 2. Cooling channel; 3. Inlet; 4. Outlet; 5. Fins; 6. Groove; 7. Connecting ring; 8. Heat spreader; 9. Vacuum chamber column; 10. Sealing mechanism; 11. Chamber; 12. Through hole; 13. Heat dissipation teeth; 101. Circular ring frame; 102. Mounting groove; 103. Movable ring; 104. Spring; 105. Sealing ring. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Example 1: Refer to Figure 1-5 A probe station wafer carrier cooling device includes a chassis 1, a cooling channel 2 at the upper end of the chassis 1, a water inlet 3 on one side of the cooling channel 2, and a water outlet 4 on the other side of the cooling channel 2. A plurality of fins 5 are connected at equal intervals along the axis of the cooling channel 2. A groove 6 is provided at the upper end of the chassis 1, and a connecting ring 7 is connected to the groove 6. A heat spreader 8 is fixedly connected to the upper end of the connecting ring 7. The connecting ring 7 and the heat spreader 8 are an integral structure. The heat spreader 8 cooperates with the chassis 1. A vacuum chamber column 9 is fixedly connected to the bottom end of the heat spreader 8. A plurality of vacuum chamber columns 9 are provided and are distributed at equal intervals along the axis of the heat spreader 8. The vacuum chamber columns 9 are located in the cooling channel 2.

[0024] Work process:

[0025] Heat from the support platform is transferred to the heat spreader plate 8, and heat from the heat spreader plate 8 is transferred to several vacuum chamber columns 9. Coolant is introduced through the inlet 3 and flows in the cooling channel 2. During the flow of the coolant, it comes into contact with several vacuum chamber columns 9. The vacuum chamber columns 9 quickly diffuse the point-like cold source into a uniform surface cold source. The flow of the coolant cools the several vacuum chamber columns 9. The coolant can absorb and carry away these locally concentrated heats in a timely and uniform manner, thereby cooling the heat spreader plate 8 and improving the overall heat dissipation efficiency.

[0026] During the flow of coolant, it collides with several fins 5. The fins 5 disturb the coolant, preventing it from remaining stationary in the cooling channel 2, thereby improving the temperature uniformity of the cooling medium.

[0027] Example 2: After the connecting ring 7 is connected to the groove 6, there is a gap between the heat spreader 8 and the chassis 1, and the coolant can easily leak from the gap. (Refer to...) Figure 3-4As another preferred embodiment of this utility model, the difference from embodiment 1 is that a sealing mechanism 10 is connected to the outside of the heat spreader 8. The sealing mechanism 10 includes a ring frame 101, which is fixedly connected to the outside of the heat spreader 8. An installation groove 102 is provided at the bottom end of the ring frame 101. A movable ring 103 is slidably connected in the installation groove 102. A spring 104 is fixedly connected to the upper end of the movable ring 103. One end of the spring 104 is fixedly connected to the installation groove 102. A sealing ring 105 is fixedly connected to the bottom end of the movable ring 103. The sealing ring 105 is a corrosion-resistant sealing ring.

[0028] The upper end of the chassis 1 presses the sealing ring 105, and the sealing ring 105 pushes the movable ring 103 upward. After the movable ring 103 moves, it presses the spring 104. The spring 104 is compressed and generates elastic force. The elastic force generated by the spring 104 causes the sealing ring 105 to press and contact the upper end of the chassis 1, sealing the gap between the heat spreader 8 and the chassis 1 to prevent coolant leakage.

[0029] Example 3: The cooling effect of the heated coolant decreases during its flow, as described above. Figure 3 As another preferred embodiment of this utility model, the difference from embodiment 1 is that a chamber 11 is provided in the chassis 1, and a plurality of through holes 12 are provided on the chamber 11. A heat dissipation tooth 13 is fixedly connected to the upper end of the interior of the chamber 11. The heat dissipation tooth 13 is a stainless steel heat dissipation tooth. The heat in the coolant is transferred to the chassis 1, and part of the heat on the chassis 1 is transferred to the heat dissipation tooth 13. The heat on the heat dissipation tooth 13 is released into the chamber 11, and the heat in the chamber 11 is released from the through holes 12, thereby increasing the heat dissipation area and improving the cooling effect.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A probe station wafer carrier cooling device, comprising a chassis (1), wherein a cooling channel (2) is provided at the upper end of the chassis (1), an inlet (3) is provided on one side of the cooling channel (2), and an outlet (4) is provided on the other side of the cooling channel (2), characterized in that, in: The upper end of the chassis (1) is provided with a groove (6), and a connecting ring (7) is connected to the groove (6). A heat spreader (8) is fixedly connected to the upper end of the connecting ring (7). The heat spreader (8) cooperates with the chassis (1). A vacuum chamber column (9) is fixedly connected to the bottom end of the heat spreader (8). The vacuum chamber column (9) is located in the cooling channel (2).

2. The probe station wafer carrier cooling device according to claim 1, characterized in that, The cooling channel (2) has several fins (5) connected at equal intervals along the axis.

3. The probe station wafer carrier cooling device according to claim 1, characterized in that, The connecting ring (7) and the heat spreader (8) are an integral structure.

4. The probe station wafer carrier cooling device according to claim 1, characterized in that, The vacuum chamber column (9) is provided with several columns that are evenly distributed along the axis of the heat spreader (8).

5. The probe station wafer carrier cooling device according to claim 1, characterized in that, A sealing mechanism (10) is connected to the outside of the heat spreader (8). The sealing mechanism (10) includes a ring frame (101), which is fixedly connected to the outside of the heat spreader (8). A mounting groove (102) is provided at the bottom end of the ring frame (101). A movable ring (103) is slidably connected in the mounting groove (102). A spring (104) is fixedly connected to the upper end of the movable ring (103). One end of the spring (104) is fixedly connected to the mounting groove (102).

6. The probe station wafer carrier cooling device according to claim 5, characterized in that, The bottom end of the movable ring (103) is fixedly connected to a sealing ring (105), which is a corrosion-resistant sealing ring.

7. The probe station wafer carrier cooling device according to claim 1, characterized in that, The chassis (1) has a chamber (11) inside, and a number of through holes (12) are provided on the chamber (11). Heat dissipation teeth (13) are fixedly connected to the upper part of the interior of the chamber (11).

8. The probe station wafer carrier cooling device according to claim 7, characterized in that, The heat dissipation teeth (13) are stainless steel heat dissipation teeth.

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